Core Insights - The 2026 IEEE Fellow selection list has been announced, recognizing 347 scholars for their outstanding contributions in engineering and technology fields, with over 70 from mainland China and Hong Kong, marking a new high for Chinese representation [1] Group 1: IEEE Fellow Recognition - IEEE Fellow is the highest membership honor awarded by the IEEE, recognizing significant breakthroughs in research, technology leadership, or exceptional engineering contributions [1] - The selection process is rigorous, with an acceptance rate of less than 0.1% of the total membership [1] Group 2: Areas of Contribution - The newly elected fellows' research spans critical fields such as artificial intelligence, integrated circuits, wireless communication, quantum computing, biomedical engineering, renewable energy, and cybersecurity [1] - Their work has not only achieved theoretical breakthroughs but also has had a profound practical impact on industry upgrades and solving major engineering challenges [1] Group 3: Key Technologies - Several elected fellows played core roles in tackling "bottleneck" technologies, including high-performance computing architectures, next-generation mobile communication standards, high-end chip design, and intelligent sensing systems [1]

如果您希望可以时常见面，欢迎标星收藏哦~ 三星电子已完成第六代高带宽存储器（HBM4）的研发，并已内部完成生产准备批准（PRA） 阶段，这是量产前的最后一步。 据半导体行业消息人士12月3日透露，三星电子半导体事业部（DS）近期完成了HBM4芯片的 PRA阶段，这是其内部质量验证的最终阶段。PRA是一项内部指标，用于证明产品的良率和性 能已达到量产标准。三星电子通过将10纳米第六代（1c）DRAM芯片与采用其4纳米逻辑工艺制 造的基础芯片相结合，克服了发热和速度方面的技术挑战。此次PRA的通过表明，三星电子已 进入一个阶段，其制造竞争力不再仅仅局限于研发完成，而是能够直接转化为盈利能力。 三星的业绩预计将大幅增长。金融投资行业预测，该公司2026年的年度营业利润将接近或超过 100万亿韩元，创历史新高。具体来看，今年的年度营业利润预计在40万亿至42万亿韩元之间。 证券公司预计，三星明年的营业利润至少为84万亿韩元，最高可达105万亿韩元，比今年增长2 至2.5倍。尤其值得一提的是，据分析，仅DS部门明年的营业利润就将达到77万亿至93万亿韩 元左右。 营业利润大幅增长的背景在于HBM市场格局的转变。从明年下 ...

通过此次合作，安森美半导体（Onsemi）和Innoscience将致力于克服这些障碍，以期快速在全 球范围内大规模部署针对主流市场的优化氮化镓解决方案。工业应用：机器人电机驱动器、太阳 能微型逆变器和优化器汽车：直流-直流转换器、同步整流电信基础设施直流-直流转换器和负载 点转换器消费及大众市场：电源、适配器、DC-DC转换器、电机驱动器、音频设备、轻型电动汽 车、电动工具、机器人人工智能数据中心中间母线转换器、直流-直流转换器、电池备用单元。 对于安森美半导体的客户而言，与Innoscience的合作将带来以下好处：加快产品上市速度：凭借 安森美半导体的系统专业知识和英诺思公司成熟的氮化镓技术和制造工艺，实现快速原型制作、 加速设计导入，并迅速进入主流市场。 如果您希望可以时常见面，欢迎标星收藏哦~ 安森美半导体（onsemi）和Innoscience今日宣布签署谅解备忘录（MoU），旨在评估加速氮化 镓（GaN）功率器件部署的机遇，首先从40-200V功率器件入手，并显著扩大客户群体。该备忘 录概述的合作将安森美半导体在集成系统和封装领域的领先优势与Innoscience成熟的GaN技术和 大规模量产能 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 根据外媒TECHPOWERUP 的报导，近日，日本富士通(Fujitsu) 在Technology Update 2025 的 活动上，介绍了未来MONAKA 系列处理器的未来发展。其中，除了开发更多核心的Arm 伺服器 处理器外，还计划直接内置AI 核心功能。 报导指出，富士通的MONAKA 处理器拥有采用Armv9-A 架构的核心，支援SVE2 指令集，提供 了可变长度的向量寄存器。其采用了小芯片设计，运用了CoWoS 系统级封装（SiP）和博通推出 的业界首个3.5D F2F 封装技术，具有4 个运算模组，每个拥有36 个增强型Armv9 核心，共计 144 个核心。双插槽就面的配置下，可扩展到每个节点288 个核心，平台也支援12 通道DDR5 记 忆体。 另外，MONAKA 采用了2 纳米制程技术，并使用混合铜键合（HCB）以Face 2 Face（F2F）方 式堆叠在采用5 纳米制程技术的SRAM 模组上。富士通会将计算模组、SRAM 模组还有I/O 模组 结合在一起，其中I/O 模组还整合了记忆体控制器，并支援CXL 3.0 和PCIe 6.0 标准的连 ...

三星电子的晶圆代工业务（半导体代工制造）曾是其软肋，如今正借助汽车半导体市场强劲的增 长势头实现复苏。继获得特斯拉AI6和现代汽车MCU（微控制器单元）的订单后，该公司目前正 向现代汽车供应eMRAM。此举助力三星晶圆代工业务巩固了其在汽车晶圆代工领域的地位。 据 半 导 体 行 业 3 日 消 息 ， 三 星 晶 圆 代 工 将 向 现 代 汽 车 供 应 采 用 14nm （ 纳 米 ， 十 亿 分 之 一 米 ） FinFET工艺量产的eMRAM（嵌入式磁性随机存取存储器）。 eMRAM 是一种利用直接嵌入半导体内部的磁性来存储数据的存储半导体。与 NAND 闪存类 似，它是一种非易失性存储器，即使断电也能保留数据。它的速度大约是 NAND 的 1000 倍。 然而，其低功耗特性正在推动汽车行业对其需求的增长。 尽管 eMRAM 是一种存储芯片，但它是由代工厂批量生产的。典型的存储半导体是单独出售给客 户的产品，而 eMRAM 是一种集成到逻辑芯片中的工艺技术。它本质上是成品芯片中的一个模 块。 如果您希望可以时常见面，欢迎标星收藏哦~ 三星电子此前宣布，已于 2024 年 5 月完成 14nm eMR ...

如果您希望可以时常见面，欢迎标星收藏哦~ 三菱电机在 5 月份透露，将重新评估其此前在截至 2026 年 3 月的五年内投资 2600 亿日元提高 功率器件产能的计划，并将其中一部分投资转移到光器件领域。 该公司声称其在数据中心光器件领域拥有约50%的全球市场份额。光器件业务较高的利润率将有 助于抵消其半导体和器件业务整体下滑的影响。 总部位于东京的富士奇美拉研究所估计，随着越来越多的数据中心不断建成，到 2030 年，包括 光学设备在内的设备市场规模将增长至 10.73 万亿日元，约为 2024 年的 3.5 倍。 鉴于这些预测，三菱电机的竞争对手也准备提高光学器件的产能。 住友电工株式会社计划在 2026 财年将光器件产能较 2024 财年翻一番，以满足快速增长的需 求。 随着人工智能驱动的需求持续增长，三菱电机计划将用于数据中心和通信基站的光半导体器件产 能提高三倍，加大投资力度。 由于电动汽车市场增长乏力，这家日本电子制造商将把部分计划投资从电动汽车用功率器件领域 转移出去，转而将 2028 财年的光学器件产能提高到 2024 财年的三倍。 该公司将提高光器件的产量，这些器件可以将光信号转换为电信号， ...

Group 1: Black Sesame Intelligence Acquisition - Black Sesame Intelligence announced plans to acquire Zhuhai Yizhi Electronic Technology Co., Ltd. through equity purchase and capital injection, with an expected total cost of approximately RMB 400 million to 550 million [1] - Upon completion of the acquisition, Black Sesame is expected to obtain a majority stake in Yizhi, which will be considered a non-wholly-owned subsidiary, and its financial performance will be consolidated into the group [1] - Yizhi is a system solution provider focused on AI machine vision algorithms and SoC chip design, specializing in the development of edge/terminal general-purpose AI SoC chips, with product lines covering smart automotive, smart hardware, and smart security applications [1] Group 2: Marvell Acquisition of Celestial AI - Marvell announced the acquisition of Celestial AI for at least $3.25 billion in cash and stock, with the potential to increase to $5.5 billion if Celestial meets revenue milestones [4][7] - Following the acquisition, Marvell aims to enhance its semiconductor networking business by integrating Celestial's technology, which is crucial for connecting high-performance computing systems [5][6] - Marvell's stock rose 13% after reporting third-quarter earnings that exceeded expectations, with projected data center revenue growth of 25% next year [5] Group 3: SiTime Negotiations with Renesas - SiTime is in discussions to acquire the timing division of Renesas Electronics, with a potential valuation of up to $2 billion, including debt [8] - The timing division produces clocks used for synchronizing signals in wireless infrastructure, networks, and data centers [8] - SiTime's stock has increased by 34% this year, with a market capitalization of approximately $7.8 billion, while Renesas's stock has decreased by 11%, with a market cap of about ¥3.4 trillion ($2.19 billion) [9]

Group 1 - The core issue involves a former employee of Tokyo Electron's Taiwan subsidiary being prosecuted for leaking critical 2nm technology information, which has raised concerns about corporate governance and information security [1][2] - Taiwan's prosecutors have determined that Tokyo Electron's Taiwan subsidiary had a legal obligation to supervise the former employee, but the company lacked specific preventive management measures, leading to its potential criminal liability [2] - Tokyo Electron has stated that there was no evidence of organizational involvement in the information leak and that the incident has not impacted the company's operations [2] Group 2 - The company emphasizes the importance of information security, particularly in protecting sensitive information of customers and stakeholders, and has established a robust information security system monitored by internal and external experts 24/7 [3] - To prevent similar incidents in the future, Tokyo Electron plans to strengthen its compliance system and auditing mechanisms across its Taiwan subsidiary and the entire group [3] - The company is committed to enhancing corporate value and meeting the expectations of all stakeholders [3]

然而，随着芯片服务提供商加速自主研发ASIC芯片以满足更复杂的功能需求，其对封装尺寸的 要求也大幅增长。因此，一些芯片服务提供商正在考虑从台积电的CoWoS芯片转向英特尔的 EMIB芯片。 TrendForce指出，CoWoS技术通过中介层将计算逻辑、内存和I/O芯片连接起来，并将这些芯片 安 装 在 基 板 上 。 该 技 术 已 扩 展 到 包 括 CoWoS-S 、 CoWoS-R 和 CoWoS-L 。 随 着 NVIDIA 的 Blackwell平台在2025年接近量产，市场需求正迅速转向CoWoS-L，因为它将硅中介层集成到了 封装中。预计随着NVIDIA即将推出的Rubin架构的推出，这一趋势还将继续，Rubin架构将采用 更大的光罩尺寸。 人工智能/高性能计算需求的增长导致了CoWoS技术的重大瓶颈，包括产能短缺、光罩尺寸限制 和制造成本上升。TrendForce观察到，大部分CoWoS产能已被NVIDIA GPU占用，其他客户的 选择十分有限。 此外，对更大封装尺寸的需求不断增长以及美国本地化要求，促使谷歌和 Meta 等北美主要 CSP 与英特尔合作，共同采用 EMIB。 英特尔的EMIB ...

Core Insights - Germany has initiated a significant semiconductor funding program since the EU Chip Act came into effect, primarily aimed at supporting Intel's long-delayed €30 billion (approximately $34.8 billion) wafer fab project in Magdeburg [1] - The funding is being diversified across various technology projects, including mature node capacity in Dresden and quantum sensor-based measurement devices in Munich [1] - The urgency for this funding stems from the EU Chip Act's project tender announcement expected by the end of 2024, marking a shift from direct negotiations to a structured bidding process [1][2] Funding Allocation and Concerns - The funding plan includes €2 billion (approximately $2.3 billion) to ensure Intel's subsidies are not diverted to non-semiconductor projects, as the German budget faces pressure with €3 billion (approximately $3.4 billion) reallocated to general infrastructure [2] - There is a concern that remaining microelectronics funds, estimated at €7 billion to €8 billion (approximately $8.1 billion to $9.2 billion), may be diluted if not quickly deployed for reliable industrial projects [2] Project Timeline and Demand - The project solicitation is set to begin in mid-November 2024 and conclude in early January 2025, with industry demand significantly exceeding supply, as companies have requested approximately €6 billion (approximately $6.9 billion) in funding, three times the available amount [3] - A legal document allowing companies to "self-assume risk" and start work before final funding approval has been issued, although no projects have yet received binding funding grants [3][4] Approval Process and Political Support - Projects must first receive approval from the EU Commission's competition authority before public funds can be disbursed, with German ministries expressing support but awaiting final approval from Brussels [5] - A high-profile event by GlobalFoundries marked the formal launch of its factory expansion project under the EU Chip Act, attended by top German officials, emphasizing the political backing for semiconductor industry ambitions [5][6] Regional Dynamics and Competitive Landscape - The new funding structure has created competitive dynamics among German states, with Bavaria benefiting from a more favorable funding model compared to Saxony, which faces greater pressure due to its larger semiconductor cluster [7] - As multiple projects receive early approval, Germany aims to reshape its semiconductor landscape beyond a few large fabs, focusing on mature process nodes, memory projects, and core materials and chemicals [8] Future Outlook - Despite Intel's initial plans being canceled, Germany remains committed to developing its microelectronics industry, accelerating various innovative projects to prevent strategic funds from being diverted to other sectors [9]