另外，富士总研指出，近年来，因AI普及带动数据中心处理的资讯量爆炸性增加，提振光收发器 市场急速扩大，特别是400G、800G产品需求扬升，预估2025年全球光收发器市场规模将扩大至 3.7兆日圆，之后将逐年呈现增长，2030年市场规模预估将扩增至10.7兆日圆、将较2024年飙增 2.6倍(飙增约260%)。 富士总研指出，目前800G光收发器产品主要获得北美大型云端服务商、英伟达采用，今后、随着 网路高速化，期待将扩大被采用。受2024年、2025年需求急增影响，预估2027年左右800G产品 需求将暂时放缓，不过因大型IT业者正式大规模采用、加上更换需求，预估2028年以后将持续维 持20%以上的年成长率。 据了解，XDFOI 是长电科技独有的一种面向 Chiplet（芯粒/ 小芯片）架构的极高密度多扇出型 封装异构集成解决方案，涵盖 2D、2.5D、3D 集成技术。 此次成功出样的硅光引擎通过在封装体内实现光电器件与逻辑芯片的高密度集成，在封装层面有 效优化了能效与带宽表现，为降低系统互连损耗和提升整体可扩展性提供了支持。 CPO需求，狂飙160倍 随着数据中心、AI投资增加，带动光通讯相关机器/元件 ...

Core Viewpoint - The article highlights the upcoming "Collaborative Innovation Forum from Devices to Networks" scheduled for March 18, 2026, at the Shanghai New International Expo Center, focusing on the semiconductor and communication industries, aiming to foster collaboration across the entire semiconductor value chain [2][10]. Group 1: Event Overview - The forum is a key event of the Munich Shanghai Optical Fair, co-hosted by Semiconductor Industry Observation and the fair itself, with a mission centered on "collaborative breakthroughs across the semiconductor value chain" [2]. - The forum will feature 200 core industry professionals from various sectors, including operators, equipment manufacturers, and semiconductor companies, ensuring targeted and professional technical exchanges [3][4]. Group 2: Longsight's Role - Shenzhen Longsight Technology Co., Ltd. will present its advanced electronic measurement solutions at the forum, showcasing its core technologies and full-scenario solutions [2][5]. - Longsight aims to address the "bottleneck" issues in high-end electronic measurement instruments, providing a comprehensive product system across electronic, wireless, and digital fields [6]. Group 3: Product Innovations - Longsight's ExWave TS series high-performance real-time oscilloscopes can capture high-speed signals up to 90GHz, breaking decades of Western technological monopoly and representing the most advanced level in China [6][7]. - The company’s high-frequency signal sources and spectrum analyzers are designed for cutting-edge fields like 6G and satellite communication, achieving international leading standards with capabilities up to 110G frequency and 5-8G bandwidth [8]. Group 4: Forum's Collaborative Value - The forum aims to break down barriers between the semiconductor and communication industries, addressing the challenges of localized production processes by promoting "full value chain collaboration" [10]. - Longsight will share insights on optical communication and high-speed optical testing, focusing on oscilloscope applications and future testing solutions, which are crucial for chip design and optical device manufacturers [10][12]. Group 5: Key Takeaways from Longsight's Presentation - The presentation will emphasize the strength of domestic high-end measurement capabilities, showcasing practical paths for replacing high-end measurement instruments [12]. - It will also share best practices in integrated applications, providing valuable references for industry players facing technological upgrades [12]. - Lastly, it aims to build bridges for collaboration, connecting measurement instrument manufacturers with chip design and optical device sectors to enhance industry responsiveness and competitiveness [12].

Group 1 - The article highlights that a company is set to launch its first 4M bit low-power SPI NOR Flash chip, filling a gap in its product line within the Flash sector. This product features low cost, low power consumption, high-speed read/write capabilities, and non-volatile memory, catering to small storage needs. This marks a significant step for the company, which primarily focuses on microcontrollers (MCUs), into the high-demand storage chip market [1][2] - The company, Zhongwei Semiconductor, is a platform-based chip design enterprise specializing in mixed-signal chip design centered around MCUs, providing "MCU + supporting chip" solutions widely used in smart home appliances, consumer electronics, and industrial control. It holds a leading market share in the domestic smart home appliance MCU chip sector and is one of the major MCU suppliers in China [1][2] - The current surge in the storage chip market is attributed to a profound adjustment in global supply and demand dynamics, driven by the rapid growth of artificial intelligence infrastructure, leading to unprecedented demand for high-end memory. Major international companies like Micron Technology have warned of ongoing shortages [1][2] Group 2 - TrendForce forecasts a significant quarter-on-quarter increase in contract prices for DRAM and NAND Flash in Q1 2026. This context has led downstream customers to increasingly seek supply chain diversification and stability, presenting a rare market entry opportunity for domestic chip companies [2] - Zhongwei Semiconductor's extension from its core MCU field into storage chips reflects the domestic semiconductor industry's efforts to seize industry upturn opportunities and enhance supply chain autonomy and competitiveness. If this strategic attempt succeeds, it could strengthen the company's influence in critical chip sectors during the domestic substitution process [2] - However, the storage industry is characterized by strong cyclical fluctuations, indicating that the current AI-driven high demand may face turning points due to supply and demand changes. For new entrants like Zhongwei Semiconductor, the ability to manage technology, market dynamics, and cyclical challenges will be crucial for success in this competitive landscape [2]

Core Viewpoint - The article discusses the strategic moves of U.S. semiconductor companies, particularly Micron and Intel, in response to the U.S. government's tariffs on semiconductor imports from South Korea and Taiwan, highlighting their efforts to expand capacity and gain a competitive edge in the semiconductor market [2][3]. Group 1: Micron Technology - Micron Technology, the third-largest memory semiconductor company globally, plans to acquire Taiwan's PSMC's P5 factory for $1.8 billion (approximately 2.66 trillion KRW), which includes a 300mm wafer cleanroom [2]. - The P5 factory currently operates at 20% capacity, producing 50,000 wafers per month, but plans to expand DRAM production starting in 2027 [2][3]. - This acquisition aims to address the growing global demand for storage and is expected to create synergies with Micron's existing facilities in Taiwan [2]. Group 2: Intel Corporation - Intel is accelerating its semiconductor business revival with a $28 billion (approximately 41 trillion KRW) investment in a wafer fabrication plant in Ohio, which is one of the largest semiconductor projects in the U.S. [3]. - The Ohio project, supported by $8.9 billion in government funding under the CHIPS Act, aims to produce advanced 1.4nm products and is expected to begin operations between 2030 and 2031 [3]. - Intel has recently hired GPU expert Eric Demers to enhance its artificial intelligence accelerator strategy, which is seen as a significant move to improve its competitive position in the AI market [3].

Core Viewpoint - TSMC plans to expand its advanced packaging (AP) factories to address capacity shortages and maintain its competitive edge in the semiconductor industry, particularly in advanced packaging technologies like CoWoS [1][4][6] Group 1: TSMC's Expansion Plans - TSMC is set to announce the construction of four advanced packaging factories in Tainan, including locations in Chiayi Science Park and Southern Science Park [1] - The company aims to start mass production at its AP factory 1 in the Ziyi Technology Park in the first half of this year [1] - TSMC's expansion is also a response to concerns about its potential transformation into "American TSMC" due to recent factory expansions in the U.S. [1] Group 2: Advanced Packaging Technology - The global tech industry is in a fierce competition for advanced packaging technology, particularly TSMC's CoWoS, which is crucial for connecting high-performance chips with ultra-fast memory [4][5] - The complexity of modern AI hardware and the need for advanced packaging techniques like CoWoS-L are creating significant bottlenecks in the supply chain [5][6] - TSMC's shift to hybrid bonding technology enhances performance and reduces heat but requires stringent cleanroom conditions, elevating the risk associated with packaging processes [6] Group 3: Market Dynamics and Competition - NVIDIA has secured nearly 60% of TSMC's CoWoS capacity for 2026, forcing competitors like AMD and Broadcom to vie for the remaining capacity [7] - The advanced packaging secondary market is rapidly maturing, with companies like Intel and Samsung offering alternatives to TSMC's services [8] - The dependency on TSMC for advanced packaging remains a vulnerability for the industry, as geopolitical stability in Taiwan is critical for global AI economic growth [8] Group 4: Financial Performance and Projections - TSMC reported a record revenue of $122.42 billion in 2025, a 35.9% year-over-year increase, with a net profit of $55.18 billion [14][20] - The company anticipates significant capital expenditures to meet future chip etching and packaging demands, with estimates suggesting $250 billion over the next few years [22] - AI-related revenue is projected to grow substantially, with estimates indicating that AI accelerator sales could account for approximately 27.3% of total revenue by 2025 [27][28]

Group 1 - The core viewpoint of the article highlights the rise of NPU-based companies in the semiconductor industry, particularly in the AI sector, as they secure significant deals with industry leader NVIDIA, indicating a shift in market dynamics [1] - The global AI fabless market is evolving through technological competition and mergers, with key players including Groq, SambaNova Systems, Cerebras, Tenstorrent, and Korean companies Rebellions and FuriosaAI [1] - NVIDIA's acquisition of Groq's core technology rights for $20 billion (approximately 29 trillion KRW) is noted as the largest deal in NVIDIA's history, significantly boosting Groq's valuation to around $7 billion, nearly tripling its worth [1] Group 2 - Cerebras has signed a $10 billion (approximately 14 trillion KRW) computing power supply contract with OpenAI and is in talks to raise $1 billion in new investments [2] - The NPU industry is expanding its business scope from chip supply to server and data center infrastructure, with a focus on the Middle East's demand for "autonomous AI" to reduce reliance on US and Chinese technology [2] - Rebellions is targeting the Saudi data center market with its REBEL-Quad product, which is said to perform comparably to NVIDIA's flagship GPU [2] Group 3 - Rebellions' CEO expressed concerns about the competitive landscape, noting that countries like the US and China are building AI infrastructure using non-NVIDIA products for supply chain diversification [3] - The CEO highlighted that Saudi Arabia purchased Groq chips worth 750 billion KRW last year, while the UAE bought Cerebras chips worth 1.5 trillion KRW, contrasting with Rebellions' government revenue of only 7 billion KRW [3] - Rebellions plans to begin mass production of REBEL-Quad in the first half of the year, while FuriosaAI aims to supply up to 20,000 RNGD units by the end of the year [3]

Core Insights - Jensen Huang, CEO of Nvidia, expressed that the company’s true strength lies not in technology but in its unique culture and resilience developed through adversity [1][2] - Huang described himself as a "reluctant CEO," emphasizing the vulnerability that comes with leadership and the importance of collaboration within the company [1][2] - Nvidia operates without a definitive ultimate goal, focusing instead on continuous operation and adaptation to future technological changes [3][4] Group 1: Company Culture and Leadership - Huang highlighted that Nvidia's culture encourages facing challenges and learning from mistakes, creating a safe environment where employees are not penalized for errors [2] - The company has a flat organizational structure, with Huang referring to his direct reports as "CEOs" in their own right, indicating a collaborative leadership approach [2] Group 2: Future of AI and Employment - Huang predicted that AI investments will transform computing, leading to a shift from human-programmed systems to self-learning systems guided by humans [3][4] - Contrary to fears of job losses, Huang believes that job roles will evolve rather than disappear, with new opportunities arising from AI advancements [4]

Core Viewpoint - Samsung Electronics' memory division is narrowing the profit gap with SK Hynix, primarily due to a rapid increase in DRAM prices since the second half of last year, benefiting Samsung significantly due to its higher market share in shipments [1][2]. Group 1: Financial Performance - Samsung Electronics reported preliminary sales of 93 trillion KRW and an operating profit of 20 trillion KRW for the last quarter, with the memory semiconductor division's operating profit expected to be in the high range of 17 trillion KRW [1]. - The operating profit for Samsung's memory division nearly doubled from the previous quarter's approximately 8 trillion KRW, driven by severe supply shortages causing prices of DRAM and NAND products to surge [1]. - SK Hynix initially projected an operating profit between 16 trillion to 17 trillion KRW, but due to a stronger-than-expected memory supercycle, the profit could reach at least 18 trillion KRW [1][2]. Group 2: Market Trends - The average selling price (ASP) of DRAM and NAND is expected to rise by approximately 30% [1]. - TrendForce predicts that the average selling price of general DRAM will increase by 55% to 60% quarter-on-quarter in the first quarter of this year [2]. - The memory supercycle in the fourth quarter of last year has led both companies to confirm their best quarterly performances ever, with Samsung's high production of general memory contributing to its rapidly improving profitability [2]. Group 3: Future Outlook - Samsung Electronics is expected to surpass SK Hynix in operating profit for the first quarter of this year due to the anticipated significant rise in general DRAM prices [2]. - Both companies are set to release their fourth-quarter financial reports on the same day, marking a significant event in the semiconductor industry [2].

Core Viewpoint - Thailand has approved a joint venture led by Taiwan's ZDT, the world's largest printed circuit board (PCB) manufacturer, with an investment of $2.07 billion (approximately 14 billion RMB) aimed at establishing Thailand as a regional production center for advanced PCBs [1][2]. Group 1: Investment Details - The joint venture will invest in four new PCB projects, which are expected to enhance Thailand's high-tech electronics supply chain [1]. - The first project of the joint venture was approved in 2023 and began production in September of the previous year, creating 5,600 local jobs [1]. - ZDT will produce advanced PCBs, including multilayer, flexible, and high-density interconnect PCBs [1]. Group 2: Strategic Implications - This investment aligns with Thailand's new industrial roadmap aimed at developing the semiconductor-related business and attracting over 2.5 trillion Thai Baht in foreign direct investment by 2050 [2]. - Since the push for digital economic development began in 2023, Thailand has approved 214 new projects in the electronics sector, with a total value of 300 billion Thai Baht [2].

Core Viewpoint - Samsung Electronics' foundry business is gradually recovering its operating rate, with expected losses decreasing compared to last year due to increased wafer input in advanced and core processes [1][2]. Group 1: Production Capacity and Utilization - The average capacity utilization rate of Samsung's wafer factories is expected to be around 60% in the first half of this year, an increase of approximately 10 percentage points from 50% in the second half of last year [1]. - The foundry department's operating losses were estimated at about 20 trillion KRW in the first and second quarters of last year, but losses narrowed to around 10 trillion KRW in the third and fourth quarters due to increased wafer input in existing core processes [1]. Group 2: Advanced Technology and Market Opportunities - Samsung has started mass production of the latest mobile application processor "Exynos 2600" based on 2nm technology, with a single wafer yield expected to be around 50% [1]. - The semiconductor industry insider noted that Samsung is increasing wafer input for its foundry, indicating a better market environment this year compared to last year, especially as TSMC faces supply shortages in advanced processes [2]. - Samsung's foundry department needs over 80% capacity utilization to break even, highlighting the importance of stable mass production of advanced processes to gain the trust of global tech giants [2].