如果您希望可以时常见面，欢迎标星收藏哦~ 市场传出，苹果(Apple Inc.)及供应商去(2025)年严重错估消费者对iPhone Air的需求，如今正在 结算报废零件的损失，粗估金额可能有数亿美元之谱。 独立科技记者Tim Culpan 28日透过个人的Substack电子报订阅平台指出，消息显示尽管苹果已在 去年10月下令减产，该公司与供应商手中仍累积了最多150万台iPhone Air的零组件。 更惨的是，据传部分零件无法转作他用，或许只有报废一途。要厘清的是，这不代表有150万支 iPhone需要报废，而是指iPhone Air专用的特定零件。 根据Culpan分析，那些无法重新利用的零件所引发的资产减损金额，应落在数亿美元左右(low hundreds of millions of dollars)。 iPhone在2025年7-9月的整体销售额多达490亿美元、10-12月 预估销售额更有望达约800亿美元，区区数亿美元其实不算严重。 Culpan直指，真正的问题应该是，苹果何以这么不了解自家顾客的需求，以及这场混乱会对供应 链产生什么影响。据说，虽然部分供应商需自行承担损失，但苹果会吸收大部分 ...

Core Viewpoint - The patent lawsuit initiated by Murata Manufacturing against Maxscend Microelectronics in 2025 is not a typical infringement dispute but a significant structural conflict in the Thin-Film Surface Acoustic Wave (TF-SAW) technology field, spanning across China, South Korea, and Germany, reflecting Murata's long-standing global IP enforcement strategy targeting a rapidly growing Chinese RF front-end manufacturer [1][2]. Group 1: Patent Overview - Murata claims eight patents against Maxscend in China, South Korea, and Europe, showcasing a systematic distribution across various technical abstraction levels rather than focusing on a single device feature or manufacturing process [3][4]. - The patents cover TF-SAW layered structure design, resonator-level transverse mode engineering, and complete filter system architecture, indicating a deliberate layered patent protection strategy [3][4]. Group 2: Timeline and Jurisdiction - The dispute first emerged in China and South Korea, with Murata filing lawsuits in Seoul and Shanghai on April 11, 2025, targeting specific patents in each jurisdiction [5]. - By November 2025, the lawsuit expanded to Europe, with Murata filing against a filter product sold in Germany, seeking a court order to stop infringement and recalling products, with a claim amount of approximately €1 million [6]. Group 3: Technical Focus - The claimed patents are based on the LiTaO₃/Si layered TF-SAW platform, addressing core issues in high-frequency, wideband RF applications, specifically transverse modes and higher-order modes [7]. - The patents impose multiple design constraints on structural, material, and system levels to mitigate the adverse effects of these modes [7]. Group 4: Chinese Patent Details - The four Chinese patents represent various complementary paths to control the TF-SAW design space, focusing on different aspects such as IDT structure, controlled sound speed distribution, and constraints on higher-order mode velocities [8][9]. Group 5: South Korean Patent Details - The three South Korean patents further develop the ideas from the Chinese patents, emphasizing mass loading for transverse mode control and establishing clear design rules for high-order mode velocity constraints [9][10]. Group 6: European Patent Details - The European patent EP3007358 addresses the transverse mode issue at the filter system level, proposing intentional differences in low-speed region widths between series and parallel resonators to disperse transverse mode resonance [10]. Group 7: Maxscend's IP Development - Since 2021, Maxscend has accelerated its patent activities in RF front-end modules and related devices, with a significant increase in patent applications and new patent families, indicating a strategic shift towards higher integration and frequency applications [11][16]. - Maxscend currently holds 217 RF patent families, with 25 directly related to TF-SAW technology, highlighting its importance in the company's RF technology roadmap [16][17]. Group 8: Comparative IP Landscape - Murata holds over 230 TF-SAW related patent families globally, significantly surpassing Maxscend's patent reserves, reflecting Murata's decades of R&D investment and strategic positioning in the TF-SAW domain [17][18]. - Maxscend's patents are primarily concentrated in China, with limited international extension, contrasting with Murata's extensive global patent coverage [17][18]. Group 9: Structural Impact of the Lawsuit - The lawsuit reveals systemic vulnerabilities for companies entering the TF-SAW technology field, particularly those relying on mainstream material systems and established design paradigms [20]. - The long-term implications for Maxscend include the need for differentiated technological paths to ensure freedom to operate as patent density increases in the TF-SAW domain [20][22]. Group 10: Industry Implications - This lawsuit exemplifies how established RF giants leverage comprehensive global patent portfolios to defend their technological leadership while highlighting the challenges faced by rapidly growing challengers in balancing innovation and existing IP constraints [22].

如果您希望可以时常见面，欢迎标星收藏哦~ 三星电子预测今年内存半导体将持续短缺。由于第一季度DRAM和NAND闪存的出货量均有所增 长，价格上涨预计不可避免。 特别是，高带宽存储器（HBM）难以满足全球因人工智能基础设施投资而激增的需求。三星电子 已 设 定 目 标 ， 今 年 其 HBM 销 量 将 比 去 年 增 长 三 倍 以 上 。 容 量 方 面 ， 预 计 将 超 过 100 亿 吉 比 特 （Gb）。 29日，三星电子通过电话会议公布了其2025年第四季度收益，并宣布了其对今年存储器市场的展 望。 由于去年下半年供应严重短缺，存储器供应商正在迅速提高DRAM和NAND闪存的盈利能力。三 星电子报告称，去年第四季度其DRAM平均售价（ASP）较上一季度增长了40%。NAND闪存的平 均售价也较上一季度增长了20%。 今年第一季度，存储器出货量（位数）的增长预计仍将受到限制。与上一季度相比，DRAM 和 NAND 的出货量预计分别保持在个位数低段和个位数中段的水平。因此，存储器价格将面临进一 步的上涨压力。 三星电子解释说："由于近期人工智能领域的需求快速增长，内存供应扩张受到限制，这种情况在 短期 ...

Core Viewpoint - Japan's semiconductor manufacturing equipment sales reached a historic high of 5 trillion yen in 2025, marking a 14% year-on-year increase, and this is the first time sales have surpassed the 5 trillion yen mark [1]. Group 1: Sales Performance - In 2025, Japan's semiconductor equipment sales amounted to 5,585.08 billion yen, significantly exceeding the previous year's sales of 4,435.99 billion yen, marking the second consecutive year of growth [1]. - December 2025 saw a sales figure of 423.487 billion yen, a 4.5% decrease compared to the same month last year, indicating the first contraction in 24 months, although sales remained above 300 billion yen for 26 consecutive months [1]. - Compared to November 2025, sales increased by 0.7%, marking the second consecutive month of growth [2]. Group 2: Market Position and Future Projections - Japan holds a 30% global market share in semiconductor equipment sales, ranking second only to the United States [3]. - DISCO, a major Japanese wafer cutting machine manufacturer, reported a 3% year-on-year increase in shipment value to 113.6 billion yen for the last quarter of 2025, with expectations of a 26% increase in the upcoming quarter [3]. - The Semiconductor Equipment Association of Japan (SEAJ) revised its forecast for 2025 sales to 4,911.1 billion yen, a 3% increase from the previous estimate, driven by investments in TSMC's 2nm technology and stable DRAM investments [3]. - For the fiscal year 2026, Japan's semiconductor equipment sales are projected to reach 5,500.4 billion yen, representing a 12% year-on-year increase, and this will also be the first time sales exceed 5 trillion yen in a fiscal year [4].

如果您希望可以时常见面，欢迎标星收藏哦~ 日前，韩国《加强和支持半导体产业竞争力的特别法》（以下简称"半导体特别法"）在国会全体会 议上获得通过。 随着这项特别法律的颁布，为应对半导体行业日益激烈的竞争，包括竞争对手国家的技术竞赛和大 规模补贴，建立了一个制度基础，以系统地支持整个半导体产业供应链，包括存储器和系统半导 体、设计、制造和封装，以及材料、组件和设备。 由于劳工团体的反对，曾引起争议的"每周 52 小时工作制例外"条款已从该法案中删除。 特别是，原本分散在各个项目和预算中的半导体扶持政策，已经扩大到通过以下方式全面、持续地 扶持半导体产业：成立总统半导体产业竞争力强化特别委员会；制定半导体产业竞争力强化基本计 划；设立半导体产业竞争力强化专项账户。 此外，还可以通过以下方式集中扶持大都市区以外的半导体产业：指定兼顾区域均衡发展的半导体 产业集群，支持集群产业基础设施的建设和运营，以及支持迁入集群的企业和机构。 此外，还包括各项企业扶持措施的依据，包括技术开发和示范中心建设项目；培育中小企业、代工 生产（代工厂）和系统半导体生态系统；支持人力资源开发和吸引海外人才；法规、许可证和初步 可行性研究的特 ...

Core Viewpoint - Alibaba is positioning its AI ecosystem, referred to as "Tongyun Ge," as a leading AI supercomputer, integrating self-developed chips, cloud services, and open-source models to achieve high efficiency in training and deploying large models [1][2]. Group 1: Product Launch and Features - The "Zhenwu 810E" high-end AI chip was launched on January 29, marking the official introduction of Alibaba's self-developed PPU [1]. - The "Zhenwu" PPU features a 96G HBM2e memory and an inter-chip bandwidth of 700 GB/s, designed for AI training, inference, and autonomous driving applications [2]. - The performance of the "Zhenwu" PPU surpasses that of NVIDIA's A800 and mainstream domestic GPUs, and is comparable to NVIDIA's H20, with an upgraded version reportedly outperforming the A100 [2]. Group 2: Market Position and Achievements - The "Zhenwu" PPU has been deployed in multiple clusters on Alibaba Cloud, serving over 400 clients, including State Grid, Chinese Academy of Sciences, Xiaopeng Motors, and Sina Weibo [1]. - The "Qwen3-Max-Thinking" flagship inference model from Tongyi Lab has set multiple global records, rivaling the performance of GPT-5.2 and Gemini 3 Pro [4]. - The number of derivative models from the Qianwen open-source model has exceeded 200,000, with download counts surpassing 1 billion, maintaining its position as the largest in the world [4].

如果您希望可以时常见面，欢迎标星收藏哦~ 韩国SK海力士公司周三表示，由于人工智能的持续需求推高了先进和传统存储芯片的价格，其季 度利润翻了一番多，创下历史新高，轻松超过了预期。 据路透社计算，英伟达供应商第四季度营业利润飙升 137%，达到 19.2 万亿韩元（135 亿美 元）。 相比之下，一年前为 8.1 万亿韩元，而伦敦证券交易所智能估值 (LSEG SmartEstimate) 的共识 预测为 17.7 万亿韩元，该估值更倾向于那些业绩记录较为稳定的分析师。 SK海力士将于周四举行第四季度财报发布会。 根据麦格理证券研究公司的数据，SK海力士在高带宽内存（HBM）领域占据了令人羡慕的领先 地位，该内存被英伟达等公司用于人工智能芯片组，占据了HBM市场61%的份额。 SK海力士也对HBM4充满信心，这款第六代HBM预计将成为今年AI内存市场竞争最激烈的领 域。SK海力士解释说："去年9月，我们率先在业内建立了HBM4的量产体系，目前正按客户需求 量产。"他补充道："我们将继续保持HBM4领域的领先地位，并加强与客户和合作伙伴的合作框 架，以便提供'定制HBM'的最佳产品，这正成为下一代关键的竞争优势。 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 1月28日上午，国台办在新闻发布厅举行例行新闻发布会，发言人张晗就近期两岸热点问题回答 记者提问。 会上有记者提问：对于美台关税谈判结果，岛内舆论担忧，如果未来3年台湾半导体供应产能 40%移至美国，将重创台湾经济，大量高科技人才、包括中下游产业链都会出现出走潮，将是台 湾未来数十年追不回的损失。对此有何评论？ 国台办发言人张晗表示，面对台湾半导体全产业链迁美，岛内舆论担忧、业界担忧、民众担忧， 只有民进党当局还在竭力粉饰太平。民进党当局为"倚外谋独"，无底线媚美卖台，"跪送"台湾半 导体产业优势，却要岛内民众和业界承担无法挽回的损失，必然导致业界恐慌、民怨沸腾，必定 自食恶果。 推荐阅读 10万亿，投向半导体 芯片巨头，市值大跌 黄仁勋：HBM是个技术奇迹 Jim Keller：RISC-V一定会胜出 全球市值最高的10家芯片公司 点这里加关注，锁定更多原创内容 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代表半导体芯闻对该 观点赞同或支持，如果有任何异议，欢迎联系我们。 喜欢我们的内容就点 "在看 " 分享给小伙伴哦~ （来源 ： ...

Core Viewpoint - The establishment of the 6-inch automotive-grade power semiconductor wafer production base by Ruineng Microelectronics in the Zhongguancun (Shunyi) third-generation semiconductor industrial park marks a significant advancement in the development of the third-generation semiconductor industry in Shunyi District, with the production line entering trial production phase [1][2]. Group 1 - The automotive-grade power chips produced by Ruineng Microelectronics have stringent requirements for reliability, consistency, and lifespan, which have historically been a weakness in the domestic industry [2]. - The total investment for the 6-inch automotive-grade power semiconductor wafer production base is 926 million yuan, covering an area of 30,000 square meters, with plans to gradually increase production capacity over three years after official production begins, aiming for full production by the end of 2025 [2]. - The production base is expected to enhance the synergy within the semiconductor industry chain, contributing to the establishment of a core area for automotive-grade power chips and a demonstration zone for third-generation semiconductor applications in Shunyi District [6]. Group 2 - Ruineng Microelectronics is positioned in the midstream of the semiconductor industry chain, connecting upstream with third-generation semiconductor material companies and downstream with automotive manufacturers, fostering a beneficial cycle of semiconductor chip design, processing, and vehicle application [6]. - The company has engaged in deep cooperation with other enterprises in the industrial park, forming a complementary and collaborative supply chain ecosystem, with initiatives like Poisson Energy Space actively facilitating upstream and downstream connections [6]. - The operational support system in the Zhongguancun (Shunyi) third-generation semiconductor industrial park includes standardized factory buildings and power capacity enhancements, along with a "one-on-one" service mechanism to address the growth needs of enterprises like Ruineng Microelectronics [9].

Core Viewpoint - The company plans to acquire 60% of Guangdong Changxing Semiconductor Technology Co., Ltd. for 520 million yuan, aiming to enhance its presence in the semiconductor industry and improve its business structure and asset portfolio [1]. Group 1: Acquisition Details - The acquisition will make Changxing Semiconductor a subsidiary of the company, included in the consolidated financial statements [1]. - Changxing Semiconductor, established in 2012, specializes in memory chip packaging and testing, with advanced packaging technologies such as 8-layer stacked die packaging and BGA, SiP, CSP techniques [1]. Group 2: Financial Projections - For the fiscal year 2025, Changxing Semiconductor is projected to generate revenue of 646 million yuan and a net profit of 74.57 million yuan [1]. - The company has performance commitments, including a minimum net profit of 75 million yuan for 2026 and cumulative net profits of at least 155 million yuan from 2026 to 2027, and 240 million yuan from 2026 to 2028 [1]. Group 3: Strategic Implications - The acquisition is intended to allow the company to quickly enter the storage chip industry, diversify its operational risks, and enhance its overall competitiveness and risk resistance [1]. - This move aligns with the company's strategic expansion into the technology sector and its "cultural tourism + technology" strategy [1].