以下文章来源于芯世相 ，作者编辑部 芯世相 . 芯片电子元器件IC半导体分销教科书式必读公众号【芯世相】；缺芯片，销库存，保品质，市场行情早 知道，尽在芯片超人。加我：chrisjiang08 知名芯片分销商 "周立功"（立功科技）要被卖了？ 从昨晚开始，这个消息在芯片圈子里火速传播。作为 NXP 芯片的重要代理商，立功科技在芯片分 销领域拥有一定知名度，而交易的另一方商络电子更是知名芯片分销上市公司。 根据商络电子的公告，总算知道到底发生了啥。 6 月 4 日，商络电子公布，公司于近日与广州立功科技股份有限公司 ( 简称"标的公司"或"立功科技" ) 的主要股东陈智红、周立功、广州市呈祥投资有限公司、珠海德赢投资合伙企业 ( 有限合伙 ) 、珠 海立远投资合伙企业 ( 有限合伙 ) 及珠海众咖投资合伙企业 ( 有限合伙 ) 签订了《投资意向协议》， 公司拟通过现金方式购买立功科技部分股权，并 达到控股标的公司的目的 。 公告显示，本次交 易目标公司的整体估值以甲乙双方协商确定。 最终的交易价格将根据尽职调查、审计或评估结果 等进一步确定。 商络电子、立功科技 是如何发家的？ 先大致了解一下两家公司的主要情况 ...

Core Viewpoint - Texas Instruments (TI) plans to increase prices on over 3,300 product lines, with the price hike set to take effect on June 15, indicating a strategic shift from aggressive pricing to maintaining product line profitability [1][2]. Group 1: Price Increase Details - The price increase will see an average hike of over 10%, with some products experiencing increases of 40%-70% [1]. - The distribution of price increases is as follows: 9% of items will see increases of 100% or more, 5% will see increases of 50%-100%, 1% will see increases of 30%-50%, 55% will see increases of 15%-30%, and 30% will see increases of less than 15% [1]. - The price hikes are primarily focused on low-margin products, older items, and those that did not meet committed quantities, particularly in the signal chain category such as ADCs and operational amplifiers [1]. Group 2: Market Implications - The price increase is a global initiative, not limited to China, but in China, it mainly affects lower-margin products like operational amplifiers and ADCs [1]. - This shift in pricing strategy may provide opportunities for domestic companies like Shengbang and Sirepu, whose main products overlap with TI's mid-to-low-end items, potentially allowing them to gain market share as they follow suit with price increases [2]. - The overall industry is showing signs of recovery, with TI reporting Q1 revenue of $4.069 billion, a year-on-year increase of 11%, and Q2 revenue expected to be between $4.17 billion and $4.53 billion, surpassing market expectations [2].

今天下午，中科寒武纪科技股份有限公司发布了2025 年度向特定对象发行A 股股票募集说明书。他们 在说明书中指出，本次向特定对象发行股票募集资金总额不超过 498,000.00 万元（含本数）， 扣除发 行费用后的净额拟投资于以下项目： 在公告中，寒武纪表示，本次向特定对象发行股票有以下几个目的： 1、增强公司面向大模型的芯片技术和产品综合实力，提升公司在智能芯片产业领域的长期竞争力 寒武纪表示，大模型的快速发展正推动人类社会加速迈向强人工智能时代，引发智能算力市场的 空前 增长机遇。本次募投项目面向大模型技术演进对智能芯片的创新需求，拟开展面向大模型的智能处理器 技术创新突破，研发覆盖不同类型大模型任务场景的系列化芯片方 案；拟建设先进封装技术平台，灵 活高效地支撑不同场景下差异化产品的封装，增强智 能算力硬件产品对未来大模型技术发展新需求的 适应性。本次募投项目的实施将全面提 升公司在复杂大模型应用场景下的芯片技术和产品综合实力， 提升公司在智能芯片产业 领域的长期竞争力。 2、构建面向大模型的软件平台，进一步提升公司软件生态的开放性和易用性 寒武纪表示，大模型技术驱动人工智能产业迈向全新发展阶段，大模型 ...

Core Viewpoint - Alibaba Group is rapidly establishing technological leadership in the artificial intelligence sector through the development of intelligent agents based on the Qwen3 model, marking a significant shift in its AI strategy [1][2]. Group 1 - Alibaba's various business units have initiated development plans for intelligent agents based on the Qwen3 model, indicating a self-sustaining technological iteration within the company [1]. - The Qwen series models are serving as a dual-purpose foundation: internally, they unify Alibaba's AI capabilities, while externally, they accelerate the AI transformation of industries in China through an open-source strategy [1]. - Alibaba Cloud is promoting the global deployment of the Qwen model, positioning itself to compete with mainstream open-source models in Europe and the United States [1]. Group 2 - The involvement of Jack Ma, who has been monitoring the Qwen3 development closely, underscores the strategic importance of Qwen3 for Alibaba's future and reflects the urgency of the company in the AI competition [2].

Core Viewpoint - The article summarizes the EDA (Electronic Design Automation) tool expenditures mentioned in the 2024 financial reports of 15 listed SoC/MCU/ASIC chip design companies, indicating that EDA expenses are relatively low, around 1% of total R&D costs, but are crucial for chip design [1]. Group 1: EDA Expenditures - Few companies disclose EDA tool expenses in their annual reports, and the disclosed amounts are generally low compared to overall R&D expenses [1]. - EDA tools are essential in chip design, akin to physical education in school exams, where despite low scoring weight, failing to meet standards can prevent entry into prestigious institutions [1]. - Companies like 瑞芯微 reported a significant increase of 294.58% in long-term payables due to increased EDA tool purchases [1][2]. Group 2: Company-Specific Insights - 中科蓝讯 reported EDA tool payables with a year-end balance of 5,309,734.52 yuan, down from 6,163,510 yuan at the beginning of the period [2][3]. - 普冉半导体 noted a 77% increase in intangible assets attributed to new EDA and IP purchases [5]. - 炬芯科技 indicated a 217% increase in other payables, primarily due to increased EDA tool procurement [7]. - 国民技术 reported EDA tool amortization of 370,000 yuan in long-term deferred expenses [14]. Group 3: Government Support and Risks - 晶晨股份 received government subsidies for EDA innovation applications [9]. - Several companies, including 恒玄科技 and 国科微, mentioned risks associated with EDA in their reports [13][16]. - 北京君正 received multiple EDA-related subsidies, highlighting government support for the industry [16].

英伟达首席科学家戴利出席AI EXPO博览会 图源：台媒 报道称，相关数据显示，在2019年，中国的AI高端研究人员人数约占全球三分之一，而目前这一比例已 增长到接近全球总数的一半。 戴利表示，虽然中国在全球AI硬件市场的占有率尚不及美国，但已成功吸引并培养了大量AI研发人才。他 提到，这些人才此前很多参与英伟达的研发工作。他认为，如果不是美国的出口限制，华为也不会如此迅 速成长，现在那些研究人员都转而为华为开发软件。 据中国台湾"联合新闻网"3日报道，美国芯片制造商英伟达（NVIDIA）的首席科学家比尔·戴利（Bill Dally）在2日表示，美国对中国实施的人工智能（AI）技术相关的出口限制措施，反倒让中国获得很大的 发展空间。他透露，大量过去为英伟达从事计算机编程工作的AI研究人员，如今大多都转而为华为编写程 序。 当地时间6月2日，戴利出席了由美国华盛顿智库"特别竞争研究计划"（SCSP）主办的第二届国家竞争力 AI博览会（AI EXPO）。他指出，当前AI领域不仅存在企业之间的竞争，还涉及国家间的竞争。他特别指 出，美国政府升级扩大出口管制措施，禁止出口高端技术及芯片到中国市场，包括禁止英伟达生产的 ...

Core Viewpoint - Morgan Stanley's report indicates that due to U.S. export controls, China's HBM technology gap is narrowing, with Changxin Storage (CXMT) aiming to produce HBM3/3E by 2027 [1][2]. Group 1: HBM Technology Development - China currently lags 3-4 years behind global leaders in HBM3 technology, but this gap is expected to close due to advancements in AI chip production capabilities [2][3]. - Changxin Storage's entry into the 1z nm DDR5 production has reduced its DRAM technology gap from 5 years to 3 years compared to market leaders [2][3]. - The rapid progress in HBM production in China may lead to increased competition and price volatility in the global DRAM landscape [3][5]. Group 2: Market Dynamics and Competitors - The Chinese semiconductor ecosystem is becoming more competitive, with local solutions emerging across various segments, including chips, substrates, and assembly [4][5]. - By 2027, approximately 37% of wafer manufacturing capacity is expected to be concentrated in China, with significant growth in mature node semiconductors [5][6]. - The introduction of GDDR7 as a potential substitute for HBM in gaming GPUs could fill the gap in AI inference, with expected revenue growth of around $400 million from GDDR7 sales [2][7]. Group 3: Changxin Storage (CXMT) Production Plans - Changxin Storage plans to begin small-scale production of HBM2 by mid-2025, with HBM3 and HBM3E development accelerated to 2026 and 2027, respectively [14][19]. - The company aims to achieve a monthly HBM production capacity of approximately 100,000 wafers by the end of 2026, expanding to 400,000 wafers by the end of 2028 [18][20]. - Changxin Storage's DDR5 production is set to increase to 110,000 wafers per month by the end of 2025, representing 6% of global DRAM capacity [19][20]. Group 4: Hybrid Bonding Technology - China leads in hybrid bonding patents, which are crucial for advanced HBM production, with significant advancements made by Yangtze Memory Technologies (YMTC) [21][22]. - The hybrid bonding technology is expected to enhance the performance and yield of HBM products, with major manufacturers considering its implementation in future HBM generations [27][28]. - The competitive landscape in hybrid bonding is shifting, with Chinese companies developing local solutions that could help close the technology gap with global leaders [23][26].

Core Viewpoint - The recent EDA ban imposed by the U.S. on China has sparked widespread concern and discussion within the industry, highlighting the potential impact on semiconductor design capabilities and market dynamics [1][9]. Timeline Summary - On May 23, the U.S. Department of Commerce notified EDA companies about new export controls affecting China, which was publicly reported on May 28, leading to immediate responses from affected companies [2][3]. - By May 29, Synopsys announced it received a notification regarding new export restrictions and subsequently withdrew its financial guidance for the third quarter and full year of fiscal 2025 [3][4]. - On May 30, reports indicated that the ban applies to all Chinese entities, not just those on the entity list, raising further concerns about the implications for the industry [1][3]. Market Reaction - Following the news, Synopsys and Cadence experienced significant stock declines, with Synopsys dropping 9.64% and Cadence falling 10.67% in a single trading day, reflecting market panic over potential disruptions in EDA services [3][6]. - The initial reaction from industry professionals was one of anxiety, fearing that a complete halt in EDA tool availability would severely impact ongoing projects [8]. Company Responses - Companies like Synopsys and Cadence exhibited varied responses to the ban, with Synopsys quickly adjusting its financial outlook due to its substantial business in China, while Cadence took a more cautious approach [5][6]. - Siemens EDA, while not immediately confirming the ban, reportedly began verifying software demand from Chinese clients and halted some software upgrades [4][5]. Strategic Considerations - The differing responses from EDA companies may stem from their respective business interests in China, with Synopsys and Cadence deriving approximately 10%-15% of their revenue from the Chinese market [6]. - The U.S. ban may inadvertently strengthen the market position of these companies by limiting competition from Chinese firms in advanced chip design [7]. Industry Outlook - Despite short-term challenges, the ban could accelerate the development of domestic EDA tools in China, as industry professionals express hope for increased investment and focus on local alternatives [8]. - Domestic EDA companies like Huada Empyrean, GigaDevice, and Glorious Microelectronics are positioning themselves to fill the gap left by U.S. firms, with advancements in various EDA tool capabilities [8].

其实，老美拿着EDA搞事情，已经很多年了，之前是点对点，针对特定的国内单位和公司。 比如说，2018年， 美国 禁止 中兴 使用EDA工具。再比如， 2019年，华为海思 被列入实 体清单后，被迫切断与美国EDA公司的合作。这次就明确了针对全部中国客户。 以下文章来源于龙科多 ，作者龙科多 龙科多 . 深度科技观察，聚焦半导体、操作系统等底层技术。内容全平台发布。 今天聊聊最新的美国EDA禁令。龙科多认为，美国此举基本无法起到多少制裁作用， 利好国 产EDA发展 。但这个事，还是值得具体说道说道。 最近，《纽约时报》 等多个外媒称，美国商务部已向包括Cadence、新思科技和西门子等全 球领先的EDA公司发出通知，要求停止向中国供应EDA技术。 Cadence、新思科技 都是美国公司，西门子是德国公司。消息一出，国内还是非常关注。有 一些人士认为不大可能，认为报道不准确。 不过，外媒陆续报道 ，上述三家EDA公司都对外发布公告，表示收到了美方的通知。这下， 基本做实了。 EAD工具，主要是用于 半导体制造测试的设计和验证，以及监控性能和质量。 如果再细分， 包括 模拟IC设计与验证、数字IC设计与验证，晶圆制 ...

Core Viewpoint - ARM has announced a significant strategic adjustment by abandoning the long-standing Cortex brand and restructuring its product line with a new naming system, reflecting its deep insight into future market competition and concerns about the emerging RISC-V architecture as a potential threat [1][3]. Group 1: Brand and Product Line Changes - ARM's Cortex brand, known for its high recognition in the semiconductor industry, will be replaced by a new, simplified naming system to better meet the needs of different market segments and enhance competitiveness in the global chip market [1][2]. - The new product naming system categorizes Compute Subsystems (CSS) based on application areas, including Arm Neoverse for infrastructure, Arm Niva for PC, Arm Lumex for mobile, Arm Zena for automotive, and Arm Orbis for IoT, while retaining the Mali brand for GPUs [2]. Group 2: Concerns about RISC-V - ARM has issued a clear warning regarding the RISC-V architecture, which has gained attention due to its open-source nature, potentially leading customers to choose it over ARM products if its ecosystem continues to grow [3][4]. - Despite RISC-V's current limitations in advanced design support compared to ARM, its development poses a potential threat, especially as ARM raises licensing prices, making RISC-V a more cost-effective alternative for some manufacturers [4]. Group 3: Market Implications - ARM's decision to abandon the Cortex brand and restructure its product line is a crucial response to market changes and competitive challenges, aiming to enhance market adaptability and service precision [4]. - The evolving competitive landscape in the global chip design market may undergo profound changes as ARM implements its new strategy and RISC-V continues to develop [4].