我是芯片超人花姐，入行20年，有50W+芯片行业粉丝。 有很多不方便公开发公众号的， 关于芯片买卖、 关于资源链接等， 我会分享在朋友圈 。 扫码加我本人微信 2025年的第一季度， 全球半导体销售额延续高增长 ， 但 芯片大厂业绩的 分化 现象似乎更加严 重。除了主要市场及产品带来的差异，比如AI与存储相关企业的业绩情况总体更好一些， 汽车芯 片大厂的业绩还是惨淡 。 即便 在 泛 应用 市场，芯片大厂们 也出现了不同程度的分化。 此外，4月的关税风波也影响 着 半导体产业链的各个环节，不少大厂针对关税给出了他们的预 测。 我们整理 了 2025年第1季度半导体产业链主要大厂的营收情况 ，供大家参考。 01 芯片设计（含IDM） TI：营收增长，工业市场广泛复苏 德州仪器 （TI）公布第一季度收入为 40.7 亿美元，净收入为 11.8 亿美元。 营收较去年同期增 长 11%，环比增长 2% 。除个人电子产品的季节性下滑外，所有的市场均实现了环比增长。TI 第二季度的展望是收入在 41.7 亿美元至 45.3 亿美元之间。 此外，德州仪器CEO哈维夫·伊兰（Haviv Ilan）在财报电话会上针对美国关税发 ...

Group 1 - TSMC's Arizona plant has secured a significant order from AMD, which will shift its EPYC server production from Samsung to TSMC's 4nm process [1] - Major tech companies like Apple and NVIDIA have also announced plans to utilize TSMC's Arizona facility for chip production [1] - AMD's upcoming sixth-generation EPYC processors will be produced using TSMC's 2nm technology, making AMD the first high-performance computing (HPC) client for TSMC's 2nm process [1] Group 2 - AMD had previously collaborated closely with Samsung on the SF4X process for various products, including EPYC CPUs, Ryzen APUs, and Radeon GPUs, but it is unclear if this partnership has ended entirely [2] - Samsung's need to establish a reputation in the semiconductor industry makes AMD's withdrawal a significant setback for the South Korean company [2] - AMD is also working with TSMC to produce the "Venice" server CPU using 2nm technology and is focused on the Ryzen 9000 series consumer CPUs [2]

Core Viewpoint - Taiwan Semiconductor Manufacturing Company (TSM) has experienced a significant share price increase of 19.7% over the past month, outperforming the broader Zacks Computer and Technology sector, which gained 16.2% during the same period [1][2]. Market Performance - The recent rally in TSM's stock is attributed to broader market optimism, particularly due to positive developments in U.S.-China trade negotiations, which alleviated fears of economic disruption and improved global growth prospects [2][3]. - Semiconductor stocks, including TSM, Broadcom, Marvell Technology, and NVIDIA, were major beneficiaries of this rally, recovering from a previous selloff following tariff announcements [4]. Growth Drivers - TSM is positioned at the forefront of the ongoing AI boom, which is expected to drive a multi-year structural growth cycle for the company [6]. - AI-related revenues for TSM tripled in 2024, constituting a mid-teen percentage of total revenues, with expectations to double again in 2025, reflecting a 40% compound annual growth rate over the next five years [7][9]. Financial Performance - TSM reported strong first-quarter results for 2025, with revenues increasing by 35% year over year to $25.53 billion and net income rising by 53% to nearly $11 billion, driven by demand for advanced 3nm and 5nm nodes [10]. - The company's first-quarter EPS also surged by 53.6% to $2.12, exceeding the Zacks Consensus Estimate of $2.03, marking a consistent trend of beating earnings expectations [11]. Investment Outlook - TSM is set to invest between $38 billion and $42 billion in capital expenditures in 2025, significantly higher than the $29.8 billion investment in 2024, with a focus on advanced manufacturing processes [12]. - TSM's forward 12-month price-to-earnings (P/E) ratio is 18.51, below the sector average of 23.84, indicating an attractive valuation for potential investors [13][14]. Challenges - TSM faces near-term challenges, including a 25% increase in electricity prices in Taiwan, which could impact operational costs, especially for advanced nodes [15]. - Softness in key markets such as PCs and smartphones is expected to limit growth, with projected low single-digit growth in these sectors for 2025 [16]. - Rising operational costs from overseas expansions and geopolitical tensions, particularly with China, pose additional risks to TSM's outlook [18]. Conclusion - TSM's technological leadership and strategic investments position it as a compelling long-term player in the semiconductor industry, but short-term challenges necessitate a cautious approach, suggesting that holding TSM stock is currently the most prudent strategy [19].

Core Insights - JR Research is recognized as a top analyst in technology, software, and internet sectors, focusing on growth and GARP strategies [1] - The investment approach emphasizes identifying attractive risk/reward opportunities with robust price action to generate alpha above the S&P 500 [1][2] - The investment group Ultimate Growth Investing specializes in high-potential opportunities across various sectors with a focus on strong growth potential and contrarian plays [3] Investment Strategy - The strategy combines sharp price action analysis with fundamental investing to identify growth opportunities with significant upside potential [2] - The focus is on avoiding overhyped and overvalued stocks while targeting battered stocks that have recovery possibilities [2] - The investment outlook typically spans 18 to 24 months for the thesis to materialize [3] Target Audience - The group is designed for investors looking to capitalize on growth stocks with strong fundamentals, buying momentum, and turnaround plays at attractive valuations [3]

Core Insights - Steven Cress is a key figure in quantitative strategy and market data at Seeking Alpha, contributing to the platform's quantitative stock rating system and analytical tools [1][2][3] - The Seeking Alpha Quant Rating system aims to interpret data for investors, providing insights that save time and enhance investment decisions [1][2] - Cress has a strong background in investment research, having founded CressCap Investment Research and Cress Capital Management, and previously worked at Morgan Stanley and Northern Trust [3][4] Company Overview - Seeking Alpha has integrated Cress's expertise in quantitative analysis and market data, enhancing its offerings for investors [1][3] - The platform features a systematic stock recommendation tool called Alpha Picks, aimed at helping long-term investors build superior portfolios [1][2] Industry Impact - Cress's approach focuses on removing emotional biases from investment decisions through a data-driven methodology, which is increasingly relevant in today's investment landscape [2][4] - With over 30 years of experience, Cress is well-equipped to address various investment topics, indicating a depth of knowledge that can influence market trends [4]

这也将对台积电、三星等产能集中在亚洲地区的晶圆制造大厂，以及NVIDIA、苹果、高通、联发科等 依赖于亚洲晶圆代工产能的芯片设计厂商带来负面影响。 今年4月14日，美国商务部下属部门工业与安全局（BIS）通过联邦公报官网宣布，根据《1962年贸易 扩展法》第"232条款"赋予的权力，对进口半导体及其衍生产品、进口药品及药用成分发起国家安全调 查，并征求公众意见。 针对进口半导体及其衍生产品的调查，主要聚焦外国补贴、供应链依赖风险、美国国内产能瓶颈等14项 调查细节，希望确定进口半导体及其衍生产品对美国国家安全的影响。 其中包括半导体基板和裸晶圆、传统芯片、尖端芯片、微电子和SME组件等产品。衍生产品包括含有 半导体的下游产品，例如构成电子供应链的产品。相关利益关系人可在5月7日结束调查前提交意见。 涵盖外国补贴、供应链依赖风险、美国国内产能瓶颈等核心议题，并希望在当地时间5月7日前征询完美 国大众意见后结束调查。这也意味着美国政府可能最快将于本周三以后公布半导体关税细节。 国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 5月6日消息，美国特朗普政 ...

来源：本文编译自wccftech ，谢谢 。 三星在工艺节点方面难以获得业界的认可，尽管其产品种类繁多，产能也相当可观，但这家韩国巨 头仍未能像台湾同行那样抢占市场风头。据@Jukanlosreve报道，AMD已决定放弃三星代工厂的4 纳米订单，转而选择台积电在美国的生产。 三星代工的麻烦仍在继续，据报道，AMD 已经放弃了对该公司的 4nm 订单，很可能转向台积 电。 如果您希望可以时常见面，欢迎标星收藏哦~ 虽然此举的具体原因尚未披露，但很可能是三星代工厂业绩低迷以及台积电美国业务对AMD等公 司颇具吸引力的后果。 据称，由于红队采取了双采购策略，AMD 正在与三星在 SF4X 工艺上展开广泛合作，合作范围不 仅限于 EPYC 服务器 CPU，还包括 Ryzen APU 和 Radeon GPU。 这一举措最初被视为一项重大突破，但据报道，现在却走向了失败。虽然目前尚不确定是否仅仅因 为 EPYC 服务器 CPU 而放弃这笔交易，但似乎对三星代工厂的兴趣正在下降。这并非好事，尤其 是考虑到这家韩国巨头需要提升其在芯片行业的声誉，而一个主要合作伙伴的退出并非利好信号。 台积电位于亚利桑那州的工厂目前正在量产 ...

法国巴黎银行驻香港的大中华区外汇和利率主管王菊（音译）说："本地出口商感到恐慌，本地寿险公司对冲不足，而与股票相关的资金外流已经停 止。" 台积电股价周一下跌1.3%，因市场担心新台币走强将影响其出口收入。周一早些时候，台北的美元兑新台币交易量跃升至2008年全球金融危机以来的 最高水平。银行收到了大量客户咨询，国泰联合银行（Cathay United Bank Co.）在其在线应用程序上引入了线上排队，以"保持系统稳定"。 尽管新台币上涨，台湾相关部门周一并未积极干预市场以限制其强势，尽管它通常会这样做以平抑波动。新加坡华侨银行资深外汇策略师Christopher Wong表示，对新台币升值的容忍度可能反映了更广泛的政策调整。在谈判之前，由市场决定的汇率可能也有助于贸易谈判。 SHMET 网讯：香港金管局表示，他们继续购买美元，试图捍卫外汇挂钩。 香港金管局今晨再注资605.43亿港元，因美元弱势，港元汇价兑每美元长时间触及7.75强方兑换保证。金管局资料披露，根据联系汇率机制，在美股收 市后，再接78.12亿美元沽盘，银行体系结余将升至1613.84亿港元。 自上周五美股收市后，因触及强方兑换保证，金管局 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文编译自semiengineering，谢谢。 混合方法有所帮助，堆叠更多层HBM也同样有效。三星、SK 海力士和美光是仅有的几家生产 HBM 的公司。三星以此为跳板，开始针对特定工作负载定制 HBM。但最佳解决方案是 HBM 和 SRAM 的结合，而代工厂最新的路线图展示了不同存储器的复杂组合，其互连间距非常紧密，以 促进数据移动。 英特尔最新的架构显示，14A 逻辑层直接堆叠在 SRAM 层上方。 英特尔代工厂、台积电和三星代工厂正在争相提供完整 3D-IC 的所有基础组件，这些组件将在未 来几年内以最小的功耗实现性能的大幅提升。 人们将大量注意力集中在工艺节点的进步上，但成功的3D-IC实现远比仅仅扩展数字逻辑复杂得 多，也更全面。它需要新材料，以及处理更薄基板并将其组装的不同方法。它涉及不同的背面供电 方案、各种类型的桥接器、多芯片通信的接口标准以及新的互连技术和方法。此外，它还需要对 EDA 工具和方法、数字孪生、多物理场仿真进行重大变革，以及重组工程团队和流程，并在从设 计到制造的整个流程的多个阶段融入人工智能。 3D-IC 已出现在代工厂的内部路 ...

Group 1: Core Insights - TSMC's recent conference highlighted the rapid expansion of the semiconductor industry, projecting a market size of $1 trillion by 2030, driven primarily by high-performance computing (HPC) and artificial intelligence (AI) applications [2][4] - By 2030, HPC/AI is expected to dominate the semiconductor market, accounting for 45%, while smartphones will represent 25%, automotive electronics 15%, IoT 10%, and other sectors 5% [4][6] - The demand for semiconductors is accelerating due to AI-driven applications, including AI accelerators in data centers, AI PCs, AI smartphones, and long-term applications like robotic taxis and humanoid robots [4][6] Group 2: Advanced Process Technologies - TSMC's N3 series (3nm process) includes N3, N3E, and upcoming versions like N3P, which will enhance performance by 5% while reducing power consumption by 5% to 10% [7][9] - The N2 process (2nm) is expected to achieve a 10%-15% speed improvement or a 20%-30% power reduction compared to previous technologies, with transistor density increasing by 15% [12][18] - A16 technology, set for production in 2026, will utilize a super power rail architecture to improve logic density and efficiency, achieving an 8%-10% performance boost and a 15%-20% power reduction compared to N2P [19][20] Group 3: Advanced Packaging and System Integration Innovations - TSMC introduced the 3DFabric platform, which includes 2.5D and 3D integration technologies to overcome traditional design limitations and support high-density memory integration [24][30] - The CoWoS technology supports high-density interconnects and has been successfully applied in advanced products like Tesla's Dojo supercomputer [28][33] - Future applications, such as augmented reality glasses and humanoid robots, will require advanced packaging technologies to integrate numerous high-performance chips efficiently [37][40]