公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容编译自zdnet 。 DDR4（双倍数据速率 4）内存价格曾被视为 DRAM 市场的领先指标，但如今它正在逐渐失去解释 市场趋势的作用。这是因为随着 PC 和服务器市场加速向 DDR5 的升级，全球内存制造商正在减少 DDR4 的产量。因此，近期 DDR4 价格的飙升被解读为供应减少导致的暂时现象，而非市场复苏的 迹象。 据业内人士10日透露，包括三星电子、SK海力士、美光等主要DRAM厂商都在持续削减DDR4产 量。随着服务器和PC市场支持DDR5的产品增多，生产结构也正在围绕DDR5进行重组。 DDR5 的采用正在迅速扩大，尤其是在服务器市场。 占据服务器 CPU 市场 90% 份额的英特尔，在 2023 年发布的第四代至强可扩展处理器 (Sapphire Rapids) 中彻底停止了对 DDR4 的支持。此后发布的所有服务器处理器，包括 Emerald Rapids 和 Granite Rapids，也都只支持 DDR5。AMD 从 Genoa 平台开始也原生支持 DDR5，服务器市场实际 上已经过渡到仅支持 DDR5 的架构。 DDR5 转 ...

Market Performance - The main board led the gains with notable increases in stocks such as Dingxin Communication (+10.07%), Wanda Film (+10.04%), and Guiguang Network (+10.04) [1] - The ChiNext board saw significant rises with Tianshan Electronics (+19.98%) and Boshang Optoelectronics (+14.60%) [1] - The Sci-Tech Innovation board was led by Fuxin Technology (+19.99%) and Tengjing Technology (+14.94%) [1] - Active sub-industries included SW Optical Components (+3.75%) and SW Passive Components (+2.53%) [1] Domestic News - A report from TrendForce indicates that Meta's new AR device, Meta Ray-Ban Display Glasses, is expected to increase the market share of LCoS display products to 13% by 2026 [1] - Baoli International announced an investment in Hongtai Technology, acquiring 1%-3% equity based on a positive outlook for the semiconductor testing equipment industry [1] - Xiaomi has initiated a recall of 116,887 SU7 standard electric vehicles produced between February 6, 2024, and August 30, 2025, as per regulatory requirements [1] - Shengmei Shanghai launched the Ultra ECDP electrochemical stripping equipment designed for wide bandgap semiconductor manufacturing, enhancing etching uniformity and appearance [1] Company Announcements - Ciweng Media announced receiving a government subsidy of RMB 10 million, with RMB 7.6 million attributed to the company, representing 25.04% of the last audited net profit [2] - Kirin Xin'an reported receiving government subsidies totaling RMB 482.94 million related to revenue [2] - Jiayuan Technology signed an investment agreement, paying RMB 45 million for the first tranche and RMB 150 million for the first capital increase [2] - Ankai Micro plans to invest RMB 20 million to increase its stake in Shiqi Future, aiming to enhance its competitive edge in the intelligent vision sector [2] Overseas News - STMicroelectronics announced a $60 million investment to build a new experimental production line for next-generation panel-level packaging technology in France [2] - Major memory manufacturers are accelerating investments in 1c DRAM, with Samsung and SK Hynix making significant moves in production lines [2] - TrendForce reports that AMD's upcoming MI450 Helios platform is prompting Nvidia to push suppliers for higher specifications on key components [2] - Nvidia and Intel announced a collaboration to develop customized data center and PC products to enhance operational efficiency across various applications [2]

Core Viewpoint - Major memory companies are accelerating investments in 1c (6th generation 10nm) DRAM, with Samsung Electronics leading the charge in production line construction, while SK Hynix and Micron are also making significant moves in this area [2][3]. Group 1: Investment and Production Plans - Samsung Electronics has begun constructing a new production line for 1c DRAM at its P4 plant in Pyeongtaek and is also transitioning its Hwaseong Line 17 for 1c DRAM production, aiming for a maximum capacity of 60,000 wafers per month by the end of this year [2]. - SK Hynix plans to start its transition investment for 1c DRAM in the second half of this year, with full-scale implementation expected next year, likely at its Icheon M14 factory, which is currently being repurposed from NAND to DRAM production [2][3]. - Micron has received a subsidy of up to 536 billion yen (approximately 4.7 trillion KRW) from the Japanese government for its new DRAM factory in Hiroshima, which will focus on the 1γ process, expected to be operational by 2027 [3]. Group 2: Technological Advancements - The 1c process is anticipated to be utilized not only for high-value DRAM for servers but also for HBM4E (7th generation HBM), which is a key area of focus for SK Hynix [3].

Group 1 - Samsung Electronics plans to complete equipment investment for its P4 1c DRAM in the first half of next year, aiming to gain an advantage in the HBM4 field. The company's 1c DRAM capacity is expected to rise to approximately 60,000 wafers per month this year [2] - China's hydropower sector has achieved full domestic control of its auxiliary control systems, with the successful operation of a self-developed system at the Huaneng Xiaowan Hydropower Station, marking a significant milestone in domestic hydropower infrastructure [2] - The Chinese Academy of Sciences has successfully developed an ion cyclotron resonance heating system, which has passed expert review, indicating a breakthrough in high-power radio frequency heating technology [2] Group 2 - Galaxy General's founder Wang He announced that the company will exceed a production scale of 1,000 units this year, with a potential tenfold growth in three years. The launch of the Galaxy Space Capsule represents a fusion of embodied intelligence and cultural consumption, with plans for rapid expansion into industrial and consumer markets [2]

Core Viewpoint - Samsung Electronics is actively expanding its 1c (6th generation 10nm class) DRAM capacity to secure its leading position in the next-generation HBM (High Bandwidth Memory) market [2][3] Group 1: Investment Plans - Samsung plans to complete investments in its P4 1c DRAM facility in the Pyeongtaek complex by the first half of next year, including converting existing plants like P3 [2] - The final production line of the P4 facility is expected to begin investment early next year, with the P4 DRAM facility investment currently underway [2][3] - The remaining PH2 cleanroom is expected to start construction by the end of this year or early next year, which will likely also include a DRAM production line [2] Group 2: Production Capacity - Samsung's 1c DRAM capacity is projected to reach up to 60,000 wafers per month this year, with further expansion expected in the first half of next year [3] - The company is also converting the 17th line in Hwaseong for 1c DRAM production, indicating a strategic shift towards enhancing DRAM capacity [3] Group 3: Market Strategy - The company is focusing on ensuring production capacity for 1c DRAM to support the commercialization of HBM4, with plans to accelerate investments as yields and performance stabilize [3]

Core Viewpoint - Samsung Electronics is intensifying its recruitment of experienced high-bandwidth memory (HBM) experts to regain leadership in the semiconductor industry, betting on a market rebound after a weak second quarter [2][3]. Group 1: Recruitment and Focus - Samsung is targeting experienced engineers in next-generation semiconductor and chip packaging technologies, particularly in hybrid bonding technology, which is crucial for enhancing AI and computing application performance [2]. - The company plans to hire professionals across six of its nine major business divisions, including storage chip business, foundry, semiconductor research center, global manufacturing and infrastructure, testing and system packaging, and AI center [2]. - The recruitment application deadline is August 19, with industry observers expecting a significant increase in hiring, indicating a recovery in the storage chip market [2]. Group 2: HBM Development and Market Position - Samsung is seeking packaging development experts for advanced HBM designs and product planners to communicate with customers interested in customized HBM, which features vertically stacked DRAM products [3]. - The company aims to launch customized HBM as early as next year to close the gap with HBM pioneer SK Hynix [3]. - Samsung is working on improving hybrid bonding technology, which connects chips directly without using bumps, essential for manufacturing products with 16 or more DRAM layers [3]. Group 3: Production Timeline and Challenges - Samsung has delayed the mass production of its next-generation HBM chips to 2026, indicating a more cautious approach in ongoing DRAM redesign efforts [4]. - The company initially planned to start mass production of 12-inch HBM4 modules based on 10nm-class sixth-generation 1c DRAM in the second half of 2025, but now aims to deliver early samples to major customers in Q3 2025 [4]. - Internal testing has shown progress, with a yield of about 65% for a small number of wafers as of early July, although these samples are not specifically designed for HBM applications [4]. Group 4: Financial Performance and Strategic Adjustments - Samsung's DS department, responsible for non-memory products, will halt senior employee recruitment due to expanded losses in Q2, with an operating profit of 400 billion KRW (approximately 288 million USD) [5]. - The DS department's performance has been a significant factor in Samsung's quarterly results, alongside the foundry division [5]. Group 5: Competitive Landscape - SK Hynix is aggressively expanding its HBM offerings, anticipating strong demand driven by AI model training and new product launches, with plans to double HBM sales by 2025 [6]. - The company is preparing for the next generation HBM4, aiming for commercialization in 2026 after distributing early samples in March [6]. - SK Hynix is also focusing on expanding its GDDR7 product line for AI graphics cards and maintaining a cautious investment strategy in NAND memory [6].

Core Viewpoint - SK Hynix has successfully developed low-power DRAM based on next-generation technology, targeting AI memory solutions to meet the demands of major tech companies like NVIDIA [2][3]. Group 1: Product Development - In the first half of the year, SK Hynix developed LPDDR5X based on the 1c (6th generation 10nm) process, which is more energy-efficient compared to standard DRAM [2]. - The LPDDR development sequence has progressed to the 7th generation, with LPDDR5X now in mass production [2]. - The company plans to start transitioning to 1c DRAM production in the second half of the year [2]. Group 2: Technical Specifications - The newly developed 1c 24Gb LPDDR5X product can achieve a maximum operating speed of 10.7Gbps and will be offered in SoCAMM and LPCAMM formats for AI servers and PCs [3]. - LPCAMM technology combines the advantages of traditional LPDDR modules and onboard solutions, reducing packaging area while enhancing energy efficiency [3]. - SOCAMM, similar to LPCAMM, features a higher number of I/O ports (694) compared to LPCAMM (644), making it attractive to major tech companies [3]. Group 3: Market Implications - The advancements in LPCAMM and SOCAMM have garnered attention from global tech giants and storage manufacturers, with NVIDIA expected to adopt these products in the next generation of AI PCs [3].

Market Performance - The main board led the gains with notable increases in stocks such as Jishi Media (+10.09%), Zhongdian Xilong (+10.05%), and Beiwai Technology (+10.04) [1] - The ChiNext board saw significant rises with Guangku Technology (+20.01%) and Rongke Technology (+20.00%) [1] - The Sci-Tech Innovation board also performed well, with Zhongchuan Special Gas (+20.01%) and Jinchengzi (+20.01%) [1] - Active sub-industries included SW Communication Network Equipment and Devices (+8.75%) and SW Passive Components (+7.03%) [1] Domestic News - TSMC announced plans to gradually phase out 6-inch wafer manufacturing over the next two years and continue to integrate 8-inch wafer capacity to enhance efficiency [1] - Guangli Micro announced the acquisition of 100% equity in LUCEDA, a global leader in silicon photonic chip design automation software [1] - Kaifeng Gas reported that its gas filling and storage project in Shantou, Guangdong, is nearing completion, with an expected annual output value exceeding 80 million yuan upon reaching full capacity [1] - IDC data indicated that China's tablet market shipment volume is projected to reach 8.32 million units in Q2 2025, reflecting a year-on-year growth of 15.6% [1] Company Announcements - Aiwei Electronics reported total revenue of 1.37 billion yuan for H1 2025, a year-on-year decrease of 13.4%, while net profit attributable to shareholders increased by 71.09% to 157 million yuan [3] - Ankai Micro reported total revenue of 234 million yuan for H1 2025, a decrease of 3.02%, with a net loss of 49 million yuan [3] - Pengding Holdings reported total revenue of 16.375 billion yuan for H1 2025, a year-on-year increase of 24.75%, with net profit attributable to shareholders rising by 57.22% to 1.233 billion yuan [3] - Youyan Silicon reported total revenue of 491 million yuan for H1 2025, a decrease of 3.2%, with net profit attributable to shareholders declining by 18.74% to 106 million yuan [3] Overseas News - Vuzix announced the launch of the new Vuzix LX1 smart glasses, designed for warehouse operations, expected to be mass-produced by the end of the year [4] - Samsung Electronics is developing a rectangular SoP packaging technology to compete for large-scale chip system integration orders with Intel and TSMC [4] - SK Hynix plans to apply six-layer extreme ultraviolet (EUV) technology to mass production of 1c DRAM to enhance DDR5 and high-bandwidth memory (HBM) product performance [4] - Arm introduced Arm Neural Technology at SIGGRAPH, which can significantly reduce GPU workload for mobile content by up to 50% [4]

Core Viewpoint - Samsung Electronics' semiconductor business is showing signs of recovery due to large-scale foundry orders from major U.S. tech companies, with market attention on whether this momentum will extend to its flagship memory chip business [2] Group 1: HBM3E and HBM4 Developments - The first turning point for Samsung's memory business recovery will be its timeline for supplying high-bandwidth memory (HBM3E) chips for NVIDIA's AI accelerators [2] - Analysts predict that Samsung will complete the certification of its 12-inch HBM3E chips by the end of August and begin mass production in the fourth quarter [3] - Morgan Stanley reports that Samsung expects its HBM3E sales to reach a high level of 90% in the second half of the year, indicating full shipments to major customers [3] - Samsung's next potential turning point will be the supply of HBM4 chips, expected to become mainstream for NVIDIA's next-generation AI processor by 2026 [4] - Samsung has completed the development of HBM4 products and is transitioning to the 1c DRAM process, sending samples to major customers [4] Group 2: Competitive Landscape - Samsung is investing in new production facilities to recover from previous setbacks, while SK Hynix is delaying large-scale expenditures until confirming supply commitments with major clients [6] - Analysts suggest that if Samsung successfully supplies HBM4 to NVIDIA, it could regain market leadership lost for nearly 30 years [6] - Market tracking agency Omdia reports that as of Q1 2025, SK Hynix held a 36.9% share of the DRAM market, surpassing Samsung's 38.6% [7] Group 3: Technological Advancements - Samsung is using the more advanced 1c process for HBM4 chips, while SK Hynix plans to use the previous generation 1b DRAM [8] - SK Hynix is actively transitioning to EUV technology for the development of next-generation DRAM, planning to increase the number of EUV layers in its 1c DRAM [10][11]

Core Viewpoint - The global storage chip industry is witnessing a competitive battle in the 10nm sixth-generation DRAM sector, with Samsung Electronics and SK Hynix adopting contrasting strategies to regain market leadership [2][3]. Group 1: Company Strategies - Samsung is rapidly investing in new production facilities to recover from previous product setbacks, aiming to start mass production of 1c DRAM three to four months ahead of SK Hynix [2][3]. - SK Hynix is delaying large-scale expenditures until securing supply commitments from major clients like Nvidia, focusing on profitability before further investments [2][4]. - Samsung plans to utilize 1c DRAM in its HBM4 products, while SK Hynix will use the previous generation 1b DRAM for the same category [3][4]. Group 2: Market Position and Competition - Analysts predict that if Samsung successfully supplies Nvidia with the new DRAM, it could reclaim its market leadership lost for nearly 30 years [2][3]. - As of Q1 2025, SK Hynix is projected to hold a 36.9% share of the DRAM market, surpassing Samsung's 38.6% share, indicating a shift in competitive dynamics [3]. Group 3: Technological Developments - SK Hynix is implementing six layers of EUV (Extreme Ultraviolet) lithography technology in its 1c DRAM, a significant increase from the previous generation [5][6]. - The company is also developing high numerical aperture (High-NA) EUV technology, which poses challenges in mask development due to the complexity of the process [6][7].