Group 1: Definition and Classification of Photomasks - Photomasks, also known as photomask or lithographic mask, are essential tools in microelectronics manufacturing for transferring patterns onto substrates [2][4] - Photomasks can be classified into quartz masks, soda masks, and others, with quartz masks being preferred for high-precision applications due to their superior optical properties [6][16] Group 2: Manufacturing Process of Photomasks - The manufacturing process of photomasks is complex, involving multiple steps such as CAM file processing, photoresist coating, laser lithography, developing, etching, and inspection [6][9] - Key parameters such as critical dimension (CD) and overlay accuracy are crucial for ensuring the quality and yield of photomasks [9][10] Group 3: Photomask Industry Chain - The photomask industry chain consists of upstream raw material suppliers, midstream manufacturers, and downstream users including IC manufacturers and flat panel display (FPD) producers [14][16] - Major players in the midstream photomask manufacturing include companies like HOYA, DNP, and LG-IT, while downstream users include TSMC and Intel [14] Group 4: Market Characteristics of Semiconductor Photomasks - The semiconductor photomask market is projected to reach USD 5.4 billion, with mature processes accounting for 87% of the market share [34] - The market has shown steady growth, with a compound annual growth rate (CAGR) of nearly 7% from 2020 to 2023 [34][39] Group 5: Market Characteristics of Flat Panel Display Photomasks - The flat panel display photomask market is primarily driven by demand in China, which accounted for 57% of global demand in 2022 [57] - The market is expected to grow, with a projected increase in demand for larger and higher precision displays [60][62] Group 6: Competitive Landscape of Photomasks - The global semiconductor photomask market is highly concentrated, with major players like Photronics, Toppan, and DNP controlling over 80% of the market [69] - Domestic manufacturers in China are rapidly catching up, with companies like SMIC and Longtu Photomask making significant advancements [69][74] Group 7: Future Trends in Photomasks - The development of advanced logic processes and specialty processes represents two major directions in semiconductor manufacturing [82] - The trend towards smaller feature sizes and increased integration in semiconductor devices will drive demand for high-precision photomasks [84]

Investment Rating - The report does not explicitly provide an investment rating for the advanced packaging equipment industry. Core Insights - The advanced packaging technology aims to enhance chip performance, increase functional integration, reduce product size, and improve thermal management capabilities, driven by the demand for high-performance electronic products. The key to achieving these advanced packaging technologies lies in advanced packaging equipment [2]. Summary by Sections Semiconductor Packaging Equipment Industry Overview - Traditional packaging focuses on low cost and simple structures, while advanced packaging utilizes high-density interconnects, heterogeneous integration, and 3D stacking technologies to meet the demands of high-performance computing, 5G, and AI [16]. - The global semiconductor manufacturing equipment sales are projected to grow from $106.3 billion in 2023 to $117.1 billion in 2024, with advanced packaging driving an increase in the share of packaging equipment sales [21][22]. Required Semiconductor Equipment for Packaging Processes - Advanced packaging introduces new applications such as wafer thinning, RDL (Redistribution Layer) production, bump production, and TSV (Through-Silicon Via) production, necessitating both existing backend packaging equipment and new front-end equipment [9][27]. - The traditional backend packaging equipment must undergo technological upgrades to accommodate smaller sizes, higher integration, and more complex structures, focusing on precision, material compatibility, process control, and automation [32]. Advanced Packaging Equipment Analysis - The report highlights the need for various semiconductor equipment types, including thinning machines, dicing machines, and bonding machines, to support advanced packaging processes [35][45]. - The global thinning machine market is dominated by Japanese companies, with a concentration ratio of approximately 85%, while domestic companies like Huahai Qingke and Jing Sheng Machinery are emerging players [40][44]. Traditional Backend Equipment Upgrades and Manufacturers - Traditional backend packaging equipment requires upgrades to meet the demands of advanced packaging, focusing on precision enhancement, material compatibility, process control, and automation [32]. - Key domestic suppliers for thinning machines include Huahai Qingke, Jing Sheng Machinery, and China Electronics Technology Group [32].

Investment Rating - The report does not explicitly provide an investment rating for the advanced packaging equipment industry. Core Insights - The advanced packaging technology aims to enhance chip performance, increase functional integration, reduce product size, and improve thermal management capabilities, driven by the demand for high-performance electronic products. The key to achieving these advanced packaging technologies lies in advanced packaging equipment [2]. - The future of the IC packaging equipment market is expected to grow significantly as advanced packaging becomes a core and cost-effective path to surpass Moore's Law, leading to an increase in the sales proportion of packaging equipment [5][26]. Summary by Sections Semiconductor Packaging Equipment Industry Overview - Traditional packaging focuses on low cost and simple structures, while advanced packaging meets the demands of high-performance computing, 5G, and AI through high-density interconnects and heterogeneous integration [16]. - The global semiconductor manufacturing equipment sales are projected to grow from $106.3 billion in 2023 to $117.1 billion in 2024, with packaging equipment sales expected to increase significantly due to the rising complexity and demand for AI chips [21][22]. Required Semiconductor Equipment for Packaging Processes - Advanced packaging introduces new applications such as wafer thinning, RDL (Redistribution Layer) production, bump production, and TSV (Through-Silicon Via) production, necessitating both existing back-end packaging equipment and new front-end equipment [9][27]. - The traditional back-end packaging equipment must undergo technological upgrades to meet the requirements of smaller sizes, higher integration, and more complex structures [32]. Advanced Packaging Equipment Analysis - The report highlights the need for various traditional back-end devices, including thinning machines, dicing machines, bonding machines, and molding machines, which must adapt to advanced packaging requirements [35][45]. - The global thinning machine market is dominated by Japanese companies, with a concentration ratio of approximately 85%, while domestic companies are also emerging in this space [40][44]. Traditional Back-End Equipment Upgrades and Manufacturers - Traditional back-end packaging equipment requires upgrades in precision, material compatibility, process control, and automation to meet the demands of advanced packaging technologies [32]. - Key domestic suppliers for thinning machines include Huahai Qingke, Jing Sheng Machinery, and China Electronics Technology Group, among others [32].