公众号记得加星标⭐️，第一时间看推送不会错过。 来源：本文编译自 Chip Interfaces ApS 。 飞利浦半导体公司（现为恩智浦半导体公司）于 1980 年发明的 I2C（Inter-Integrated Circuit：内 部集成电路）总线，在简化嵌入式系统通信方面迈出了一大步。它是一种简单的双线接口，用于同 步、多主/多从、单端串行通信。 45 年后，它仍然广泛用于连接低速外设集成电路 (IC)、处理器和微控制器。但如今的硅片已经发 生了变化，我们已经从 8 位 MCU 发展到多核 SOC，从简单的传感器发展到复杂的多模传感器设 备。对带宽、延迟和功耗的需求都在增加，而这正是新型改进型总线变体得以发展的契机。 什么是I3C以及它为何重要？ I3C（Improved Inter-Integrated Circuit：改进型集成电路）是由MIPI 联盟开发的一种总线，是一 种基于 I2C 的双线接口，并对其进行了改进以提高速度和效率。它旨在取代 I2C（以及部分 SP I），同时仍保持与 I2C 的向后兼容。它提供高达 12.5 MHz 的更高时钟速度、无需额外线路的带 内中断、动态寻址、双数据速率 ...

Core Viewpoint - Jilin Huamei Electronics Co., Ltd. expects significant growth in net profit for the first half of 2025, with projections indicating an increase of 44.99% to 71.62% compared to the same period last year [2][4]. Financial Performance Summary - The company anticipates a net profit attributable to shareholders ranging from 98 million to 116 million yuan, representing a year-on-year increase of 3,040.86 million to 4,840.86 million yuan [2][4]. - The projected net profit after deducting non-recurring gains and losses is expected to be between 105.19 million and 123.19 million yuan, reflecting a substantial increase of 93.74% to 126.90% compared to the previous year [2][4]. Previous Year Comparison - For the same period last year, the net profit attributable to shareholders was 67.59 million yuan, and the net profit after deducting non-recurring gains and losses was 54.29 million yuan [6]. Reasons for Performance Increase - The increase in performance is attributed to enhanced operational management efficiency, improved customer communication, and the ability to meet personalized customer needs, leading to growth in sales orders and revenue [8].

Core Viewpoint - The GaN market is experiencing significant changes, with TSMC announcing its exit from GaN foundry services within two years, while other companies like Powerchip and Infineon are ramping up their GaN production capabilities. This shift indicates a competitive landscape where GaN is poised for growth, particularly in high-efficiency applications like electric vehicles and fast charging [1][4][15]. Group 1: TSMC's Exit and Market Dynamics - TSMC will gradually phase out its GaN semiconductor foundry business due to profit margin pressures from Chinese competitors, halting the development of 200mm wafer production [1][2]. - Navitas Semiconductor plans to transition its production from TSMC to Powerchip, with expectations to produce GaN products rated from 100V to 650V by mid-2026 [2]. - The exit of TSMC opens opportunities for other players like Powerchip and Infineon to fill the production gap and capture market share [1][4]. Group 2: Competitor Strategies - Infineon is advancing its 12-inch GaN production, with plans to release customer samples by Q4 2025, leveraging its IDM model for scalable production [4]. - Renesas Electronics has shifted focus from SiC to GaN, suspending its SiC projects due to market saturation and is preparing to enhance its GaN capabilities following its acquisition of Transphorm [5][6]. - ROHM is committed to deepening its collaboration with TSMC to address market demands and explore future production frameworks [3]. Group 3: Market Growth and Challenges - The GaN semiconductor market is projected to grow significantly, with a compound annual growth rate (CAGR) of 98.5% from 2024 to 2028, potentially exceeding $6.8 billion by 2028 [15]. - The main drivers for GaN market growth include consumer electronics and electric vehicles, with expectations for GaN applications in fast chargers and adapters to grow at a CAGR of 71.1% [15]. - Transitioning GaN from peripheral applications to core power systems in electric vehicles presents challenges, including reliability and ecosystem maturity [16][17]. Group 4: Strategic Partnerships and Investments - STMicroelectronics has extended its lock-up period for its investment in Innoscience, signaling confidence in the latter's future and the broader GaN market [9][11]. - The partnership between ST and Innoscience aims to leverage each other's manufacturing capabilities to enhance GaN product development and production [12]. - Innoscience has emerged as a key player in the GaN market, achieving significant revenue growth and expanding its wafer production capacity [14].

Core Viewpoint - A former employee of semiconductor companies ASML and NXP was sentenced to three years in prison for sharing sensitive company technology with Russian contacts, violating EU sanctions [1][2][3] Group 1: Legal Proceedings - The court in Rotterdam sentenced German Aksenov to three years in prison, reducing the initial four-year sentence due to lack of payment evidence [6] - Aksenov was arrested in August 2023 and has been in custody since then, facing charges of selling design manuals and contacting the Russian Federal Security Service (FSB) [2][3] - The court found that Aksenov copied hundreds of confidential documents from ASML and NXP's servers and shared them with a Russian individual [3][5] Group 2: Implications of the Crime - The prosecution emphasized the severity of the crime, noting that microchips are critical components for military vehicles, precision weapons, and drones [2] - By assisting Russia in semiconductor production, Aksenov was considered to have made a "significant contribution" to violence against Ukraine [2] - The court stated that the sanctions aim to limit Russia's access to technology that could aid its military during conflicts [4]

美股开盘 达美航空大涨11% 金十数据7月10日讯，美股开盘，道指、标普500指数接近平开，纳指涨0.2%。达美航空(DAL.N)大涨 11%，Q2业绩超预期，同时恢复全年业绩指引。美国航空集团(AAL.O)涨7.3%，西南航空(LUV.N)涨 3.4%。台积电(TSM.N)涨0.4%，Q2销售额同比增39%。稀土生产商MP Materials涨近60%，公司获美国 国防部数十亿美元合作大单。 ...

证券代码：688110 证券简称：东芯股份 公告编号：2025-034 东芯半导体股份有限公司 关于 2023 年限制性股票激励计划首次授予部分第二 个归属期部分归属结果、2024 年限制性股票激励计划 首次授予部分第一个归属期部分归属结果的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示 ? 本次归属股票数量：121.536 万股。其中，2023 年限制性股票激励计划 首次授予部分第二个归属期第一批次归属 59.952 万股；2024 年限制性股票激励 计划首次授予部分第一个归属期第一批次归属 61.584 万股。 ? 本次归属股票来源：公司从二级市场回购的本公司 A 股普通股股票。 根据中国证券监督管理委员会、上海证券交易所、中国证券登记结算有限 责任公司上海分公司有关业务规则的规定，东芯半导体股份有限公司（以下简 称"公司"）于 2025 年 7 月 10 日收到中国证券登记结算有限责任公司上海分 公司出具的《过户登记确认书》，完成了公司 2023 年限制性股票激励计划首次 授予部分第二个归属期第一 ...

Core Viewpoint - The restructuring plan of Jiangsu Times Chip Storage Semiconductor Co., Ltd. has failed due to severe investor defaults, marking the end of a significant 12-inch wafer factory in China's semiconductor industry and highlighting the deep contradictions between capital frenzy and industrial rationality [1][2]. Group 1: Restructuring Failure - The restructuring process began in July 2023 when the company, which planned to invest 13 billion yuan in a 12-inch wafer factory, was accepted for bankruptcy liquidation due to insolvency [2]. - The core asset, an ASML lithography machine valued at 143 million yuan, went unsold in an auction due to outdated technology and debt disputes [2]. - The restructuring investor, Huaxin Jiechuan Integrated Circuit Manufacturing Co., Ltd., proposed a 20 billion yuan restructuring plan but failed to pay the agreed funds, leading to the termination of the restructuring process on June 13, 2025 [2]. Group 2: Industry Context - The fate of Times Chip Storage reflects the "Great Leap Forward" style development in China's semiconductor industry, where the company was established in 2016 with plans to produce 100,000 PCM chips annually [3]. - The company faced a financial crisis in 2020, unable to pay for equipment, project costs, and employee salaries, resulting in a total execution amount of 863 million yuan involving various creditors [3]. - The original shareholders' equity has been legally wiped out due to the company's inability to cover its debts [3]. Group 3: Industry Warnings - The case of Times Chip Storage is not isolated, as other projects like Dehuai Semiconductor and Wuhan Hongxin have also faced failures due to blind expansion and investment [4]. - In contrast, leading companies in the industry are building barriers through technological iteration and ecosystem integration, such as SMIC's increased production capacity and Changdian Technology's cost reduction strategies [4]. - Policy initiatives are being strengthened to guide the industry, with funds being established to support semiconductor optimization across the entire chain [4]. Group 4: Future Outlook - The management has initiated a new round of investor recruitment, but the revival of the project is considered highly challenging [5]. - The original shareholders plan to continue promoting PCM technology through foundry services without bearing shareholder responsibilities [5]. - The demise of Times Chip Storage may signify a shift in the industry from "barbaric growth" to "rational restructuring," emphasizing the need to respect industrial laws to compete globally [5].

Core Viewpoint - The GaN market is experiencing significant changes, with TSMC announcing its exit from GaN foundry services, while other companies like Power Semiconductor Manufacturing Corporation (PSMC) and Infineon are ramping up their GaN production capabilities. This shift indicates a competitive landscape where companies are vying for dominance in the GaN semiconductor market, particularly in high-power applications like electric vehicles [1][2][3]. Group 1: TSMC's Exit and Market Dynamics - TSMC has decided to phase out its GaN semiconductor foundry business over the next two years due to declining profit margins caused by competition from Chinese manufacturers [3]. - Navitas, which previously relied on TSMC for production, will transition its manufacturing to PSMC, with plans to produce GaN products rated from 100V to 650V starting in 2026 [4]. - Infineon is increasing its investment in GaN technology, aiming to produce scalable GaN on 300mm wafers, with initial customer samples expected by Q4 2025 [5]. Group 2: Shift in Focus from SiC to GaN - Renesas Electronics has halted its SiC project and is shifting its focus to GaN, driven by a slowdown in the electric vehicle market and an oversupply of SiC chips [7]. - Renesas is leveraging its acquisition of Transphorm to enhance its GaN product offerings, introducing new high-voltage GaN FETs that improve efficiency and reduce costs [8]. Group 3: Strategic Investments and Collaborations - STMicroelectronics has extended its lock-up period for its investment in Innoscience, indicating strong confidence in the latter's future and the GaN market [10][11]. - Innoscience has emerged as a key player in the GaN market, achieving significant revenue growth and expanding its wafer production capacity [13]. Group 4: Market Growth and Challenges - The GaN semiconductor market is projected to grow significantly, with a compound annual growth rate (CAGR) of 98.5% from 2024 to 2028, potentially exceeding $6.8 billion by 2028 [14]. - However, challenges remain for GaN to transition from niche applications like fast charging to core applications in electric vehicles, which require higher reliability and ecosystem maturity [15][16]. Group 5: Competitive Landscape and Future Outlook - The GaN industry is at a critical juncture, with companies like Navitas, Infineon, and others actively working to commercialize high-power GaN solutions [17]. - The next two years will be crucial for GaN manufacturers to prove their strategies and for the market to determine if GaN can penetrate core power applications effectively [17].

Core Viewpoint - The breakthrough in glass substrate technology is attracting significant attention in the global semiconductor industry, with companies like Absolics aiming for commercial production by the end of 2025 [3][5]. Group 1: Company Developments - Absolics, a subsidiary of SKC, is accelerating the production of glass substrates to expand shipment scale and prepare for mass production [3]. - The company has initiated prototype product production at its factory in Georgia, USA, with an annual capacity of 12,000 square meters [3]. - Absolics plans to increase the procurement of materials and components needed for glass substrate processing by over 60% in the second half of the year [6]. Group 2: Financial Support and Investments - In the first quarter, Absolics secured $50 million in loans and received $40 million in initial manufacturing subsidies under the CHIPS and Science Act [6]. - The company is preparing a capital increase plan involving its major shareholders, SKC and Applied Materials, to enhance manufacturing capabilities [6]. Group 3: Industry Trends - Other companies are also advancing in the glass substrate market, with Samsung planning to use glass substrate interlayers for advanced semiconductors by 2028 [6]. - LG Innotek is constructing a pilot production line at its Gimhae factory, aiming to start prototype production by the end of the year [6].

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 7月9日消息，近日，江苏时代芯存半导体有限公司 管理人发布公告，宣布重整投资人华芯杰创公司违约， 时代芯存 重整计划执行失败！ 根据通告，其中提到" 江苏时代芯存 已构成资不抵债，原股东淮安淮沭科技发展有限公司及 北京时代全芯 的股东权益依法归零"，同时因华芯杰创集成 电路制造（广东）有限公司严重违约，管理人已于 2025 年 6 月 13 日依法解除《重整投资协议》，并终止重整程序。 公开资料显示，江苏时代芯存半导体有限公司2016 年 10 月落户国家级淮安高新技术产业开发区，项目总投资 130 亿元，由北京时代全芯存储技术股份有 限公司和淮安园兴投资有限公司合资成立，致力于开发及生产搭载最新 PCM 技术的存储产品。 该公司曾计划打造一座12 英寸晶圆厂，每年可生产 10 万片相变存储器，还曾引入一台价值 1.43 亿元的 ASML 光刻机，但后续因债务等种种问题深陷泥 潭，2023 年 7 月，江苏淮安市淮阴区人民法院正式受理时代芯存破产清算案，并对其光刻机进行公开拍卖。 而如今相应重整计划 ...