Core Viewpoint - Dongxin Co., Ltd. (688110.SH) is set to release its first public offering of restricted shares for trading on December 10, 2024, with a total of 165,713,025 shares being made available, representing 37.47% of the company's total share capital [1][2][3]. Group 1 - The company issued a total of 110,562,440 shares during its initial public offering (IPO) on December 10, 2021, with a total share capital of 442,249,758 shares post-IPO [2][3]. - The restricted shares have a lock-up period of 36 months from the date of the IPO, which is now nearing its end [3]. - The stock is currently in a state of decline, having broken its initial offering price [4]. Group 2 - The total amount raised by the company during the IPO was 3.337 billion yuan, with a net amount of 3.064 billion yuan after deducting issuance costs [5]. - The final net fundraising amount exceeded the original plan by 2.314 billion yuan, which was initially set at 750 million yuan for various projects including R&D and working capital [6]. - The total issuance costs amounted to 273 million yuan, with the lead underwriter, Haitong Securities Co., Ltd., receiving 251 million yuan in fees [6].

Group 1: Company Overview - Dongxin Semiconductor Co., Ltd. is actively engaged in the development of niche DRAM products, including DDR3(L), LPDDR1, LPDDR2, and is currently advancing LPDDR4x and PSRAM for market promotion and sales [1] - The company aims to maintain its technological leadership through continuous R&D innovation, process upgrades, and performance enhancements [2] Group 2: Market Insights - The SLC NAND market is characterized by a relatively dispersed competitive landscape, with key players including Samsung Electronics, Kioxia, and local Chinese manufacturers [1] - The demand for niche DRAM primarily comes from sectors such as TV, security, and consumer electronics, with automotive applications focusing on stability rather than speed [2] Group 3: Future Development Plans - The company plans to expand into emerging fields such as IoT, smart hardware, automotive electronics, and healthcare, while enhancing its customized product and service capabilities [2] - Dongxin Semiconductor aims to leverage its industry resources, customer base, and supply chain experience to explore integrated solutions in storage, computing, and connectivity [2]

海通证券股份有限公司（以下简称"海通证券"或"保荐机构"）作为东芯半导 体股份有限公司（以下简称"东芯股份"或"公司"）首次公开发行股票并在科创板 上市持续督导期间的保荐机构，根据《证券发行上市保荐业务管理办法》《上海 证券交易所科创板股票上市规则》《上海证券交易所科创板上市公司自律监管指 引第1号——规范运作》等有关法律法规和规范性文件的要求，对东芯股份首次 公开发行部分限售股上市流通的事项进行了核查，具体情况如下： 一、本次上市流通的限售股类型 根据中国证券监督管理委员会于 2021 年 11 月 9 日出具的《关于同意东芯半 导体股份有限公司首次公开发行股票注册的批复》（证监许可[2021]3558 号），同 意东芯半导体股份有限公司首次公开发行股票的注册申请。公司首次向社会公众 公开发行人民币普通股（A 股）股票 110,562,440 股，并于 2021 年 12 月 10 日在 上海证券交易所科创板上市，发行完成后总股本为 442,249,758 股，其中有限售 条件流通股 357,463,056 股，无限售条件流通股 84,786,702 股。 海通证券股份有限公司 关于东芯半导体股份有限公司 ...

证券代码：688110 证券简称：东芯股份 公告编号：2024-068 东芯半导体股份有限公司 首次公开发行部分限售股上市流通公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次股票上市类型为首发限售股份；股票认购方式为网下，上市股数为 165,713,025 股。 本次股票上市流通总数为 165,713,025 股。 本次股票上市流通日期为 2024 年 12 月 10 日。 一、本次上市流通的限售股类型 根据中国证券监督管理委员会于 2021 年 11 月 9 日出具的《关于同意东芯半 导体股份有限公司首次公开发行股票注册的批复》（证监许可[2021]3558 号），同 意东芯半导体股份有限公司（以下简称"公司"、"东芯股份"）首次公开发行股票 的注册申请。公司首次向社会公众公开发行人民币普通股（A 股）股票 110,562,440 股，并于 2021 年 12 月 10 日在上海证券交易所科创板上市，发行完成后总股本为 442,249,758 股，其中有限售条件流通股 357,463,056 股 ...

Group 1: Company Overview - The company is actively introducing domestic alternatives for automotive-grade products, with initial shipments already commenced [1] - The revenue structure remains largely unchanged, with SLC NAND products continuing to dominate, and sales strategies will be adjusted based on market demand [1] Group 2: Inventory Management - As of the end of Q3, the company's inventory value stands at 918 million yuan, with inventory levels being manageable and primarily consisting of raw materials, commissioned processing materials, and finished goods [2] - The procurement plan is based on inventory status, customer demand, and market forecasts, with inventory levels influenced by supply and demand dynamics [2]

Group 1: Company Overview and Recent Developments - The company introduced its recent operational status, highlighting the advantages and disadvantages of IDM and Fabless models, with a focus on cost pressures and capital investment risks associated with IDM [1] - The company is pursuing Wi-Fi 7 as a new R&D project due to the expanding market for Wi-Fi chips, driven by high bandwidth, security, low latency, and the increasing demand for reliable wireless communication in IoT devices [2] Group 2: Market Position and Product Strategy - The company aims to maintain its leading position in the SLC NAND market in mainland China by increasing product offerings and enhancing market share [2] - The company is actively promoting mid-to-high capacity NOR products and expanding its niche DRAM product line to capture more market share [2] - The competitive landscape for SLC NAND is shifting, with major players like Samsung exiting the market, providing the company an opportunity to increase its market share [2] Group 3: Cost and Pricing Insights - The company anticipates stable foundry prices in the second half of the year as capacity constraints ease, indicating a steady pricing environment [2]

Group 1: Company Performance Overview - The company has made significant progress in the R&D of 1xnm SLC NAND Flash products, achieving key performance indicators while continuing design optimization and process debugging [1] - In the first three quarters, the company recorded an asset impairment loss of -15.9777 million, showing a significant decrease compared to the previous year due to a recovering downstream application market [1] Group 2: Product Development and Market Position - The company is focusing on the development of mid-to-high capacity NOR Flash products (64Mb-1Gb) based on 48nm and 55nm processes, targeting different customer segments to ensure performance, power consumption, and cost-effectiveness [2] - The SLC NAND Flash product line covers storage capacities from 512Mb to 32Gb, offering flexibility in interface types and voltage options, meeting diverse application needs [2] - The reliability of the company's products is highlighted, with endurance exceeding 100,000 write cycles and data retention in extreme conditions for up to 10 years, moving towards automotive-grade standards [2] Group 3: Market Conditions and Pricing - The company anticipates stable foundry prices in the second half of the year as capacity constraints ease, indicating a relatively calm market environment [2]

证券代码：688110 证券简称：东芯股份 公告编号：2024-067 东芯半导体股份有限公司 监事会关于公司 2024 年限制性股票激励计划 预留授予激励对象名单的公示情况说明及核查意见 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 东芯半导体股份有限公司（以下简称"公司"）于 2024 年 10 月 28 日召开 第二届董事会第十八次会议、第二届监事会第十五次会议审议通过了《关于向 2024 年限制性股票激励计划激励对象授予预留部分限制性股票的议案》。根据 《中华人民共和国公司法》（以下简称"《公司法》"）、《中华人民共和国证券 法》（以下简称"《证券法》"）、《上市公司股权激励管理办法》（以下简称 "《管理办法》"）等相关法律法规及《东芯半导体股份有限公司章程》（以下 简称"《公司章程》"）的有关规定，公司对 2024 年限制性股票激励计划（以 下简称"本次激励计划"）预留授予激励对象的名单在公司内部进行了公示，监 事会结合公示情况对预留授予激励对象名单进行了核查，相关公示情况及核查情 况如下： 一、公示情况及核查 ...

Group 1: R&D Investment and Focus - The company invested CNY 52.21 million in R&D during the reporting period, a year-on-year increase of 24.60% [1] - Total R&D expenses for the first three quarters reached CNY 157.97 million, reflecting a commitment to technological innovation [1] - Future R&D efforts will focus on enhancing core technology capabilities and expanding product lines in the storage chip sector [2] Group 2: Market Performance and Strategy - The company's storage product line experienced growth in shipment volume, primarily driven by SLC NAND products [1] - Revenue growth is attributed to the recovery of the storage market and increased demand from major operators promoting FTTR solutions [2] - The company aims to increase market share by focusing on leading clients across various downstream application fields [2] Group 3: New Product Development - The company is advancing the development of SLC NAND Flash products based on 2xnm process technology, with significant progress on 1xnm products [2] - Ongoing R&D for NOR Flash products targets mid-to-high capacity ranges (64Mb-1Gb) to meet diverse customer needs [2] - The company is also developing DRAM products, including LPDDR4x, to enhance product diversity [2] Group 4: Strategic Expansion into New Technologies - The company is exploring integrated technology fields, including Wi-Fi 7, to diversify its product offerings [2] - A new subsidiary, Yixin Tonggan, has been established to focus on Wi-Fi 7 chip development, leveraging experienced R&D teams [2] - Investment in Shanghai Lishan aims to enhance capabilities in GPU chip design, aligning with the company's core business [2]

东芯半导体股份有限公司投资者关系活动记录表 （2024 年 10 月 28 日-11 月 1 日） 证券代码：东芯股份 证券简称：688110 | --- | --- | |-----------------------|-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------| | | 特定对象调研 □ 分析师会议 | | 投资者关系活 | 媒体采访 □ 业绩说明会 | | 动类别 | 路演活动 | | | 电话会议 | | | | | 参与单位名 ...