如果您希望可以时常见面，欢迎标星收藏哦~ 面 对 半 导 体 产 业 从 消 费 性 电 子 驱 动 转 向 高 效 能 运 算 （ HPC ） 驱 动 的 结 构 性 变 革 ， 联 发 科 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代表半导体芯闻对该 观点赞同或支持，如果有任何异议，欢迎联系我们。 陈冠州强调，硅光子技术的实现并非仅靠单一芯片，而是涉及高度复杂的整合工程。联发科解释， 光通讯技术的重点在于如何将光积体电路（PIC）与电积体电路（EIC）进行完美的封装与整合， 这直接连结到先进封装技术的挑战。联发科指出，无论是2.5D 或3D 封装，当芯片堆叠时，电性 干扰与散热特性与传统消费性电子产品截然不同，挑战非常巨大。为了克服这些障碍，联发科已与 台积电建立紧密合作关系，利用台积电的COUPE （Compact Universal Photonic Engines） 平台 来实践先进封装的光学技术。 联发科强调，虽然业界存在不同的技术路线，且各自有优缺点，但公司抱持开放态度，会根据客户 产品的特性（适合A 技术或B 技术）来协助客户完成设计，并不局限于单一方案。尽 ...

Core Insights - The industry is shifting its focus from "mobility" to "stable delivery" in the context of embodied intelligence and humanoid robots, emphasizing the importance of engineering details that ensure reliability, such as internal joint connections [1] Group 1: Industry Trends - The consensus in the industry is that the real differentiators for robots in practical applications are not just algorithms and structural design, but also the often-overlooked engineering details that affect reliability [1] - Key engineering challenges in humanoid robots include managing multiple "rotational interconnection nodes" in constrained spaces, which require reliable communication and power transmission through rotating interfaces [1] Group 2: Product Development - 德氪微 recently launched a millimeter-wave wireless EtherCAT module (SDKT1020-P020-FETN) designed for the rotational joints in embodied intelligence applications, aiming to enhance reliability and interconnectivity [3] - This module utilizes proprietary millimeter-wave wireless connection chips and full-duplex circularly polarized antennas to achieve non-contact data transmission at rotating interfaces, integrating both data and power transmission [3][4] - The module supports various communication protocols (Ethernet/EtherCAT/CAN) and can achieve data rates up to 3Gbps, catering to high-bandwidth requirements [4] Group 3: Reliability and Performance - The module targets a bit error rate (BER) of less than 10⁻¹², operates in temperatures ranging from -25℃ to 85℃, and supports a maximum rotational speed of 2000 r/min, with a lifespan exceeding 3 years [5] - The design is compact, facilitating installation within joint cavities and allowing for customization to fit different robotic applications [5] - The focus is on reducing wiring, lowering maintenance needs, and enhancing the reliability of interconnections, which is crucial as embodied intelligence robots transition from demonstration to mass delivery [5]

Core Viewpoint - The article discusses the significant decline in sales and market share of Ericsson and Nokia in the Chinese 5G market due to geopolitical tensions and shifts in customer spending patterns, highlighting the challenges faced by Western telecom suppliers in China [3][5][7]. Group 1: 5G Infrastructure in China - China has built 4.83 million 5G base stations by the end of November, with an increase of 579,000 from the previous year, surpassing the total number installed in Europe since the technology's inception [2]. - The expected explosive growth in 5G spending in China makes it an attractive market for companies like Ericsson and Nokia, especially compared to the more regulated European market [2]. Group 2: Sales Decline of Ericsson - Ericsson's revenue from Chinese customers fell sharply from nearly $1.8 billion in 2019 to approximately $0.798 billion in 2025, representing a decline of over 40% [3]. - The company's market share in China has significantly decreased, with its revenue from the region accounting for only 3% of total sales in the latest quarterly report [3]. - In 2021, Ericsson's sales in China nearly halved to about $1.1 billion, attributed to geopolitical actions against Huawei and ZTE [3]. Group 3: Nokia's Market Challenges - Nokia's market share in China is reported to be only 3% as of 2025, with a significant drop in revenue from nearly €2.2 billion ($2.6 billion) in 2019 to about €1.1 billion ($1.3 billion) in 2025 [4][5]. - The company has hinted at a complete exit from the Chinese mobile communications market, citing national security concerns [5]. - Nokia's revenue in the Greater China region is projected to decline by 19% to €913 million ($1.08 billion) by 2025, which is only 42% of the revenue from seven years ago [5]. Group 4: Strategic Moves and Workforce Reduction - Nokia's acquisition of its subsidiary Nokia Shanghai Bell for €501 million ($592 million) aims to simplify its operations in China while potentially reducing expenditures [6]. - Both Ericsson and Nokia have significantly reduced their workforce in China, with Ericsson's employee count dropping from approximately 14,000 in mid-2021 to about 9,500 by the end of the previous year [7]. - The anticipated exit of both companies from the Chinese market raises concerns about their future in the global 6G market, as Chinese operators invest rapidly in mobile network technology [7].

Group 1 - Lam Research announced the appointment of Dr. Anirudh Devgan to its board of directors, bringing extensive semiconductor ecosystem and technical expertise [1] - Dr. Devgan has been with Cadence Design Systems since 2012, serving in various senior leadership roles, and has been CEO since 2021 [1] - Under Dr. Devgan's leadership, Cadence has been at the forefront of applying artificial intelligence to engineering design and has expanded its business into system analysis and computational life sciences [1] Group 2 - Dr. Devgan is recognized as an authority in the Electronic Design Automation (EDA) field, having pioneered large-scale parallel and distributed architectures [2] - He holds 27 U.S. patents and is a fellow of IEEE and a member of the National Academy of Engineering [2] - Lam Research's board chairman, Abhijit Talwalkar, expressed confidence that Dr. Devgan's broad knowledge of the semiconductor ecosystem will enhance Lam's operations and innovation [2]

Core Insights - Memory prices have increased by 80% to 90% in 2026 compared to Q4 2025, with DRAM, NAND, and HBM prices reaching record highs [1] - OEMs are adjusting their memory configurations and prioritizing high-end products with LPDDR5 to manage cost pressures [1] - DRAM operating profit margins reached approximately 60% in Q4 2025, surpassing HBM for the first time, with expectations for further increases in Q1 2026 [2] Group 1: Market Trends - The memory shortage is more severe than initially anticipated, driven by demand from AI-driven data centers and cloud service providers, leading to expected price increases of 90% to 95% for DRAM and 55% to 60% for NAND in Q1 2026 [3][4] - OEMs typically bulk purchase memory a year in advance, which has led to discrepancies in pricing between pre-installed systems and independent memory kits [3] - The demand for LPDDR memory is expected to rise significantly, with prices projected to increase by approximately 90%, marking the largest increase ever [4] Group 2: AI Impact - The transition from training to inference in AI infrastructure requires more DRAM and storage space, particularly for storing key-value caches during model inference [5] - The need for high-performance storage has surged due to the growth of AI inference applications, leading to increased procurement by major communication service providers [4][5] - Despite expectations for DRAM prices to peak later this year, a return to normal levels is projected to take several years, with high prices expected to persist until 2028 [5]

如果您希望可以时常见面，欢迎标星收藏哦~ 当全世界都在争相寻找下一个英伟达时，一位日本学者表示，路线图在于市场，而不是政府政策。 "坦白说，这是一场市场骗局。[它的股价]不可能那么高。"东京大学教授、信息通信工程研究员江 崎博史在谈到英伟达的股价表现时说道。他的这番言论出自日本YouTube系列节目《Academia Cross》的一期节目。 他说："目前的英伟达就像一辆老式美国汽车。它耗油量大，噪音也大，但它很酷。" 当 被 问 及 未 来 两 到 三 年 内 有 哪 些 有 前 途 的 公 司 可 能 成 为 下 一 个 英 伟 达 时 ， Esaki 提 到 了 SambaNova Systems。 SambaNova是一家总部位于加州帕洛阿尔托的独角兽企业，由出生于台湾、在巴西长大的梁罗德 里于2017年创立。去年有报道称，美国芯片制造商英特尔正就以16亿美元收购SambaNova进行最 终谈判，但上个月有报道称谈判已经陷入僵局。 对投资者而言，这无疑是天大的好消息。英伟达的股价在1月底为191美元。两年前买入的投资者 如今股价已翻了三倍，一年前买入的投资者也能获得约60%的收益。及早发现下一个英伟达 ...

Core Viewpoint - The supply of server CPUs is tightening, with Intel and AMD notifying Chinese customers of supply limitations, leading to price increases of over 10% for Intel's server chips in the Chinese market [2][3]. Group 1: Supply Chain Dynamics - Intel's delivery times for certain products have extended up to six months due to supply constraints [2]. - AMD has also confirmed supply limitations, with delivery times for some server CPUs extended to 8-10 weeks [2]. - The demand for AI infrastructure is driving competition for AI-specific chips, impacting the entire computing supply chain, particularly storage chips, which are seeing rising prices [2]. Group 2: Market Position and Competition - Intel and AMD dominate the global server CPU market, but Intel's market share has decreased from over 90% in 2019 to about 60% by 2025, while AMD's share has increased from approximately 5% to about 20% in the same period [3]. - Major Chinese cloud providers like Alibaba and Tencent are significant customers for both Intel and AMD [3]. Group 3: Underlying Factors of Supply Constraints - Intel faces yield challenges that limit its production capacity, while AMD relies on TSMC, which is prioritizing AI chip production, further constraining CPU capacity [3]. - The shortage of memory chips, a critical component for servers, is prompting customers to purchase CPUs in advance to secure relatively lower-priced memory resources [3]. - The rise of "intelligent AI" systems, which require higher computational power than traditional applications, is driving overall demand for CPUs [3].

Core Viewpoint - The article highlights the upcoming Munich Shanghai Optical Expo as a key platform for the semiconductor and optoelectronics industry, focusing on collaborative innovation from devices to networks, particularly in the context of CPO (Co-Packaged Optics) technology [1][2]. Group 1: Industry Trends - The semiconductor industry is evolving towards "device miniaturization, advanced packaging, and high-speed networking," with collaborative innovation from devices to networks being crucial for overcoming computational and communication bottlenecks [2]. - CPO technology is identified as a pivotal hub connecting "devices, packaging, and networks," necessitating higher requirements for collaborative design due to its role in AI data centers and high-speed interconnect scenarios [2]. Group 2: Challenges in the Industry - The increasing complexity of heterogeneous integration, higher adaptability requirements between devices and networks, and the challenges in design-process-application collaboration are significant pain points hindering large-scale industry advancement [2]. - The bottleneck in CPO development has shifted from optimizing individual components to achieving overall system-level collaboration, which includes considerations for thermal, stress, and signal integrity [2]. Group 3: Company Contributions - Zhuhai Silicore Technology, a leading domestic EDA company, will participate in the forum, showcasing its next-generation 2.5D/3D stacked chip EDA solutions aimed at addressing design bottlenecks in the "device-packaging-network" collaboration [1][3]. - The company's 3Sheng Integration Platform has been validated by leading domestic advanced packaging manufacturers and supports mainstream processes like CoWoS and high-density substrate fan-out, facilitating complex scenarios in silicon photonics integration [3]. Group 4: Forum Highlights - The forum will feature three core technology presentations from Zhuhai Silicore Technology, focusing on EDA solutions for silicon photonics chips, collaborative breakthroughs in CPO technology, and the establishment of an advanced packaging ecosystem [7][9][11]. - The EDA+CPO technology collaboration aims to address core challenges in the entire link, including signal integrity, thermal reliability, and packaging parasitics, facilitating scalable deployment of CPO solutions [9][10]. Group 5: Networking Opportunities - The forum will provide a platform for industry professionals, including semiconductor manufacturers, network equipment vendors, and advanced packaging practitioners, to engage in discussions and find collaborative innovation solutions [15].

Core Viewpoint - AMD's CEO, Lisa Su, defends the company's weak earnings forecast, stating that demand has increased recently, despite a 17% drop in stock price, marking the worst single-day performance since May 2017 [1] Group 1: Earnings and Forecast - AMD's Q4 earnings exceeded Wall Street expectations, but analysts remain cautious about the company's outlook, which has overshadowed its performance [1] - The company expects Q1 revenue to be $9.8 billion, with a fluctuation of $300 million, up from a previous estimate of $9.38 billion [1] - AMD's data center business accelerated growth from Q4 to Q1, driven by increased demand for AI computing capabilities [1] Group 2: AI and Data Center Business - The launch of AMD's new integrated server-level AI system, Helios, is anticipated to mark a turning point for the company in the second half of the year [2] - AMD's data center business saw sales reach $5.38 billion in Q4, a year-over-year increase of 39.4% and a quarter-over-quarter increase of 23.9% [9] - The company achieved a significant milestone as sales of Instinct GPUs surpassed Epyc CPUs for the first time, driven by strong demand in the AI sector [4][15] Group 3: Market Dynamics and Competition - AMD's GPU sales are projected to continue growing, with estimates suggesting that Instinct GPU sales could reach between $2.5 billion and $2.6 billion in the current quarter [4] - The company is competing with Nvidia in the GPU market, with the recent approval of sales in China for the MI308 GPU contributing to revenue growth [4] - AMD's overall sales for the data center group reached $16.64 billion for the year, a 32.2% increase, although operating profit growth was only 3.5% [11] Group 4: Future Outlook - CEO Lisa Su indicated that the data center business could grow at over 60% annually over the next three to five years, potentially leading to AI revenue in the hundreds of billions by 2027 [5] - AMD's other business segments, excluding data centers, are also expected to show strong growth, with projected sales exceeding $18 billion in 2025, a 36.3% increase [13]

Core Viewpoint - The semiconductor industry is experiencing a wave of mergers and acquisitions, with four significant deals occurring recently, involving over $10 billion in total [1]. Group 1: Texas Instruments Acquires Silicon Labs - Texas Instruments (TI) announced the acquisition of Silicon Labs for $75 billion, paying $231 per share in cash, aiming to enhance its position in embedded wireless connectivity solutions [3][8]. - The merger will combine TI's leading analog and embedded processing products with Silicon Labs' strong product portfolio in mixed-signal solutions, creating a global leader in embedded wireless connectivity [3][5]. - TI expects to generate approximately $450 million in annual manufacturing and operational synergies within three years post-transaction [7]. Group 2: Infineon Acquires ams OSRAM Sensor Business - Infineon plans to acquire ams OSRAM's non-optical analog/mixed-signal sensor product portfolio for €570 million, enhancing its position in the automotive and industrial sensor markets [9][10]. - The acquisition is expected to generate approximately €230 million in revenue by 2026 and will immediately enhance Infineon's earnings per share [9][10]. - Infineon aims to leverage the complementary product offerings to provide comprehensive system solutions for its customers [9][11]. Group 3: SiTime Acquires Renesas Timing Business - SiTime is set to acquire certain assets of Renesas' timing business for $1.5 billion in cash and stock, significantly expanding its product offerings and customer base [12][16]. - The acquisition is projected to help SiTime achieve its goal of $1 billion in revenue and enhance its financial performance, with expectations of a gross margin increase to 60%-65% [15][16]. - SiTime's CEO emphasized that the acquisition will allow the company to address critical timing challenges in high-performance applications [12][15]. Group 4: Siemens Acquires Canopus AI - Siemens announced the acquisition of Canopus AI, a company specializing in AI-driven measurement solutions for semiconductor manufacturing, to strengthen its position in the semiconductor manufacturing ecosystem [18][19]. - The integration of Canopus AI's advanced measurement technology with Siemens' existing product portfolio aims to enhance precision and efficiency in semiconductor manufacturing [18][20]. - This acquisition reflects Siemens' commitment to leveraging industrial AI to address key challenges in semiconductor manufacturing [19][20].