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下周三开幕 | 华为、小鹏、中兴、比亚迪、OPPO、小米、寒武纪、理想、阳光电源......买家齐聚2025热博会!
DT新材料· 2025-11-24 23:10
2025年12月3-5日 第六届热管理产业大会暨博览会 (简称:热博会) 将在 深圳国际会展中心宝安(10号馆) 盛大 开幕 !本届展会覆盖热管 理材料、器件、系统解决方案与工程应用,汇聚产业链600余家热管理优质供应商,预计 吸引20,000余名专业观众到场,涵盖 研发/技术/设计、采购负责人、终端应用厂商决策者 等核心人群。 部分VIP买家名单涵 消费电子、数据中心、互联网、新能源汽车、工业制造、 高校及科研院所等 多个关键领域, 通过iTherM搭建的高效供需对接平台,构筑从技术洞察到商业合作的高速通道。 诚挚邀请国内外知名 学者、技术专家、产业上下游企业高管和代表、政府园区、科研院所和投资机构等莅临交流与 合作, 共探热管理产业新动态、新技术、新场景和新趋势,共享新质生产力千亿大市场! 华为技术有限公司 华为数字能源技术有限公司 华为终端有限公司 荣耀终端股份有限公司 OPPO 英伟达半导体有限公司 小米通讯技术有限公司 维沃移动通信有限公司(vivo) 影石创新科技股份有限公司 深圳市腾讯计算机系统有限公司 努比亚技术有限公司 公牛集团股份有限公司 深圳三星通信技术研究有限公司 深圳市海思半导体有限 ...
倒计10天!大会议程+展商名单+参会名录,第六届热管理产业大会暨博览会(建议收藏)
DT新材料· 2025-11-24 00:05
Core Points - The iTherM 2025 conference will focus on the thermal management industry, emphasizing the integration of electronic information, new materials, new energy, semiconductors, digital economy, automotive, smart networking, low-altitude economy, and green low-carbon industries [1][3] - The event aims to explore new dynamics, technologies, scenarios, and trends in the thermal management industry, highlighting its market potential worth billions [1] Event Details - The conference is scheduled for December 3-5, 2025, at the Shenzhen International Convention and Exhibition Center [3] - The theme of the conference is "Integration · Innovation | Delivering a Little More" [3] Organizers and Support - Organized by DT New Materials and iTherM, with support from various academic and industry experts [4][5] - The event will feature contributions from renowned scholars and industry leaders, including members from prestigious institutions [4] Conference Agenda - The agenda includes multiple specialized sessions covering topics such as thermal science, thermal interface materials, chip and electronic device management, and liquid cooling technology [5][6] - Each day will feature a series of presentations and discussions led by experts in the field, focusing on advancements and challenges in thermal management [5][6] Exhibitors and Participants - A diverse range of exhibitors will participate, showcasing innovations in thermal management materials and technologies [38][39] - Notable companies and institutions, including major players in the semiconductor and automotive sectors, are expected to attend [42]
高澜股份:热管理业务主要产品达到国内领先或国际先进水平
Sou Hu Cai Jing· 2025-11-12 08:05
Core Viewpoint - The company, Gaolan Co., Ltd. (300499), has achieved domestic and international leading levels in its thermal management technologies across various sectors, including controllable nuclear fusion, nuclear power, wind power, and charging piles [1] Group 1 - The company emphasizes its commitment to independent innovation and research and development since its establishment [1] - The main products in the thermal management business have reached a leading level domestically or an advanced level internationally, with some products achieving international leading status [1]
液冷、芯片、微通道、热界面材料、数据中心/机器人热管理报道130+报告主题一览
DT新材料· 2025-11-11 16:03
Core Points - The article discusses the upcoming iTherM 2025 Thermal Management Industry Conference and Expo, focusing on advancements in thermal management across various industries such as electronics, new materials, and renewable energy [2][4][39]. - The conference will take place from December 3 to 5, 2025, at the Shenzhen International Convention and Exhibition Center, emphasizing the integration and innovation in thermal management technologies [4][40]. Event Details - The conference is organized by DT New Materials and iTherM, with support from local government and various academic institutions [4][5]. - The event will feature multiple sessions covering topics like thermal interface materials, liquid cooling technologies, and thermal management in data centers and electric vehicles [6][39]. Key Themes - The conference will address six major application themes: data centers, new energy vehicles, humanoid robots, consumer electronics, eVTOL/unmanned aerial vehicles, and energy storage [39]. - Key topics include thermal science, thermal management materials, heat pipes, insulation materials, microjet cooling, and chiplet/3D IC thermal management [39]. Notable Speakers and Sessions - The event will host prominent experts from various universities and industries, discussing cutting-edge research and applications in thermal management [5][10][19]. - Specific sessions will focus on advancements in thermal management technologies, including high-performance thermal interface materials and innovative cooling solutions for high-density chips [10][19][30].
热管理赛道升温,多家企业密集布局
DT新材料· 2025-11-07 16:05
Core Insights - The article highlights significant capital movements in the thermal management and semiconductor materials sectors, indicating a growing demand driven by the explosion of computing power and new energy industries [1][10]. Group 1: Strong Technology's Investment - Strong Technology announced a cash acquisition of 35% equity in Aluminum Treasure Technology for 70 million yuan, with 40 million yuan allocated for capital increase and 30 million yuan for equity transfer [2]. - The acquisition targets the core segment of AI server cooling, with 40% of Aluminum Treasure's revenue derived from cooling modules specifically for AI servers, serving major clients like NVIDIA and Google [2][4]. - Strong Technology's revenue for the first three quarters of 2025 reached 1.372 billion yuan, a year-on-year increase of 74.72%, with cooling products becoming a significant growth driver [4]. Group 2: Yubang New Materials' Diversification - Yubang New Materials announced an investment of 4.16 million yuan to acquire 40% equity in Shanghai Yubang Fengjun, entering the thermal management sector [5]. - The new company will provide temperature control solutions across various scenarios, including data centers and energy storage, differentiating itself from Strong Technology's hardware focus [5][7]. - The demand for thermal management in the new energy vehicle sector is growing at 15% annually, with data centers requiring up to 50 kW of cooling per cabinet [7]. Group 3: Taoxin Technology's Financing - Anhui Taoxin Technology completed a multi-million yuan Pre-A round of financing led by Xin'anjiang Capital, focusing on copper-clad ceramic substrates for power semiconductors [9]. - The company aims to replace foreign competitors in the high-end copper-clad ceramic substrate market, with a projected sales revenue of 40 million yuan by 2025, doubling from 2024 [9]. - The financing will primarily support the development of silicon nitride substrates to meet the 800 million yuan market demand for third-generation semiconductors [9]. Group 4: Industry Trends and Future Outlook - The activities of these three companies reflect structural opportunities in the thermal management industry, driven by the increasing demand for high thermal conductivity and reliability in materials due to the growth of new energy vehicles and AI data centers [10]. - The thermal management market is expected to maintain a growth rate of over 12% annually in the next three years, with companies possessing technological barriers becoming the focus of capital investment [10].
同星科技(301252) - 12、2025年11月5日投资者关系活动记录表
2025-11-05 08:08
Group 1: Data Center Development - The company is actively expanding its presence in the liquid cooling market for data centers, driven by the rising demand for artificial intelligence and cloud computing technologies [2] - The global data center market is expected to continue growing, providing opportunities for the company to leverage its technological advantages and production capacity [2] Group 2: Core Business Strategy - The company's main business focuses on heat exchanger products, automotive air conditioning components, and thermal management, while also exploring emerging markets like data center liquid cooling [3] - Future business priorities include deepening expertise in finned and microchannel heat exchangers, targeting niche markets such as cold chain logistics and heat pump dryers [3] Group 3: Investment in Robotics - The company has invested in a robotics firm, viewing robotics as a core future industry and a key area for strategic collaboration [3] - This investment aims to enhance the company's smart factory initiatives and leverage its thermal management expertise in the development of robotic technologies [3]
议程发布!130+主题报告,热管理千人年度盛会进入30天倒计时!
DT新材料· 2025-11-04 16:04
Core Viewpoint - The article emphasizes the rapid advancements in electronic technology, particularly in chip, device, and electronic equipment miniaturization, high performance, integration, and multifunctionality, which have led to increased power density and heat generation. This necessitates high standards for efficient thermal management materials and innovative solutions across various sectors, including consumer electronics, 5G, AI, and energy storage [2][4]. Conference Overview - The 6th Thermal Management Industry Conference and Exposition (iTherM 2025) will take place from December 3-5, 2025, at the Shenzhen International Convention and Exhibition Center, focusing on the integration of thermal management with various industries such as electronics, new materials, and green energy [4][33]. - The conference aims to gather over 2000 participants and 350 exhibitors, covering an exhibition area of 20,000 square meters, and will feature more than 20 activities including keynote speeches, roundtable discussions, and case studies [4][33]. Key Themes and Topics - iTherM 2025 will address cutting-edge developments in thermal management, including functional materials, technological applications, and engineering solutions, with a focus on intellectual property and innovative technologies that can transition from laboratories to market [4][33]. - The conference will include specialized sessions on topics such as thermal interface materials, chip and electronic device thermal management, liquid cooling technologies, and battery thermal management [6][12][16][25]. Notable Speakers and Organizers - The event will feature prominent scholars and industry leaders, including members from renowned institutions such as Tsinghua University and the Chinese Academy of Sciences, who will share insights on the latest trends and technologies in thermal management [5][6]. - The conference is organized by DT New Materials and supported by various governmental and academic institutions, highlighting the collaborative effort in advancing thermal management technologies [5][6]. Registration and Participation - Registration fees for participants are set at ¥2200 for regular attendees and ¥1200 for students if registered before October 31, 2025, with on-site fees being higher [30][31]. - The conference encourages participation from various stakeholders, including government agencies, research institutions, and investment firms, to foster collaboration and innovation in the thermal management sector [4][5].
宇邦新材:增资上海宇邦逢君云储科技416万元 持股40%
Mei Ri Jing Ji Xin Wen· 2025-11-04 09:39
Core Viewpoint - Company Ubon New Materials (301266) announced an investment in Shanghai Ubon Fengjun, acquiring a 40% stake through a capital increase of 4.16 million yuan, indicating a strategic move to strengthen its position in the thermal management industry [1] Company Summary - Ubon New Materials will invest 4.16 million yuan of its own funds to increase its stake in Shanghai Ubon Fengjun to 40% [1] - Shanghai Ubon Fengjun aims to be a leader in the thermal management sector, focusing on the research, development, manufacturing, and sales of thermal management products [1] Industry Summary - The product range of Shanghai Ubon Fengjun includes new power temperature control products, data center equipment products, energy storage temperature control products, industrial air conditioning products, and cloud computing devices [1]
宇邦新材拟取得上海宇邦逢君40%股权 其专注于热管理产品业务
Zhi Tong Cai Jing· 2025-11-04 09:34
Core Viewpoint - The company, Yubang New Materials (301266.SZ), is making a strategic investment in Shanghai Yubang Fengjun Cloud Storage Technology Co., Ltd. by increasing its capital contribution to 4.16 million RMB, acquiring a 40% stake in the company, which focuses on thermal management products [1] Group 1: Investment Details - The company will use its own funds to invest 4.16 million RMB in Shanghai Yubang Fengjun [1] - After the investment, the company will hold a 40% equity stake in Shanghai Yubang Fengjun [1] Group 2: Business Focus - Shanghai Yubang Fengjun aims to be a leader in the thermal management industry, specializing in the research, manufacturing, and sales of thermal management products [1] - The product range includes new power temperature control products, data center equipment products, energy storage temperature control products, industrial air conditioning products, and cloud computing devices [1] Group 3: Strategic Rationale - The investment decision is based on a forward-looking consensus regarding the development of thermal management equipment, future market demand, and the company's diversification strategy [1]
宇邦新材(301266.SZ)拟取得上海宇邦逢君40%股权 其专注于热管理产品业务
智通财经网· 2025-11-04 09:32
Core Viewpoint - Company Ubon New Materials (301266.SZ) announced a capital increase of RMB 4.16 million to Shanghai Ubon Fengjun Cloud Storage Technology Co., Ltd, acquiring a 40% stake in the company, which focuses on thermal management products [1] Group 1: Investment Details - The capital increase will be funded by the company's own resources [1] - After the investment, the company will hold a 40% equity interest in Shanghai Ubon Fengjun [1] Group 2: Strategic Rationale - The investment decision is based on a forward-looking consensus regarding the development of the thermal management equipment sector [1] - The company aims to address future market demands and pursue diversification in its business operations [1] Group 3: Company Focus - Shanghai Ubon Fengjun is dedicated to becoming a leader in the thermal management industry, specializing in the research, manufacturing, and sales of thermal management products [1] - The product range includes new power temperature control products, data center equipment, energy storage temperature control products, industrial air conditioning products, and cloud computing devices [1]