Core Viewpoint - The report from Minsheng Securities highlights "speed" and "power" as the two core contradictions in current AI development, with PCB (Printed Circuit Board) being a crucial component in the AI industry chain, benefiting significantly from the ongoing advancements in PCB technology and processes [1] Group 1: PCB Industry Trends - The PCB industry is experiencing rapid development in advanced packaging and high-density interconnect technologies, transitioning from traditional HDI and substrate technologies to mSAP processes capable of sub-10μm line widths to meet the demands of high-speed signal transmission and large-scale integration [1] - New technologies such as CoWoP (Chip-on-Wafer-on-Panel) are changing the form of packaging substrates by using large-size PCBs to carry multiple chips, thereby reducing costs and enhancing interconnect density [1] Group 2: Upstream Material Demand - Driven by AI demand, leading PCB manufacturers like Shenghong Technology, Huitian Technology, and Pengding Holdings are actively expanding production, creating a resonance between material upgrades and capacity expansion [2] - Key upstream materials for PCBs include copper foil, electronic cloth, and resin, with upgrades in these materials to meet the requirements of high-speed signal transmission and lightweight designs [2] Group 3: Equipment Supply and Domestic Substitution - The core processes of PCB manufacturing, including drilling, electroplating, and etching, are critical for determining interconnect density, signal integrity, and production yield, with increasing demands for precision and reliability in these processes [3] - Domestic equipment manufacturers such as Dazhu CNC, Dingtai High-Tech, and Dongwei Technology are accelerating their layouts in advanced process equipment for high-layer boards, HDI, and mSAP, reflecting the industry's shift towards domestic substitution [3] Group 4: Investment Recommendations - Recommended PCB leading manufacturers include Shenghong Technology (300476.SZ), Pengding Holdings (002938.SZ), Huitian Technology (002463.SZ), Shenzhen South Circuit (002916.SZ), Guanghe Technology (001389.SZ), and Jingwang Electronics (603228.SH) [4] - In the materials sector, companies with core technologies and customer resources such as Honghe Technology (603256.SH), Zhongcai Technology (002080.SZ), Feilihua (300395.SZ), Defu Technology (301511.SZ), Longyang Electronics (301389.SZ), and Meilian New Materials (300586.SZ) are recommended [4] - For equipment, focus on domestic substitution in core segments with companies like Dazhu CNC (301200.SZ), Xinqi Microelectronics (688630.SH), Dingtai High-Tech (301377.SZ), and Dongwei Technology (688700.SH) [4]

Market Performance - The component sector increased by 4.52% on August 25, with Shengyi Electronics leading the gains [1] - The Shanghai Composite Index closed at 3883.56, up 1.51%, while the Shenzhen Component Index closed at 12441.07, up 2.26% [1] Top Gainers in Component Sector - Shengyi Electronics (688183) closed at 73.36, up 12.69% with a trading volume of 344,400 shares and a transaction value of 2.39 billion [1] - Fangbang Co., Ltd. (688020) closed at 66.99, up 12.31% with a trading volume of 78,400 shares and a transaction value of 507 million [1] - Jingwang Electronics (603228) closed at 59.60, up 10.00% with a trading volume of 592,700 shares and a transaction value of 3.43 billion [1] - Victory Technology (300476) closed at 239.90, up 9.00% with a trading volume of 837,800 shares and a transaction value of 18.58 billion [1] - Other notable gainers include Shenzhen South Circuit (002916) and Dongshan Precision (002384), with increases of 7.46% and 7.32% respectively [1] Underperformers in Component Sector - Tianjin Pulin (002134) closed at 23.40, down 10.00% with a trading volume of 312,600 shares [2] - Jinsai Technology (871981) closed at 44.24, down 4.63% with a trading volume of 59,700 shares [2] - ST Dongjing (002199) closed at 10.93, down 3.10% with a trading volume of 73,900 shares [2] Capital Flow in Component Sector - The component sector saw a net inflow of 162 million from main funds, while retail investors experienced a net outflow of 236 million [2]

Group 1 - The company ShenNan Circuit Co., Ltd. has applied for a patent for a method and device for cleaning pool walls, including an underwater robot and storage medium, with the patent publication number CN120520461A and application date of May 2025 [1] - The patent addresses the issue of underwater robots slipping on wet surfaces while climbing pool walls, which significantly affects their work efficiency [1] Group 2 - ShenNan Circuit Co., Ltd. was established in 1984 and is located in Shenzhen, primarily engaged in the manufacturing of computers, communications, and other electronic devices [2] - The company has a registered capital of 5,128.77535 million RMB and has made investments in 10 enterprises, participated in 2,213 bidding projects, and holds 1,652 patents [2]

Investment Rating - The report maintains a "Recommended" rating for leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd. [4][5] Core Viewpoints - The PCB industry is experiencing rapid advancements in packaging and high-density interconnect technologies, with traditional HDI and substrate technologies evolving into mSAP processes to meet the demands of high-speed signal transmission and large-scale integration [1][2] - The demand for PCB is driven by AI applications, leading to significant expansions in production capacity among leading companies, with total investments exceeding 30 billion RMB [2][20] - The core materials for PCB, including copper foil, electronic cloth, and resin, are undergoing upgrades to meet the high-frequency and high-speed requirements of AI applications [2][20][26] Summary by Sections 1. CoWoP and mSAP as Core Technologies - CoWoP (Chip-on-Wafer-on-PCB) is emerging as a future packaging route, enhancing interconnect density and reducing costs by directly using large-size PCBs [1][11] - mSAP (Modified Semi-Additive Process) is becoming the core process for achieving sub-10 µm line capabilities, essential for high-performance applications [1][14] 2. PCB Capacity Expansion and Material Upgrades - Leading PCB manufacturers are actively expanding production capacity, with significant investments announced by companies like Huadian Co., Ltd. and Shenghong Technology [2][20] - The upgrade of core materials includes the transition of copper foil from HVLP1 to HVLP5, electronic cloth to third-generation low-dielectric cloth, and resin to hydrocarbon and PTFE types [2][20][28] 3. Tight Supply of Core Equipment and Acceleration of Domestic Substitution - The supply of core PCB equipment, including drilling, plating, and etching imaging, is tight, with domestic manufacturers accelerating their layouts in advanced process equipment [2][49] - Companies like Dazhu CNC and Ding Tai High-Tech are focusing on high-layer boards and HDI equipment to meet the increasing demands of the industry [2][49] 4. Investment Recommendations - The report suggests focusing on leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd., as well as material companies with core technologies like Honghe Technology and Zhongcai Technology [3][4] - Equipment manufacturers involved in domestic substitution, such as Dazhu CNC and Xinqi Microelectronics, are also highlighted as potential investment opportunities [3][4]

证券之星消息，8月22日元件板块较上一交易日上涨3.35%，南亚新材领涨。当日上证指数报收于 3825.76，上涨1.45%。深证成指报收于12166.06，上涨2.07%。元件板块个股涨跌见下表： | 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | | --- | --- | --- | --- | --- | --- | --- | | 688519 | 南亚新材 | 75.75 | 11.61% | 19.07万 | | 14.21亿 | | 688183 | 生益电子 | 65.10 | 10.55% | 32.79万 | | 20.87亿 | | 600601 | 方正科技 | 7.89 | 10.04% | 267.95万 | | 20.65 Z | | 600183 | 生益科技 | 47.61 | 7.11% | 55.74万 | | 26.20亿 | | 002916 | 深南电路 | 149.92 | 5.89% | 18.11万 | | 27.04亿 | | 603186 | 华正新材 | 41.18 | 4.65% | 17.18万 | | 7.03 ...

Group 1 - The Shanghai Composite Index is at 3783.05 points, above the five-day moving average, with a change of 0.32% [1] - The total trading volume of A-shares today is 1,080.3 billion yuan [1] - A total of 276 A-shares have prices that have surpassed the five-day moving average, with notable stocks including San Chuan Wisdom, Ping Gao Co., and Tong Hui Electronics, showing divergence rates of 13.32%, 13.23%, and 9.93% respectively [1] Group 2 - The top three stocks with the highest divergence rates from the five-day moving average are: - San Chuan Wisdom (300066) with a price increase of 20.06% and a divergence rate of 13.32% [2] - Ping Gao Co. (688227) with a price increase of 19.99% and a divergence rate of 13.23% [2] - Tong Hui Electronics (833509) with a price increase of 16.85% and a divergence rate of 9.93% [2] - Other notable stocks include Ding Tai Gao Ke (301377) with a divergence rate of 8.41% and An Fu Technology (603031) with a divergence rate of 7.32% [2]

深南电路股价报142.71元，较前一交易日下跌1.58%。盘中最高触及145.95元，最低下探137.33元，成交 金额达16.06亿元。 深南电路主营业务为印制电路板研发生产，产品广泛应用于通信设备、工业控制、医疗电子等领域。公 司一季度实现营业收入47.83亿元，净利润4.91亿元。 公司发布公告称，董事王波因工作调整辞职，同时选举崔荣担任职工代表董事。崔荣持有公司股票2.6 万股。在行业层面，AI服务器需求增长带动PCB行业景气度提升，多家企业开启扩产计划。 资金流向数据显示，当日主力资金净流出3031.2万元，近五日累计净流出5.15亿元。 风险提示：市场有风险，投资需谨慎。 ...

Group 1 - The company, Shenzhen South Circuit (002916), announced the election of Mr. Cui Rong as the employee representative director of the fourth board of directors [1]

证券代码：002916 证券简称：深南电路 公告编号：2025-025 深南电路股份有限公司 关于公司董事辞职及补选职工代表董事的公告 根据《中华人民共和国公司法》及《公司章程》的有关规定，王波先生的辞 职不会导致公司董事会成员低于法定人数，其辞职报告自送达董事会时生效。截 至本公告披露日，王波先生未持有公司股份，不存在未履行完毕的公开承诺。王 波先生将按照公司相关规定做好工作交接，其辞任董事不会对公司的正常经营造 成影响。 公司及董事会对王波先生在董事任职期间为公司发展所做出的贡献表示衷 心的感谢。 二、补选职工代表董事情况 公司于 2025 年 8 月 18 日召开 2025 年第一次临时股东会，审议通过了《关 于修订<公司章程>的议案》。根据修订后的《公司章程》，公司董事会由 9 名董 事组成，其中独立董事 3 名、职工董事 1 名。 公司于 2025 年 8 月 20 日召开职工代表大会，经与会职工代表讨论和民主表 决，同意选举崔荣先生担任公司第四届董事会职工代表董事，任期自本次职工代 表大会选举通过之日起至第四届董事会任期届满之日止。崔荣先生的主要简历附 后。 本次选举职工代表董事工作完成后，公司第 ...

Core Viewpoint - The recent surge in prices of various chemical products and industrial materials is driven by strong market demand, particularly from the AI sector, leading to significant growth in the PCB industry and related companies [1][3]. Group 1: Market Dynamics - The PCB industry has seen a remarkable increase in market capitalization, with companies like Shenghong Technology surpassing 200 billion yuan and several others exceeding 100 billion yuan [1][9]. - The surge in stock prices for PCB-related companies has been notable, with 18 A-share PCB concept stocks increasing by over 100% since the beginning of the year [1][9]. Group 2: Company Performance - Major PCB companies reported strong performance in their semi-annual reports, with Shengyi Electronics achieving a revenue increase of 91% and a net profit increase of 452.11% [5][7]. - Other companies in the PCB supply chain, such as Tongguan Copper Foil and Heli Tai, also reported significant revenue and profit growth, with Tongguan Copper Foil's net profit increasing by 159.47% [3][9]. Group 3: Price Trends and Supply Chain Issues - The price of PCB products has been rising due to supply shortages of key materials like glass fiber cloth, which is critical for PCB manufacturing [12][14]. - The demand for AI-related PCBs is particularly strong, with industry experts indicating that this demand will support price increases until at least the end of Q4 [3][11]. Group 4: Future Outlook - The global PCB market is projected to grow, with an expected compound annual growth rate of 5.2% from 2024 to 2029, driven by sectors such as AI servers and data centers [17]. - Companies are actively expanding production capacities to meet the growing demand, with Shengyi Electronics planning to invest approximately 1.9 billion yuan in new production facilities [17][19].