Core Viewpoint - BOE has successfully lit up the first product of its 8.6-generation AMOLED production line five months ahead of schedule, marking a significant milestone in the project and indicating a key breakthrough in medium-sized OLED technology development and mass production preparation [2] Group 1 - The successful lighting of the first product signifies a major milestone following the early completion of the production line [2] - This achievement establishes a solid foundation for subsequent product mass production and delivery [2] - The project has transitioned from the "construction phase" to the "operational phase" [2]

Core Viewpoint - BOE (京东方) has successfully lit up the first product from China's first 8.6-generation AMOLED production line five months ahead of schedule, marking a significant milestone in its production capabilities and technology advancement [1][4]. Group 1: Production Line Details - The total investment for the 8.6-generation AMOLED production line is 63 billion yuan, with a designed capacity of 32,000 glass substrates per month, focusing on high-end touch OLED displays for laptops and tablets [4]. - The production line utilizes FMM product technology compatible with flexible OLED and Hybrid OLED, offering advantages in yield, production efficiency, product quality, and luminous efficiency compared to other technologies [4]. - The OLED screens produced will feature lower power consumption and longer lifespan due to the use of low-temperature polycrystalline silicon oxide (LTPO) backplane technology and Tandem stacked light-emitting device fabrication processes [4]. Group 2: Milestones and Future Plans - Since its commencement in 2024, the production line has achieved significant breakthroughs, with the first batch of equipment arriving four months ahead of schedule in May 2025, setting a record for high-generation production line construction [4]. - The first product was lit up five months ahead of schedule, marking a key step towards mass production operations expected in 2026 [4]. - Starting in May next year, BOE plans to begin mass production of the 8.6-generation OLED panels for laptops, with clients including Acer and ASUS, although specific supply volumes have not yet been disclosed [4]. Group 3: Existing Production Capacity - BOE has already established three 6th-generation flexible AMOLED production lines in Chengdu, Chongqing, and Mianyang, with a cumulative shipment of over 500 million OLED displays [5]. - With the lighting of the first 8.6-generation AMOLED production line and upcoming mass production, BOE will operate four AMOLED production lines, reinforcing its leading position in OLED capacity and production technology [5].

12月22日，"BOE Tech Day走进理想汽车"活动在理想汽车北京研发总部成功举办。京东方科技集团高级副总裁、京东方精电董事会主席兼CEO苏宁先 生，理想汽车副总裁、供应链负责人孟庆鹏先生等双方核心高管团队出席活动并举行高层会谈，共探智能座舱技术创新与生态应用的未来路径。现场京东 方精电还带来了一系列极具未来感的智能座舱前沿科技，此次活动不仅为尖端技术打造了集中展示的舞台，更成为京东方精电与理想汽车基于深度互信与 共同愿景的重要桥梁。 极致画质，引领视觉升级 全球首发的画质增强技术内置领先图像算法，使得画面的全局细节极大增强，边界轮廓更清晰、暗场细节更丰富、纹理清晰、画面层次感更丰富，让每一 帧画面都栩栩如生；同时画面色彩饱和度高，场景艳丽生动，带来极致的视觉享受，可广泛应用于车载中控、副驾及后排娱乐显示。全新一代UB Cell超 高画质车载显示相较普通TFT显示产品视觉效果实现极大飞跃，以高对比度、极致黑态、广色域和超低反射率，树立座舱画质新标杆。 高端技术，重塑性能标杆 车规级双15.05英寸OLED双联屏拥有1000000:1超高对比度，带来震撼的视觉享受；行业领先的一体贴合工艺打造极致轻薄屏身， ...

转自：金融投资报 2026年1月1日，《中央企业违规经营投资责任追究实施办法》（以下简称"办法"）将正式施行，资本市 场迎来央企治理的制度性革新。这份明确98种违规情形、将5000万元及以上损失定为"重大损失"的"办 法"，不仅给央企经营套上"紧箍咒"，更将重塑央企参股上市公司的治理刚性与投资逻辑，为笔者预期 2026年即将出现的"央企尽责概念股"打开价值重估空间。 作为控股参股上市公司的大股东（特别是无实控人场景下的大股东），央企的投资行为长期影响着标的 公司的治理质量与发展走向。此前，*ST高鸿、中银5等退市案例中，央企大股东未能有效履职的问题 暴露无遗。从深交所第一家非ST股票一元"闪电"退市的中银绒业，到充分退市预警后严重造假退市的 *ST高鸿，诸多案例中都曾出现央企股东"缺位"，导致中小投资者利益受损的情况。 "办法"的落地恰逢其时，其核心突破在于将追责范围延伸至央企股权投资全链条。无论是跨界非主业投 资、参与金融衍生品交易，还是对参股公司失控失管等，均被纳入追责清单。从制度上遏制了央企盲目 投资、粗放管理的乱象。对于无实控人公司中的央企股东而言，办法明确了其作为重要股东的监督义 务，避免"控股不控 ...

12月29日突破年线个股乖离率排名 | 证券代 | 证券简 | 今日涨跌幅 | 今日换手率 | 年线 | 最新价 | 乖离率 | | --- | --- | --- | --- | --- | --- | --- | | 码 | 称 | （%） | （%） | （元） | （元） | （%） | | 002261 | 拓维信 息 | 10.00 | 15.48 | 30.88 | 33.77 | 9.36 | | 603116 | 红蜻蜓 | 9.95 | 3.81 | 5.78 | 6.30 | 9.00 | | 300716 | ST泉为 | 10.64 | 3.18 | 10.34 | 11.02 | 6.56 | | 002965 | 祥鑫科 技 | 7.00 | 10.56 | 38.87 | 40.81 | 4.99 | | 600178 | 东安动 力 | 10.03 | 5.76 | 12.59 | 13.16 | 4.51 | | 301589 | 诺瓦星 云 | 6.60 | 5.79 | 159.14 | 166.30 | 4.50 | | 000048 | 京基智 农 | 10.01 ...

| 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | --- | --- | --- | --- | --- | --- | | 300940 | 南极光 | 29.75 | -4.13% | 14.32万 | 4.27亿 | | 300269 | 联建光电 | 6.47 | -3.43% | 58.67万 | 3.82 亿 | | 688010 | 福光股份 | 31.40 | -3.09% | 7.81万 | 2.47亿 | | 301421 | 波长光电 | 104.99 | -2.62% | 5.57万 | 5.87亿 | | 688195 | 腾景科技 | 171.88 | -2.62% | 6.88万 | 11.83 乙 | | 688502 | 成莱光学 | 406.80 | -2.45% | 9660.62 | 3.93亿 | | 300889 | 爰克股份 | 20.78 | -2.30% | 5.95万 | 1.24亿 | | 002745 | 木林麻 | 9.52 | -2.16% | 25.89万 | 2.48亿 | | 688538 | 和辉光电 | ...

Core Viewpoint - The semiconductor industry is shifting from process competition to packaging innovation, with glass substrates emerging as a key material to overcome performance bottlenecks in advanced packaging [1][2]. Group 1: Industry Dynamics - Major companies like Samsung, Intel, AMD, and Nvidia are actively exploring glass substrates for next-generation chip development, indicating a strategic focus on this material [1]. - Recent developments include Japan's Rapidus exploring glass substrate technology and Samsung's plans to establish a joint venture with Sumitomo Chemical for glass substrate production [1][2]. Group 2: Advantages of Glass Substrates - Glass substrates offer significant advantages over traditional organic substrates and silicon interposers, including lower dielectric loss, excellent thermal stability, and high flatness [3][4]. - The electrical performance of glass substrates is superior, with signal transmission loss at 10GHz being only 0.3dB/mm, and dielectric loss reduced by over 50% compared to organic substrates [4]. - Glass substrates can achieve a thermal expansion coefficient (CTE) of 3-5ppm/°C, matching silicon chips and reducing warpage by 70% during thermal cycling [4]. Group 3: Types of Glass Substrates - Glass substrates are categorized into glass interposers and glass core substrates, each serving different roles in advanced packaging scenarios [3][6]. - Glass interposers are primarily used in 2.5D packaging, enabling high-density interconnections between multiple chips [6]. - Glass core substrates are aimed at 3D packaging and chiplet integration, providing a stable solution for increasing chip sizes and I/O counts [8]. Group 4: Industry Competition - The competition in the glass substrate market is intensifying, with companies like Intel, Samsung, TSMC, and new entrants like Rapidus and Absolics making significant investments and strategic moves [12][14][20]. - Intel has invested over $1 billion in developing glass substrate technology and aims for large-scale application by 2026-2030 [12][13]. - Samsung is pursuing a dual-line strategy, focusing on both rapid commercialization and long-term technological breakthroughs in glass substrates [14][15]. Group 5: Challenges and Barriers - The glass substrate industry faces challenges in scaling production, with many companies still in the early stages of development and validation [34][39]. - Key technical challenges include the efficiency and yield of TGV (Through Glass Via) processes, high-density wiring, and bonding reliability [35][41]. - Cost remains a significant barrier, with the production costs of glass substrates being substantially higher than traditional organic substrates, limiting their application in price-sensitive markets [39][40]. Group 6: Domestic Developments - Domestic companies in China are actively pursuing opportunities in the glass substrate market, leveraging their expertise in glass processing and precision manufacturing [23][30]. - Companies like BOE and Wog Glass are making strides in developing glass substrates for semiconductor packaging, with plans for mass production and technological advancements [24][25]. - The establishment of industry alliances and collaborations between academia and industry is fostering innovation and addressing common technical challenges in the glass substrate sector [30][31].

登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：000725 证券简称：京东方A 公告编号：2025-093 证券代码：200725 证券简称：京东方B 公告编号：2025-093 京东方科技集团股份有限公司 关于变更指定信息披露媒体的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记载、误导性陈述或重大遗 漏。 证券代码：200725 证券简称：京东方B 公告编号：2025-092 京东方科技集团股份有限公司 关于参与设立的投资基金募集完毕的 公告 京东方科技集团股份有限公司（以下简称"公司"）原指定信息披露媒体为《证券时报》《中国证券报》 《上海证券报》《大公报》和巨潮资讯网（www.cninfo.com.cn）。因与《大公报》签订的信息披露服 务协议已到期，自2026年1月1日起，公司指定信息披露媒体变更为《证券时报》《中国证券报》《上海 证券报》和巨潮资讯网（www.cninfo.com.cn）。公司将及时修改《京东方科技集团股份有限公司章 程》中涉及信息披露媒体的内容。 公司对《大公报》以往提供的优质服务表示衷心的感谢！ 特此公告。 京东方科技集团股份有限公司 董 ...

本公司及董事会全体成员保证信息披露的内容真实、准确、 完整，没有虚假记载、误导性陈述或重大遗漏。 | 证券代码：000725 | 证券简称：京东方 | A | 公告编号：2025-093 | | --- | --- | --- | --- | | 证券代码：200725 | 证券简称：京东方 | B | 公告编号：2025-093 | 京东方科技集团股份有限公司 关于变更指定信息披露媒体的公告 董 事 会 2025 年 12 月 26 日 1 京东方科技集团股份有限公司（以下简称"公司"）原指定信息 披露媒体为《证券时报》《中国证券报》《上海证券报》《大公报》和 巨潮资讯网（www.cninfo.com.cn）。因与《大公报》签订的信息披露 服务协议已到期，自 2026 年 1 月 1 日起，公司指定信息披露媒体变 更为《证券时报》《中国证券报》《上海证券报》和巨潮资讯网 （www.cninfo.com.cn）。公司将及时修改《京东方科技集团股份有限 公司章程》中涉及信息披露媒体的内容。 公司对《大公报》以往提供的优质服务表示衷心的感谢！ 特此公告。 京东方科技集团股份有限公司 ...

| 证券代码：000725 | 证券简称：京东方 | A | 公告编号：2025-092 | | --- | --- | --- | --- | | 证券代码：200725 | 证券简称：京东方 | B | 公告编号：2025-092 | 注：上表中单项数据加总数与合计数差异系数据计算时四舍五入所致。 特此公告。 京东方科技集团股份有限公司 董 事 会 2025 年 12 月 26 日 1 京东方科技集团股份有限公司 关于参与设立的投资基金募集完毕的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完 整，没有虚假记载、误导性陈述或重大遗漏。 2023 年 11 月，京东方科技集团股份有限公司（以下简称"公司"） 通过下属子公司京东方创新投资有限公司（以下简称"京东方创投"）出 资参与设立北京显智链二期创业投资基金(有限合伙）(以下简称"显智链 二期基金")，具体内容详见公司于 2023 年 11 月 29 日在巨潮资讯网上披 露的相关公告。 近日，京东方创投收到《关于显智链二期基金后续募集情况的通知函》， 显智链二期基金的后续募集期已结束，认缴的出资总额为 15.3 亿元，具 体情况如下： | 序号 ...