今天A股市场震荡走低，三大指数"跳水"下挫。其中，创新药、核电等方向领跌，机器人、半导体、 PCB等板块盘中活跃。两市成交12506亿，较上一交易日放量595亿。收盘，沪指下跌0.79%，深指下跌 1.21%，创业板指下跌1.36%，市场超4600只个股下跌。 那，两市突然"跳水"大跌，原因是什么呢？我认为有三大原因：1、美联储宣布不降息，美元指数大 涨，股市承压。虽然，市场早有预期这次美联储不会宣布降息，但听鲍威尔讲话的意思，预计未来数月 将出现更多关税驱动的物价上涨，并且预测通货膨胀率为3%，纵然点阵图显示今年降息2次，但可能也 不会降息。受到不降息预期的刺激，美元指数已经突破99了，压制股票市场。 2、PCB概念持续活跃。有机构表示，英伟达GB200/300积极拉货，2025、2026年ASIC迎来爆发式增 长，目前多家AI-PCB公司订单强劲，满产满销，正在大力扩产，二、三季度业绩高增长有望持续。 3、半导体盘中活跃。主要有两方面的原因，一方面是三大巨头，三星、SK海力士、美光宣布停产，另 一方面是国产算力产业链仍在奋力追赶，关键环节处于"强需求、弱供给"的状态，国产化率的提升，刺 激了半导体板块。 ...

截至2025年6月19日 13:05，上证科创板芯片指数上涨0.09%，成分股峰岹科技上涨5.18%，睿创微纳上涨2.34%，中科飞测上涨2.26%，翱捷科技上涨1.81%， 恒玄科技上涨1.60%。科创芯片ETF(588200)逆市红盘。 | 股票代码 | 股票简称 | 涨跌幅 | 权重 | | --- | --- | --- | --- | | 688981 | 中芯国际 | -0.37% | 10.08% | | 688041 | 海米信息 | -0.70% | 9.35% | | 688256 | 寒武纪 | 0.14% | 8.61% | | 688008 | 澜起科技 | 0.92% | 8.25% | | 688012 | 中微公司 | 0.31% | 7.40% | | 688521 | 芯原股份 | -2.69% | 3.42% | | 688126 | 沪硅产业 | -0.83% | 2.82% | | 688608 | 恒玄科技 | 1.60% | 2.69% | | 688099 | 晶晨股份 | 0.26% | 2.57% | | 688213 | 慰特威 | 0.52% | 2.5 ...

6月19日，A股三大指数小幅低开而后下挫，锂电电解液、半导体设备等概念相继走高。截至2025年6月19日 10点19分，中证半导体材料设备主题指数 （931743）强势上涨1.49%，成分股华海诚科上涨5.35%，金海通上涨4.62%，中科飞测上涨4.40%，北方华创，华海清科等个股跟涨。半导体材料ETF （562590）上涨1.44%，最新价报1.06元。流动性方面，半导体材料ETF盘中换手2.73%，成交911.60万元。规模方面，半导体材料ETF近1周规模实现显著增 长，新增规模位居可比基金首位。 消息方面，2025陆家嘴论坛在上海举行，证监会表示，将在科创板设置科创成长层，同时推出6项更具包容性、适应性的改革措施。重启未盈利企业适用科 创板第五套标准上市，支持人工智能、商业航天、低空经济等前沿科技领域企业适用第五套标准，成为改革最大亮点。 广发证券指出，半导体行业在AI等新技术的带领下呈现以下趋势：（1）汽车电子、新能源、物联网、大数据和人工智能等领域新技术、新产品的渗透率提 升和需求增长，成为半导体板块成长的重要动力；（2）国产化持续推进，近年来中美贸易摩擦凸显出半导体供应链安全和自主可控的重要性和 ...

Core Viewpoint - Maolai Optics (688502.SH) is accelerating its expansion by issuing convertible bonds to raise up to 581 million yuan for the construction of ultra-precision optical production and R&D projects, which will enhance its production capacity and operational efficiency [1][2]. Group 1: Financial Performance - In Q1 2025, Maolai Optics reported revenue of 142 million yuan, a year-on-year increase of 28.23%, and a net profit of 16.64 million yuan, up 288.73% [5]. - For 2024, the company achieved revenue of 503 million yuan, a 9.78% increase, but net profit decreased by 23.98% to 35.52 million yuan [4]. - The gross profit margin for Q1 2025 was 50.49%, an increase of 1.01 percentage points year-on-year [5]. Group 2: Investment Projects - The ultra-precision optical production project has a total investment of 417 million yuan, with the raised funds expected to cover this amount entirely [2]. - The project is projected to achieve an internal rate of return of 16.51% (after tax) and a payback period of 8.3 years, with expected annual sales revenue of 600 million yuan upon reaching full capacity [2][3]. Group 3: Market Context - The semiconductor equipment market in China has surpassed 200 billion yuan, with photolithography equipment demand being particularly strong, accounting for over 20% of the market [3]. - Maolai Optics aims to leverage its technological and production advantages to expand its market share in the semiconductor ultra-precision optical sector [3]. Group 4: R&D Investment - From 2022 to 2024, Maolai Optics' R&D expenses increased annually, totaling 192 million yuan over the three years [4][5]. - The company has developed several core technologies, contributing to its high gross profit margins, which were 49.52%, 51.89%, and 48.48% for the years 2022, 2023, and 2024, respectively [5].

Group 1: Company Performance and Growth - The company achieved a revenue increase of 236.78% in Q1 2025, driven by the sales of smart card products and the successful launch of semiconductor packaging materials [1][2] - The performance trend for the first half of 2025 indicates overall business growth, particularly in the semiconductor packaging materials sector and high-margin smart card services [1][2] Group 2: Employee Stock Ownership Plan - The performance assessment targets for the 2025 employee stock ownership plan are set at a minimum of 16% growth in both net profit and operating revenue [2] - The company aims to maintain growth through enhanced cooperation with domestic operators and expansion into new application scenarios for smart cards [2] Group 3: Semiconductor Packaging Materials - The company is expanding its customer base to include major domestic and international power semiconductor packaging enterprises, with a focus on high-performance packaging materials [3][4] - The competitive landscape shows that while international giants dominate the semiconductor packaging materials market, domestic companies are rapidly catching up, particularly in high-growth sectors like electric vehicles and AI computing [3][4] Group 4: Smart Card Business - The smart card market is experiencing stable growth, with new applications in industrial internet and AIoT driving demand [5][6] - The company has established a comprehensive end-to-end system for smart card production, enhancing its competitive edge and customer loyalty [5][6] Group 5: Liquid Cooling Technology - The liquid cooling products are primarily used in AI servers and high-performance computing, with a focus on high thermal efficiency and low energy consumption [7][8] - The market for liquid cooling technology is expected to grow significantly, driven by increasing performance demands in data centers and high-performance computing [8][9] Group 6: Safety Solutions - The company's safety barrier project is designed for high-speed rail platforms, enhancing passenger safety through innovative physical isolation solutions [10][11] - The business model is based on pricing per platform length, with potential for significant value addition due to high technical barriers and safety requirements [10][11] Group 7: Business Synergy and Future Strategy - The company has developed a synergistic relationship among its four main business segments, leveraging core competencies in materials and structural design [11] - Future growth strategies include cautious consideration of mergers and acquisitions, focusing on long-term stability rather than rapid expansion [11]

ff9 本次发行股票拟在科创板上市。科创板公司具有研发投入大、经营风险高、 业绩不稳定、退市风险高等特点，投资者面临较大的市场风险。投资者应充 分了解科创板的投资风险及本公司所披露的风险因素，审慎作出投资决定。 北京屹唐半导体科技股份有限公司 Beijing E-Town Semiconductor Technology Co., Ltd. （北京市北京经济技术开发区瑞合西二路 9 号） 首次公开发行股票并在科创板上市 招股意向书 保荐人（主承销商） （中国（上海）自由贸易试验区商城路 618 号） 联席主承销商 （北京市朝阳区建国门外大街 1 号国贸大厦 2 座 27 层及 28 层） 北京屹唐半导体科技股份有限公司 招股意向书 声 明 中国证监会、上海证券交易所对本次发行所作的任何决定或意见，均不表明 其对发行人注册申请文件及所披露信息的真实性、准确性、完整性做出保证，也 不表明其对发行人的盈利能力、投资价值或者对投资者的收益作出实质性判断或 者保证。任何与之相反的声明均属虚假不实陈述。 根据《证券法》的规定，股票依法发行后，发行人经营与收益的变化，由发 行人自行负责；投资者自主判断发行人的投资价值，自主 ...

Core Viewpoint - The company is implementing a differentiated and high-end development strategy focused on electroplating and photolithography, with significant progress in product testing and upcoming mass production, which is expected to drive continuous growth in performance [1][3]. Electroplating - The company has established a competitive product matrix for electroplating solutions, achieving full category coverage in traditional and advanced packaging fields, and has made breakthroughs in high-end markets [1]. - In the advanced packaging sector, multiple products for electroplating solutions and additives have entered mass production, widely used in Bumping and RDL processes [1]. - The high-purity copper electroplating solution has achieved stable supply to Huada Technology and Tongfu Microelectronics, while the tin-silver electroplating additive has passed stringent certification from Changdian Technology and received small batch orders [1]. - The copper electroplating additive for advanced packaging is currently undergoing batch stability verification, and the 28nm Damascus copper interconnect process copper plating additive is in the final stages of product certification [1]. - The ultra-high purity cobalt-based solution and additives for 5-14nm advanced processes are progressing well in client testing, and the cleaning solution for copper processes in wafer manufacturing has entered the mass production scaling phase [1]. Photolithography - The advanced packaging negative photoresist has covered multiple mainstream packaging factories, with market penetration continuously increasing, and the company plans to enrich product models for full category coverage [2]. - The self-developed positive PSPI photoresist has successfully obtained the first domestic order from a mainstream wafer factory, breaking the long-standing technology monopoly of the US and Japan, and is expected to gradually achieve mass shipments by 2025 [2]. - The company is also developing negative PSPI and high-sensitivity chemical amplification PSPI, with plans to continue advancing product certification in advanced packaging and wafer manufacturers by 2025 [2]. - The wafer ICA chemical amplification photoresist is undergoing successful client validation testing, with some indicators outperforming international benchmark products [2]. - The OLED high-sensitivity photoresist is in client testing for OLED backplane array photolithography processes, and the company has reached a consensus with BOE on future cooperation and strategic planning [2]. - The high-thickness KrF photoresist is currently in the laboratory research phase, aiming to fill domestic gaps [2]. Market Expansion - The company has acquired INOFINE to expand into the Southeast Asian market, further solidifying its leading position in wet electronic chemicals [3]. - INOFINE, established in 2009, is one of the early entrants in the semiconductor wet electronic chemicals business in Malaysia and holds a certain influence in the local market [3]. - From 2025, INOFINE will be included in the company's consolidated financial statements [3]. Financial Projections - The company expects revenues of 600 million, 727 million, and 913 million yuan for the years 2025, 2026, and 2027, respectively, with net profits attributable to the parent company projected at 50 million, 71 million, and 103 million yuan for the same years [3].

Group 1 - The company held its 2024 annual shareholder meeting, electing Zhang Tianchuang as a non-independent director and chairman of the board [2] - Zhang Tianchuang has a background in military education and has held various leadership roles within the company, including general manager [2] - Multiple institutional investors attended the meeting, where the company discussed its future strategy in the civil aviation sector [2] Group 2 - The company is actively participating in the domestic production of various aircraft models, aiming to contribute to the national strategy for aircraft localization [2] - The company plans to expand its customer base in the civil aviation sector by leveraging its PMA supplier qualifications to meet maintenance and replacement needs [3] - In 2024, the company reported a revenue of 83.92 million yuan from its landing gear business, marking a year-on-year increase of 1,766.18% [3] Group 3 - The company is integrating resources through its subsidiary, Saini Aviation, to expand its international market presence in civil aviation [3] - The company has completed various certification and production processes for landing gear, laying the groundwork for future deliveries [3] - The company is also exploring new applications for titanium alloys and developing advanced lightweight technologies [3]

原标题：2025企业数智化财务创新研讨会在京举办 近日，以"智融财通慧领未来"为主题的2025企业数智化财务创新研讨会在京举办，本次大会由中国企业 财务管理协会主办、联通数字科技有限公司承办。众多行业领袖、学术专家、企业精英齐聚一堂，围绕 企业财务数字化转型的创新实践、未来趋势以及生态合作展开交流，共同探索数智财务发展的新范式。 数字经济浪潮下，财务数字化转型已成为企业提升核心竞争力和实现可持续发展的关键路径。中国企业 财务管理协会会长张连起表示，协会将持续关注企业在数字化转型中的需求和挑战，积极推动财务管理 领域的数智化创新，并期待与联通数科在赋能企业数字化发展上深化协同，促进生态建设与经验交流。 研讨会上，中国联通集团财务部副总经理刘峰介绍，中国联通以"往来穿透、指标牵引"为抓手推进财务 数据治理，以"大小模型协同、以小为主"作为智能应用的务实路径，推动前沿技术在财务场景稳健落 地。来自中国石油化工集团有限公司财务部、中国信通院云大所政企数字化转型部、中国铁塔股份有限 公司业务支撑部等企业相关负责人，分享了公司在财务数智化转型的探索与实践。 活动现场，嘉宾们围绕数智化财务展开交流。在"AI+财务"深化应用 ...

Core Viewpoint - The 2025 TrendBank (Fifth) Lithography Industry Conference will be held on July 9-10, 2025, in Hefei, focusing on advanced lithography technologies and the challenges faced by the domestic lithography materials industry [14][25]. Group 1: Conference Overview - The conference will feature over 20 speakers from the lithography industry, covering advanced lithography technologies, photoresists, wet electronic chemicals, masks, and lithography equipment [15]. - The event aims to promote deep integration of industry, academia, and research, enhancing communication and collaboration among domestic research institutions, universities, and enterprises [23][24]. Group 2: Industry Challenges - The domestic lithography industry faces significant challenges, including low self-sufficiency rates in high-end photoresists and reliance on imports for key materials and equipment [22]. - The high-precision manufacturing technology for masks is difficult, with major raw materials also being imported, which poses risks to supply stability [22]. Group 3: Conference Details - The conference will take place at the Sheraton Hefei New Station Hotel, with an expected attendance of around 300 participants [16]. - Registration fees are set at RMB 2600 if paid by June 30, and RMB 2800 thereafter, which includes conference materials, meals, and a gala dinner [18].