Core Viewpoint - The company Huahai Chengke reported a mixed financial performance for Q1 2025, with revenue growth but a significant decline in net profit due to increased costs related to employee stock incentives and depreciation from new facilities [1][2]. Financial Performance Summary - Q1 2025 revenue reached 83.87 million yuan, a year-on-year increase of 15.84% compared to 72.40 million yuan in the same period last year [2]. - Net profit attributable to shareholders decreased by 43.56% to 7.21 million yuan from 12.77 million yuan year-on-year [2]. - The company's net profit after excluding non-recurring items fell by 48.97% to 6.56 million yuan from 12.86 million yuan year-on-year [2]. Annual Performance Overview - For the full year 2024, Huahai Chengke achieved a revenue of 332 million yuan, up 17.23% from 283 million yuan in 2023 [3]. - The net profit attributable to shareholders for 2024 was 40.06 million yuan, reflecting a 26.63% increase from 31.64 million yuan in 2023 [3]. - The net profit after excluding non-recurring items rose by 24.59% to 34.13 million yuan from 27.40 million yuan year-on-year [3]. Product and Market Insights - Huahai Chengke specializes in the research, production, and sales of epoxy molding compounds and electronic adhesives, primarily used in semiconductor packaging and board-level assembly [4]. - The production of epoxy molding compounds reached 12,400 tons in the reporting period, marking a 20.40% increase, with revenue from this segment at 316 million yuan, up 18.81% [4]. - The adhesive segment saw a production decline of 20.92% to 36.23 tons, but revenue increased by 8.44% to 15 million yuan, with a gross margin of 35.05%, down 7.02 percentage points from the previous year [4]. Strategic Initiatives - The company is planning to acquire 100% of Hengsu Huawai through a combination of cash and stock issuance, which is expected to enhance production scale and efficiency [5]. - A project to build a high-density integrated circuit and system-level module packaging epoxy molding compound facility is underway, with an expected annual production capacity of 11,000 tons upon completion [5]. - As of the reporting period, the company has invested 184 million yuan in fundraising projects, achieving 63.83% of the planned progress [5].

证券代码：688535 证券简称：华海诚科 公告编号：2025-030 江苏华海诚科新材料股份有限公司 关于股份回购进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2024/12/31 | | --- | --- | | 回购方案实施期限 | 待董事会审议通过后 12 个月 | | 预计回购金额 | 2,500万元~5,000万元 | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 √用于转换公司可转债 | | | □为维护公司价值及股东权益 | | 累计已回购股数 | 39.15万股 | | 累计已回购股数占总股本比例 | 0.49% | | 累计已回购金额 | 2,753.91万元 | | 实际回购价格区间 | 62.17元/股~88.99元/股 | 一、回购股份的基本情况 江苏华海诚科新材料股份有限公司（以下简称"公司"）于 2024 年 12 月 27 日召开第三届董事会第二十一次会议，审议通过了《关于以集中竞价方式回购公 司股份方案的议案》，同意自 ...

Core Viewpoint - The company, Jiangsu Huahai Chengke New Materials Co., Ltd., emphasizes its commitment to transparency and accuracy in financial reporting, as well as its strategic focus on enhancing core competitiveness through innovation and sustainable development [1][7][10]. Financial Data - The first quarter financial report for 2025 has not been audited, and the company has provided key financial data and indicators in RMB [2][5]. - The company reported a total of 94,656 shares repurchased, accounting for 0.12% of the total share capital, with a total expenditure of approximately RMB 7.999 million [4]. Shareholder Information - The company plans to repurchase shares using its own funds and bank loans, with a total repurchase amount between RMB 25 million and RMB 50 million, and a maximum price of RMB 121.99 per share [4][10]. Business Strategy - The company is focused on deepening its core business in semiconductor packaging materials, aiming to enhance its R&D capabilities and product offerings in response to emerging technologies such as AI, 5G, and IoT [11][10]. - The company plans to continue its high investment in R&D, with a reported R&D expenditure of RMB 26.41 million in 2024, reflecting a year-on-year increase of 7.15% [12][10]. Mergers and Acquisitions - The company has acquired a 30% stake in Hengsuo Huawai Electronics and plans to acquire the remaining 70% through a combination of shares, convertible bonds, and cash, which will enhance its capabilities in semiconductor packaging materials [15][10]. Corporate Governance - The company is committed to improving its governance structure and compliance with relevant laws and regulations, ensuring a clear division of responsibilities among its board, supervisory board, and management [16][10]. Investor Relations - The company prioritizes effective communication with investors and aims to enhance the quality of its disclosures and investor engagement through various channels [18][10]. Social Responsibility - The company adheres to its core values of integrity, technological innovation, and quality excellence, while actively fulfilling its social responsibilities and contributing to the stability of the capital market [19][10].

证券代码：688535 证券简称：华海诚科 公告编号：2025-029 表决结果：3 票同意，0 票反对，0 票弃权。 一、监事会会议召开情况 江苏华海诚科新材料股份有限公司（以下简称"公司"）第三届监事会第二 十三次会议于 2025 年 4 月 29 日（星期二）在连云港经济技术开发区东方大道 66 号江苏华海诚科新材料股份有限公司会议室以现场结合通讯的方式召开。会 议通知已于 2025 年 4 月 24 日通过邮件的方式送达各位监事。本次会议应出席监 事 3 人，实际出席监事 3 人。 会议由监事会主席陈青主持，公司高级管理人员列席会议。会议召开符合有 关法律、法规、规章和《公司章程》的规定。出席会议的监事对各项议案进行了 认真审议并做出了如下决议： 二、监事会会议审议情况 （一）、审议通过《关于公司 2025 年第一季度报告的议案》 经审议，监事会认为：公司已严格按照各项法律、法规、规范性文件的要求 规范运作，公司《2025 年第一季度报告》的编制和审议程序符合相关法律、行 政法规和中国证监会的相关规定，报告的内容真实、全面、公允地反映了公司本 报告期的财务状况及经营成果。我们保证公司《2025 年第一 ...

Financial Performance - The company's revenue for Q1 2025 was ¥83,874,474.65, representing a 15.84% increase compared to ¥72,402,604.63 in the same period last year[3] - Net profit attributable to shareholders decreased by 43.56% to ¥7,208,777.38 from ¥12,771,702.45 year-on-year[3] - The basic and diluted earnings per share both fell by 43.75% to ¥0.09 from ¥0.16 in the previous year[4] - Total operating revenue for Q1 2025 reached ¥83,874,474.65, an increase of 15.5% compared to ¥72,402,604.63 in Q1 2024[17] - Net profit for Q1 2025 was ¥7,140,076.45, a decrease of 44.1% from ¥12,771,727.42 in Q1 2024[18] - Operating profit for Q1 2025 was ¥7,286,167.76, down 51.6% from ¥15,042,851.09 in Q1 2024[18] - Basic earnings per share for Q1 2025 were ¥0.09, down from ¥0.16 in Q1 2024[18] Research and Development - Research and development expenses totaled ¥8,135,185.57, an increase of 50.85% compared to ¥5,392,889.91 in the same period last year, accounting for 9.70% of revenue[4] - Research and development expenses increased to ¥8,135,185.57 in Q1 2025, compared to ¥5,392,889.91 in Q1 2024, reflecting a rise of 50.9%[17] - The company plans to continue investing in R&D and expanding its product offerings to enhance market competitiveness[6] Cash Flow and Liquidity - The net cash flow from operating activities was negative at -¥2,345,166.56, an improvement from -¥3,243,303.78 in the previous year[3] - In Q1 2025, the company reported cash inflows from operating activities of CNY 36,252,366.49, an increase of 20.5% compared to CNY 30,066,938.87 in Q1 2024[19] - The net cash outflow from operating activities was CNY -2,345,166.56, improving from CNY -3,243,303.78 in the same period last year[19] - Cash outflows for purchasing goods and services decreased to CNY 13,236,374.65 from CNY 15,128,351.69, a reduction of 12.5%[19] - The company experienced a net cash outflow from investing activities of CNY -5,904,736.41, worsening from CNY -2,968,051.53 in Q1 2024[20] - The company's cash and cash equivalents at the end of Q1 2025 stood at CNY 31,730,326.97, up from CNY 30,217,615.90 at the end of Q1 2024[20] Assets and Liabilities - Total assets at the end of the reporting period were ¥1,385,995,300.27, a decrease of 1.19% from ¥1,402,647,705.52 at the end of the previous year[4] - Total liabilities decreased to ¥341,698,846.15 from ¥363,298,285.26, indicating a reduction of 5.6%[15] - The equity attributable to shareholders increased slightly by 0.48% to ¥1,044,074,392.88 from ¥1,039,069,276.16 at the end of the previous year[4] - The equity attributable to shareholders of the parent company increased to ¥1,044,074,392.88 from ¥1,039,069,276.16, a growth of 0.5%[15] Shareholder Information - The total number of common shareholders at the end of the reporting period is 9,289[8] - The largest shareholder, Han Jianglong, holds 11,241,799 shares, representing 13.93% of total shares[8] - The company has approved a share repurchase plan with a total amount between RMB 25 million and RMB 50 million, with a maximum repurchase price of RMB 121.99 per share[10] - The company has repurchased a total of 94,656 shares, accounting for 0.12% of the total share capital[10] - The highest repurchase price recorded was RMB 88.99 per share, while the lowest was RMB 81.18 per share[10] - The company has not reported any changes in the participation of major shareholders in margin trading or stock lending activities[9] Financial Costs - The company reported a decrease in financial expenses, with total financial costs at ¥1,524,632.34 compared to a gain of ¥83,892.43 in Q1 2024[17]

| 名称 | 持有数量(万股) | 占总股本比 | 增减情况 | | --- | --- | --- | --- | | | | 例(%) | (万股) | | 杨森茂 | 539.02 | 10.48 | 不变 | | 天水华天科技（002185）股份有限公司 | 325.76 | 6.33 | 不变 | | 深圳哈勃科技投资合伙企业(有限合伙) | 201.73 | 3.92 | -40.35 | | 李启明 | 117.73 | 2.29 | 不变 | | 钱方方 | 107.50 | 2.09 | 不变 | | 薛建民 | 89.91 | 1.75 | 不变 | | 陈青 | 86.67 | 1.68 | 不变 | | 许小平 | 81.45 | 1.58 | -1.31 | | 德邦半导体产业混合发起式A | 80.00 | 1.56 | -34.19 | | 上海盛宇股权投资基金管理有限公司-江苏盛宇华天创业投 | | | 新进 | | 资合伙企业(有限合伙) | 77.00 | 1.50 | | | 较上个报告期退出前十大股东有 | | | | | 中芯聚源私募基金管理(上海)有限公司-聚源信诚 ...

Core Viewpoint - The radio frequency power amplifier market is experiencing unprecedented growth driven by advancements in wireless communication technologies such as 5G, IoT, and autonomous driving, with a projected market size of $6.254 billion in 2024 and expected to reach $9.976 billion by 2031, reflecting a compound annual growth rate (CAGR) of 6.90% [1][13]. Industry Overview - Radio frequency power amplifiers are essential electronic devices that amplify input RF signals to higher power levels, crucial for wireless communication, radar, and satellite communication [3]. - The operational principle involves key steps: signal input and matching, signal amplification, and output matching and load driving [3]. Market Dynamics - The market is segmented into linear power amplifiers and switch-type power amplifiers, with linear amplifiers having high frequency but narrow bandwidth, while switch-type amplifiers offer high efficiency and output power but lower linearity [5]. - The demand for RF power amplifiers is significantly driven by the increasing number of 5G base stations, with an expected construction of 4.251 million base stations in China by 2024, an increase of 874,000 from the previous year [11]. Industry Chain - The RF power amplifier industry chain includes upstream suppliers of EDA software, substrate materials, and packaging materials, midstream manufacturers of RF power amplifiers, and downstream manufacturers or operators in mobile terminals, communication base stations, IoT devices, and military radar [7]. Substrate Materials - Common substrates for RF power amplifiers include Si, GaAs, and GaN, with GaAs being the mainstream substrate due to its superior performance in mobile terminals and micro base stations [9]. - The global GaAs substrate market was approximately $200 million in 2019 and is projected to reach $348 million by 2025, with a CAGR of 9.67% [9]. Competitive Landscape - The RF power amplifier market is primarily dominated by American companies such as Skyworks, Qorvo, and Broadcom, while domestic companies in China are gaining competitive advantages through better understanding of local markets and cost control [15]. - Key domestic players include Weijie Chuangxin, Shenzhen Feixiang Technology, Guangzhou Huizhiwei Electronics, and Jiangsu Zhuosheng Microelectronics [15][16]. Company Performance - Weijie Chuangxin reported a revenue of 854 million yuan for its RF power amplifier modules in the first half of 2024, a year-on-year increase of 7.14% [16]. - Guangzhou Huizhiwei Electronics achieved a revenue of 384 million yuan in the first three quarters of 2024, a year-on-year decrease of 3.59%, with a net loss of 298 million yuan [18]. Future Trends - The industry is expected to pursue higher power density, efficiency, and linearity to meet the demands of complex communication environments, with a trend towards miniaturization and integration of RF power amplifiers [20]. - The integration of artificial intelligence technologies is anticipated to enable smart and adaptive RF power amplifiers that optimize power output, gain, and linearity in real-time [20].

证券代码：688535 证券简称：华海诚科 公告编号：2025-028 江苏华海诚科新材料股份有限公司 第三届监事会第二十二次会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 一、监事会会议召开情况 江苏华海诚科新材料股份有限公司（以下简称"公司"）第三届监事会第二 十二次会议于 2025 年 4 月 22 日（星期二）在连云港经济技术开发区东方大道 66 号江苏华海诚科新材料股份有限公司会议室以现场结合通讯的方式召开。会 议通知已于 2025 年 4 月 12 日通过邮件的方式送达各位监事。本次会议应出席监 事 3 人，实际出席监事 3 人。 会议由监事会主席陈青主持，公司高级管理人员列席会议。会议召开符合有 关法律、法规、规章和《公司章程》的规定。出席会议的监事对各项议案进行了 认真审议并做出了如下决议： 二、监事会会议审议情况 （一）审议通过《关于 2024 年度监事会工作报告的议案》 监事会认为：公司《华海诚科 2024 年度监事会工作报告》真实、准确、完 整地体现了公司监事会 2024 年度的工作情况。监 ...

Company Overview - The company is dedicated to the research, production, and sales of semiconductor packaging materials, specifically epoxy molding compounds and electronic adhesives, and is one of the few specialized factories in China for chip-level solid and liquid packaging materials [8][9] - The main products include epoxy molding compounds and electronic adhesives, which are widely used in semiconductor packaging and board-level assembly [9][12] Business Model - The company employs a research and development model focused on optimizing the formulation and production processes of semiconductor packaging materials [10] - The procurement model involves a dedicated procurement department that collaborates with various departments to select suppliers and manage material needs [10] - The production model combines sales-driven production with demand forecasting to ensure alignment between production plans and sales [11] - The sales model is customer-centric, primarily targeting direct customers while also engaging with trading partners, with a strong sales presence in East China, Southwest China, and South China [11] Industry Position - Since its establishment in 2010, the company has focused on the R&D and industrialization of semiconductor packaging materials, achieving significant technological advancements and market recognition [19] - The company is recognized as a national high-tech enterprise and has established stable partnerships with leading industry players, enhancing its market share and brand influence [19] Financial Performance - In the reporting period, the company achieved operating revenue of 331.63 million yuan, a year-on-year increase of 17.23%, and a net profit attributable to shareholders of 40.06 million yuan, up 26.63% year-on-year [24] Profit Distribution Plan - The company plans to distribute a cash dividend of 2.00 yuan per 10 shares (including tax) for the 2024 fiscal year, with a total proposed cash dividend amounting to approximately 24.13 million yuan, representing 60.23% of the net profit attributable to shareholders [55][54]

Core Viewpoint - Huahai Chengke reported a significant increase in revenue and net profit for the year 2024, indicating a positive trend in the semiconductor packaging materials market as it enters a recovery phase after a downturn that began in late 2022 [1][4]. Financial Performance - The company's operating revenue reached 332 million yuan, a year-on-year increase of 17.23% - The net profit attributable to shareholders was 40 million yuan, up 26.63% year-on-year - The net profit after deducting non-recurring items was 34 million yuan, reflecting a growth of 24.59% year-on-year [1] - Cash flow from operating activities decreased significantly to 2.9765 million yuan, down 90.58% year-on-year, primarily due to increased employee compensation and reduced government subsidies [1] Product Performance - Revenue from epoxy encapsulation materials was 316 million yuan, an increase of 18.81% year-on-year, with a gross margin of 25.16%, down 0.40 percentage points from the previous year - Adhesive revenue was 15 million yuan, growing by 8.44% year-on-year, but with a gross margin of 35.05%, down 7.02 percentage points from the previous year [2][3] Market Position and Competition - Huahai Chengke is a leading domestic semiconductor packaging materials manufacturer, increasing its market share in traditional packaging while making technological breakthroughs in advanced packaging [4] - In the traditional packaging sector, domestic manufacturers dominate the market for epoxy encapsulation materials, while foreign brands have largely retreated - In advanced packaging fields like QFN, BGA, and FOWLP, foreign brands maintain a monopoly, with domestic brands still in the early stages of sales or R&D [5] Product Development and Future Outlook - The company is focusing on high-value-added products, although some products still face margin pressure - Huahai Chengke has successfully developed high-end packaging materials for advanced packaging applications, currently undergoing customer validation, with mass production expected to take time [6][5] - The company is progressing on investment projects, including a high-density integrated circuit packaging project, with 63.83% of the planned investment completed [7]