Group 1 - The semiconductor packaging equipment industry is experiencing robust growth in China, driven by strong demand in emerging applications such as smartphones, AI, IoT, and automotive electronics. The sales revenue for semiconductor packaging equipment in China is projected to reach 28.27 billion yuan in 2024, representing a year-on-year increase of 18.93% [1][18] - The industry is expected to continue evolving towards high-density, high-performance, and high-reliability equipment due to rapid advancements in technologies like 5G, IoT, and AI [1][18] - The global semiconductor equipment market is also witnessing significant growth, with sales expected to reach 117.1 billion USD in 2024, a 10.16% increase from 2023 [15][17] Group 2 - Key players in the semiconductor packaging equipment market include both international leaders such as ASM Pacific Technology, Kulicke & Soffa, and local Chinese companies like North Huachuang, Shengmei Semiconductor, and Xinyi Chang [21][23] - North Huachuang's revenue from electronic process equipment is projected to be 27.707 billion yuan in 2024, marking a 41.28% increase [23] - Shengmei Semiconductor's revenue is expected to reach 5.44 billion yuan in 2024, reflecting a 46.43% growth [25] Group 3 - The semiconductor packaging equipment industry is supported by various policies aimed at promoting domestic production and technological breakthroughs, including the implementation of national standards and talent cultivation initiatives [8][10] - The industry is characterized by a complex supply chain, with upstream components including sensors and subsystems, midstream manufacturing, and downstream applications serving OSATs, IDMs, and foundries [11][13] Group 4 - The industry is witnessing a shift towards high precision and intelligent equipment, with advancements in packaging technologies such as Chiplet and 3D IC driving innovation [27] - New application scenarios, particularly in electric vehicles and AI chips, are creating additional market opportunities for specialized packaging equipment [28] - The construction of digital factories is transforming traditional equipment operation and maintenance, enhancing efficiency through real-time data collection and predictive maintenance [29]

Core Viewpoint - Shengmei Shanghai has evolved into a platform company in the semiconductor equipment industry, aiming to become a leading global player by leveraging its innovative technologies and expanding its product offerings [1][3]. Group 1: Company Development and Achievements - Shengmei Shanghai was founded in 2005 and developed the world's first SAPS technology in 2008, achieving profitability since 2013 and experiencing exponential growth in equipment sales since 2017 [1]. - The company has successfully maintained a profitable status and has seen rapid growth in financial metrics since its listing on the Sci-Tech Innovation Board [1][2]. - As of 2024, Shengmei Shanghai's cleaning equipment covers 95% of cleaning process steps, ranking fourth globally with an 8% market share [2]. Group 2: Technological Innovations - The company has developed proprietary technologies such as SAPS and TEBO, addressing global challenges in the application of megasonic technology in semiconductor cleaning equipment [2]. - Shengmei Shanghai has filed a total of 1,526 patents by the end of 2024, with 470 granted patents, showcasing its commitment to original innovation [4]. - The Tahoe cleaning equipment, developed by the company, reduces sulfuric acid consumption by up to 75%, aligning with national energy-saving policies [5]. Group 3: Strategic Expansion - The company aims to expand its product portfolio beyond cleaning equipment to include electroplating, advanced packaging, and other semiconductor manufacturing equipment [3]. - Shengmei Shanghai is actively pursuing a global market strategy, targeting a balanced order volume from domestic and international clients [6]. - The company has established a local presence in South Korea to enhance service and support for its clients in that market [7]. Group 4: Future Outlook - The company is focused on continuing its path of differentiation and innovation, aiming to transition from an industry innovator to a standard setter in the semiconductor equipment sector [7]. - Shengmei Shanghai plans to leverage its dual capital market presence to enhance its competitive advantage and expand its global footprint [6].

Group 1 - The Shanghai Stock Exchange Sci-Tech Innovation Board Semiconductor Materials and Equipment Theme Index decreased by 0.30% as of July 21, 2025, with mixed performance among constituent stocks [1] - Hanbo Semiconductor signed a counseling agreement with CITIC Securities on July 11, 2025, to officially start its A-share IPO process, focusing on high-end GPU chip solutions for AI core computing power and graphics rendering [1] - Shanxi Securities highlights the urgent need for domestic lithography machine production due to the construction boom of wafer fabs in China and increased U.S. export controls on semiconductor equipment [1] Group 2 - The Sci-Tech Innovation Board Semiconductor ETF (588170) tracks the Semiconductor Materials and Equipment Theme Index, encompassing hard-tech companies in the semiconductor equipment and materials sectors [2] - The semiconductor equipment and materials industry is a crucial area for domestic substitution, characterized by low domestic substitution rates and high potential for domestic replacement, benefiting from the expansion of semiconductor demand driven by the AI revolution [2]

Group 1 - UBTECH Technology has secured the largest procurement order in the humanoid robot industry, amounting to approximately 90.51 million yuan, marking a significant milestone for the company [1] - UBTECH plans to deliver 500 units of its industrial humanoid robot Walker S2, which features autonomous battery swapping capabilities, by the end of the year [1] - The company has also announced that it has received over 100 orders for its Tian Gong Xing Zhe robot aimed at research and education, with expectations to deliver more than 300 units this year [1] Group 2 - Anyang Iron and Steel has successfully delivered its first advanced high-manganese wear-resistant steel from its Anyang base, marking a breakthrough in high-end material development [2] - The Mn13 series of high-manganese wear-resistant steel is primarily used in mining machinery, metallurgical equipment, construction machinery, and coal machinery, indicating strong demand in the mining and metallurgy sectors [2] Group 3 - Shanghai Semiconductor Equipment Co., Ltd. and East China University of Science and Technology have signed an agreement to establish a joint technology innovation transfer center for high-end semiconductor equipment [3] - The collaboration will focus on technical breakthroughs, achievement transformation, and talent cultivation, indicating a commitment to advancing semiconductor technology [3] Group 4 - Shanghai Electric's subsidiary, Shanghai Heavy Machinery Works, has successfully passed the expert review for its first high-end intelligent equipment project, which addresses the technical challenges of high-performance requirements for main equipment forgings in high-temperature gas-cooled reactors [4] - This project represents a significant achievement in the manufacturing of pressure vessels and components for nuclear island applications [4]

证券代码：688082 证券简称：盛美上海 公告编号：2025-053 盛美半导体设备（上海）股份有限公司 关于召开 2025 年第一季度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 会议召开时间：2025 年 07 月 25 日（星期五）15:00-16:00 会 议 召 开 地 点 ： 上 海 证 券 交 易 所 上 证 路 演 中 心 （ 网 址 ： https://roadshow.sseinfo.com/） 会议召开方式：上证路演中心视频录播和网络互动 投资者可于 2025 年 07 月 18 日（星期五）至 07 月 24 日（星期四）16:00 前登录上证路演中心网站首页点击"提问预征集"栏目或通过公司邮箱 （ir@acmrcsh.com）进行提问。公司将在说明会上对投资者普遍关注的问题进 行回答。 盛美半导体设备（上海）股份有限公司（以下简称"公司"）已于2025年4 月30日发布公司2025年第一季度报告，为便于广大投资者更全面深入地了解公司 2025年第一季度经营成果 ...

北京市金杜律师事务所上海分所 关于盛美半导体设备（上海）股份有限公司 致：盛美半导体设备（上海）股份有限公司 北京市金杜律师事务所上海分所（以下简称本所）接受盛美半导体设备（上 海）股份有限公司（以下简称公司）委托，根据《中华人民共和国证券法》（以 下简称《证券法》）、《中华人民共和国公司法》 （以下简称《公司法》 ）、中国证券 监督管理委员会（以下简称中国证监会） 《上市公司股东会规则》 （以下简称《股 东会规则》）等中华人民共和国境内（以下简称中国境内，为本法律意见书之目 的，不包括中国香港特别行政区、中国澳门特别行政区和中国台湾省）现行有效 的法律、行政法规、规章和规范性文件和现行有效的公司章程有关规定，指派律 师出席了公司于 2025 年 7 月 15 日召开的 2025 年第三次临时股东大会（以下简 称本次股东大会），并就本次股东大会相关事项出具本法律意见书。 为出具本法律意见书，本所律师审查了公司提供的以下文件，包括但不限于： 股份有限公司章程》（以下简称《公司章程》）； （上海）股份有限公司关于召开 2025 年第三次临时股东大会的通知》 （以下简称《股东大会通知》）； 公司已向本所保证，公司已 ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-051 盛美半导体设备（上海）股份有限公司 关于选举第二届董事会职工代表董事的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 根据《中华人民共和国公司法》（以下简称"《公司法》"）《上海证券交 易所科创板股票上市规则》《上海证券交易所科创板上市公司自律监管指引第1 号——规范运作》和《盛美半导体设备（上海）股份有限公司章程》（以下简称 "《公司章程》"）等相关规定，盛美半导体设备（上海）股份有限公司（以下 简称"公司"）于2025年7月15日召开了职工代表大会，会议经出席本次会议的 全体职工代表投票表决，一致同意选举杨霞云女士为公司第二届董事会职工代表 董事（简历详见附件），任期自本次职工代表大会审议通过之日起至公司第二届 董事会任期届满之日止。 上述职工代表董事符合《公司法》等法律法规和《公司章程》规定的任职条 件。董事会中兼任公司高级管理人员以及由职工代表担任的董事人数总计不超过 公司董事总数的二分之一。 特此公告。 盛美半导体设备（上海）股份有限公 ...

1. 经公司 2025 年第二次临时股东大会审议通过的《盛美半导体设备（上海） 股份有限公司章程》（以下简称《公司章程》）； 2. 公司第二届董事会第二十一次会议决议； 3. 公司第二届监事会第二十次会议决议； 4. 公司 2025 年 6 月 27 日刊登于上海证券交易所网站的《盛美半导体设备 （上海）股份有限公司关于召开 2025 年第三次临时股东大会的通知》 （以下简称《股东大会通知》）； 5. 公司本次股东大会股权登记日的股东名册； 6. 出席会议的股东及其他人员的到会登记记录及凭证资料； 北京市金杜律师事务所上海分所 关于盛美半导体设备（上海）股份有限公司 2025 年第三次临时股东大会之法律意见书 致：盛美半导体设备（上海）股份有限公司 北京市金杜律师事务所上海分所（以下简称本所）接受盛美半导体设备（上 海）股份有限公司（以下简称公司）委托，根据《中华人民共和国证券法》（以 下简称《证券法》）、《中华人民共和国公司法》（以下简称《公司法》）、中国证券 监督管理委员会（以下简称中国证监会）《上市公司股东会规则》（以下简称《股 东会规则》）等中华人民共和国境内（以下简称中国境内，为本法律意见书之目 的 ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-052 盛美半导体设备（上海）股份有限公司 2025年第三次临时股东大会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 一、 会议召开和出席情况 （一） 股东大会召开的时间：2025 年 7 月 15 日 （二） 股东大会召开的地点：中国（上海）自由贸易试验区丹桂路 999 弄 B2 栋会议室 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 53 | | --- | --- | | 普通股股东人数 | 53 | | 2、出席会议的股东所持有的表决权数量 | 363,575,341 | | 普通股股东所持有表决权数量 | 363,575,341 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 | 82.4719 | | 例（%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 82.4719 | （四） 表决方 ...

Core Insights - The semiconductor electroplating copper industry is experiencing rapid growth driven by strong demand from emerging technologies such as AI, 5G, and HPC, with the market expected to reach 5.2 billion yuan in 2024 and exceed 9.7 billion yuan by 2028, reflecting a compound annual growth rate (CAGR) of 16.8% [1][12][10] - Domestic companies have made significant breakthroughs in key technologies, accelerating the process of domestic substitution, with notable advancements in electroplating solutions and equipment [1][16][18] - The industry is focusing on three main directions: technological autonomy, green manufacturing, and collaborative innovation across the industrial chain [1][20] Industry Overview - Semiconductor electroplating copper involves the electrochemical deposition of copper layers on semiconductor wafers, replacing traditional aluminum interconnects due to its high conductivity and low resistance [2][4] - The market structure shows that electroplating solutions dominate with a 65% share, with advanced packaging and wafer manufacturing being the primary growth engines [1][14] Market Dynamics - The advanced packaging sector is rapidly growing, with the market size increasing from 35.13 billion yuan in 2020 to an expected 110 billion yuan by 2025, driven by AI and HPC demands [10][12] - The industry is characterized by a dual structure where foreign companies dominate the high-end market while domestic firms focus on differentiated breakthroughs [18][20] Technological Developments - Significant technological advancements include the development of a "deposition rate reversal" patent by Nantong Saike, which achieves void-free filling in TSV applications, and the introduction of the first domestic 12-inch TSV electroplating equipment by Northern Huachuang [16][18] - The industry is also seeing a shift towards green manufacturing processes, with a focus on cyanide-free technologies and intelligent control systems to enhance production efficiency and product quality [22][21] Competitive Landscape - The competitive landscape is marked by international giants controlling over 75% of the high-end electroplating liquid and additive market, particularly in the sub-5nm advanced process area [18][20] - Domestic companies like Aisen and Shanghai Xinyang are making strides in the advanced packaging electroplating copper base liquid and achieving certifications for 28nm Damascus electroplating solutions [18][19] Future Trends - The industry is expected to continue its trajectory of high-end technology breakthroughs and domestic substitution, with a focus on green upgrades and application innovations [20][21] - The market for TSV electroplating solutions is projected to reach 5 billion yuan by 2028, with a CAGR of 18.92%, indicating strong growth potential [23][10]