AMD PC部门高管Rahul Tikoo告诉CRN，这家芯片设计公司正在"与客户洽谈"一款专用加速器芯 片的"用例"和"潜在机会"。这款芯片并非GPU，但可能是一款神经处理单元。 "我们很快就能实现 这个目标，"他说道。 AMD 的一位高级 PC 高管表示，该芯片设计师正在探索独立神经处理单元的潜力，该单元可以作 为 PC 中独立 GPU 的替代品。 AMD 客户端 CPU 业务负责人 Rahul Tikoo 在上个月 AMD Advancing AI 活动前举行的一次简 报会上回答 CRN 提问时证实，这家总部位于加州圣克拉拉的公司正在"与客户讨论"专用加速器芯 片的"用例"和"潜在机会"，该芯片不是 GPU，但可能是神经处理单元 (NPU)。 Tikoo 发表上述言论之际，联想、戴尔科技和惠普等 OEM 厂商正开始探索使用独立 NPU 和其他 类型的专用加速器芯片，作为 PC 中 AI 工作负载 GPU 的替代品。例如，戴尔上个月宣布，将在 新款 Dell Pro Max Plus 笔记本电脑中使用基于 NPU 的 Qualcomm AI 100 PC 推理卡。 "这是一组非常新的用例，因此我们正在密切 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源 ：内容来自 中央社 。 全球晶圆代工龙头台积电赴美国亚利桑那州设厂，一名曾在该厂任职4年的工程师近日于Reddit论 坛上详叙被压榨的过程，而且他在台湾受训完再到美国上班，中间经历许多混乱及不安，甚至发生 种种歧视，文章引发许多网友关注。 台湾人不帮美国同事 原po指出，2021年加入台积电后便在那年夏天前往台南受训，期间包括住宿安排、工作用的设 备、最基本的进出门禁都一团乱，甚至缺乏可以用英文沟通的窗口。许多台湾员工对于这批即将派 到美国工作的同事也不太愿意协助，理由是「美国人赚太多了，薪水很高，不值得我们帮忙」。 他透露在台湾这段日子深刻感受到文化差异和排外氛围，所以后来有20%的人选择离职。几年后回 到了亚利桑那，新厂施工进度严重落后、现场规画松散、要求未经完整训练的员工做设施维护、主 管偏好用台湾人等，如果拒绝服从还会导致年终考绩被扣分，这时大约有70%的人已离开公司。 点这里加关注，锁定更多原创内容 严重的性别与种族歧视 此外，他在面试新人时也被指示要优先考虑台湾人，其次为持有签证的人，因为较好控制。至于印 度裔人士不要录取，还给他们取难听的绰号，他面 ...

若美国对ASML生产半导体设备——包括深紫外光微影(DUV)设备、极紫外光微影(EUV)设备、量 测设备、检测设备等——课征15%关税，恐严重打击赴美设厂的芯片制造商，尤其是对英特尔 (Intel)、格罗方德(GlobalFoundries)、三星电子(Samsung)、德州仪器(Texas Instruments)及台积 电而言。 举例来说，ASML用于10纳米以下制程的先进浸润式DUV ArF (氟化氩)设备每台平均要价8,961.5 万美元，而低数值孔径(Low-NA) EUV设备的定价则约为2.65亿美元、端看配置而定。若加上15% 关税，这些机台的成本将分别激增至1.03亿美元、3.05亿美元。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源 ：内容来自moneyDJ 。 国总统川普(Donald Trump)与欧盟执委会主席冯德莱恩(Ursula von der Leyen)周日(7月27日)宣 布 敲 定 贸 易 框 架 、 欧 盟 输 美 产 品 关 税 订 为 15% 。 外 媒 爬 梳 声 明 内 文 发 现 ， 艾 司 摩 尔 (ASML Holding NV)等厂商生产的半导体设备，将 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源 ：内容 编译自 pcwatch 。 台积电日前宣布，正在开发第二代超大规模封装技术"晶圆系统（SoW）"，该技术将系统集成到 直径约300毫米的巨型硅晶圆或相同尺寸的圆盘状载体上，并公布了该技术的概要。 SoW 将微型芯片（chiplet）、堆叠的芯片模块、内存模块、电源模块、输入/输出板以及散热板安 装在一个直径约 300 毫米的巨型圆盘状载体的两侧。微型芯片和内存模块通过重分布层 (RDL) 以 高密度和短距离互连，从而实现超宽带信号传输。 直径约300mm的圆盘形状和尺寸，是半导体制造设备中常用的形状和尺寸，易于应用半导体制造 要素技术。此外，基于现有制造设备进行定制也较为容易，这也是其优势之一。 台积电于2019年开发并开始量产第一代SoW"InFO_SoW"。该公司将这款第一代产品定位为一种 封装技术，将其"InFO_（集成扇出型，本质上与FO-WLP相同）"技术的RDL尺寸扩展至直径约 300毫米的圆盘。第一代InFO_SoW的技术概述和应用实例已在上一篇专栏文章中介绍。 第一代是逻辑，第二代是逻辑和内存集成 正如上一篇专栏文章结尾处提到，台积电将第 ...

Core Viewpoint - Samsung Electronics reported a significant decline in its semiconductor division's operating profit, down 94% year-on-year, primarily due to high inventory-related costs despite stable sales [1][5]. Financial Performance - For Q2, Samsung's operating profit was 4.67 trillion KRW (approximately 3.4 billion USD), a 55.23% decrease compared to the same period last year [1][5]. - Net profit fell by 48.01% to 5.11 trillion KRW, while total revenue slightly increased by 0.67% to 74.56 trillion KRW [1][5]. - The semiconductor business revenue decreased by 2% year-on-year, reflecting ongoing inventory issues [1][5]. Business Segments - The semiconductor division faced challenges with low capacity utilization in its foundry business, leading to stagnant revenue of 6.7 trillion KRW [1][5]. - The mobile and network business saw a 40.9% increase in operating profit, reaching 3.1 trillion KRW, driven by strong sales of flagship models like Galaxy S25 and mid-range Galaxy A series [1][5]. Future Outlook - Samsung anticipates a slight improvement in profitability in the second half of the year, focusing on increasing server memory chip sales and awaiting certification for HBM3E high-bandwidth memory [2][6]. - The company aims to enhance the yield of its next-generation 2nm GAA process to attract large clients, including a recent eight-year contract with Tesla worth 23 trillion KRW [2][3][8]. Product Innovations - The smartphone market is expected to be boosted by the launch of new foldable models, Galaxy Z Fold 7 and Z Flip 7, along with innovative products like XR headphones and a three-segment "Trifold" smartphone [4][8]. - Samsung's AI strategy is advancing, with a shift towards a multi-modal architecture for smartphone interaction, enhancing features in the S25 series through collaboration with Google [9]. Market Conditions - Despite uncertainties in the second half of the year, Samsung expects a rebound in performance, driven by growth in AI and robotics sectors [6]. - The company is closely monitoring the impact of tariffs and geopolitical risks on its core businesses, particularly in semiconductors and consumer electronics [6]. Investment Strategy - Samsung has invested 120 million USD in approximately 40 companies in the first half of the year, focusing on AI, robotics, and digital health to discover new technologies [6]. - The company plans to expand its HBM and advanced DRAM sales, anticipating a significant price increase for DRAM starting in the second half of the year [6][7].

欢迎参加Tower Semiconductor 2025年全球技术研讨会(TGS 2025) 中国 上海 2025年9月16日 TGS希望为我们现有的和潜在的客户提供一个与Tower管理层和技术专家直接交流的机会，也为 所有参会者提供当面交流和学习的条件。我们诚邀您的加入! 会议议程 Registration 08:30-09:30 09:30-09:45 Opening Mrs. Rachel Xie China Country Manager 09:45-10:30 CEO Keynote Mr. Russell Ellwanger Tower Semiconductor CEO 10:30-11:15 Lunch Invited Talk by Eoptolink 11:15-12:00 Market Megatrends and Tower's Technology Solutions in RF Mobile, Infrastructure, Power, and Sensors Dr. Marco Racanelli President 12:00-13:30 13:30-14:15 Tower' ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源 ：内容来自 eenewseurope 。 Raspberry Pi 已推出其多核 RP2350 微控制器的第三个版本，以解决该芯片的许多性能和安全问 题，并为工业应用添加 5V 支持。 新 版 本 RP2350 A4 同 时 具 有 ARM 和 RISC-V 内 核 ， 由 首 席 执 行 官 Eben Upton 在 eeNews Europe Elektor 供应链问题现场圆桌会议上宣布。 RP2350 的首发版本 A2 存在 GPIO 焊盘设计错误，导致焊盘无法正常进入高阻状态，并且存在 RP2350 黑客挑战赛参与者发现的一系列安全问题。这些问题已通过 A4 版本中对金属层的最新改 进得到解决。 Upton 表示："我们对焊盘宏进行了细微调整，以消除焊盘高端的不良漏电；这种漏电会导致下方 A2 的电流-电压曲线出现较大的负向偏移。因此，不再需要外部电阻来拉低输入，尽管在现有设计 中可以安全地保留它们。" RP2350 黑客挑战赛中发现的 Boot ROM 安全漏洞已在 A4 启动 ROM 中得到修复，此外，还实 施了多种新的防御策略，以降低未来被攻击的可 ...

Core Viewpoint - Intel's latest financial report indicates a potential shift in strategy, with CEO Pat Gelsinger stating that if the next-generation 14A process does not attract "large customers," continued investment in this process may not be economically viable [1] Group 1: Intel's Strategy and Market Impact - Intel is currently pushing forward with the 14A process, but this is contingent on confirming customer commitments; without sufficient external orders and technical collaborations, it will be difficult to recoup investments [1] - Bernstein warns that if Intel abandons the 14A or more advanced processes, it could severely impact the overall wafer fabrication equipment (WFE) market, as Intel accounts for 20% of global logic chip equipment spending and 10-15% of overall semiconductor equipment [1] - The potential exit of Intel from advanced process development could lead to a significant market contraction [1] Group 2: Supply Chain Implications - The EUV equipment supply chain is particularly sensitive, with Japan's Lasertec having about 40% of its unfulfilled orders from Intel, and ASML relying on Intel for 15-20% of its EUV revenue; a halt in Intel's process upgrades could delay the adoption of High-NA EUV equipment [2] - TSMC is expected to be the biggest beneficiary of Intel's potential exit, as it has the capability to take over Intel's orders due to its advanced process technology and yield [2] - The supply chain may undergo restructuring, with HOYA potentially increasing its market share from 70% to 100% if Intel withdraws from the EUV mask substrate supply [2] Group 3: Financial Considerations - Transitioning to a fabless model could theoretically improve Intel's stock price, but if it only halts the 14A process while retaining the 18A process, it would still incur high capital expenditures and potentially lower margins due to outsourcing [2] - Bernstein cautions that this scenario could exacerbate market uncertainties, leading the firm to recommend reallocating funds to other investment opportunities rather than buying Intel stock [2]

Core Viewpoint - Samsung Electronics is revamping its Exynos application processor (AP) architecture to address long-standing performance and heat issues, with the upcoming Exynos 2600 expected to incorporate a new Heat Pass Block (HPB) component for improved thermal management [1][3]. Group 1: Exynos 2600 Development - The Exynos 2600 will utilize a 2nm process technology, which is more refined than the 3nm process used in its predecessor, the Exynos 2500 [1][3]. - The introduction of HPB aims to mitigate potential heat bottlenecks associated with the advanced 2nm process, enhancing overall performance [2][3]. Group 2: Market Implications - The success of the Exynos 2600 is critical for Samsung's System LSI division, as it is planned for use in the upcoming Galaxy S26 series, which is a flagship product with significantly higher supply volumes compared to other models [3]. - The previous Exynos 2500 was not adopted for the Galaxy S25 series, marking a setback for Samsung, making the upcoming Exynos 2600 a pivotal opportunity for recovery [3]. Group 3: Foundry Business Impact - Samsung Foundry recently signed a contract worth approximately 22.8 trillion KRW (around 120 billion RMB) with Tesla for 2nm advanced process semiconductor supply, laying a foundation for business recovery [4]. - The successful adoption of Exynos 2600 by Galaxy S26 will directly influence the Foundry division's order volume, creating a synergistic growth opportunity for both System LSI and Foundry businesses [5].

Core Viewpoint - The article discusses the transformative impact of RISC-V, an open instruction set architecture (ISA), on the semiconductor industry, highlighting its potential to reshape the competitive landscape traditionally dominated by a few tech giants [1][2]. Group 1: RISC-V Overview - RISC-V is characterized as an open, public, and royalty-free ISA that allows individuals and organizations to freely use, modify, and expand upon it, contrasting with other ISAs that have higher barriers to entry [5][6]. - The RISC-V International organization plays a crucial role in promoting technical collaboration among member companies and fostering ecosystem development through standardized frameworks and community support [6][18]. Group 2: Market Potential and Growth - According to SHD Group's report, the shipment of RISC-V-based SoC chips is expected to exceed 20 billion units by 2031, with market penetration projected to rise from 5.9% in 2024 to 25.7% [11]. - RISC-V's architecture is being applied across various sectors, including IoT, automotive electronics, and data centers, showcasing its versatility and efficiency [14][16]. Group 3: Technological Advancements - The introduction of the RVA23 specification has unified the core functionalities of 64-bit application processors, accelerating RISC-V's entry into the general computing domain and ensuring software compatibility across different vendors [9][10]. - RISC-V's capabilities in AI are highlighted, with NVIDIA integrating multiple RISC-V cores into its GPUs, and a projected shipment of RISC-V cores reaching 1 billion units in 2024 [14]. Group 4: Community and Innovation - The development of RISC-V is significantly driven by community engagement, with nearly 300 development boards distributed and multiple online training courses offered to foster innovation [18][19]. - The open accessibility of RISC-V specifications lowers the barriers for small and medium-sized enterprises, promoting a vibrant ecosystem of innovation [18]. Group 5: Future Outlook - RISC-V is expected to expand its influence beyond embedded devices into high-performance computing, enterprise AI processors, and even aerospace applications, marking a significant evolution from its academic origins [21][23]. - The upcoming RISC-V Automotive Conference 2025 will focus on the development trends and application prospects of RISC-V in the smart automotive sector [23].