如果您希望可以时常见面，欢迎标星收藏哦~ SK 海力士去年取得了有史以来最高的业绩，决定向员工发放相当于基本工资 2964%（年薪的二十 分之一）的绩效奖金，这是有史以来最高的奖金。 据业内人士2月4日透露，SK海力士将今年的"利润分享（PS）"支付比例设定为2964%，支付日期 为2月5日。PS是SK海力士的绩效奖金制度，根据年度业绩，以10%的营业利润为资金来源，每年 一次性支付一定比例的年薪。 从今年SK海力士的绩效奖金发放开始，公司开始实施去年下半年劳资双方达成一致的新绩效奖金 发放标准。新标准取消了之前的绩效奖金发放上限（最高1000%），并以上一年营业利润的10%作 为资金来源。公司决定将此标准维持10年。 每位员工计算出的绩效奖金的 80% 在当年支付，剩余的 20%（每年 10%）分两年支付。 SK海力士，利润翻倍 韩国SK海力士此前公布，2025年全年利润创历史新高，营业利润翻了一番多，原因是人工智能相 关存储芯片短缺推高了价格，帮助该公司超出市场预期。 这家内存芯片制造商在12月季度也公布了创纪录的收入和利润，该公司正与竞争对手三星争夺全 球顶级内存生产商的头衔。 与此同时，SK海力士宣布 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 美媒报导，博通和台积电正成为客制化人工智能芯片热潮的主要受益者，与英伟达在人工智能基础 设施市场的持续主导地位一起，从中获取价值。 247wallst报导指出，博通刚刚公布2026财年第一季业绩，营收达180.2亿美元，年增28%，其中人 工智能半导体营收飙升74%。该公司预计，在客制化人工智能加速器和乙太网路人工智能交换器的 推动下，2026财年第一季人工智能半导体营收将年增一倍，达到82亿美元。 博通最近一个季度的获利成长高达188%，毛利率稳定在68%左右，这使其在超大规模资料中心建 构专有芯片架构的过程中展现出卓越的定价能力。 台积电作为制造支柱的作用同样至关重要。这家晶圆代工巨头公布了2025财年第四季财报，营收 达337.3亿美元，年增20.5%，其中77%的晶圆收入来自先进的7纳米及以下制程。台积电3纳米制 程占晶圆营收的28%，5纳米制程占35%，反映出市场对尖端人工智能芯片制造的强劲需求。台积 电45%的利润率和54%的营业利益率也凸显了服务人工智能基础建设的获利能力。 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 在 2026 年 2 月 4 日举行的财务业绩发布会上，ROHM 总裁回答提问时表示："由于我们公司与 台积电共同创立的历史，我们已经从台积电购买了许可证，现在正朝着自主生产的方向发展。" ROHM计划在其滨松工厂（滨松市）启动一条8英寸生产线并开始生产。该公司还表示，如果需求 突然增加，将把部分生产外包给VIS。虽然投产时间将取决于项目启动的进展情况，但该公司正在 迅速采取行动，以尽可能减少影响，直到台积电撤出为止。 参考链接 https://eetimes.itmedia.co.jp/ee/articles/2602/04/news114.html （来源 ： 编译自eetjp ） 点这里加关注，锁定更多原创内容 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代表半导体芯闻对该 观点赞同或支持，如果有任何异议，欢迎联系我们。 推荐阅读 10万亿，投向半导体 芯片巨头，市值大跌 黄仁勋：HBM是个技术奇迹 Jim Keller：RISC-V一定会胜出 全球市值最高的10家芯片公司 喜欢我们的内容就点 "在看 " 分享给小伙伴哦~ 继台 ...

Group 1 - Nvidia has requested Samsung Electronics to expedite the supply of its sixth-generation high bandwidth memory (HBM4), indicating a competitive race for HBM4 supply among AI semiconductor designers like AMD and Google [1] - Samsung and SK Hynix are currently conducting final quality tests on HBM4, but Nvidia's demand to accelerate supply regardless of test results suggests a shift in the dynamics of supplier relationships [1] - The domestic memory companies have seen record performance due to the "memory supercycle," positioning them as "super suppliers" in the global AI and semiconductor supply chain [2] Group 2 - SK Hynix is projected to capture 54% of the global HBM4 market this year, while Samsung Electronics is expected to hold 28%, together accounting for over 80% of the market [2] - The shift in the semiconductor market is reflected in the earnings outlook for Samsung and SK Hynix, with Morgan Stanley predicting Samsung's operating profit to reach 245 trillion KRW and SK Hynix to reach 179 trillion KRW, significantly up from last year's figures [2] - The increasing demand for memory, driven by AI advancements, has led to a shortage of general memory, enhancing the bargaining power of memory companies [2]

Core Viewpoint - Shenzhen Baiwei Storage is gaining attention as a dark horse in the storage industry, with projected net profits for 2025 expected to increase significantly compared to the previous year, driven by technological advancements and market demand for storage solutions [1][2]. Financial Performance - Baiwei Storage anticipates a net profit attributable to shareholders of 850 million to 1 billion yuan for the fiscal year 2025, representing an increase of 688.77 million to 838.77 million yuan year-on-year, which translates to a growth of 427.19% to 520.22% [1]. - The fourth quarter of 2025 is expected to see a net profit of 819.59 million to 969.59 million yuan, reflecting a year-on-year growth of 1225.40% to 1449.67% and a quarter-on-quarter increase of 219.89% to 278.43% [1]. Technological Advancements - The company's success is attributed to its continuous investment in new technologies, advanced packaging capabilities, and wafer-level advanced testing manufacturing [2]. - Baiwei Storage is one of the first companies to integrate research and development in packaging and testing, providing a comprehensive solution of "storage + wafer-level advanced testing" [2]. Market Trends - The rise of edge AI is reshaping the storage landscape, with predictions that AI smartphones and PCs in China will see penetration rates exceeding 50% and 80%, respectively, in the next three years [4]. - The demand for storage solutions is increasing as various industries explore the potential of AI applications, leading to new challenges and requirements for storage products [5]. Product Innovation - The Mini SSD, introduced by Baiwei Storage, is a response to the evolving market needs, characterized by high performance, large capacity, and compact size [9][10]. - The Mini SSD has received multiple international awards, including TIME's "Best Invention of the Year" and "Best-in-Show" at Embedded World North America 2025, highlighting its innovative design and market acceptance [12][13]. Product Features - The Mini SSD features a size of 15mm x 17mm x 1.4mm, which is 60% smaller than M.2 2230 SSDs, and offers a capacity range from 512GB to 2TB [15]. - It supports PCIe 4.0x2 interface and NVMe 1.4 protocol, achieving read speeds of 3700MB/s and write speeds of 3400MB/s, along with IP68 dust and water resistance [16]. Ecosystem Development - Baiwei Storage is collaborating with top industry partners to build an open and prosperous ecosystem for the Mini SSD, aiming to leverage AI opportunities in the market [20]. - The company is committed to continuously upgrading the Mini SSD and introducing more innovative products to empower the industry [21].

Core Viewpoint - The article discusses the recent significant drop in the stock price of Cambrian, a company focused on artificial intelligence chip development, and highlights its financial performance and projections for 2025 [2][3]. Group 1: Company Performance - Cambrian's stock price fell by over 14% on February 3, closing down 9.18% at 1128 CNY per share, resulting in a total market capitalization of 475.66 billion CNY [2]. - The company forecasts its 2025 revenue to be between 6 billion to 7 billion CNY, representing a year-on-year growth of 410.87% to 496.02%, with a projected net profit of 1.85 billion to 2.15 billion CNY, marking a turnaround from previous losses [2]. - In 2024, Cambrian reported a revenue of 1.174 billion CNY, with a net loss of 0.452 billion CNY [2]. Group 2: Research and Development - Cambrian has maintained a strong focus on research and development, with R&D expenses reaching 0.843 billion CNY in the first three quarters of 2025, contributing to a total of 6.604 billion CNY since its IPO [2]. - The company has been recognized in the market as a domestic equivalent to Nvidia, emphasizing its role in the AI chip sector [2]. Group 3: Historical Financial Growth - Since its listing, Cambrian's revenue has increased nearly 15 times from 0.444 billion CNY prior to its IPO in 2020 [3]. - The stock price has also seen substantial growth, rising from an initial price of 64.39 CNY per share to 1258.89 CNY per share as of January 30, reflecting an approximate increase of 18 times [3].

Core Viewpoint - Samsung Electro-Mechanics has begun commercializing semiconductor glass substrates, marking its entry into the glass substrate market, which is gaining attention as the next generation of semiconductor substrates [1][2]. Group 1: Business Transition and Strategy - The semiconductor glass substrate department has been moved from the Advanced Technology Development Department to the Packaging Solutions Division, indicating a strategic shift towards commercialization [1]. - Samsung Electro-Mechanics appointed Joo Hyuk, former head of the Central Research Institute, as Vice President and head of the Packaging Solutions Division, emphasizing the importance of this transition [1]. - The company aims to accelerate the commercialization process by integrating core glass substrate technology with market supply preparations [1][2]. Group 2: Technological Development and Challenges - Semiconductor glass substrates, which replace existing plastic materials, significantly enhance device performance and are seen as the new substrate for AI semiconductors [1]. - Key technical challenges include signal transmission coatings within the glass and micro-cracks that affect substrate durability and quality, which the company is actively working to overcome [2]. - Samsung Electro-Mechanics plans to collaborate with the materials, components, and equipment (MSE) industry to address these challenges and develop glass substrate samples with global semiconductor companies [2]. Group 3: Market Positioning and Future Outlook - The company established a pilot production line for glass substrates at its Sejong factory last year and formed a joint venture with Sumitomo Chemical to expedite production and supply [2]. - Samsung Electro-Mechanics anticipates that the glass substrate era will truly begin after 2027, with plans to build a supply chain and initiate mass production based on partner demand [2].

Group 1 - SiTime is set to acquire Renesas Electronics' timing division for approximately $3 billion (about 20.8 billion RMB), which focuses on signal synchronization devices for wireless infrastructure [1] - The acquisition is expected to be the largest in SiTime's history, with negotiations ongoing and a potential announcement coinciding with Renesas' annual performance report [1][2] - SiTime's stock has surged by 83% over the past 12 months, giving it a market capitalization of around $9.8 billion, while Renesas' stock has increased nearly 30%, with a market cap of approximately 4.9 trillion yen (about $310 billion) [2] Group 2 - The sale of the timing division will provide Renesas with additional funds to pursue acquisitions in high-growth areas and transition towards a platform-based business model [2] - Renesas has already made a strategic acquisition of Altium Ltd., an American electronic design software provider, in 2024, indicating a shift from one-time product sales to other business models [2]

图：诺瓦星云+德氪微联合参展ISE2026 2月3日，全球专业视听与系统集成领域的重要展会——2026年欧洲视听技术及系统集成展（以下简称"ISE"）在西班牙巴塞罗那会展中心开 幕。德氪微电子（深圳）有限公司（以下简称"德氪微"）在现场展示其面向 LED 显示系统内部互连的毫米波无线连接芯片与解决方案，呈现 该技术在 LED 显示产品工程化与规模化应用中的最新进展。 在与诺瓦星云联合参展的展位（3C100），德氪微通过一套电动演示装置，演示毫米波无线连接技术在 LED 显示系统中的自动连接逻辑。模块在靠 近并进入工作位置后，即可完成无线连接，无需物理插拔，直观体现毫米波无线连接"靠近即可工作"的技术特性。该方案通过无线方式替代传统线 缆与连接器，减少人工插接依赖，降低装配误差与潜在失效风险，为 LED 显示产品的结构设计、装配一致性与长期可靠性提供支撑。 目前，德氪微毫米波无线连接芯片已大批量量产出货。德氪微表示，未来将持续推进毫米波无线连接技术在商用 LED 显示场景中的产品化与系统 级优化，为LED一体机、海报屏、双面屏、机械旋转屏及更多创新显示形态提供成熟可靠的内部连接方案。 如需了解更多信息，或获取样 ...

Core Viewpoint - Samsung Electronics and SK Hynix have announced the mass production of the sixth generation High Bandwidth Memory (HBM4), but they have postponed the introduction of hybrid bonding machines, which were initially expected to be partially used in HBM4 production [1][2] Group 1: Production and Technology - Samsung and SK Hynix plan to use existing TC bonding machines from companies like Semes and Hanmi Semiconductor for HBM4 mass production, even for the initially expected 16-layer HBM4 products [1] - The companies will continue to use the micro bump DRAM stacking method by adjusting the stacking height of HBM4, which involves reducing the bump pitch [1][2] - Hybrid bonding technology, considered a disruptive technology for the next generation of HBM, is still under research and testing, with large-scale production expected to take time [1][2] Group 2: Performance and Market Dynamics - The number of channels in HBM4 has doubled compared to the previous generation, and the interface width has increased, leading to enhanced signal transmission speeds per pin [2] - The design goal for HBM4 is to reduce the micro bump pitch to approximately 10 micrometers (µm), which is still expected to meet performance targets [2] - Current TC bonding machines can meet the standards set by the International Semiconductor Standards Organization (JEDEC), while hybrid bonding machines and no-flux bonding machines are more expensive and have lower yields [2] Group 3: Future Outlook - Samsung has sent samples of HBM4 using hybrid bonding technology to customers and expects gradual commercialization of HBM4E, the next generation [2] - Despite the potential of hybrid bonding technology for high-end product lines, TC bonding machines will continue to play a core role in mainstream HBM4E products due to stability and cost-effectiveness [2]