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精测电子:实际控制人彭骞累计质押股数约3399万股
Mei Ri Jing Ji Xin Wen· 2025-11-13 10:56
每经AI快讯,精测电子(SZ 300567,收盘价:71.4元)11月13日晚间发布公告称,公司近日接到公司 控股股东、实际控制人彭骞先生的通知,彭骞先生将其直接持有的公司部分股权办理了质押登记及质押 解除手续。截至本公告日,彭骞累计质押股数约为3399万股,占公司总股本比例为12.15%。 截至发稿,精测电子市值为200亿元。 每经头条(nbdtoutiao)——"银行直供房,不计成本卖!"有的半价出售,众多刚需还不知道!银行用 过的房很抢手,有人加价100万元抢拍 (记者 王晓波) ...
精测电子(300567) - 武汉精测电子集团股份有限公司关于控股股东、实际控制人部分股权质押及解除质押的公告
2025-11-13 10:46
证券代码:300567 证券简称:精测电子 公告编号:2025-136 公司及董事会全体成员保证信息披露的内容真实、准确、完整,没有虚假记 载、误导性陈述或重大遗漏。 武汉精测电子集团股份有限公司(以下简称"公司")近日接到公司控股股 东、实际控制人彭骞先生的通知,彭骞先生将其直接持有的公司部分股权办理了 质押登记及质押解除手续,具体情况如下: 一、股东股份质押及解除质押的基本情况 | 彭骞 | | | | | 名称 | 股东 | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 是 | | | 致行动人 | 东及其一 | 第一大股 | 股股东或 | | 是否为控 | | ,000 | 3,000 | | (股) | | 数量 | 质押 | 本次 | | | 4.29 | | (%) | 比例 | | 股份 | 所持 | 直接 | 占其 | | 1.07 | | | (%) | 比例 | 股本 | 司总 | | 占公 | | 锁定 股 | 高管 | | | 售股 | 为限 | 是否 | | | | 否 月 11 日 月 10 | 202 ...
精测电子(300567) - 武汉精测电子集团股份有限公司关于变更办公地址的公告
2025-11-10 10:30
证券代码:300567 证券简称:精测电子 公告编号:2025-134 武汉精测电子集团股份有限公司 关于变更办公地址的公告 公司及董事会全体成员保证信息披露的内容真实、准确、完整,没有虚假记 载、误导性陈述或重大遗漏。 武汉精测电子集团股份有限公司(以下简称"公司")因经营发展需要,于 近日搬迁至新办公地址,现将变更情况公告如下: | 办公地址 | 武汉市东湖新技术开发区流芳园 | 武汉市东湖新技术开发区佛祖岭 | | --- | --- | --- | | 变更事项 | 变更前 南路22号 | 变更后 四路2号 | 公司投资者联系地址同步变更为以上新办公地址,除上述变更外,公司注册 地址、网址、投资者热线、传真、电子邮箱等其他联系方式均保持不变。 特此公告。 武汉精测电子集团股份有限公司 董事会 2025年11月10日 ...
精测电子(300567) - 武汉精测电子集团股份有限公司关于变更2025年第三次临时股东大会现场会议地址的公告
2025-11-10 10:30
证券代码:300567 证券简称:精测电子 公告编号:2025-135 武汉精测电子集团股份有限公司 重要提示: 鉴于武汉精测电子集团股份有限公司(以下简称"公司")于近日搬迁至新 的办公地址,经慎重考虑,公司将 2025 年第三次临时股东大会现场会议地点变 更为"武汉市东湖新技术开发区佛祖岭四路 2 号会议室"。本次变更股东大会召 开地点的事项符合相关法律、行政法规、部门规章、规范性文件和公司章程等相 关规定。除现场会议召开地点变更外,本次股东大会的召开方式、股权登记日、 会议登记时间、会议议案等事项均未发生变化。 本次变更会议地点后的股东大会相关信息如下: 关于变更2025年第三次临时股东大会现场会议地址的公告 公司及董事会全体成员保证信息披露的内容真实、准确、完整,没有虚假记 载、误导性陈述或重大遗漏。 一、召开会议的基本情况 1、股东会届次:2025 年第三次临时股东大会 2、股东会的召集人:董事会 3、本次会议的召集、召开符合《中华人民共和国公司法》《深圳证券交易 所创业板股票上市规则》《深圳证券交易所上市公司自律监管指引第 2 号—创业 板上市公司规范运作》等法律、行政法规、部门规章、规范性文件及 ...
精测电子涨2.12%,成交额1.60亿元,主力资金净流出362.13万元
Xin Lang Cai Jing· 2025-11-10 02:16
Core Viewpoint - Jingce Electronics has shown a significant stock performance with a year-to-date increase of 21.31% and a recent rise of 4.46% over the last five trading days, indicating strong market interest and potential growth in the sector [1][2]. Financial Performance - For the period from January to September 2025, Jingce Electronics reported a revenue of 2.271 billion yuan, reflecting a year-on-year growth of 24.04%. The net profit attributable to shareholders was 100 million yuan, marking a 21.70% increase compared to the previous year [2]. - The company has distributed a total of 530 million yuan in dividends since its A-share listing, with 136 million yuan distributed over the last three years [3]. Shareholder and Market Activity - As of October 31, 2025, the number of shareholders for Jingce Electronics decreased by 3.82% to 20,100, while the average number of circulating shares per person increased by 3.97% to 11,313 shares [2]. - The stock's trading activity showed a net outflow of 3.6213 million yuan from major funds, with significant buying and selling activity from large orders [1]. Business Overview - Jingce Electronics, established on April 20, 2006, and listed on November 22, 2016, specializes in the research, production, and sales of detection systems for displays, semiconductors, and new energy [1]. - The company's revenue composition is as follows: displays 48.56%, semiconductors 40.74%, new energy 8.67%, and others 2.03% [1].
[热闻寻踪]HBM4溢价红利来袭,A股产业链谁能分羹?
Quan Jing Wang· 2025-11-08 03:58
Core Viewpoint - The A-share market is experiencing significant interest in high bandwidth memory (HBM) concepts, with related stocks seeing substantial capital inflow and price increases. SK Hynix and NVIDIA have finalized an HBM4 supply agreement, with a price increase of over 50% compared to HBM3E, and predictions of operating profits exceeding 70 trillion KRW by 2025 [1]. Group 1: Company Developments in HBM - Zhongtian Precision has a 6.71% indirect stake in Visionary Storage and is focused on HBM technology, with HBM2/2e products in final testing and HBM3/3e in development, targeting applications in AI and edge devices [1]. - Unisoc's HBM products are still in the R&D phase, with future iterations planned based on user needs, particularly for specialized industry applications [2]. - Jingce Electronics has aging testing equipment for HBM chips and has received orders for related products, benefiting from the demand surge due to AI developments [3]. - Longxin Technology is collaborating with industry partners on HBM R&D, aiming to enhance bandwidth and reduce latency for future GPGPU needs [4]. - Aisen Co. has developed advanced packaging materials applicable to HBM storage chips [5]. - Kuaike Intelligent is advancing TCB equipment for HBM packaging, which is crucial for the process [6]. - Sanxiang New Materials is focusing on electronic-grade zirconium and hafnium materials, which are essential for HBM and other high-performance storage chips, with some products already sent to semiconductor clients [6]. Group 2: Market Trends and Predictions - The HBM4 high premium is currently benefiting overseas oligopolies, while domestic companies are primarily focused on thematic trading, necessitating close monitoring of certification progress and DRAM price increases for valuation flexibility [1]. - The demand for large-capacity, high-performance storage chips is rising, leading to tighter supply of core materials [6].
研判2025!全球及中国前道量检测设备发展背景、市场规模、企业格局及未来趋势分析:市场规模稳步扩张,行业格局高度集中,国产化程度较低[图]
Chan Ye Xin Xi Wang· 2025-11-08 02:40
Core Insights - The front-end measurement and inspection equipment is a crucial segment of the semiconductor equipment market, accounting for approximately 13% of the total market size [1][5][11] - The global semiconductor measurement and inspection equipment market is projected to reach $15.22 billion in 2024, reflecting a year-on-year growth of 18.7% [1][7] - The market for front-end measurement and inspection equipment in mainland China is experiencing rapid growth, with an average annual compound growth rate of 30% from 2020 to 2024, reaching a market size of 43.8 billion yuan in 2024 [1][9] Group 1: Industry Overview - Front-end measurement is essential for quality control in semiconductor manufacturing, involving the measurement of parameters such as film thickness and surface defects [2][4] - The global semiconductor equipment market is expected to rebound in 2024, achieving a historical sales high of $117 billion, with significant contributions from China, South Korea, and Taiwan [4][5] Group 2: Market Dynamics - The front-end measurement equipment market is dominated by a few international leaders, with KLA holding over 50% market share, indicating a highly concentrated supply market [1][11] - Domestic companies like Zhongke Feimeasure and Shanghai Precision Measurement are emerging as suppliers of front-end measurement equipment, driven by the rapid development of China's semiconductor industry [1][12] Group 3: Future Trends - The domestic market share of front-end measurement equipment is expected to increase as local companies enhance their understanding of technology and manufacturing processes [1][13] - There is a growing demand for improved performance in measurement and inspection equipment, focusing on sensitivity, accuracy, stability, and throughput to ensure high yield rates in semiconductor production [1][14]
精测电子今日大宗交易折价成交25万股,成交额1847.5万元
Xin Lang Cai Jing· 2025-11-07 09:01
Group 1 - The core event involves a block trade of 250,000 shares of Jingce Electronics, with a transaction value of 18.475 million yuan, accounting for 3.7% of the total trading volume on that day [1] - The transaction price was 73.9 yuan, which represents a discount of 3.25% compared to the market closing price of 76.38 yuan [1]
精测电子:关于控股孙公司完成工商变更登记并换发营业执照的公告
Core Viewpoint - Jingce Electronics announced a change in the business scope of its subsidiary Beijing Jingyi Optoelectronics Technology Co., Ltd. to meet actual development needs [1] Group 1 - The company has completed the necessary business registration changes and obtained a new business license from the Beijing Economic and Technological Development Zone Market Supervision Administration [1]
精测电子(300567) - 武汉精测电子集团股份有限公司关于控股孙公司完成工商变更登记并换发营业执照的公告
2025-11-06 10:00
关于控股孙公司完成工商变更登记并换发营业执照的公告 证券代码:300567 证券简称:精测电子 公告编号:2025-133 武汉精测电子集团股份有限公司 1、统一社会信用代码:91110302MA01WBP879 2、名称:北京精亦光电科技有限公司 公司及董事会全体成员保证信息披露的内容真实、准确、完整,没有虚假记 载、误导性陈述或重大遗漏。 武汉精测电子集团股份有限公司(以下简称"公司")控股孙公司北京精亦 光电科技有限公司(以下简称"北京精亦")根据实际发展需要,对其经营范围 进行了变更。 近日,北京精亦完成了上述事宜的工商变更登记手续,并取得北京经济技术 开发区市场监督管理局换发的《营业执照》。北京精亦新换发的《营业执照》相 关信息如下: 8、住所:北京市北京经济技术开发区荣昌东街甲 5 号 3 号楼 2 层 201-5 备查文件 3、类型:其他有限责任公司 4、法定代表人:吴涛 5、经营范围:一般项目:技术服务、技术开发、技术咨询、技术交流、技 术转让、技术推广;货物进出口;技术进出口;电气设备销售;机械电气设备销 售;机械电气设备制造;电子产品销售;机械设备研发;普通机械设备安装服务; 电子专用设备 ...