在全球算力重构与国产芯片突围的浪潮中，奕斯伟计算已然成为中国RISC-V架构芯片领域的标杆性企业。 据其港交所招股书披露，这家专注于RISC-V架构的芯片设计公司，采用无晶圆厂（fabless）模式，深耕芯片、芯片组、板卡及核心软件的研发设计，为 智能终端与具身智能终端产品筑牢"芯"底座，助力各行业实现智能升级。 京东方创始人、前董事长王东升作为公司创始人之一，在2019年6月卸任京东方相关职务后，毅然投身北京奕斯伟，开启了自己的"芯"征程，为公司注入 了深厚的产业资源与战略远见。自成立以来，企业发展势头迅猛，五年内顺利完成四轮融资，IDG资本、众行资本、国鑫创投等知名投资机构先后入局， 累计融资金额超90亿元，彰显了资本市场对其RISC-V布局的高度认可。 奕斯伟计算构建了多元化的产品矩阵，清晰划分出智能终端与具身智能两大核心芯片板块。其中，智能终端芯片涵盖人机交互芯片与多媒体处理芯片，广 泛应用于家居、办公、便携等日常场景，赋能终端设备实现屏幕输入输出管理与多媒体信号高效处理；具身智能芯片则包含互连芯片与计算芯片，聚焦汽 车、机器人、工业等高端场景，让各类智能体具备感知、处理、执行的完整能力，实现对物理环 ...

Core Viewpoint - The recent investment by Xiaomi into Unisoc QingTeng signifies a strategic partnership aimed at enhancing the supply chain for Xiaomi's ecosystem, particularly in the NFC chip sector, which is crucial for various smart devices [1][3]. Group 1: Investment and Financing - Xiaomi's investment in Unisoc QingTeng has increased the company's registered capital from approximately 59.21 million to 65.98 million yuan [1]. - Historical financing rounds for Unisoc QingTeng include investments from Shenzhen Capital Group and Xiaomi's investment arm, with undisclosed amounts in the A round and angel round [2]. Group 2: Strategic Importance - The partnership allows Xiaomi to address supply chain vulnerabilities exposed during the 2023 NFC chip shortage, ensuring better control over core components [4][6]. - Unisoc QingTeng, established in 2019, focuses on smart IoT chips, including NFC chips, which align with Xiaomi's extensive product ecosystem [3][6]. Group 3: Market Context and Opportunities - The global NFC chip market is dominated by foreign giants, holding over 60% of the market share, while domestic manufacturers face challenges in production quality and technology [4]. - The NFC technology is evolving beyond payment solutions, becoming integral to the digital economy, with advancements in distance, speed, and security [7]. Group 4: Future Prospects - The global IoT market is projected to reach $1.8 trillion by 2025, with low-power NFC and wireless communication chips growing at over 15% annually [8]. - The collaboration between Xiaomi and Unisoc QingTeng is seen as a significant step towards domestic NFC chip manufacturers gaining a foothold in both consumer and industrial applications, potentially enhancing their influence in the global supply chain [8].

Core Viewpoint - Star Semiconductor has successfully completed multiple rounds of strategic financing, raising nearly 1.5 billion yuan, which has significantly boosted its post-financing valuation beyond the unicorn threshold, indicating strong market confidence in its growth potential [1][6]. Financing History - Star Semiconductor was founded in October 2020 and quickly secured 100 million yuan in angel funding within two months. It completed a 400 million yuan Pre-A round in February 2021, followed by a Pre-A+ round later that year. After raising over 100 million USD in the A round in June 2022, its valuation peaked at 4.8 billion yuan. However, due to changes in the primary market, its valuation fell to 3.6 billion yuan during a 500 million yuan B round in April 2024, prompting a pragmatic adjustment of the pre-financing valuation to 3 billion yuan to expedite funding [3][6]. Business Development and Innovations - In the low Earth orbit satellite internet sector, Star Semiconductor is set to achieve significant advancements by 2025, collaborating with major smartphone manufacturers to develop satellite direct connection solutions and working with leading new energy vehicle manufacturers to create satellite internet systems. The company has also provided satellite communication baseband chips to major communication equipment manufacturers, establishing a comprehensive industrial ecosystem [4][6]. - Star Semiconductor has successfully developed a flagship smartphone model capable of satellite video calls based on the 5G NTN standard, marking a significant leap for China in this field [4]. - In the 5G cellular communication sector, the company has partnered with various module and MiFi customers to develop 5G RedCap modules and MiFi products, with applications in industrial IoT and low-altitude economies [4]. Intellectual Property and Team Background - The core team of Star Semiconductor consists of former Huawei experts who aim to create competitive core chips in the face of international challenges. The team has led the company to rapid growth, achieving product certifications with two of the top six global smartphone manufacturers and several leading automotive and communication equipment companies [6]. - As of the end of 2025, Star Semiconductor has applied for a total of 270 intellectual property rights, including 195 invention patents, establishing a solid technological barrier [4]. Market Outlook - The completion of nearly 1.5 billion yuan in financing not only provides sufficient funding for future technological research and capacity expansion but also reflects strong capital confidence in the 5G/6G chip and satellite communication sectors. With the support of its core team, industry layout, and capital, Star Semiconductor is expected to continue breaking through core technological barriers and enhance China's position in the global 5G/6G and satellite communication markets [6].

上海浦东发展银行（下称"浦发银行"）于2月4日集中发布两则重要采购结果公示，分别完成鲲鹏芯片服务器、海光四号芯片服务器两大项目的中标结果公 布，合计中标金额达3.73亿元，标志着该行金融云信创基础设施建设再提速，国产算力在金融核心场景的应用持续深化。 本次两大采购项目的招标公告均于2025年12月26日同步发布，经过规范评审流程后，最终确定中标方。其中，《2025年金融云信创基础设施系统常规扩容 项目等两项目第二批鲲鹏芯片服务器采购项目》由上海恒驰信息系统有限公司以1.58亿元中标，采购内容涵盖第二批鲲鹏芯片服务器及配套维保服务，用 于支撑金融云信创基础设施的常规扩容需求。另一项《2025年金融云信创基础设施常规扩容等二项目之海光四号芯片服务器采购项目》则由北京神州新桥 科技有限公司以2.15亿元中标，除满足金融云信创基础设施扩容外，还将为对公分布式核心重构及核心平台领域公共能力建设项目提供海光四号芯片服务 器与维保服务，助力核心业务系统的信创升级。 上海恒驰信息系统成立于2005年，核心业务聚焦ICT集成、云业务与信息安全，2017年成为华为公有云一级代理，在国产算力部署与云基础设施建设领域 积累了成熟案例 ...

Core Viewpoint - Sony's recent showcase of a new image stabilization chip indicates a significant shift in camera technology, particularly in motion picture processing, suggesting a future where stabilization occurs at the source rather than through post-processing [1][9]. Group 1: Technology Overview - The showcased image stabilization LSI chip operates close to the image sensor, stabilizing signals during image capture rather than after processing, which allows for real-time correction of shake, rotation, and drift [1][4]. - This chip reduces visible artifacts and edge distortion, providing smoother motion in fast pans or handheld shots, with a latency of approximately 1.5 frames [1][4]. Group 2: Industry Implications - By publicly demonstrating this chip, Sony invites manufacturers to design systems around it, indicating a readiness for widespread application in the imaging industry [4][6]. - The chip is expected to first impact professional and embedded imaging systems, such as broadcast cameras, remote and robotic gimbals, drones, and small camera modules, rather than consumer-level mirrorless cameras [6]. Group 3: Competitive Advantage - Sony's strategy involves proving the chip's value in demanding professional environments before influencing broader camera designs, reinforcing its dominance in the image sensor market [6][8]. - The integration of the stabilization chip with image sensors enhances Sony's control over the entire imaging process, leading to improved image quality and reduced reliance on downstream corrections [6][9]. Group 4: Future Developments - Sony's recent innovations, including high-resolution global shutter sensors, demonstrate a commitment to advancing imaging technology without compromising motion integrity, which is crucial for filmmakers [8][9]. - The trend of shifting decision-making power regarding image quality to the sensor level signifies a broader industry movement towards hardware-based solutions for image processing [9].

日前，国家超算互联网核心节点在郑州正式上线试运行，这一全国一体化算力网络的重大基础设施，凭 借3套中科曙光scaleX万卡超集群系统的同步部署，一举成为全国首个实现3万卡规模部署、且可实际投 入运营的最大国产AI算力池。 作为国家部委、河南省、郑州市多方协同发力、重点部署的战略工程，该核心节点的落地承载着打破算 力壁垒、优化资源配置的重要使命，其战略价值不言而喻。此次开创性完成国产万卡超集群的规模化部 署，不仅创下多项业界纪录，更打造了一个可复制、可验证、可普及的国家级算力建设样板间，为全国 一体化算力网络发展提供了宝贵的实践参考。 中科曙光scaleX万卡超集群的三大核心优势，构筑起这一国产算力底座的硬核实力，全方位领跑业界发 展。在集成度上，该集群采用全球首创的高密度单机柜设计，融合超高密度刀片、浸没相变液冷等前沿 技术，将单机柜算力密度提升20倍之多，同时将电能利用效率（PUE）控制在1.04的超低水平，实现了 算力与节能的双向突破，呼应了"双碳"目标下算力基础设施绿色发展的要求。 众所周知，算力作为数字经济时代的核心生产力，堪比农业时代的水利、工业时代的电力，而我国算力 网络建设的核心目标，正是打破算 ...

值得一提的是， 在此之前的2025年 12月，模拟芯片大厂ADI就已经宣布将于2026年2月1日起对全系列产品进行涨价。今年1月以来， 国科微、中微半 导、英集芯、美芯晟、必易微、普冉股份 等 多家国产芯片厂商也相继宣布了涨价。 2月5日，汽车芯片大厂英飞凌向客户发出通知称， 由于功率开关与相关芯片供给持续吃紧，以及原材料与基础设施成本攀升，公司将自2026年4月1日起 对这部分产品价格进行上调。 英飞凌在通知函中表示，半导体市场对英飞凌的一些产品面临着巨大的需求增长，这主要是由于人工智能数据中心的大量部署，导致部分功率开关和相关 芯片短缺。为了支持不断增长的需求，英飞凌需要进行大量额外投资，以扩大晶圆厂产能。此外，英特尔还正面临原材料和基础设施成本的相关增加。 虽然，英飞凌努力通过提高内部效率来应对投入各类成本的增加，但英飞凌现在处于一个无法再吸收这些的地步。因此，英飞凌需要与客户和合作伙伴共 同承担这一成本的增长。 英飞凌强调："我们已经采取了一切可能的措施，将这种价格调整限制在受投资拉动和制造成本增加影响的功率开关和相关芯片产品的最小可能数量内。" 根据通知，英飞凌将于2026年4月1日开始执行新的价格 ...

Core Viewpoint - The article highlights the significant increase in IPO applications on the Sci-Tech Innovation Board, with 48 companies accepted in 2025 compared to only 6 in 2024, particularly emphasizing the semiconductor sector with 20 companies [1]. Group 1: Company Summaries - Angrui Micro, based in Beijing, focuses on RF and analog integrated circuit design and has successfully completed its IPO process, emphasizing domestic substitution in RF and analog chips [1]. - Shanghai Super Silicon specializes in the R&D and production of 300mm and 200mm semiconductor silicon wafers, which are critical substrates for chip manufacturing [1]. - Hengyun Chang, located in Shenzhen, develops plasma RF power systems and devices, essential for advanced chip manufacturing processes [1]. - Chipmi Technology, based in Shanghai, focuses on semiconductor-grade perfluoroether rubber materials, crucial for sealing in semiconductor production [1]. - Zhaoxin Integrated, also in Shanghai, develops high-end general-purpose processors and supporting chips, aiding in domestic chip substitution [2]. - Shanghai Superconductor specializes in high-temperature superconducting materials, enhancing semiconductor device performance [2]. - Youxun Co., based in Xiamen, is a leader in optical communication front-end transceiver chips, recognized as a national champion in manufacturing [2]. - Yadian Technology, located in Jiangsu, develops wet cleaning equipment for silicon-based and compound semiconductors, vital for chip manufacturing precision [3]. - Moer Thread, based in Beijing, focuses on GPU and related products, aligning with high-end industry development needs [3]. - Muxi Co., located in Shanghai, specializes in full-stack GPU products, supporting AI training and general computing [3]. - Qinheng Micro, based in Nanjing, develops interface chips and interconnect MCUs, essential for embedded systems [4]. - Youyan Composite Materials, located in Beijing, produces special non-ferrous metal alloy products for semiconductor packaging [4]. - Lianxun Instruments, based in Suzhou, develops electronic measurement instruments and semiconductor testing equipment [4]. - Lepu Technology, based in Chengdu, focuses on high-end semiconductor equipment, crucial for chip manufacturing [4]. - Zhongke Kehua, located in Jiangsu, specializes in semiconductor packaging materials, impacting chip packaging quality [5]. - Pinzhun Laser, based in Shanghai, develops precision lasers for semiconductor production processes [5]. - Changxin Technology, located in Anhui, focuses on DRAM products, contributing to domestic storage chip production [5]. - Ruishi Chuangxin, based in Chongqing, develops RF front-end chips and modules for various applications [5]. - Taosheng Technology, based in Shanghai, specializes in semiconductor testing interfaces, crucial for product quality assurance [6]. - Zhongtu Technology, located in Dongguan, develops GaN substrates, essential for high-end chips and new energy applications [6]. Group 2: Market Trends and Characteristics - The 20 companies show a significant regional concentration in Shanghai, Jiangsu, Beijing, and Guangdong, indicating a well-developed semiconductor industry ecosystem in these areas [12]. - The companies cover a comprehensive industry chain, including upstream materials, midstream chip design, and downstream testing and packaging, aligning with collaborative industry development trends [12]. - There is a notable profit disparity among the companies, with many in the high R&D investment sectors like chip design operating at a loss, while those in testing and materials are achieving profitability [12].

Core Viewpoint - The passive components industry is experiencing a price increase, particularly in multilayer ceramic capacitors (MLCC), with some distributors in mainland China raising spot prices by up to 20% [2][3]. Group 1: Price Trends - The price increase trend includes tantalum capacitors, chip resistors, magnetic beads, and MLCC, with industry expectations for improved performance from related manufacturers [3]. - Tantalum capacitors have seen price hikes of 20% to 30% due to high demand from AI server applications, leading to a supply-demand imbalance [3]. - MLCC is expected to follow suit in price increases, supported by a significant rise in demand as system designs adapt to include more MLCCs [4]. Group 2: Market Dynamics - The dependency on tantalum capacitors in AI devices has led to a design shift towards using a combination of tantalum capacitors and MLCCs to mitigate supply risks and control costs [4]. - The demand for MLCC is no longer just a reactive response to price increases but is now driven by structural demand expansion, particularly in AI applications [4]. - For the company Yageo, tantalum capacitors account for approximately 18% to 22% of revenue, while MLCC contributes about 18% to 20% [4].

2月4日，国内高动态视频 CMOS 图像传感器（CIS）设计领军企业 —— 深圳市元视芯智能科技股份有限公司（简称 "元视芯"）官宣，于 2025 年底顺利 完成 A + 轮融资并完成工商变更登记。本轮融资总额超 3 亿元人民币，由策源资本、无锡产投及一汽红旗私募基金联合领投，创新工场、知守投资、中 信建投资本、华天科技、弘芯投资、福田资本、亿合资本等多家知名机构跟投，老股东 GRC 富华资本持续追投。 自 2021 年 11 月成立以来，元视芯始终秉持 "技术驱动，场景赋能" 发展理念，依托端侧 AI、LOFIC 融合感知、计算光学、高速高精度 ADC 四大核心技 术，构建 "智能车载" 与 "智能消费" 双轨并行的研发战略，成为全球唯一成功将 2D LOFIC 技术应用于车规级 CIS 的供应商。经过四年迅猛发展，公司已 成长为行业内营收破亿速度最快的图像传感器设计企业之一：营收规模从 2023 年的数百万元跃升至 2025 年近 2 亿元，累计出货量突破 7500 万颗，规模 化交付能力获市场广泛信赖，并先后获评国家级专精特新 "小巨人" 企业、国家高新技术企业、" 中国 IC 独角兽企业 " 等重磅称 ...