BOE(000725)
Search documents
290亿!京东方第6代新型半导体显示器件生产线全面量产
WitsView睿智显示· 2025-05-26 09:34
Core Viewpoint - BOE has successfully transitioned its 6th generation new semiconductor display device production line from construction to operation, marking a significant step in its strategy to enhance its position in the semiconductor display industry [1][3]. Investment and Production Details - The total investment for the 6th generation production line is 29 billion yuan, covering an area of 420,000 square meters, with a designed monthly production capacity of 50,000 pieces, which commenced construction in 2023 [3]. - The production line focuses on high-end products such as VR display panels, small to medium-sized high-value IT display panels, and automotive display panels, utilizing LTPO and LTPS technologies [3][4]. Technological Innovations - BOE's LTPO technology combines the high mobility of LTPS and the low power consumption of Oxide, achieving over 1500 PPI ultra-high pixel density while significantly reducing panel power consumption [4]. - The company has developed a 2117 PPI Real RGB display screen, achieving the highest resolution in the LCD industry [4]. Product Offerings - During the delivery event, BOE showcased several products ready for mass production, including a 2.24-inch 1500 PPI and 1700 PPI VR display module, a 16-inch 240Hz gaming laptop screen (resolution 2560×1600, 100% DCI-P3 color gamut), and a 14.6-inch narrow bezel high-end automotive central control screen [4].
搭载京东方技术,飞利浦推出全球首款圆偏光LCD显示器
WitsView睿智显示· 2025-05-26 05:43
此外,官方还提到这款显示器支持DC调光技术及德国莱茵TÜV无频闪、低蓝光双重护眼认证,在 护眼方面表现较为突出。 #显示器面板 【 IT之家 】 5 月23日, 飞利浦 宣布 推出"全球首款圆偏光LCD显示器"27M2N3500UK ,定价为 1199元,规格为"2K 300Hz" 。 图片来源:飞利浦显示器 据了解, 这款显示器配备一款2560x1440分辨率300Hz Fast IPS面板,显示器GtG响应速度1ms, SDR峰值亮度450尼特,覆盖95.8% DCI-P3、100% sRGB和100% sRGB色域。 此次推出的飞利浦EVNIA舒视蓝4.0显示器采用BOE(京东方)新一代圆偏光技术, 在屏幕表面搭 载独特的圆偏光护眼层,相比传统线偏振光技术,其光矢量端点轨迹呈圆形,偏振方向随时间均匀 分布,通过模拟太阳光的螺旋扩散原理,使得显示器发出的光更接近自然光,可大幅减少光线对晶 状体和视网膜的定向刺激,为用户提供更接近自然光的健康护眼体验。 ▶ 关于集邦 上下滑动查看 ...
债市“科技板”发力显效总规模逾2865亿元 一马当先银行已成发行主体主力
Zheng Quan Ri Bao· 2025-05-25 16:07
Core Viewpoint - The issuance of technology innovation bonds (referred to as "Tech Bonds") has significantly increased, particularly following the launch of the "Technology Board" in the interbank bond market on May 9, with 110 issuers having issued 135 Tech Bonds totaling over 286.5 billion yuan by May 25 [1][2] Group 1: Issuance Overview - A total of 135 Tech Bonds have been issued by 110 entities, with a total scale exceeding 286.5 billion yuan [1] - Banks are the primary issuers, with 14 banks collectively issuing 170 billion yuan, accounting for approximately 60% of the total issuance [1][2] - Securities companies have issued a total of 17.4 billion yuan through 13 issuers, while equity investment institutions have issued 7.31 billion yuan through 17 bonds [2] Group 2: Issuer Types and Their Activities - Financial institutions, including banks and securities companies, are actively participating in the issuance of Tech Bonds, reflecting a trend of financial resources being directed towards technology innovation [2] - The average issuance size of Tech Bonds by banks is larger than that of other institutions, with funds primarily allocated to loans for technology innovation [2][3] - Technology companies have issued 83 Tech Bonds totaling 91.798 billion yuan, covering both traditional industries and emerging sectors such as semiconductors and smart manufacturing [3] Group 3: Use of Proceeds and Bond Characteristics - The proceeds from bank-issued Tech Bonds are mainly used for loans in the technology innovation sector, while securities companies use the funds for investments in technology innovation [4] - The majority of the 135 Tech Bonds have medium to long-term maturities, with 6 bonds having maturities of no less than 10 years [4] - Most Tech Bonds are fixed-rate, with only 2 out of 135 being floating-rate bonds, indicating a preference for stable financing options [4] Group 4: Policy Support and Market Expansion - The rapid development of Tech Bonds is supported by significant policy backing, including the announcement by the People's Bank of China and the China Securities Regulatory Commission on May 7 [5] - The introduction of risk-sharing tools for Tech Bonds is expected to lower financing costs and encourage more investors to participate [5][6] - Future improvements in the supporting measures for Tech Bonds, such as simplified disclosure rules and government guarantees, are anticipated to enhance market liquidity and reduce default risks [6]
京东方申请像素电路、驱动方法和显示装置专利,在高频显示时能保证数据电压写入时间
Jin Rong Jie· 2025-05-24 12:06
Group 1 - BOE Technology Group Co., Ltd. and its subsidiaries have applied for a patent titled "Pixel Circuit, Driving Method, and Display Device" with publication number CN120032594A, filed on March 2025 [1] - The patent describes a pixel circuit that includes a driving circuit, first control circuit, first reset circuit, first storage circuit, second storage circuit, and data writing circuit, indicating advancements in display technology [1] - The first control circuit manages the connection between the power voltage terminal and the second node under the control of a first reset control signal, showcasing the technical complexity of the proposed invention [1] Group 2 - BOE Technology Group Co., Ltd. was established in 1993 in Beijing, primarily engaged in the manufacturing of computers, communications, and other electronic devices, with a registered capital of approximately 3.77 billion RMB [2] - The company has invested in 67 enterprises and participated in 246 bidding projects, indicating a strong presence in the market [2] - Chengdu BOE Optoelectronics Technology Co., Ltd., established in 2007, also focuses on similar manufacturing activities with a registered capital of 2.5 billion RMB and has participated in 860 bidding projects [2] - Beijing BOE Technology Development Co., Ltd., founded in 2016, specializes in technology promotion and application services, with a registered capital of 38 million RMB and has invested in one enterprise [2]
京东方等申请一种改善漏光及断裂不良问题的阵列基板等专利,改善在触控电极与触控走线导通的过孔处、像素电极与晶体管导通的过孔处存在漏光以及二者漏光不均匀的问题
Jin Rong Jie· 2025-05-24 03:46
Group 1 - The core viewpoint of the news is the application of a patent by BOE Technology Group Co., Ltd. and Ordos Yuansheng Optoelectronics Co., Ltd. for a technology aimed at improving display panel performance [1] - The patent, titled "An Array Substrate, Display Panel, and Display Device," addresses issues such as light leakage and uneven light leakage at the connection points of touch electrodes and pixel electrodes [1] - The patent application was filed on November 2023, indicating ongoing innovation in the display technology sector [1] Group 2 - BOE Technology Group Co., Ltd. was established in 1993 and is primarily engaged in the manufacturing of computers, communications, and other electronic devices, with a registered capital of approximately 3.77 billion RMB [2] - The company has invested in 67 enterprises and participated in 246 bidding projects, holding 5000 patent records and 776 trademark records [2] - Ordos Yuansheng Optoelectronics Co., Ltd. was founded in 2011, focusing on electrical machinery and equipment manufacturing, with a registered capital of approximately 1.18 billion RMB [2] - This company has invested in 1 enterprise, participated in 200 bidding projects, and holds 1899 patent records [2]
京东方申请阵列基板及液晶显示面板专利,可解决现有技术中无法在加热线的延伸方向上进行热量补偿的问题
Jin Rong Jie· 2025-05-24 01:43
Group 1 - BOE Technology Group Co., Ltd. and Chengdu BOE Optoelectronics Technology Co., Ltd. have applied for a patent titled "Array Substrate and Liquid Crystal Display Panel" with publication number CN120035788A, filed on March 2023 [1] - The patent describes an array substrate and liquid crystal display panel that includes a display area (AA) and a peripheral area (CC) surrounding the display area, with multiple heating zones (1) in the display area [1] - Each heating zone (1) is equipped with heating electrodes (12), and the array substrate also includes a temperature control module (3) and heating line modules, which consist of multiple heating line groups corresponding to each heating zone [1] Group 2 - BOE Technology Group Co., Ltd. was established in 1993 in Beijing, primarily engaged in the manufacturing of computers, communications, and other electronic devices, with a registered capital of 3,765,252.9195 million RMB [2] - The company has invested in 67 enterprises, participated in 246 bidding projects, and holds 776 trademark records and 5,000 patent records [2] - Chengdu BOE Optoelectronics Technology Co., Ltd. was founded in 2007 in Chengdu, also focusing on the manufacturing of computers, communications, and other electronic devices, with a registered capital of 2,500,000 million RMB [2] - This subsidiary has participated in 859 bidding projects and holds 5,000 patent records, along with 486 administrative licenses [2]
京东方A: 2024年度股东大会决议公告

Zheng Quan Zhi Xing· 2025-05-23 10:48
Meeting and Attendance - The shareholder meeting was held on May 23, 2025, starting at 10:00 AM, with online voting available from 9:15 AM to 3:00 PM on the same day [1] - A total of 11,472,417,007 shares were represented, accounting for 30.6617% of the company's voting rights [1] - 15 individuals attended the meeting in person, representing 5,964,222,572 shares, which is 15.9402% of the voting rights [1] Proposal Voting Results - The meeting adopted a combination of on-site and online voting methods [1] - Proposal voting results showed a high level of agreement, with the overall approval rate for various proposals exceeding 96% [2][3] - Specific proposals affecting minority shareholders were counted separately, with significant support from small shareholders [1][2] Legal Opinions - The legal opinion confirmed that the meeting procedures complied with Chinese laws and regulations, and the qualifications of attendees were valid [3] - The voting procedures and results were deemed legal and effective [3]
京东方A(000725) - 关于回购公司部分社会公众股份并注销暨通知债权人的公告
2025-05-23 10:34
证券代码:000725 证券简称:京东方 A 公告编号:2025-039 证券代码:200725 证券简称:京东方 B 公告编号:2025-039 京东方科技集团股份有限公司 关于回购公司部分社会公众股份并注销 暨通知债权人的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、 完整,没有虚假记载、误导性陈述或重大遗漏。 京东方科技集团股份有限公司(以下简称"公司")分别于 2025 年 4 月 18 日、2025 年 5 月 23 日召开第十一届董事会第四次会议和 2024 年度股东大会,审议通过了《关于回购公司部分社会公众股份的 议案》。具体内容详见公司 2025 年 4 月 22 日刊登于巨潮资讯网的 《关于回购公司部分社会公众股份方案的公告》(公告编号:2025- 029)。 公司结合自身财务状况、经营状况,拟以自筹资金回购部分社会 公众股份予以注销并减少公司注册资本,通过增厚每股收益,传达成 长信心,维护公司价值,切实提高公司股东的投资回报。公司本次回 购股份的种类为公司已发行的 A 股股份,在回购价格不超过 6.11 元/ 股的条件下,按回购金额上限 20 亿测算,预计回购股份数量不低于 3 ...
京东方A(000725) - 2024年度股东大会决议公告
2025-05-23 10:30
京东方科技集团股份有限公司 2024 年度股东大会决议公告 | 证券代码:000725 | 证券简称:京东方 | A | 公告编号:2025-038 | | --- | --- | --- | --- | | 证券代码:200725 | 证券简称:京东方 | B | 公告编号:2025-038 | 本公司及董事会全体成员保证信息披露的内容真实、准确、完整, 没有虚假记载、误导性陈述或重大遗漏。 一、会议召开和出席情况 1、时间: (1)现场会议开始时间:2025 年 5 月 23 日 10:00 (2)网络投票时间: 通过深圳证券交易所交易系统进行网络投票的具体时间为:2025 年 5 月 23 日的交易时间,即 9:15-9:25,9:30-11:30 和 13:00-15:00。 通过深圳证券交易所互联网投票系统投票的具体时间为:2025 年 5 月 23 日 9:15 至 15:00 中的任意时间。 2、地点:京东方科技集团股份有限公司会议室(北京市北京经济技 术开发区西环中路 12 号) 3、方式:现场表决与网络投票相结合的方式 4、召集人:公司董事会 特别提示: 1、本次股东大会未出现否决议案的情形 ...
京东方A(000725) - 关于京东方科技集团股份有限公司2024年度股东大会的法律意见书
2025-05-23 10:30
中国北京市朝阳区建国路 77 号华贸中心 3 号写字楼 34 层 邮政编码 100025 电话: (86-10) 5809-1000 传真: (86-10) 5809-1100 北京市竞天公诚律师事务所 关于京东方科技集团股份有限公司 2024 年度股东大会的法律意见书 致:京东方科技集团股份有限公司 北京市竞天公诚律师事务所(以下称"本所")接受京东方科技集团股份有 限公司(以下称"公司")的委托,指派本所律师列席了公司于 2025 年 5 月 23 日在京东方科技集团股份有限公司会议室(北京市北京经济技术开发区西环中路 12 号)召开的公司 2024 年度股东大会(以下称"本次股东大会"),并依据《中 华人民共和国公司法》《中华人民共和国证券法》等中国现行法律、法规和其他 规范性文件(以下称"中国法律法规")及《京东方科技集团股份有限公司章程》 (以下称"《公司章程》")的规定,就本次股东大会的召集和召开方式、出席 会议人员资格、召集人资格、会议表决程序和表决结果等事宜(以下称"程序事 宜")出具本法律意见书。 为出具本法律意见书,本所律师审查了公司提供的有关本次股东大会的文件, 包括但不限于公司第十一届 ...