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兴森科技:宜兴硅谷因客户产品结构不佳、竞争激烈致亏损,下半年有望改善
Jin Rong Jie· 2025-08-28 01:02
Core Viewpoint - The company is facing ongoing losses in its subsidiary Yixing Silicon Valley, despite previous claims of improvement, attributed to poor customer and product structure, as well as intense competition [1] Financial Performance - The loss for the first half of this year increased to over 80 million yuan, compared to over 49 million yuan in the same period last year [1] Management Response - The company acknowledged the issues and stated that it aims to improve performance in the second half of the year through price increases and stricter cost control [1] - Plans include optimizing production processes, enhancing yield levels, adjusting customer and product structures, and expanding overseas market efforts to further reduce losses [1]
兴森科技2025年中报简析:营收净利润同比双双增长,盈利能力上升
Zheng Quan Zhi Xing· 2025-08-27 22:56
Core Viewpoint - The recent financial report of Xingsen Technology (002436) shows significant growth in revenue and net profit for the first half of 2025, indicating improved profitability and operational efficiency [1] Financial Performance - Total revenue for the first half of 2025 reached 3.426 billion yuan, an increase of 18.91% year-on-year [1] - Net profit attributable to shareholders was 28.83 million yuan, up 47.85% year-on-year [1] - In Q2 2025, total revenue was 1.846 billion yuan, reflecting a year-on-year increase of 23.69% [1] - Q2 net profit attributable to shareholders was 19.46 million yuan, a substantial increase of 465.68% year-on-year [1] - Gross margin improved to 18.45%, up 11.44% year-on-year, while net margin improved to -2.54%, an increase of 17.37% year-on-year [1] Cost and Efficiency Metrics - Total selling, administrative, and financial expenses amounted to 454 million yuan, accounting for 13.26% of revenue, a decrease of 2.69% year-on-year [1] - Earnings per share (EPS) doubled to 0.02 yuan, a 100% increase year-on-year [1] - Operating cash flow per share was -0.1 yuan, a significant decline of 172.51% year-on-year [1] Balance Sheet Insights - Cash and cash equivalents decreased to 1.136 billion yuan, down 12.28% year-on-year [1] - Accounts receivable increased to 2.287 billion yuan, up 14.49% year-on-year [1] - Interest-bearing liabilities rose to 5.293 billion yuan, an increase of 16.31% year-on-year [1] Business Model and Investment Considerations - The company's performance is primarily driven by capital expenditures, necessitating careful evaluation of the profitability of these investments [2] - Analysts suggest monitoring cash flow and debt levels, as the cash ratio is only 52.35% and the interest-bearing debt ratio is 35.31% [3] - The average return on invested capital (ROIC) over the past decade is 7.1%, indicating relatively weak investment returns [1][3] Market Sentiment and Analyst Expectations - Analysts project a net profit of 112 million yuan for 2025, with an average EPS estimate of 0.07 yuan [4] - The largest fund holding Xingsen Technology shares is the Everbright Credit Enhancement Bond A, with a current scale of 4.168 billion yuan [5]
兴森科技H1营收34.26亿元,净利润同比增长47.85%
Ju Chao Zi Xun· 2025-08-27 10:13
Core Insights - The company reported a revenue of 3.43 billion yuan for the first half of 2025, representing an 18.91% increase compared to the same period last year [1] - Net profit attributable to shareholders reached 28.83 million yuan, a 47.85% increase year-on-year [1] - The company’s semiconductor business, including IC packaging substrate and semiconductor testing board, achieved a revenue of 830 million yuan, marking a 38.39% increase [2][3] Financial Performance - Revenue for the PCB business was 2.448 billion yuan, a year-on-year growth of 12.8%, with a gross margin of 26.32%, slightly down by 0.77 percentage points [2] - The net profit for the Fineline subsidiary was 75.96 million yuan, a decrease of 13.5%, primarily due to foreign exchange losses [2] - The company’s total assets at the end of the reporting period were 14.99 billion yuan, a 9.67% increase from the previous year [1] Business Segments - The IC packaging substrate business generated 722 million yuan in revenue, a 36.04% increase, driven by CSP packaging substrate contributions [2][3] - The company is focusing on high-value products in the CSP packaging substrate business, particularly in storage and RF sectors, and is expanding into the automotive market [3] - The FCBGA packaging substrate project has not yet achieved mass production, leading to a negative gross margin of -25.17% [3]
兴森科技:公司FCBGA封装基板项目投资超38亿 样品订单数量超过去年全年
Xin Lang Cai Jing· 2025-08-27 09:29
Core Viewpoint - The company has significantly invested in its FCBGA packaging substrate project, exceeding 3.8 billion, and is well-prepared for mass production in terms of technical capabilities, production capacity, and product yield [1] Group 1: Investment and Production Readiness - The overall investment scale of the FCBGA packaging substrate project has surpassed 3.8 billion [1] - The company is fully prepared for mass production regarding technical capabilities, production capacity, and product yield [1] - Sample order quantities for the first half of 2025 have already exceeded the total for the entire year of 2024 [1] Group 2: Strategic Expansion - The company is planning to further expand its high-end HDI capacity aimed at the AI sector to seize opportunities arising from the AI boom [1]
兴森科技(002436) - 2025年8月27日投资者关系活动记录表
2025-08-27 09:22
Financial Performance - In Q2 2025, the company achieved a revenue of 184,625.97 million CNY, a quarter-on-quarter increase of 16.88% [2] - Net profit attributable to shareholders was 1,946.05 million CNY, up 107.64% quarter-on-quarter [2] - For the first half of 2025, total revenue reached 342,586.34 million CNY, a year-on-year growth of 18.91% [2] - Net profit attributable to shareholders for H1 2025 was 2,883.29 million CNY, reflecting a year-on-year increase of 47.85% [2] - Total assets amounted to 1,498,980.85 million CNY, a 9.67% increase from the end of the previous year [2] Industry Analysis - The global PCB industry is expected to reach a market value of 79.128 billion USD in 2025, with a year-on-year growth of 7.6% [5] - High-layer PCBs (18 layers and above) and HDI boards are projected to grow by 41.7% and 12.9% respectively in 2025 [5] - The demand for packaging substrates is also expected to recover, with a growth rate of 7.6% [5] - The Chinese and Southeast Asian markets are anticipated to outperform other global regions due to technological advantages and industry shifts [5] Project Updates - The FCBGA packaging substrate project has exceeded an investment scale of 3.8 billion CNY, with preparations for mass production well underway [7] - Sample orders for the FCBGA project in H1 2025 surpassed the total for 2024, indicating strong demand [7] CSP Packaging Substrate Business - The CSP packaging substrate business focuses on storage and RF markets, expanding into the automotive sector [8] - Capacity utilization has improved, leading to significant revenue growth, with existing capacities fully utilized and new expansions coming online [8] Traditional PCB Business - The PCB business generated revenue of 244,785.93 million CNY, a year-on-year increase of 12.80% [9] - The gross margin for PCB business was 26.32%, slightly down by 0.77 percentage points [9] Beijing Xinfai Electronics Co., Ltd. Performance - Beijing Xinfai reported revenue of 49,953.28 million CNY, a year-on-year growth of 25.50%, with net profit increasing by 46.86% [10] R&D Directions - The company is focusing on developing complex, multifunctional products, including embedded substrates and large-size ABF substrates [10] - Future innovations will center on advancements in circuit board technology to enhance market competitiveness [10]
元件板块8月27日跌0.46%,金安国纪领跌,主力资金净流出11.11亿元
Zheng Xing Xing Ye Ri Bao· 2025-08-27 08:39
Market Overview - On August 27, the component sector declined by 0.46% compared to the previous trading day, with Jin'an Guoji leading the decline [1] - The Shanghai Composite Index closed at 3800.35, down 1.76%, while the Shenzhen Component Index closed at 12295.07, down 1.43% [1] Stock Performance - Notable gainers included: - Fangzheng Technology (600601) with a closing price of 8.70, up 9.99% and a trading volume of 6.44 million shares, totaling 5.467 billion yuan [1] - Shennan Circuit (002916) closed at 169.50, up 4.19% with a trading volume of 135,900 shares, totaling 2.342 billion yuan [1] - Major decliners included: - Jin'an Guoji (002636) closed at 13.27, down 6.42% with a trading volume of 565,400 shares, totaling 776 million yuan [2] - Nanya New Materials (688519) closed at 68.68, down 6.34% with a trading volume of 130,600 shares, totaling 916 million yuan [2] Capital Flow - The component sector experienced a net outflow of 1.111 billion yuan from institutional investors, while retail investors saw a net inflow of 1.493 billion yuan [2] - The capital flow for specific stocks showed: - Fangzheng Technology had a net inflow of 1.099 billion yuan from institutional investors, while retail investors had a net outflow of 487 million yuan [3] - Xingsen Technology (002436) had a net inflow of 190 million yuan from institutional investors, but a net outflow of 75.252 million yuan from retail investors [3]
主力资金流入前20:岩山科技流入16.18亿元、华银电力流入9.48亿元
Jin Rong Jie· 2025-08-27 03:15
Group 1 - The top 20 stocks with significant capital inflow as of August 27 include: Yanshan Technology (1.618 billion), Huayin Electric Power (948 million), and Yingweik (730 million) [1] - Yanshan Technology experienced a price increase of 10.08%, while Huayin Electric Power rose by 9.63% [2] - Other notable stocks with substantial capital inflow include Jishi Media (567 million), Tianfeng Securities (485 million), and Maigemeite (437 million) [1][2] Group 2 - The sectors represented among the top inflow stocks include internet services, electric power, specialized equipment, cultural media, and securities [2][3] - Yanshan Technology and Huayin Electric Power are both in the electric power sector, indicating strong interest in this industry [2][3] - The stock with the highest price increase is Keda Intelligent, which rose by 17.75% with a capital inflow of 413 million [2]
存储芯片板块持续走强,深南电路盘中创新高
Xin Lang Cai Jing· 2025-08-27 02:16
Group 1 - The storage chip sector continues to strengthen, with ShenNan Circuit reaching a new high during trading [1] - Xingsen Technology has hit the daily limit increase [1] - Other companies such as Bai'ao Chemical, Defu Technology, Lierda, Shangluo Electronics, and Jucheng Co. also experienced gains [1]
兴森科技(002436.SZ):2025年中报净利润为2883.29万元、较去年同期上涨47.85%
Xin Lang Cai Jing· 2025-08-27 02:09
Core Viewpoint - The company reported a significant increase in revenue and net profit for the first half of 2025, indicating a positive growth trend in its financial performance [1][2]. Financial Performance - The company's total revenue for the first half of 2025 was 3.426 billion yuan, marking an increase of 5.45 billion yuan compared to the same period last year, which is an 18.91% year-on-year growth [1]. - The net profit attributable to shareholders was 28.83 million yuan, an increase of 9.33 million yuan from the previous year, reflecting a 47.85% year-on-year growth [1]. - The latest gross profit margin is 18.45%, up 1.26 percentage points from the previous quarter and 1.89 percentage points from the same period last year [2]. - The diluted earnings per share were 0.02 yuan, an increase of 0.01 yuan compared to the same period last year, representing a 100% year-on-year increase [2]. Operational Efficiency - The company's latest return on equity (ROE) is 0.57%, which is an increase of 0.20 percentage points from the same period last year [2]. - The total asset turnover ratio is 0.24 times, up 0.04 times from the previous year, indicating a 22.74% year-on-year increase [2]. - The inventory turnover ratio is 3.51 times, ranking 8th among disclosed peers [2]. Shareholder Information - The number of shareholders is 111,700, with the top ten shareholders holding a total of 526 million shares, accounting for 31.16% of the total share capital [2]. - The largest shareholder is "India Asia" with a holding of 14.4% [2]. Financial Health - The company's latest debt-to-asset ratio is 62.82%, indicating its financial leverage [3].
机构风向标 | 兴森科技(002436)2025年二季度已披露前十大机构持股比例合计下跌1.15个百分点
Sou Hu Cai Jing· 2025-08-27 01:01
Group 1 - The core viewpoint of the news is the disclosure of institutional and fund holdings in Xingsen Technology (002436.SZ) as of August 26, 2025, indicating a slight decline in institutional ownership compared to the previous quarter [1] - A total of 10 institutional investors hold shares in Xingsen Technology, with a combined holding of 93.43 million shares, representing 5.53% of the total share capital [1] - The top ten institutional investors include notable entities such as Hong Kong Central Clearing Limited and China Agricultural Bank, with their combined holding percentage decreasing by 1.15 percentage points from the previous quarter [1] Group 2 - In the public fund sector, there was an increase in holdings from one fund, Southern CSI 500 ETF, with a holding increase percentage of 0.21% [2] - One public fund, Everbright Prudential Credit Enhancement Bond A, reported a decrease in holdings by 0.63% compared to the previous quarter [2] - Two new public funds disclosed their holdings, namely Su Xin CSI A500 Index Enhanced A and Su Xin CSI 500 Index Enhanced A, while ten public funds were not disclosed in the current period [2] Group 3 - One new social security fund, the National Social Security Fund 115 Combination, disclosed its holdings in Xingsen Technology [3] - In the insurance sector, one insurance fund, Ruizhong Life Insurance Co., Ltd. - Own Funds, reported a slight increase in holdings [3] - Foreign investment sentiment showed an increase in holdings from one foreign fund, Hong Kong Central Clearing Limited, with a holding increase percentage of 0.49% [3]