业绩方面，2023年、2024年和2025年上半年，盛合晶微分别实现营业收入30.38亿元、47.05亿元和31.78 亿元，归母净利润分别为3413.06万元、2.14亿元和4.35亿元。 招股书显示，此次科创板IPO，盛合晶微拟募集资金48亿元，投向三维多芯片集成封装项目、超高密度 互联三维多芯片集成封装项目，拟重点打造芯粒多芯片集成封装技术平台的规模产能，并补充配套凸块 制造产能，加码3DIC等前沿封装技术的研发与产业化。 股权架构方面，最近两年内，盛合晶微无控股股东且无实际控制人。截至招股书签署日，盛合晶微第一 大股东无锡产发基金持股比例为10.89%，第二大股东招银系股东合计控制股权比例为9.95%，第三大股 东厚望系股东合计持股比例为6.76%。 2月24日，上交所官网显示，盛合晶微半导体有限公司（简称"盛合晶微"）科创板IPO已通过上交所上市 审核委员会审议，成为马年首家科创板过会企业。 公开资料显示，盛合晶微是全球领先的集成电路晶圆级先进封测企业，起步于先进的12英寸中段硅片加 工，并进一步提供晶圆级封装和芯粒多芯片集成封装等全流程的先进封测服务。公司致力于支持各类高 性能芯片，尤其是GPU、 ...

中国经济网北京2月25日讯 上海证券交易所上市审核委员会2026年第6次审议会议于2026年2月24日 召开，审议结果显示，盛合晶微半导体有限公司（以下简称"盛合晶微"）首发符合发行条件、上市条件 和信息披露要求。这是2026年过会的第22家企业（其中，上交所和深交所一共过会7家，北交所过会15 家）。 盛合晶微的保荐机构是中金公司，保荐代表人是王竹亭、李扬。这是中金公司今年保荐成功的第4 单IPO项目。1月21日，中金公司保荐的常州百瑞吉生物医药股份有限公司过会。2月5日，中金公司保 荐的山东春光科技集团股份有限公司过会；2月12日，中金公司保荐的河南嘉晨智能控制股份有限公司 过会。 盛合晶微是全球领先的集成电路晶圆级先进封测企业，起步于先进的12英寸中段硅片加工，并进一 步提供晶圆级封装（WLP）和芯粒多芯片集成封装等全流程的先进封测服务，致力于支持各类高性能 芯片，尤其是图形处理器（GPU）、中央处理器（CPU）、人工智能芯片等，通过超越摩尔定律 （More than Moore）的异构集成方式，实现高算力、高带宽、低功耗等的全面性能提升。 请发行人代表结合公司2.5D业务的技术来源，三种技术路线的应用 ...

Group 1: Company Developments - Huawei aims to achieve sales revenue exceeding 880 billion yuan by 2025, with over 40 million devices running HarmonyOS and more than 75,000 native applications available [2] - Liu Qiangdong announced a 5 billion yuan investment in the yacht industry through his new brand Sea Expandary, planning to establish a manufacturing base in Zhuhai and a headquarters in Shenzhen [3] - Microsoft introduced "Project Silica," a glass-based storage technology capable of storing 4.8TB of data, which can last over 10,000 years under room temperature conditions [4] - Amazon plans to invest 12 billion USD in Louisiana to build its first data center campus, creating 540 full-time jobs and supporting an additional 1,710 jobs [5] - DJI filed a lawsuit against the FCC regarding its decision to list DJI products on the "Covered List," claiming procedural flaws and lack of evidence [7] - Xiaomi won a lawsuit against a media account for defamation, resulting in a compensation of 5 million yuan [8] Group 2: Industry Innovations - AMD and Meta expanded their strategic partnership with a 6GW agreement to power Meta's next-generation AI infrastructure using AMD Instinct GPUs [10] - ASML announced a breakthrough in EUV lithography technology, increasing light source power from 600W to 1000W, potentially boosting chip production by 50% by 2030 [11] - The Anhui Quantum Computing Engineering Research Center launched China's first open-source quantum computing operating system, "Benyuan Sinan," which is compatible with various mainstream technologies [9] - Hui Xi Intelligent completed over 800 million yuan in Pre-B round financing, focusing on AI chip development and achieving successful mass production of its flagship chip R1 [17] - Unitree Technology released a new quadruped robot, Unitree As2, with enhanced performance and capabilities for navigating complex terrains [18]

Core Viewpoint - The company Shenghe Jingwei, in which the company holds a stake, has received approval for its initial public offering (IPO) and listing on the Sci-Tech Innovation Board [1] Group 1 - Shenghe Jingwei is an advanced packaging and testing enterprise for integrated circuits, starting with 12-inch mid-range silicon wafer processing [1] - The company provides a full range of advanced packaging and testing services, including wafer-level packaging (WLP) and chiplet multi-chip integration packaging [1]

Core Viewpoint - The company Shengtai Cement (000672.SZ) announced that its associate company, Shenghe Jingwei, has received approval for its initial public offering (IPO) and listing on the Sci-Tech Innovation Board [1] Group 1: Company Overview - Shenghe Jingwei is an advanced packaging and testing enterprise specializing in integrated circuit wafer-level packaging [1] - The company started with 12-inch mid-range silicon wafer processing and offers a full range of advanced packaging services, including wafer-level packaging (WLP) and chiplet multi-chip integrated packaging [1]

上峰水泥公告称，其全资子公司宁波上融参与投资的私募股权投资基金苏州璞云，投资的盛合晶微首次 公开发行股票并在科创板上市申请获审议通过。盛合晶微是全球领先的集成电路晶圆级先进封测企业。 宁波上融出资1.5亿元，持有苏州璞云67.72%投资份额。截至公告日，苏州璞云持有盛合晶微1745.46万 股（发行前），持股比例1.086%。盛合晶微上市尚需获证监会同意注册，结果及时间不确定。 ...

| | 科创板 | | | | | | --- | --- | --- | --- | --- | --- | | 主营业务 公司简称 | | 2024年宫收 | 2024年净利润 | 审核结果 | 保存/律所/审计 | | 盈合晶微 集成电路晶圆级先进封测服务 | | 470,539.56 | 18,740.07 | 通过 | 中金公司 / 锦天城 / 容诚 | 注：净利润为扣非归母净利润 盛合晶微半导体有限公司是全球领先的集成电路晶圆级先进封测企业，起步于先进的 12 英寸中段硅片 加工，并进一步提供晶圆级封装（WLP）和芯粒多芯片集成封装等全流程的先进封测服务，致力于支 持各类高性能芯片，应用于高性能运算、人工智能、数据中心、自动驾驶等终端领域。公司无控股股东 及实际控制人，第一大股东无锡产发基金持股比例为 10.89%。报告期内，公司营业收入分别为 163， 261.51 万元、303，825.98 万元、470，539.56 万元和 317，799.62 万元，扣非归母净利润分别为 - 34， 867.25 万元、3，162.45 万元、18，740.07 万元和 42，189.04 万元。 炒股就 ...

北京商报讯2月24日晚间，上交所官网显示，盛合晶微半导体有限公司（以下简称"盛合晶微"）科创板 IPO当日上会获得通过，这也是马年首家IPO上会企业。 据了解，盛合晶微是一家集成电路晶圆级先进封测企业，起步于先进的12英寸中段硅片加工，并进一步 提供晶圆级封装（WLP）和芯粒多芯片集成封装等全流程的先进封测服务，致力于支持各类高性能芯 片，尤其是图形处理器（GPU）、中央处理器（CPU）、人工智能芯片等，通过超越摩尔定律（More than Moore）的异构集成方式，实现高算力、高带宽、低功耗等的全面性能提升。公司IPO于2025年10 月30日获得受理，当年11月14日进入问询阶段。本次冲击上市，盛合晶微拟募集资金48亿元。 在上市委会议现场，上市委要求盛合晶微结合公司2.5D业务的技术来源，三种技术路线的应用领域、发 展趋势、市场空间，以及新客户开拓情况，说明与主要客户的业务稳定性及业绩可持续性。 （文章来源：北京商报） ...

来源：新浪证券-红岸工作室 2月24日，汇成股份涨0.64%，成交额5.78亿元，换手率3.50%，总市值164.49亿元。 异动分析 存储芯片+先进封装+OLED+芯片概念+人民币贬值受益 1、2025年10月14日公司，合肥新汇成微电子股份有限公司举办特定对象调研活动，向舟资本、兴全基 金、平安资管等多家机构投资者披露重磅布局：公司通过直接与间接投资相结合，拿下合肥鑫丰科技有 限公司（简称 "鑫丰科技"）27.5445% 股权，并与鑫丰科技股东华东科技（苏州）有限公司（简称 "华 东科技"）达成战略合作，共同拓展 3D DRAM 等存储芯片封测业务，瞄准 AI 基建时代下存储芯片的爆 发式需求。 2、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是Chiplet的基础之一。在研发端，公司将以客户需求为导 向，基于凸块制造技术，纵向拓展技术边界，积极布局Fan-out、2.5D/3D、SiP等高端先进封装技术。 3、2024年7月3日公司投资者关系活动记录表：公司目前OLED客户主要包括联咏、瑞鼎、 ...

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. is undergoing an IPO review on February 24, 2026, with impressive financial performance, projecting a net profit of approximately 923 million yuan in 2025, representing a year-on-year growth of 331.8% [1][3] Financial Performance - Shenghe Jingwei's revenue and net profit have shown consistent annual growth, with revenues of approximately 1.633 billion yuan, 3.038 billion yuan, and 4.705 billion yuan from 2022 to 2024, and a projected revenue of about 6.521 billion yuan in 2025, reflecting a year-on-year increase of 38.59% [3] - The net profit for the same periods is approximately -329 million yuan, 34.13 million yuan, and 214 million yuan, with a projected net profit of 923 million yuan in 2025, indicating a significant year-on-year increase of 331.8% [3] Customer Dependency - The company has a notable reliance on a major customer, referred to as Customer A, which contributed over 70% of revenue in the first half of 2025 [1][5] - The sales revenue from the top five customers accounted for 72.83%, 87.97%, 89.48%, and 90.87% in the respective years, with Customer A's contribution being 40.56%, 68.91%, 73.45%, and 74.4% [5] Inventory Growth - Shenghe Jingwei's inventory has been on the rise, with values of approximately 356 million yuan, 683 million yuan, 1.193 billion yuan, and 1.344 billion yuan at the end of each reporting period, representing 16.1%, 13.1%, 11.66%, and 13.72% of current assets [6] Shareholding Structure - The company has no actual controller or controlling shareholder, with the largest shareholder, Wuxi Chanfang Fund, holding a 10.89% stake as of the signing date of the prospectus [6]