半导体芯闻

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台积电美国工厂,提供这类封装
半导体芯闻· 2025-07-14 10:48
Group 1 - TSMC plans to invest $100 billion in advanced semiconductor manufacturing in the U.S. by March 2025, including three new fabs, two advanced packaging facilities, and a major R&D center [1] - TSMC is accelerating the construction of its third fab at Fab 21 in Phoenix, Arizona, with plans to build two dedicated buildings nearby for advanced packaging services [1] - The first advanced packaging facility, AP1, is set to begin construction in 2028, while the second facility, AP2, has no specific start date yet [2] Group 2 - The two advanced packaging facilities will focus on CoPoS and SoIC packaging technologies, with CoPoS utilizing a 310×310 mm rectangular panel to improve area utilization and capacity [2] - SoIC technology involves stacking memory chips beneath the processing core, validated in AMD's Ryzen X3D processor, with testing production for CoPoS planned to start in 2026 [2] - AP1 is expected to be operational by the end of 2029 or early 2030, aligning with TSMC's delivery timelines [2]
马来西亚,限制AI芯片
半导体芯闻· 2025-07-14 10:48
根据先前报导,美国政府准备制定一套新的出口管制规则,加强对向马来西亚与泰国出口NVIDIA 先进AI GPU的限制,防止这些芯片在现行禁令下被转出口至中国。在初步草案中,美国商务部计 划要求企业在向马、泰两国出口AI GPU 前,必须取得美国政府的出口许可。 与此同时,川普也于近期宣布对于许多国家的关税税制,其中课征马来西亚25% 关税,反而比 「解放日」的24% 还多。 如果您希望可以时常见面,欢迎标星收藏哦~ 来 源: 内容来自technews。 马来西亚将对高效能美国人工智能(AI)芯片的出口与转运实施许可制度,显示政府有意防堵敏 感芯片被转售至中国等地区。 据彭博社报导,马来西亚投资、贸易与工业部周一(14 日)发布声明指出,若个人/企业知情或有 合理理由怀疑相关货品可能被滥用,或将用于受限活动,须在出口、转运或过境前至少30 天通知 主管机关,并申请许可。该政策即日起生效。 该部表示,此举是为了补上现行法规的漏洞,同时马来西亚政府也在检讨是否将原产于美国的高效 能AI芯片纳入《战略贸易法》下的战略物项清单。 Jim Keller:RISC-V一定会胜出 对此,马来西亚投资、贸易及工业部对此发布声明指 ...
新思收购Ansys获批,附加条件曝光
半导体芯闻· 2025-07-14 10:48
Core Viewpoint - The acquisition of Ansys by Synopsys has been approved with restrictive conditions due to potential anti-competitive effects in various software markets, including optical software, photonic software, and certain EDA software markets [1][39]. Group 1: Case Background - Acquirer: Synopsys, established in 1986 in the USA, listed on NASDAQ, primarily engaged in EDA software and design IP business [2]. - Target: Ansys, founded in 1970 in the USA, also listed on NASDAQ, focuses on developing and selling simulation and analysis software [2]. - The agreement for acquisition was signed on January 15, 2024, with Synopsys acquiring all outstanding shares of Ansys [2]. Group 2: Relevant Markets - The relevant markets identified include optical software, photonic software, certain EDA software, and design IP markets, with horizontal overlaps between Synopsys and Ansys in these areas [4][5][6][15]. - Optical software and photonic software are defined as separate markets due to their distinct applications and technological complexities [5][6]. - The EDA software market is highly specialized, with various functions that do not allow for easy substitution among different software tools [7][8][9]. Group 3: Competition Analysis - The merger is expected to significantly increase market concentration in the optical software market, with combined market shares of 65-70% and a substantial increase in the HHI index [19]. - Similar concerns exist for the photonic software market, where the combined market share is also 65-70%, indicating a potential reduction in competition [20]. - The RTL power analysis software market shows a combined share of 70-75%, with a significant increase in market concentration post-merger [22]. - The transaction is likely to enhance Synopsys's market power in several EDA software markets, potentially limiting competition and innovation [37]. Group 4: Restrictive Conditions - The approval of the acquisition comes with several conditions, including the divestiture of optical solutions and power analysis software businesses to mitigate anti-competitive effects [39][40]. - Synopsys is required to maintain existing customer contracts and ensure fair access to its products without discrimination [40]. - The company must also uphold interoperability agreements with third-party EDA vendors to promote competition and innovation in the market [41].
ASIC重塑HBM供应链
半导体芯闻· 2025-07-14 10:48
Core Viewpoint - The demand for custom AI semiconductors is rapidly increasing, leading to a shift in the customer base for high bandwidth memory (HBM) from traditional GPU manufacturers like Nvidia and AMD to tech giants such as Amazon, Google, and Meta, who are designing their own ASICs [1][2]. Group 1: Market Dynamics - The shift in demand is prompting memory chip manufacturers like Samsung, SK Hynix, and Micron to adjust their supply strategies and increase production capacity for HBM targeted at ASIC developers [1]. - Micron has identified ASIC platform companies alongside Nvidia and AMD as its four major HBM customers, indicating the growing influence of this sector [1]. - Analysts predict that by 2026, global shipments of AI ASICs will surpass those of Nvidia's AI chips, with the global ASIC AI market expected to reach $30 billion this year, growing at over 30% annually [1]. Group 2: HBM Supply and Technology - The demand for HBM is increasing as it is crucial for handling high-speed data in AI workloads, with SK Hynix supplying significant volumes to Amazon, Google, and Broadcom [2]. - Samsung is delivering its fifth-generation HBM3E to Broadcom and other ASIC customers, while the upcoming sixth-generation HBM4 technology is expected to bring further changes, allowing for customized logic chips [2]. - Samsung and SK Hynix are accelerating investments in HBM4 production to meet the rising demand, with Micron also providing samples of 12-layer HBM4 chips for quality verification [2]. Group 3: Future Agreements - HBM orders typically require a year of advance booking, and it is anticipated that the three major suppliers will finalize sample agreements with ASIC customers by the end of the year [3].
英伟达,主宰800V时代
半导体芯闻· 2025-07-11 10:29
Core Insights - Nvidia is redefining the characteristics and functionalities of future power electronic devices, particularly for AI data centers, by designing a new powertrain architecture [1][4] - The shift towards 800V high voltage direct current (HVDC) data center infrastructure is being supported by various semiconductor suppliers and power system component manufacturers [1][5] Group 1: Nvidia's Influence on Power Electronics - Nvidia's push for AI data centers is creating momentum for Gallium Nitride (GaN) technology, similar to the impact of Silicon Carbide (SiC) during Tesla's rise [2] - Nvidia is collaborating with multiple partners, including Infineon, MPS, Navitas, and others, to transition to 800V HVDC systems [1][4] Group 2: Technical Requirements and Innovations - The new 800V HVDC architecture will necessitate a range of new power devices and semiconductors to meet the demands of AI data centers [5] - Infineon is developing converters to demonstrate the advantages of 800V to lower voltages, focusing on power density and efficiency [6][8] Group 3: Competitive Landscape - Other companies, such as Navitas Semiconductor, are also capitalizing on Nvidia's drive for AI data centers by leveraging their expertise in GaN technology [13] - The competition is intensifying as companies like Infineon and Navitas seek to provide solutions for Nvidia's evolving power infrastructure needs [13][14] Group 4: Market Predictions - Yole Group predicts that GaN will experience faster growth than SiC in the AI data center market, with GaN devices having higher voltage potential [16] - The shift in Nvidia's power infrastructure strategy may render existing open computing projects obsolete, leading to a fragmented market [15]
GaN,内卷加剧
半导体芯闻· 2025-07-11 10:29
Core Viewpoint - The GaN market is experiencing significant changes, with TSMC announcing its exit from GaN foundry services within two years, while other companies like Powerchip and Infineon are ramping up their GaN production capabilities. This shift indicates a competitive landscape where GaN is poised for growth, particularly in high-efficiency applications like electric vehicles and fast charging [1][4][15]. Group 1: TSMC's Exit and Market Dynamics - TSMC will gradually phase out its GaN semiconductor foundry business due to profit margin pressures from Chinese competitors, halting the development of 200mm wafer production [1][2]. - Navitas Semiconductor plans to transition its production from TSMC to Powerchip, with expectations to produce GaN products rated from 100V to 650V by mid-2026 [2]. - The exit of TSMC opens opportunities for other players like Powerchip and Infineon to fill the production gap and capture market share [1][4]. Group 2: Competitor Strategies - Infineon is advancing its 12-inch GaN production, with plans to release customer samples by Q4 2025, leveraging its IDM model for scalable production [4]. - Renesas Electronics has shifted focus from SiC to GaN, suspending its SiC projects due to market saturation and is preparing to enhance its GaN capabilities following its acquisition of Transphorm [5][6]. - ROHM is committed to deepening its collaboration with TSMC to address market demands and explore future production frameworks [3]. Group 3: Market Growth and Challenges - The GaN semiconductor market is projected to grow significantly, with a compound annual growth rate (CAGR) of 98.5% from 2024 to 2028, potentially exceeding $6.8 billion by 2028 [15]. - The main drivers for GaN market growth include consumer electronics and electric vehicles, with expectations for GaN applications in fast chargers and adapters to grow at a CAGR of 71.1% [15]. - Transitioning GaN from peripheral applications to core power systems in electric vehicles presents challenges, including reliability and ecosystem maturity [16][17]. Group 4: Strategic Partnerships and Investments - STMicroelectronics has extended its lock-up period for its investment in Innoscience, signaling confidence in the latter's future and the broader GaN market [9][11]. - The partnership between ST and Innoscience aims to leverage each other's manufacturing capabilities to enhance GaN product development and production [12]. - Innoscience has emerged as a key player in the GaN market, achieving significant revenue growth and expanding its wafer production capacity [14].
马来西亚芯片公司,暂停投资计划
半导体芯闻· 2025-07-11 10:29
如果您希望可以时常见面,欢迎标星收藏哦~ 来 源: 内容来自 彭博社 。 据马来西亚半导体行业协会主席王寿海透露,马来西亚的芯片公司正在暂缓投资和扩张,以等待美 国关税政策的明朗化。 他指出:"马来西亚公司将不得不通过人工智能、自动化、机器人技术来提高生产力,并增强全球 竞争力。" 他指出:"如果情况明朗,我认为投资就会继续。每个人都在等待事态的发展。" 特朗普曾表示,他正在考虑对包括半导体在内的特定行业征收更多关税。周一,他宣布,除非马来 西亚与美国政府达成协议,否则马来西亚将从8月1日起面临25%的关税,这"独立于部门关税"。马 来西亚最初在4月份被征收24%的关税,随后美国宣布暂停90天,将商品关税水平降至10%,以促 进谈判。 美国是马来西亚半导体出口的第三大市场。马来西亚封装了全球约十分之一的半导体,而电气和电 子产品占其出口的近五分之二。 成本上升与行业应对 王寿海表示,自马来西亚从7月1日起扩大销售和服务税后,行业已经看到经营成本略有增加,一 些公司受到的影响比其他公司更大。虽然他无法量化具体影响,但他表示这是公司必须承受的。 王寿海在接受彭博电视台 Haslinda Amin 采访时表示,这些 ...
AI芯片初创公司Groq,发展迅猛
半导体芯闻· 2025-07-11 10:29
Core Insights - Groq, an AI semiconductor startup, has established its first data center in Europe to meet the growing global demand for AI services and products, aiming for exponential growth in the region [1] - The company has received investment support from leading global firms like Cisco and Samsung, and is collaborating with Equinix to build the data center in Helsinki, Finland, which is favored for its cool climate and access to renewable energy [1][2] - Groq's valuation stands at $2.8 billion, and it has designed a chip called the Language Processing Unit (LPU) that focuses on inference rather than training AI models, similar to the responses provided by chatbots [2] Company Developments - Groq currently operates data centers in the US, Canada, and Saudi Arabia, and plans to leverage its partnership with Equinix to enhance access to its inference products through Equinix's data center platform [2] - The political environment in Europe has shifted towards the concept of "sovereign AI," emphasizing the need for data centers to be located close to users to improve service speed [2] Market Context - While NVIDIA remains a leader in chip and GPU production, emerging startups like SambaNova, Ampere, and Cerebras are also entering the AI inference chip market, indicating a competitive landscape [2]
前ASML工程师,因窃密被判入狱三年
半导体芯闻· 2025-07-11 10:29
Core Viewpoint - A former engineer from ASML and NXP Semiconductor was sentenced to three years in prison for stealing proprietary chip technology and sharing it with Russia, violating EU sanctions [1][2]. Group 1: Incident Details - The unnamed 43-year-old defendant was convicted of computer hacking and illegal technology assistance to Russia [1]. - The engineer reportedly profited €40,000 (approximately $44,000) from the intellectual property of the chip manufacturers [1]. - The court documents revealed that from May 2023 to August 2024, the defendant shared files related to semiconductor manufacturing equipment and processes with a Russian contact via Signal, Telegram, and Google Drive [1]. Group 2: Legal Proceedings - The defendant admitted to stealing company data from ASML and NXP, stating he saved files for personal use and sent them to a Russian contact without inquiring about the legality [2]. - He was acquitted of charges related to a proposal for establishing a microchip production line, as he did not provide such technical assistance [2]. Group 3: Company Responses - ASML declined to comment on the legal proceedings [3]. - NXP Semiconductor expressed a zero-tolerance policy towards data theft and stated their satisfaction with the court's ruling, emphasizing their cooperation with the prosecution [3].
7nm以下先进制程,大增!
半导体芯闻· 2025-07-11 10:29
根据国际半导体设备材料协会(SEMI)11日发布的《300毫米(12英寸)晶圆厂展望报告》显 示,预计自去年底至2028年,全球晶圆产能将以年均7%的速度增长,到2028年,月晶圆产能预计 将达到创纪录的1110万片。 分析人士将此归因于先进制程产能的持续扩张。预计到2028年,7纳米(nm;1nm=十亿分之一 米)以下先进制程的产能将从去年的每月85万台增长约69%,达到每月140万台,创历史新高。 据报道,半导体行业的跨国公司正在大幅扩大其生产能力,以满足对生成人工智能 (AI) 应用日益 增长的需求。 SEMI预计2纳米以下制程的产能将大幅扩张,今年的产能将不足20万片,到2028年将超过50万 片。SEMI总裁兼首席执行官Ajit Manocha指出:"人工智能仍然是推动半导体行业转型的关键驱 动力。人工智能应用的扩展正在推动对先进芯片的需求,因此,整个行业的投资也变得更加活 跃。" 预计到2028年,先进工艺设备的投资将超过500亿美元,高于去年的260亿美元。预计到2028年, 2纳米以下工艺晶圆设备的投资将从去年的190亿美元增加一倍以上,达到430亿美元,增幅达 120%。 如果您希望可以时常 ...