Core Viewpoint - Intel's new CEO, Pat Gelsinger, emphasizes the importance of the foundry business and aims to prioritize it despite previous concerns about financial health and potential cuts to the division [1][2][4] Group 1: Leadership and Cultural Shift - Gelsinger's commitment to the foundry business marks a significant cultural shift within Intel, moving from an engineering-centric approach to one that prioritizes customer trust and responsiveness [3][5][6] - The focus on gaining customer trust is a departure from Intel's traditional engineering culture, indicating a potential transformation in the company's operational philosophy [4][5] Group 2: Foundry Business Strategy - Intel has invested $90 billion over the past four years in wafer fabrication to support its IDM 2.0 strategy, but the future direction under Gelsinger remains uncertain [2] - The company is building an ecosystem around its foundry services, including partnerships with leading EDA firms to enhance customer support in design processes [6][7] Group 3: Technological Advancements - Intel is advancing its manufacturing processes with multiple technology nodes, including Intel 4, Intel 3, and the highly anticipated Intel 18A, which is entering risk production and set for mass production this year [10][14] - The Intel 18A node features groundbreaking technologies such as RibbonFET and PowerVia, which are expected to significantly enhance performance and efficiency, potentially giving Intel a competitive edge over TSMC [17][18] Group 4: Competitive Landscape - Intel's competition with TSMC is intensifying, with both companies developing advanced nodes; however, Intel's unique technologies may provide it with a strategic advantage [14][21] - The introduction of Intel 14A, which utilizes high-NA EUV lithography, positions Intel to potentially surpass TSMC in technology, although TSMC's cost-effective strategies could pose challenges for Intel [20][21]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 eenewseurope ，谢谢。 据报道，初创公司Lace Lithography AS（挪威卑尔根）正在开发一种光刻技术，该技术使用向表 面发射的原子来定义特征，其分辨率超出了极紫外光刻技术的极限。 该公司由卑尔根大学首席执行官 Bodil Holst 教授和首席技术官 Adria Salvador Palau 于 2023 年 7 月共同创立，后者在卑尔根大学获得博士学位，但目前在西班牙巴塞罗那运营。 传统的 EUV 系统使用 13.5nm 波长的光，通过一系列反射镜和掩模在晶圆上形成图案。原子光刻 技术能够实现直接无掩模图案化，其分辨率甚至小于受波长限制的 EUV 系统所能达到的分辨率。 该公司在其网站上声称："通过使用原子代替光，我们为芯片制造商提供了领先当前技术 15 年的 功能，而且成本更低、能耗更低。" Salvador Palau 和 Holst 教授共同撰写了一篇发表在《物理评论 A》上的论文，题为《利用中性 氦原子进行真实尺寸表面映射》。该论文详细介绍了立体氦显微镜的实现和操作。 Lace Litho 所称的 BEUV 理论上 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 2025势银异质异构集成封装产业大会 将于 4月29日 在浙江宁波 · 甬江实验室举办。 会议议程 专题论坛： 异构集成研究中心成立仪式 09:00 09:10 相关领导 主办方、联合主办方致辞 09:10 09:20 相关领导 混合键合在异构集成先进封装中的应用 09:20 钟飞 主任助理、信息材料与微纳器件制备 09:40 平台负责人 爵江实验室 Chiplet EDA全流程:设计空间探索,物 理实现及多物理验证 09:40 吴晨 项目总监 10:00 芯粒CAD和制造浙江省工程研究中心/深圳 市比昂芯科技有限公司 聚焦2.5D/3D先进封装EDA平台,探索后 10:00 端全流程设计、仿真与验证协同创新模式 10:20 赵毅 创始人兼首席科学家 珠海硅芯科技有限公司 空部 10:20 10:40 硅基光芯片制造与集成工 ...

Investment Rating - The report does not explicitly state an investment rating for the industry Core Insights - The lithography process is the most technically challenging, costliest, and time-consuming step in chip manufacturing, accounting for approximately 30% of costs and 40-50% of time in the manufacturing process [7][10][12] - The lithography process involves multiple steps, including surface treatment, coating, exposure, development, and inspection, with advanced technology nodes requiring 60-90 lithography steps [7][10] - The lithography market is dominated by three major players: ASML, Nikon, and Canon, with a market size in the hundreds of billions [3.2][4.1] Summary by Sections 1. Lithography Process - Lithography is crucial for defining the minimum line width of chips and directly impacts the performance and process level of semiconductor devices [7][10] - Key parameters in lithography include resolution and overlay accuracy, which are essential for ensuring the precise transfer of patterns onto silicon wafers [14][32] 2. Components of Lithography Machines - Lithography machines consist of several key components, including the light source, illumination system, and projection optics, which are critical for the exposure process [43][45] - The light source provides the energy needed for lithography, with different types such as mercury lamps, excimer lasers, and extreme ultraviolet (EUV) light being used depending on the process requirements [45][48] 3. Lithography Machine Market - The lithography machine market is characterized by a high level of competition among leading manufacturers, with ASML being a dominant player in the EUV segment [3.2][4.1] - The report highlights the evolution of lithography technology, including advancements in light source wavelengths and numerical aperture (NA), which are essential for improving resolution [19][22] 4. Domestic Supply Chain Manufacturers - The report outlines several domestic manufacturers involved in the lithography supply chain, including Shanghai Micro Electronics, Guoke Precision, and Huazhuo Jingke, each specializing in different aspects of lithography technology [4.1][4.2][4.3]

添加文末微信，加 先进封装 群 2025势银异质异构集成封装产业大会 将于 4月29日 在浙江宁波 · 甬江实验室举办。 会议议程 "宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 ⊙ 09:00 - 12:00 专题论坛： 异构集成研究中心成立仪式 09:00 09:10 相关领导 主办方、联合主办方致辞 09:10 09:20 相关领导 混合键合在异构集成先进封装中的应用 09:20 钟飞 主任助理、信息材料与微纳器件制备 09:40 平台负责人 爵江实验室 Chiplet EDA全流程:设计空间探索,物 理实现及多物理验证 09:40 吴晨 项目总监 10:00 芯粒CAD和制造浙江省工程研究中心/深圳 市比昂芯科技有限公司 聚焦2.5D/3D先进封装EDA平台,探索后 10:00 端全流程设计、仿真与验证协同创新模式 10:20 赵毅 创始人兼首席科学家 珠海硅芯科技有限公司 空部 10:20 1 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 appleinsider ，谢谢。 自蒂姆·库克发布Apple Silicon芯片以来，即将迎来五周年纪念日。其实，关于它的传闻也已持续 了十多年。以下是整个故事的起源、发布过程以及未来的展望。 在多年应对英特尔芯片限制之后，苹果在 2020 年WWDC期间宣布转向 Apple Silicon。放弃常用 架构的努力将使苹果从同年晚些时候开始转向为其Mac和 MacBook 产品线设计新的内部芯片系 列。 从英特尔到 Apple Silicon 的两年过渡开启了公司乃至整个行业的重大变革。除了宣称高效设计和 高性能之外，这款芯片的发布也符合预期。Apple Silicon 还将其iPhone芯片中最具前瞻性的功能 引入了桌面平台。在其 M 系列芯片中添加神经引擎是一项突破性举措，并迫使其他计算行业考虑 在处理器选择上采取类似的举措。 该芯片从根本上遵循了内置 GPU 处理器的基本理念，这在处理领域过去和现在都是一种相当传统 的概念。神经引擎无疑提升了机器学习任务的性能，但另一个与常规做法不同的变化也起到了一定 作用。 苹果决定使用统一内存，而不是为 ...

Core Viewpoint - The rise and fall of the ASUS Eee PC, which pioneered the netbook category, illustrates the rapid evolution of consumer electronics and the impact of market dynamics on product lifecycle [1][13][43] Group 1: Product Launch and Market Impact - ASUS became the world's second-largest OEM in 2006, primarily manufacturing computers and servers for Dell and HP [1] - The launch of the ASUS Eee PC in 2007 marked the beginning of the netbook revolution, achieving nearly 40 million units sold at its peak [1][9] - The Eee PC was priced at $299, significantly lower than traditional laptops, which contributed to its rapid adoption [4][9] Group 2: Market Dynamics and Consumer Behavior - The global financial crisis in 2007 amplified the appeal of low-cost netbooks as consumers sought affordable alternatives to traditional laptops [7][9] - The entry of various manufacturers, including Acer and numerous low-cost producers in Shenzhen, further drove down prices and expanded the netbook market [6][9] - Netbooks found a niche in the education sector, particularly in developing countries, where they were seen as a cost-effective solution for providing students with computers [9][12] Group 3: Decline and Technological Evolution - Despite initial success, netbook sales began to decline sharply after 2010, with sales dropping from 39.4 million units in 2010 to just 1.4 million by 2013 [10][13] - The emergence of tablets and smartphones, which offered better performance and portability, contributed to the decline of netbooks [30][36] - The rapid advancement of technology, as described by Moore's Law, led to increased performance in traditional laptops, making them more competitive against netbooks [26][29] Group 4: Legacy and Industry Influence - The netbook phenomenon highlighted consumer demand for lightweight, affordable computing solutions, influencing the design and marketing of future products like ultrabooks and Chromebooks [42][43] - Although netbooks were short-lived, their impact on the industry was significant, prompting manufacturers to explore new market segments and innovate in product design [42][43]

Core Viewpoint - Lace Lithography AS is developing a new lithography technology that utilizes atoms to define features, surpassing the resolution limits of extreme ultraviolet (EUV) lithography, potentially extending Moore's Law [1][2]. Group 1: Company Overview - Lace Lithography AS was founded in July 2023 by Bodil Holst and Adria Salvador Palau, with operations currently based in Barcelona, Spain [1]. - The company claims its atomic lithography technology can provide capabilities 15 years ahead of current technologies, with lower costs and energy consumption [1]. Group 2: Technology Details - The traditional EUV systems operate at a wavelength of 13.5nm, while the atomic lithography technology can achieve direct maskless patterning with resolutions even finer than those limited by wavelength in EUV systems [1]. - The technology is expected to support the continued miniaturization of transistors [1]. Group 3: Funding and Projects - Lace Lithography has raised approximately €450,000 in seed funding from various investors, including Runa Capital and the European Innovation Council [2]. - The FabouLACE project, funded by the EU with a budget of €2.5 million, aims to develop helium atom lithography technology and is set to run from December 1, 2023, to November 30, 2026 [2]. - The NanoLACE project, which started in 2019 and ends on December 31, 2024, has received €3.36 million in funding [2].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 eenewseurope ，谢谢。 据报道，初创公司Lace Lithography AS（挪威卑尔根）正在开发一种光刻技术，该技术使用向表 面发射的原子来定义特征，其分辨率超出了极紫外光刻技术的极限。 Lace Litho 所称的 BEUV 理论上可以实现更精细的特征，支持晶体管的持续小型化并延伸摩尔定 律。 该公司由卑尔根大学首席执行官 Bodil Holst 教授和首席技术官 Adria Salvador Palau 于 2023 年 7 月共同创立，后者在卑尔根大学获得博士学位，但目前在西班牙巴塞罗那运营。 传统的 EUV 系统使用 13.5nm 波长的光，通过一系列反射镜和掩模在晶圆上形成图案。原子光刻 技术能够实现直接无掩模图案化，其分辨率甚至小于受波长限制的 EUV 系统所能达到的分辨率。 该公司在其网站上声称："通过使用原子代替光，我们为芯片制造商提供了领先当前技术 15 年的 功能，而且成本更低、能耗更低。" https://www.eenewseurope.com/en/lace-lithography-uses-atoms-t ...

如果您希望可以时常见面，欢迎标星收藏哦~ IEEE IEDM 会议由 IEEE 电子器件学会主办，是全球规模最大、最具影响力的论坛，旨在展 示晶体管及相关微纳电子器件领域的突破性进展。 在第 70 届 IEEE IEDM 会议上，他们以"塑造未来的半导体技术"分享了芯片的未来技术。我 们摘录如下，以飨读者。 先进的逻辑技术 基于纳米片的晶体管以及由纳米片构建的3D互补场效应晶体管 (CFET) 是延续摩尔定律微缩的关 键，因为现有的FinFET架构正在达到其性能极限。纳米片是一种环栅 (GAA) 晶体管架构，其中 硅堆叠的沟道完全被栅极包围。它们比FinFET具有更好的静电控制、相对较高的驱动电流和可变 的宽度。而CFET是高度集成的3D设计，其中n-FET和p-FET纳米片相互堆叠。这些堆叠器件可以 单片构建（在同一晶圆上），也可以顺序构建（在单独的晶圆上构建，然后进行转移和集成）。 堆叠器件本质上使晶体管密度翻倍，而无需增加器件尺寸，从而实现更强大的功能，并提高功率效 率和性能。在 IEDM 2024 上，多篇论文推动了以下领域的最前沿研究： 一、台积电全新业界领先的 2 纳米 CMOS 逻辑平台 台积电 ...