证券代码:688535 证券简称:华海诚科 公告编号:2025-063 江苏华海诚科新材料股份有限公司 关于公司部分募投项目结项并将节余募集资金 永久补充流动资金 及部分募投项目延期的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏,并对其内容的真实性、准确性和完整性承担法律责任。 江苏华海诚科新材料股份有限公司(以下简称"公司")于 2025 年 9 月 26 日召开第四届董事会第六会议,审议通过了《关于公司部分募投项目结项并将节 余募集资金永久补充流动资金及部分募投项目延期的议案》,保荐机构光大证券 股份有限公司出具了同意的核查意见,具体情况如下: ー、募集资金基本情况 中国证券监督管理委员会出具了《关于同意江苏华海诚科新材料股份有限公 司首次公开发行股票注册的批复》（证监许可〔2023〕86 号），同意公司首次公 开发行股票的注册申请。公司获准首次向社会公众公开发行人民币普通股（A 股） 2,018 万股，每股面值为人民币 1.00 元，每股发行价格为人民币 35.00 元，募 集资金总额为人民币 706,300,000.00 元，扣除各项发行费用（不含增值税）人 ...

证券代码：688535 证券简称：华海诚科 公告编号：2025-067 江苏华海诚科新材料股份有限公司 第四届董事会第六次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 一、董事会会议召开情况 江苏华海诚科新材料股份有限公司（以下简称"公司"）第四届董事会第六 次会议于 2025 年 9 月 26 日（星期五）在连云港经济技术开发区东方大道 66 号 江苏华海诚科新材料股份有限公司会议室以现场结合通讯的方式召开。会议通知 已于 2025 年 9 月 21 日通过邮件的方式送达各位董事。本次会议应出席董事 6 人，实际出席董事 6 人。 二、董事会会议审议情况 （一）审议通过《关于公司部分募投项目结项并将节余募集资金永久补充 流动资金及部分募投项目延期的议案》 具体内容详见公司同日披露于上海证券交易所网站（www.sse.com.cn）的《江 苏华海诚科新材料股份有限公司关于公司部分募投项目结项并将节余募集资金 永久补充流动资金及部分募投项目延期的公告》（公告编号 2025-063）。 表决结果：6 票同意，0 票反对，0 票弃权。 （二）审议通过《关于向 2024 年限制性股 ...

江苏华海诚科新材料股份有限公司 董事会薪酬与考核委员会 关于2024年限制性股票激励计划 预留授予激励对象名单的核查意见 江苏华海诚科新材料股份有限公司(以下简称"公司")董事会薪酬与考核委 员会依据《中华人民共和国公司法》(以下简称"《公司法》")、《中华人民共 和国证券法》(以下简称"《证券法》")、《上市公司股权激励管理办法》(以下 简称"《管理办法》")《上海证券交易所科创板股票上市规则》(以下简称"《 上市规则》")、《科创板上市公司自律监管指南第4号——股权激励信息披露》 等相关法律、法规及规范性文件和《江苏华海诚科新材料股份有限公司章程》(以 下简称"《公司章程》")的有关规定，对《江苏华海诚科新材料股份有限公司 2024年限制性股票激励计划(草案)》(以下简称"本次激励计划"或"《激励 计划》")预留授予激励对象名单进行了核查，发表核查意见如下： 1、公司本次激励计划所确定的激励对象具备《公司法》《证券法》《上市规 则》等法律、法规和规范性文件及《公司章程》规定的任职资格，且不存在《管理办 法》规定的不得成为激励对象的下列情形： (1)最近12个月内被证券交易所认定为不适当人选； (2)最近1 ...

Group 1 - The company Huahai Chengke (SH 688535) announced that its fourth board meeting was held on September 26, 2025, to discuss the adjustment of the stock incentive plan for 2024 [1] - As of the report, Huahai Chengke has a market capitalization of 8.9 billion yuan [1]

格隆汇9月26日丨华海诚科(688535.SH)公布，公司于2025年9月26日召开第四届董事会第六次会议，审 议通过了《关于向2024年限制性股票激励计划激励对象授予预留限制性股票的议案》，董事会认为本次 激励计划规定的授予条件已经成就，同意限制性股票的授予日为2025年9月26日，以25.77元/股的授予 价格向符合授予条件的8名激励对象授予9.90万股限制性股票。 ...

Company Overview - Huahai Chengke New Materials Co., Ltd. is located in Lianyungang, Jiangsu Province, and was established on December 17, 2010. The company went public on April 4, 2023. Its main business involves the research, production, and sales of electronic packaging materials for semiconductor devices, special devices, integrated circuits, rare earth permanent magnet motors, and LED brackets [1]. Financial Performance - As of September 26, Huahai Chengke's stock price dropped by 5.02%, trading at 111.37 CNY per share, with a transaction volume of 411 million CNY and a turnover rate of 6.82%. The total market capitalization is 8.987 billion CNY [1]. Revenue Composition - The revenue composition of Huahai Chengke is as follows: epoxy encapsulation materials account for 92.80%, adhesives for 6.23%, and other products for 0.98% [1]. Fund Holdings - Huayuan Yuanda Fund has a significant holding in Huahai Chengke, with its fund "Huayuan Yuanda Anxin Flexible Allocation Mixed A" (000273) holding 3,154 shares, representing 4.19% of the fund's net value, making it the fourth-largest holding [2]. Fund Performance - The "Huayuan Yuanda Anxin Flexible Allocation Mixed A" fund has a total scale of 6.3752 million CNY and has achieved a year-to-date return of 17.1%, ranking 4,973 out of 8,171 in its category. Over the past year, it has returned 30.71%, ranking 4,715 out of 8,004, and since inception, it has returned 186.41% [2]. Fund Management - The fund is managed by Li Wuqin and Hong Xiao. Li Wuqin has a tenure of 9 years and 162 days, with a total fund asset size of 17.6 million CNY, achieving a best return of 101.67% and a worst return of -33.82% during his tenure. Hong Xiao has been managing for 99 days, with a fund size of 647.77 thousand CNY, achieving a best return of 13.19% and a worst return of 13.01% [3].

【深圳商报讯】（记者 陈燕青）去年证监会发布"并购六条"至今已满一年，A股并购重组市场活力释 放。根据Wind统计，最近一年A股公司累计披露重大资产重组230单，同比翻倍；最近一年共有30家公 司重组上会，同比大增近九成。从最近一年并购重组项目来看，产业并购超过七成，新质生产力行业占 比超七成，集中在半导体、信息技术、装备制造、计算机等领域。 去年9月24日，证监会发布"并购六条"，支持上市公司向新质生产力方向转型升级，鼓励上市公司加强 产业整合。 中国船舶吸收合并中国重工，此次交易是A股有史以来规模最大的吸收合并案例。作为存续公司，中国 船舶总资产将超4000亿元，营业收入超1300亿元。 9月22日，华海诚科公告称，公司发行股份及支付现金购买衡所华威电子70%股权事项，已获证监会注 册批复，这也是半导体封装材料环氧塑封料行业龙头的强强联合。 在并购市场交易活跃度提升的同时，支付方式多元化成为这轮并购重组的特征之一。据记者梳理，最近 一年实施并购的方式包括定向可转债、定增募资、现金收购、并购贷款、并购基金等。 "本轮政策重点在新兴产业的并购以及产业链上下游的整合，"北方一家券商投行高管对记者表示，从最 近一 ...

Group 1 - The core point of the news is that Huahai Chengke has received approval from the CSRC for a major asset restructuring plan, which involves acquiring 70% of Hengsu Huawai for a total price of 1.12 billion yuan, aiming to achieve 100% control post-transaction [2][3] - The acquisition is expected to propel Huahai Chengke from a domestic semiconductor packaging materials company to a world-class player in the industry, marking a significant leap in its development [3][4] - The acquisition comes with a high premium of 321.98%, raising concerns about potential goodwill impairment risks due to the absence of a performance compensation mechanism [5][6] Group 2 - Huahai Chengke's revenue from 2021 to 2024 shows fluctuations, with figures of 347 million yuan, 303 million yuan, 283 million yuan, and 332 million yuan respectively, indicating a decline in 2022 and 2023 [4] - The company's R&D expenses have been increasing year-on-year, with amounts of 18.29 million yuan, 24.64 million yuan, and 26.41 million yuan from 2022 to 2024, reflecting a commitment to innovation [4] - The company holds 31 invention patents and 84 utility model patents, emphasizing its focus on protecting core technologies and enhancing its competitive edge in the semiconductor packaging materials sector [4] Group 3 - The acquisition of Hengsu Huawai is part of a broader trend in the semiconductor industry, where mergers and acquisitions are accelerating due to the recovery of the global semiconductor market [7][8] - The demand for semiconductors is expected to grow continuously, driven by sectors such as smart vehicles, robotics, cloud computing, and artificial intelligence, which will further encourage companies to pursue mergers to meet market needs [9] - Experts predict that the trend of mergers and acquisitions in the semiconductor industry will persist for a considerable time, as domestic companies seek to catch up with international standards through strategic acquisitions [8][9]

Core Viewpoint - Huahai Chengke's stock price has seen a significant increase, reflecting strong market interest and potential growth in the semiconductor and electronic packaging materials sector [1][2]. Group 1: Company Overview - Huahai Chengke New Materials Co., Ltd. is located in Lianyungang, Jiangsu Province, and was established on December 17, 2010. The company went public on April 4, 2023 [1]. - The main business involves the research, production, and sales of electronic packaging materials for semiconductor devices, special devices, integrated circuits, rare earth permanent magnet motors, and LED brackets. The revenue composition is as follows: epoxy encapsulation materials 92.80%, adhesives 6.23%, and others 0.98% [1]. Group 2: Stock Performance - As of September 24, Huahai Chengke's stock price rose by 5.09% to 115.00 CNY per share, with a trading volume of 397 million CNY and a turnover rate of 6.79%. The total market capitalization is 9.28 billion CNY. The stock has increased for six consecutive days, with a cumulative increase of 15.65% during this period [1]. Group 3: Fund Holdings - Jin Xin Fund has a significant holding in Huahai Chengke, with its Jin Xin Minchang Mixed A Fund (005412) holding 29,300 shares, accounting for 3.45% of the fund's net value, ranking as the tenth largest holding. The estimated floating profit today is approximately 163,100 CNY, with a total floating profit of 433,700 CNY during the six-day increase [2]. - Jin Xin Minchang Mixed A Fund was established on May 21, 2020, with a current scale of 36.47 million CNY. Year-to-date returns are 35.06%, ranking 2323 out of 8173 in its category, while the one-year return is 32.01%, ranking 4859 out of 7996. Since inception, the fund has achieved a return of 67.97% [2].

Core Viewpoint - The future of artificial intelligence (AI) still has room for growth, but the leading sectors are shifting from CPO and PCB to the undervalued storage chip market, particularly companies closely tied to Huawei, Samsung, and SK Hynix, which may replicate significant growth stories [1] Group 1: Market Dynamics - The storage chip market has entered a "scramble for goods" phase, with Micron and SK Hynix announcing full-year HBM capacity sold out in Q1 [3] - Citigroup warns that the global storage chip market may face a comprehensive shortage by 2026 [3] - A price surge has begun, with SanDisk announcing over a 10% price increase across all storage products, and Micron planning a 20%-30% price hike on channel products [3] Group 2: HBM Market Potential - Not all storage chips are experiencing growth; HBM chips, which are highly correlated with AI, are considered "scarce assets" [3] - HBM technology, utilizing 3D stacking, enhances bandwidth by 3-5 times compared to traditional DRAM, reduces power consumption by nearly half, and decreases space usage by over 90%, making it crucial for overcoming high-end computing bottlenecks [3] - According to Guosheng Securities, the global HBM market size is projected to surge from $17 billion in 2024 to $98 billion by 2030, indicating nearly fivefold growth over five years [3] Group 3: Key Companies in HBM Sector - **Huahai Chengke**: The only domestic company achieving mass production of GMC (granular epoxy encapsulation material), which is essential for HBM packaging and has been validated by multiple clients [4] - **Saiteng Co., Ltd.**: The only A-share company producing HBM measurement equipment, having acquired Japanese Optima to master one of the three global HBM full-process detection technologies, with precision reaching 0.1 microns, supplying major storage giants like Samsung and SK Hynix [5] - **Shannon Chip Creation**: The exclusive cloud service storage agent for SK Hynix in mainland China, benefiting directly from the surge in HBM demand through exclusive agency of DDR5 and HBM high-end storage [6] - **Invisible Champion in HBM Materials**: The only domestic company achieving mass production of HBM precursors, also involved in electronic specialty gases and silicon micropowder, filling domestic gaps and forming a complete supply chain for HBM materials [7]