Nexchip Semiconductor Corporation(688249)
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晶合集成(688249) - 2025 Q1 - 季度财报
2025-04-28 11:40
Financial Performance - The company's operating revenue for Q1 2025 was ¥2,567,682,999.65, representing a year-on-year increase of 15.25% compared to ¥2,227,893,274.41 in the same period last year[4] - Net profit attributable to shareholders was ¥135,472,184.74, a significant increase of 70.92% from ¥79,258,819.88 in the previous year[4] - The net profit after deducting non-recurring gains and losses reached ¥122,598,689.06, marking a 113.92% increase from ¥57,309,730.50 year-on-year[4] - Basic and diluted earnings per share were both ¥0.07, reflecting a 75.00% increase from ¥0.04 in the previous year[4] - Net profit for Q1 2025 was ¥85,828,122.69, compared to ¥81,851,707.70 in Q1 2024, reflecting a growth of approximately 4.0%[21] - Earnings per share for Q1 2025 were ¥0.07, an increase from ¥0.04 in Q1 2024[22] Cash Flow and Liquidity - The net cash flow from operating activities was ¥586,407,326.79, up 48.50% from ¥394,884,867.30 in the same period last year[4] - Cash inflow from operating activities in Q1 2025 totaled ¥2,435,990,421.80, compared to ¥2,223,743,938.85 in Q1 2024, marking an increase of about 9.5%[24] - The ending balance of cash and cash equivalents decreased to 2,852,372,302.26 from 6,645,849,022.59, indicating a significant reduction in liquidity[27] - The company reported a total cash inflow from financing activities of 169,000,000.00, down from 6,798,710,582.66, highlighting a decrease in new borrowings[25] - The cash outflow for employee compensation was 382,480,519.22, slightly lower than 385,030,250.77 in the previous period, showing stable payroll expenses[25] - The cash paid for taxes was 9,291,873.01, down from 10,273,871.34, indicating a potential decrease in tax liabilities[25] Research and Development - Total R&D investment amounted to ¥337,999,455.77, which is a 13.53% increase compared to ¥297,716,502.67 in the same period last year[5] - The proportion of R&D investment to operating revenue decreased slightly to 13.16% from 13.36% year-on-year[5] - Research and development expenses for Q1 2025 amounted to ¥337,999,455.77, up from ¥297,716,502.67 in Q1 2024, indicating a rise of approximately 13.5%[20] Assets and Liabilities - Total assets at the end of the reporting period were ¥49,197,619,010.94, a decrease of 2.38% from ¥50,398,579,443.20 at the end of the previous year[5] - The company's total assets amounted to RMB 49.20 billion, a decrease from RMB 50.40 billion as of December 31, 2024, reflecting a decline of approximately 2.4%[15] - The total current liabilities decreased from RMB 7.43 billion to RMB 6.40 billion, a reduction of approximately 14%[18] - The company reported a significant increase in other non-current financial assets from RMB 607.39 million to RMB 809.31 million, an increase of about 33%[17] - The company reported a decrease in minority shareholders' equity from ¥5,218,656,470.54 in the previous year to ¥5,169,012,408.49[19] - The company’s total liabilities decreased from RMB 24.31 billion to RMB 23.00 billion, a decline of approximately 5.4%[18] Shareholder Actions - The company repurchased a total of 62,088,500 shares, accounting for 3.09% of the total share capital, with an average repurchase price of RMB 14.36 per share, totaling RMB 891.68 million[13] - The company plans to implement a restricted stock incentive plan for 2025, proposing to grant 62,088,500 shares to incentive targets, pending shareholder approval[13] Strategic Outlook - The company plans to continue expanding its market presence and investing in new technologies to drive future growth[20]
晶合集成:2025一季报净利润1.35亿 同比增长70.89%
Tong Hua Shun Cai Bao· 2025-04-28 11:32
Financial Performance - The company reported a basic earnings per share of 0.0700 yuan for Q1 2025, a 75% increase compared to 0.0400 yuan in Q1 2024, and a significant improvement from -0.2200 yuan in Q1 2023 [1] - Net profit for Q1 2025 was 1.35 billion yuan, representing a 70.89% increase from 0.79 billion yuan in Q1 2024, and a recovery from a loss of 3.31 billion yuan in Q1 2023 [1] - Operating revenue reached 25.68 billion yuan in Q1 2025, up 15.26% from 22.28 billion yuan in Q1 2024, and a substantial increase from 10.9 billion yuan in Q1 2023 [1] - The return on equity (ROE) improved to 0.65% in Q1 2025, an 80.56% increase from 0.36% in Q1 2024, and a recovery from -2.55% in Q1 2023 [1] Shareholder Structure - The top ten unrestricted shareholders collectively hold 61,456.66 million shares, accounting for 52.23% of the circulating shares, with a decrease of 899.35 million shares compared to the previous period [1] - The largest shareholder, Lichin Innovation Investment Holdings Co., Ltd., holds 38,273.22 million shares, representing 32.53% of the total share capital, with no change in holdings [2] - Midea Innovation Investment Co., Ltd. reduced its holdings by 1,173.70 million shares, now holding 5,102.21 million shares, which is 4.34% of the total share capital [2] Dividend Policy - The company has announced that it will not distribute dividends or transfer shares this time [3]
晶合集成(688249):新平台放量带动营收结构持续优化
Xin Lang Cai Jing· 2025-04-25 08:41
Core Viewpoint - The company reported strong financial performance for 2024, with significant revenue and profit growth driven by a recovering semiconductor market and improved operational efficiency [1][2]. Financial Performance - In 2024, the company achieved revenue of 9.25 billion yuan, a year-on-year increase of 27.7%, and a net profit attributable to shareholders of 530 million yuan, up 151.8% year-on-year [1]. - For Q4 2024, revenue was 2.47 billion yuan, reflecting an 11.1% year-on-year growth and a 4.1% quarter-on-quarter increase; net profit for the same period was 254 million yuan, up 41.3% year-on-year and 176.2% quarter-on-quarter [1]. Market and Product Development - The recovery in the global semiconductor market has led to increased sales and high capacity utilization for the company [2]. - The company has diversified its product offerings, with new platforms achieving mass production, including 40nm OLED display driver chips and 55nm mid-to-high-end CIS image sensor chips [2]. - The revenue contribution from the CIS platform increased significantly from 6% in 2023 to 17% in 2024, making it the second-largest revenue source for the company [2]. Future Outlook - The company plans to continue optimizing its product lines and accelerate the development and mass production of OLED, high-end CIS, and power management chips (PMIC) [3]. - Key developments include the large-scale production of 55nm mid-to-high-end BSI and stacked CIS chips, and the successful lighting of 110nm Micro OLED chips [3]. - The company aims to enhance its product structure and improve gross margins through ongoing R&D investments [3]. Valuation and Rating - The target price is set at 27.10 yuan, maintaining a "buy" rating based on diversified product structure supporting long-term growth [4]. - The net profit forecasts for 2025 and 2026 have been adjusted upward by 6% and 3% to 870 million yuan and 1.12 billion yuan, respectively [4]. - The estimated EPS for 2025, 2026, and 2027 are projected to be 0.44, 0.56, and 0.65 yuan, respectively [4].
晶合集成(688249) - 晶合集成首次公开发行部分战略配售限售股上市流通公告
2025-04-22 10:42
证券代码:688249 证券简称:晶合集成 公告编号:2025-022 合肥晶合集成电路股份有限公司 首次公开发行部分战略配售限售股上市流通公告 本次股票上市类型为首发战略配售股份(限售期 24 月);股票认购方式为网 下,上市股数为10,030,676股。本公司确认,上市流通数量等于该限售期的全 部战略配售股份数量。 本次股票上市流通总数为10,030,676股。 本次股票上市流通日期为2025 年 5 月 6 日。(因 2025 年 5 月 5 日为非交易日, 故顺延至下一交易日)。 一、本次上市流通的限售股类型 经中国证券监督管理委员会于 2022 年 5 月 9 日出具的《关于同意合肥晶合集 成电路股份有限公司首次公开发行股票注册的批复》(证监许可〔2022〕954 号) 同意,公司首次向社会公开发行人民币普通股(A 股)501,533,789 股。公司于 2023 年 5 月 5 日在上海证券交易所科创板挂牌上市,公司首次公开发行 A 股前总股本 为 1,504,601,368 股,首次公开发行 A 股后总股本为 2,006,135,157 股,其中有限售 条件流通股 1,657,372,031 股 ...
晶合集成(688249) - 晶合集成关于2025年限制性股票激励计划获得合肥市国资委批复的公告
2025-04-22 10:42
合肥晶合集成电路股份有限公司 关于 2025 年限制性股票激励计划获得 合肥市国资委批复的公告 证券代码:688249 证券简称:晶合集成 公告编号:2025-021 特此公告。 合肥晶合集成电路股份有限公司董事会 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 2025 年 4 月 23 日 合肥晶合集成电路股份有限公司(以下简称"公司")于 2025 年 3 月 14 日 召开第二届董事会第十七次会议、第二届监事会第十次会议,审议通过了《关于 公司<2025 年限制性股票激励计划(草案)>及其摘要的议案》等相关议案,具 体内容详见公司于 2025 年 3 月 15 日在上海证券交易所网站(www.sse.com.cn) 披露的相关公告及文件。 1 近日,公司收到合肥市人民政府国有资产监督管理委员会(以下简称"合肥 市国资委")出具的《关于合肥晶合集成电路股份有限公司限制性股票激励计划 的批复》(合国资分配〔2025〕50 号),合肥市国资委原则同意《合肥晶合集成 电路股份有限公司 2025 年限制性股票激励计划(草案) ...
晶合集成(688249) - 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司首次公开发行部分战略配售限售股上市流通的核查意见
2025-04-22 10:39
中国国际金融股份有限公司 关于合肥晶合集成电路股份有限公司 首次公开发行部分战略配售限售股上市流通的核查意见 中国国际金融股份有限公司(以下简称"中金公司"或"保荐机构")作为 合肥晶合集成电路股份有限公司(以下简称"晶合集成"或"公司")首次公开 发行股票并在科创板上市的保荐机构,根据《证券发行上市保荐业务管理办法》 《上海证券交易所科创板股票上市规则》《上海证券交易所科创板上市公司自律 监管指引第 1 号——规范运作》等有关规定,对首次公开发行部分战略配售限售 股上市流通事项情况进行了核查,具体情况如下: 一、本次上市流通的限售股类型 经中国证券监督管理委员会于 2022 年 5 月 9 日出具的《关于同意合肥晶合 集成电路股份有限公司首次公开发行股票注册的批复》(证监许可〔2022〕954 号)同意,公司首次向社会公开发行人民币普通股(A 股)501,533,789 股。公司 于 2023 年 5 月 5 日在上海证券交易所科创板挂牌上市,公司首次公开发行 A 股 前总股本为 1,504,601,368 股,首次公开发行 A 股后总股本为 2,006,135,157 股, 其中有限售条件流通股 1,65 ...
晶合集成(688249):持续丰富产品种类,扩大高阶晶圆产能
Shenwan Hongyuan Securities· 2025-04-22 06:13
Investment Rating - The report maintains a "Buy" rating for the company [1] Core Views - The company achieved a revenue of 9.246 billion yuan in 2024, representing a year-on-year increase of 27.69%, and a net profit of 533 million yuan, up 151.78% year-on-year [4] - The company has diversified its product offerings and is expanding its high-end wafer production capacity, with significant advancements in various technology nodes [7] - The company has successfully implemented cash dividends for the first time since its listing, indicating strong financial performance [4] Financial Data and Profit Forecast - The total revenue forecast for 2023 is 7.244 billion yuan, with a projected growth rate of -27.9%, followed by 9.249 billion yuan in 2024 with a growth rate of 27.7% [6] - The net profit for 2024 is expected to be 533 million yuan, with a significant increase of 151.8% compared to the previous year [6] - The company anticipates a net profit of 892 million yuan in 2025, reflecting a growth rate of 67.3% [6] - The gross margin is projected to be 25.5% in 2024, an increase of 3.89 percentage points year-on-year [7] Product and Market Development - The company is focusing on high-value-added areas, with R&D expenses projected at 1.284 billion yuan in 2024, accounting for 13.88% of revenue [7] - The company has made significant progress in various product lines, including the mass production of 40nm HV OLED DDIC and advancements in CIS technology [7] - A strategic partnership with a key client aims to overcome domestic technology bottlenecks and enhance the supply capacity of high-end CIS chips [7] Adjusted Profit Forecast - The profit forecast for 2025 has been adjusted to 892 million yuan from a previous estimate of 1.737 billion yuan, with new projections for 2026 and 2027 set at 1.197 billion yuan and 1.769 billion yuan, respectively [7]
全球半导体市场回暖 晶合集成2024年扣非净利润同比增长超700%
Zheng Quan Ri Bao· 2025-04-21 13:40
Company Performance - Company achieved operating revenue of 9.249 billion, a year-on-year increase of 27.69% [2] - Net profit attributable to shareholders reached 533 million, up 151.78% year-on-year [2] - Net profit excluding non-recurring gains and losses was 394 million, a significant increase of 736.77% year-on-year [2] Product Segmentation - Display driver chips (DDIC) remained the primary revenue source, accounting for 67.50% of main business income [2] - Image sensor chips (CIS) increased their share to 17.26%, becoming the second-largest product [2] Research and Development - Company invested 1.284 billion in R&D, a 21.41% increase year-on-year, representing 13.88% of operating revenue [2] - Achievements in R&D include mass production of 55nm mid-to-high-end BSI and stacked CIS chips, small batch production of 40nm high-voltage OLED display driver chips, and successful functionality verification of 28nm logic chips [3] Industry Outlook - According to WSTS, the global semiconductor market is projected to reach 628 billion in 2024, a 19.1% increase from 2023 [3] - Anticipated growth in the semiconductor market is supported by emerging fields such as AI, electric vehicles, smart manufacturing, and the Internet of Things [3] Shareholder Returns - Company plans to distribute a cash dividend of 1.00 per 10 shares, totaling 194 million (including tax) [4] - Dividend distribution is expected to signal operational stability and strong profitability, enhancing investor confidence [5]
晶合集成(688249):半导体行业景气向好,公司CIS占比快速提升
Ping An Securities· 2025-04-21 10:14
Investment Rating - The report maintains a "Recommended" investment rating for the company [1][9][13] Core Views - The semiconductor industry is experiencing favorable conditions, with the company's CIS (CMOS Image Sensor) segment rapidly increasing its share of revenue [1][8] - In 2024, the company achieved revenue of 9.249 billion yuan, a year-on-year increase of 27.69%, and a net profit attributable to shareholders of 533 million yuan, up 151.78% year-on-year [5][8] - The company plans to distribute a cash dividend of 1.00 yuan per 10 shares to all shareholders [5] Financial Performance Summary - Revenue and profit growth: The company reported a significant increase in revenue and net profit, with a gross margin of 25.50%, up 3.89 percentage points year-on-year [8] - Product mix improvement: The revenue contribution from CIS increased by 11.23 percentage points year-on-year, making it the second-largest product segment [8] - Future projections: The company expects net profits of 1.017 billion yuan in 2025, 1.551 billion yuan in 2026, and 2.176 billion yuan in 2027, with corresponding P/E ratios of 41.1X, 26.9X, and 19.2X [9][11] Revenue Breakdown - Revenue composition for 2024: DDIC (67.50%), CIS (17.26%), PMIC (8.80%), MCU (2.47%), Logic (3.76%) [8] - Process technology: Revenue contributions from various process nodes include 9.85% from 55nm, 47.84% from 90nm, 26.84% from 110nm, and 15.46% from 150nm [8] Financial Ratios - Key financial ratios for 2024 include a gross margin of 25.5%, a net margin of 5.8%, and a return on equity (ROE) of 2.6% [11] - The company maintains a debt-to-asset ratio of 48.2% and a current ratio of 1.3 for 2024 [11] Cash Flow Overview - The company expects operating cash flow of 2.754 billion yuan in 2024, with significant capital expenditures planned [12]