12月15日，汇成股份涨6.56%，成交额12.99亿元，换手率8.94%，总市值146.28亿元。 异动分析 存储芯片+先进封装+芯片概念+人民币贬值受益+专精特新 1、2025年10月14日公司，合肥新汇成微电子股份有限公司举办特定对象调研活动，向舟资本、兴全基 金、平安资管等多家机构投资者披露重磅布局：公司通过直接与间接投资相结合，拿下合肥鑫丰科技有 限公司（简称 "鑫丰科技"）27.5445% 股权，并与鑫丰科技股东华东科技（苏州）有限公司（简称 "华 东科技"）达成战略合作，共同拓展 3D DRAM 等存储芯片封测业务，瞄准 AI 基建时代下存储芯片的爆 发式需求。 来源：新浪证券-红岸工作室 区间今日近3日近5日近10日近20日主力净流入1873.96万1548.33万488.65万1.35亿6856.45万 主力持仓 主力没有控盘，筹码分布非常分散，主力成交额1.17亿，占总成交额的6.07%。 技术面：筹码平均交易成本为15.74元 2、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是 ...

12月11日，汇成股份涨0.20%，成交额3.21亿元，换手率2.42%，总市值131.78亿元。 2、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是Chiplet的基础之一。在研发端，公司将以客户需求为导 向，基于凸块制造技术，纵向拓展技术边界，积极布局Fan-out、2.5D/3D、SiP等高端先进封装技术。 3、合肥新汇成微电子股份有限公司的主营业务是集成电路高端先进封装测试服务。公司的主要产品是 集成电路封装测试。 来源：新浪证券-红岸工作室 异动分析 存储芯片+先进封装+芯片概念+人民币贬值受益+专精特新 1、2025年10月14日公司，合肥新汇成微电子股份有限公司举办特定对象调研活动，向舟资本、兴全基 金、平安资管等多家机构投资者披露重磅布局：公司通过直接与间接投资相结合，拿下合肥鑫丰科技有 限公司（简称 "鑫丰科技"）27.5445% 股权，并与鑫丰科技股东华东科技（苏州）有限公司（简称 "华 东科技"）达成战略合作，共同拓展 3D DRAM 等存储芯片封测业务，瞄准 AI 基建时代下 ...

来源：新浪证券-红岸工作室 12月9日，汇成股份跌3.82%，成交额4.80亿元，换手率3.61%，总市值131.70亿元。 异动分析 存储芯片+先进封装+芯片概念+人民币贬值受益+专精特新 1、2025年10月14日公司，合肥新汇成微电子股份有限公司举办特定对象调研活动，向舟资本、兴全基 金、平安资管等多家机构投资者披露重磅布局：公司通过直接与间接投资相结合，拿下合肥鑫丰科技有 限公司（简称 "鑫丰科技"）27.5445% 股权，并与鑫丰科技股东华东科技（苏州）有限公司（简称 "华 东科技"）达成战略合作，共同拓展 3D DRAM 等存储芯片封测业务，瞄准 AI 基建时代下存储芯片的爆 发式需求。 2、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是Chiplet的基础之一。在研发端，公司将以客户需求为导 向，基于凸块制造技术，纵向拓展技术边界，积极布局Fan-out、2.5D/3D、SiP等高端先进封装技术。 3、合肥新汇成微电子股份有限公司的主营业务是集成电路高端先进封装测试服务。公司的主要产品 ...

中国银河证券主要观点如下： 半导体设备 美国国会众议院正式提出H.R.6207号议案——《芯片设备质量法案》，禁止接受其补贴的芯片工厂使用 来自中国的12类半导体设备。该法案的提出侧面印证了中国在半导体设备领域进步迅速，也进一步强化 了自主可控逻辑，是板块上涨重要的情绪催化剂。 智通财经APP获悉，中国银河证券发布研报称，半导体行业在AI浪潮、国产替代、技术创新等多重因素 的驱动下，整体表现相对较好，支撑半导体板块长期发展的逻辑不变。在外部环境背景下，供应链安全 与自主可控是长期趋势。设备与材料在国产替代顶层设计下逻辑最硬，数字芯片是算力自主的核心载 体，先进封测受益于技术升级。 AI芯片对算力和带宽的极致追求，让先进封装从可选项变为必选项。无论是台积电最新推出的完全整 合的封装内光学I/O引擎，还是英特尔将其面向于AI的半导体封装业务部署给安靠科技，都印证了先进 封装是AI芯片的产能瓶颈和关键赋能环节，其战略价值持续提升。同时，存储芯片的需求提升也直接 拉动了存储封测的需求，为封测厂商业绩提供了稳定支撑。 模拟芯片设计 模拟芯片设计板块本周的表现整体相对稳定，国内产业从产能建设、技术攻坚到资本助力均在全方位 ...

Core Insights - The semiconductor packaging and testing industry is experiencing significant growth driven by emerging fields such as 5G, AI, IoT, and automotive electronics, with the global market expected to reach $82.1 billion in 2024, a 5% increase year-on-year [1] - Domestic packaging and testing market in China is projected to reach 314.6 billion yuan in 2024, reflecting a 7.14% growth compared to 2023, and is expected to exceed 330.33 billion yuan in 2025 [1] - Major domestic companies like Huada Technology, Changdian Technology, and Tongfu Microelectronics are showing positive financial performance, indicating a strong alignment between domestic advanced packaging technology breakthroughs and market demand upgrades [1] Financial Performance of Leading Companies - Huada Technology reported a total revenue of 12.38 billion yuan for the first three quarters, a year-on-year increase of 17.55%, with a net profit of 543 million yuan, up 51.98% [2] - Changdian Technology achieved a revenue of 28.67 billion yuan, a 14.78% increase year-on-year, but its net profit decreased by 11.39% to 950 million yuan [3] - Tongfu Microelectronics saw a revenue of 20.12 billion yuan, a 17.77% increase, and a net profit of 860 million yuan, reflecting a 55.74% growth [3] Growth Drivers - Huada Technology's growth is attributed to technological breakthroughs in DDR5 DRAM packaging and strategic acquisitions, enhancing its market position in high-value segments like automotive electronics [4] - Changdian Technology is optimizing its product structure and responding to market demand changes, with significant revenue increases in sectors like automotive electronics, which grew by 31.3% [5] - Tongfu Microelectronics is benefiting from increased revenue in mid-to-high-end products, particularly from major clients like AMD, indicating successful strategic positioning in the advanced packaging sector [6] Competitive Landscape - The high-end packaging market is becoming increasingly competitive, with both international giants and domestic leaders intensifying their R&D and capacity expansion efforts, particularly in AI chips and automotive electronics [7] - Changdian Technology has developed a comprehensive advanced packaging technology matrix, applicable across various critical sectors, including AI and automotive electronics [8] - Huada Technology is investing in advanced packaging technologies and has initiated collaborations with AI companies, positioning itself to capture emerging market opportunities [10] Industry Outlook - The domestic advanced packaging industry is transitioning to a phase of high-quality development characterized by technology-driven growth and structural upgrades [11] - Continued demand from AI and automotive electronics sectors, along with advancements in domestic packaging materials and equipment, will enable domestic companies to narrow the gap with international competitors [11] - Companies with strong R&D capabilities and a focus on high-margin products are expected to lead the market and benefit from the overall growth of the semiconductor industry [11]

来源：新浪证券-红岸工作室 12月4日，汇成股份涨3.89%，成交额6.37亿元，换手率5.04%，总市值128.35亿元。 异动分析 存储芯片+先进封装+芯片概念+人民币贬值受益+专精特新 1、2025年10月14日公司，合肥新汇成微电子股份有限公司举办特定对象调研活动，向舟资本、兴全基 金、平安资管等多家机构投资者披露重磅布局：公司通过直接与间接投资相结合，拿下合肥鑫丰科技有 限公司（简称 "鑫丰科技"）27.5445% 股权，并与鑫丰科技股东华东科技（苏州）有限公司（简称 "华 东科技"）达成战略合作，共同拓展 3D DRAM 等存储芯片封测业务，瞄准 AI 基建时代下存储芯片的爆 发式需求。 2、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是Chiplet的基础之一。在研发端，公司将以客户需求为导 向，基于凸块制造技术，纵向拓展技术边界，积极布局Fan-out、2.5D/3D、SiP等高端先进封装技术。 3、合肥新汇成微电子股份有限公司的主营业务是集成电路高端先进封装测试服务。公司的主要产品 ...

Core Viewpoint - The company, Bluestar Electronics, is engaged in semiconductor packaging and testing, with a focus on high-performance SSD products and advanced packaging technologies, indicating potential growth in the semiconductor industry driven by AI and other technological advancements [2][3][8]. Company Overview - Bluestar Electronics, established on December 30, 1998, is located in Foshan, Guangdong Province, and was listed on August 10, 2023. It is recognized as a national high-tech enterprise specializing in semiconductor device manufacturing and packaging testing [8]. - The company's main revenue sources are self-owned brands (49.20%), packaging and testing services (48.54%), and other supplementary services (2.26%) [8]. Financial Performance - As of September 30, 2025, Bluestar Electronics reported a revenue of 518 million yuan, reflecting a year-on-year growth of 2.55%. However, the net profit attributable to the parent company was a loss of 26.5 million yuan, a significant decrease of 28,229.49% compared to the previous period [9]. - The company has distributed a total of 68 million yuan in dividends since its A-share listing [10]. Market Activity - On December 4, 2023, Bluestar Electronics' stock rose by 1.19%, with a trading volume of 224 million yuan and a turnover rate of 6.77%, leading to a total market capitalization of 5.117 billion yuan [1]. - The stock has seen a net inflow of 3.92 million yuan from major investors, indicating a slight increase in interest, although the overall trend remains unclear [5][6]. Technological Advancements - The company has achieved automation and intelligence in the entire packaging and testing process, with capabilities for 12-inch wafer packaging, particularly in power semiconductors and third-generation semiconductor materials [2][4]. - Bluestar Electronics is focusing on providing customized solutions for storage needs in the AI era, including enterprise-grade SSDs and related technologies [2].

Core Insights - Shanghai has launched new national-level platforms aimed at enhancing innovation in traditional Chinese medicine and integrated circuit industries [1] Group 1: National Medical Innovation Platform - The National Medical Innovation Platform at Shanghai University of Traditional Chinese Medicine focuses on key technologies such as clinical advantage disease screening and intelligent pharmaceutical development [1] - Five leading companies in the industry, including Shanghai Pharmaceuticals and Shanghai Kaibao Pharmaceutical, have signed agreements to become the first batch of resident units [1] - The "Shanghai University of Traditional Chinese Medicine 7LAB Joint Laboratory" has been officially inaugurated [1] Group 2: Integrated Circuit Innovation Center - The "Integrated Circuit Packaging and Testing Talent Collaborative Innovation Center" is established through collaboration among government, academia, and enterprises [1] - This center aims to create a new high ground for talent integration in the integrated circuit industry [1] - The "Integrated Circuit Packaging and Testing Talent Integration Practice Base" has become a regional demonstration platform for industry-education collaboration, allowing students to engage in real production line environments and complete the entire process from design to testing [1]

Investment Rating - The industry investment rating is "Outperform the Market" (maintained) [3] Core Viewpoints - The report highlights that AI is driving advanced packaging demand, with significant growth in storage-related businesses [2][4] - The semiconductor packaging sector experienced a slight decline in gross margin in Q3 2025, but year-on-year comparisons show growth [11][12] - The report emphasizes the importance of advanced packaging technologies in enhancing chip performance and integration, particularly with the ongoing development of Chiplet packaging concepts [4][5] Summary by Sections Overview - In Q3 2025, the semiconductor packaging sector's gross margin slightly decreased, with a gross margin of 21.09%, which is higher than the average of 15.79% for leading packaging companies [11][12] OSAT (Outsourced Semiconductor Assembly and Test) - AI is significantly boosting demand for advanced packaging, with notable growth in the storage sector [17] - Major companies like ASE achieved revenues of 22.63 billion RMB in Q3 2025, reflecting an 8.34% quarter-on-quarter increase and a 16.90% year-on-year increase [18][19] - Advanced packaging services are expected to continue driving growth, particularly in AI-related applications [19][20] Testing - AI-related business growth is notable, with companies like Jingyuan Electronics reporting a revenue increase of 31.99% year-on-year in Q3 2025 [5][41] - Wei Ce Technology's revenue for the first three quarters of 2025 reached 10.83 billion RMB, a 46.22% year-on-year increase, driven by strong demand in computing and automotive electronics [5][41] Equipment - The report indicates that AI growth is leading to a continuous increase in orders, with companies like Besi reporting a 36.5% quarter-on-quarter increase in new orders [5][41] - ASMPT's revenue in Q3 2025 was 33.13 billion RMB, a 7.6% quarter-on-quarter increase, driven by growth in SMT business [5][41] Investment Recommendations - The report suggests focusing on companies benefiting from AI-driven demand, including packaging companies like ASE, Tongfu Microelectronics, and Changdian Technology, as well as testing companies like Jingyuan Electronics and Wei Ce Technology [5][41]

Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically expanding its business in the semiconductor industry, particularly in advanced packaging and testing services for integrated circuits, to capitalize on the growing demand for storage chips in the AI infrastructure era [2][3]. Group 1: Company Developments - On October 14, 2025, the company announced a significant investment by acquiring a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd., and forming a strategic partnership with East China Technology (Suzhou) Co., Ltd. to expand into 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2]. - As of September 30, 2025, the company reported a revenue of 1.295 billion yuan, representing a year-on-year growth of 21.05%, and a net profit of 124 million yuan, with a growth of 23.21% [9]. Group 2: Financial Performance - The company's overseas revenue accounted for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4]. - The company has distributed a total of 161 million yuan in dividends since its A-share listing [9]. - As of September 30, 2025, the number of shareholders increased to 23,500, with an average of 36,445 shares held per shareholder, indicating growing investor interest [9]. Group 3: Market Position - Hefei Xinhui Microelectronics specializes in high-end packaging and testing services for integrated circuits, with its main products being integrated circuit packaging and testing [3]. - The company operates within the semiconductor industry, specifically in the integrated circuit packaging and testing sector, and is involved in various concept sectors including packaging, automotive electronics, and chip technology [8].