HBM(高频宽记忆体)
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HBM 之父大胆猜测:NVIDIA 可能买存储公司
半导体芯闻· 2025-11-04 09:48
Core Insights - NVIDIA's CEO Jensen Huang visited South Korea for the first time in 15 years, meeting with key figures from Samsung and Hyundai to strengthen collaboration in memory and AI megafactories [2] - The importance of memory in the AI era is increasing, with experts suggesting that NVIDIA may consider acquiring memory companies like Micron or SanDisk to maintain its leadership in AI [2][3] - Memory bottlenecks are critical issues that need to be addressed for AI inference, with major companies focusing on solutions [3][4] Memory Demand and Types - Memory requirements for AI are categorized into HBM, DRAM, and SSD, with HBM used for real-time data storage, DRAM for short-term memory, and SSD for long-term data [4] - HBM capacity ranges from 10GB to hundreds of GB, DRAM from hundreds of GB to TB, and SSD from TB to PB [4] AI Inference Mechanism - AI inference utilizes a mechanism similar to human brain attention, which involves storing important information (Key and Value) to enhance processing speed [5] - The introduction of KV Cache allows AI models to remember previously processed information, significantly improving response times for ongoing discussions [5]
九月狂飙:当科技不再“画饼”,资本开始“扫货”
Sou Hu Cai Jing· 2025-09-30 09:14
大伙好啊,刚刚过去的九月,你的朋友圈被各种科技新闻刷屏了吗?AI不是还在"震惊部",芯片怎么 又"卡脖子"了?飞行汽车,这玩意儿真的不是PPT吗? 九月简直成了科技圈的"春运",无锡半导体展、腾讯大会、云栖大会连轴转。但这可不是简单的赶集, 而是一场硬核实力的集中阅兵。 华为小米为啥能掀起巨浪?因为它们拿出的不再是参数表,而是能重新定义市场格局的"硬货"。这直接 刺激了二级市场的神经,引发了一场关于"国产替代"和"算力自主"的全面价值重估。 光模块、HBM(高频宽记忆体)、国产GPU为什么集体躁动?逻辑很简单:大模型是吃算力的"电老 虎",而这些就是给电老虎"喂食"的食堂和后厨。 食堂和后厨都忙不过来了,说明前面的"电老虎"生意 火爆啊!中芯国际、寒武纪被券商研报刷屏,正是这条逻辑链的最强印证——资本市场正在为中国科技 的"底座"重新定价。 第三把火:汽车"上新",卷出新天际的"移动终端" 华为带着新车杀入,堪称九月最精彩的"鲶鱼效应"。它搅动的不仅是整车市场,更是整个智能驾驶产业 链的一池春水。 如果你有这种错觉,那九月资本市场的真金白银,就是一盆最提神的醒脑冰水——这不再是科幻迷的狂 欢,而是一场由政策发 ...
国内AI芯片面临两大瓶颈
半导体芯闻· 2025-09-12 10:12
Group 1 - The core viewpoint of the article highlights the significant increase in China's AI chip production capacity, projected to triple by 2026, potentially reaching millions or even tens of millions of units annually [2] - By 2026, two leading Chinese AI chip manufacturers are expected to produce over 1 million AI chips each, driven by the establishment of three new wafer fabs aimed at meeting domestic AI chip demand [2] - The strategy aims to reduce reliance on foreign high-end chips and promote domestic production, although the expansion plans face uncertainties due to U.S. restrictions on advanced process equipment and HBM supply [2] Group 2 - Despite the increase in production capacity, it is noted that the HBM inventory imported by mainland companies will be depleted by the end of this year, potentially hindering manufacturers like Huawei from producing over 1 million AI chips next year [2] - Mainland companies originally had the capability to produce over 800,000 certain types of chips annually, but the actual output is limited due to insufficient HBM supply [2]