本文信息综合自北京芯升半导体科技有限公司（下称 " 芯升半导体 " ）官方公众号信息，并参考硬氪独家报道，旨在全面呈现国产车规级核心芯片企业的最新发展动态与行业突破。 据芯升半导体官方公众号最新披露，公司近日成功完成近亿元天使轮融资，本轮融资由中关村启航担任领投方，陆石投资、和高资本、零以创投、中科光 荣、元起资本、国开科创、高创智行及三贤科技共同跟投。此次募集资金将专项用于核心产品研发与量产筹备，重点推进车载以太网交换芯片、下一代车 载光纤通信芯片的研发迭代、流片测试及产能建设，加速国产车载核心芯片的市场化落地进程。 在应用场景拓展上，依托TSN技术的跨行业通用价值，公司计划在汽车领域站稳脚跟后，逐步将技术平台延伸至具身智能、工业自动化、轨道交通、商业 航天等关键行业，打开更广阔的成长空间。 本轮融资后，芯升半导体将加速推进两大核心产品研发：面向下一代智能汽车的SV31系列车载以太网交换芯片，以及前瞻性的车载光纤通信芯片，两款 产品均计划于2026年下半年正式推出。 陆石投资董事总经理吴昊在接受硬氪采访时表示，随着汽车电子电气架构的快速演进，TSN芯片的国产化替代需求日益迫切。芯升半导体作为初创企业即 通过 ...

国内集成电路传输设备细分领域领军企业、国家级专精特新"小巨人"上海果纳半导体技术股份有限公司（下称"果纳半导体"）再添战略布局。 近日，由其100%控股的上海龙枢智控科技有限公司正式成立，法定代表人为果纳半导体创始人叶莹，注册资本500万元，注册地址落子上海临港新片区。 | 工商信息 历史工商信息 | | | | 目 文字介绍 | 【品】工商官网快照》 日 导出 | © 企查查 | | --- | --- | --- | --- | --- | --- | --- | | 统一社会信用代码 | 91310000MAK7QR2LXY | 企业名称 | 上海龙枢智控科技有限公司 | | | | | 法定代表人 | YE YING | 登记状态 | 存续 | 成立日期 | 2026-02-06 | | | | | 注册资本 | 500万元 | 实敷资本 | | | | 组织机构代码 | MAK7QR2L-X | 工商注册号 | 310142001266700 | 纳税人识别号 | 91310000MAK7QR2LXY | | | 企业类型 | 有限责任公司(非自然人投资或控股 的法人独资) | 营业期限 | 202 ...

Core Viewpoint - The termination of the acquisition of 97.0070% equity in Chip Coming Technology by Chip Origin Co., Ltd. has led to significant corporate changes at Chip Coming, indicating a potential move towards independent IPO preparation [1][3]. Group 1: Acquisition Background - In August 2025, Chip Origin planned to acquire Chip Coming to fill its gap in the RISC-V CPU IP sector, aiming to build a comprehensive IP capability [3]. - Chip Origin, a leader in semiconductor IP with a strong portfolio including GPU and NPU, had previously held a 2.99% stake in Chip Coming since 2019 [3]. - The acquisition was ultimately terminated due to disagreements between the management of Chip Coming and the transaction counterpart regarding valuation and strategic differences, particularly in the rapidly growing RISC-V sector [3]. Group 2: Corporate Changes - On February 6, 2026, Chip Coming completed several significant corporate adjustments, including changing its name and transforming from a limited liability company to a non-listed joint-stock company, which is a key step towards preparing for an IPO [1][2]. - The registration authority was upgraded to the Shanghai Municipal Market Supervision Administration, reflecting an elevation in its development positioning [4]. - Key management changes were made to enhance governance structure and address shortcomings in IPO preparation [4]. Group 3: Market Position and IPO Potential - Chip Coming is positioned as a leading player in the RISC-V sector, boasting over 300 customer resources and benefiting from favorable policies and market conditions, which supports its potential for an IPO [4]. - The series of corporate adjustments signals a clear intention for independent listing, with previous financing rounds and partnerships with industry leaders providing additional support [5].

2月8日，有"FPGA第一股"之称的上海安路信息科技股份有限公司（证券代码：688107，证券简称：安 路科技）发布公告，披露公司多名股东拟实施股份减持计划。公司近期陆续收到国家集成电路产业投资 基金股份有限公司（下称"国家大基金"）、上海安芯企业管理合伙企业（有限合伙）（下称"安芯合 伙"）等7名股东出具的减持计划告知函，各股东拟根据自身需求，通过合规方式减持公司部分股份。 安芯合伙及其一致行动人同步推出减持计划。其中，安芯合伙拟减持不超过365.27万股，占公司总股本 的比例不超过0.91%；其一致行动人上海安路芯半导体技术合伙企业（有限合伙）（下称"安路芯合 伙"）拟减持不超过14.81万股，占比不超过0.0369%；另一一致行动人上海芯添企业管理合伙企业（有 限合伙）（下称"芯添合伙"）拟减持不超过20.77万股，占比不超过0.05%。三者合计拟减持比例不超过 0.9969%，减持原因均为自身资金需求。据悉，安芯合伙、安路芯合伙、芯添合伙合计持有安路科技 8337.48万股股份，占公司总股本的20.80%，三者的执行事务合伙人均为上海导贤半导体有限公司，构 成一致行动关系。 此外，深圳思齐资本信息技术 ...

Core Viewpoint - The recent adjustment of shareholding ratios by major players in the domestic semiconductor packaging and testing industry, namely Changdian Technology, Tongfu Microelectronics, and Huada Semiconductor, aims to optimize the equity structure of Huajin Semiconductor, enhancing its technological research and development capabilities and driving high-quality industry growth [1][13]. Shareholding Changes - The shareholding ratio of Changdian Technology, Tongfu Microelectronics, and Huada Semiconductor in Huajin Semiconductor has been reduced from approximately 4.325% to 2.747% [1]. - Other notable shareholders include Beijing Zhongke Micro Investment Management Co., Ltd. and Wuxi Guochuang Chip Investment Management Partnership, which also experienced changes in their shareholding percentages [4][14]. Company Background - Huajin Semiconductor was established in 2012 as a collaborative effort among leading packaging and testing companies and research institutions, with a registered capital of 462.4682 million yuan [14]. - The company focuses on advanced packaging technologies such as TSV, 2.5D/3D, and Chiplet, and plays a crucial role in key technology breakthroughs and standard formulation within the industry [14][16]. Technological Capabilities - Huajin Semiconductor has built a leading semiconductor packaging and testing research center in China, with a team of nearly 100 researchers, over half of whom hold doctoral or master's degrees [16]. - The company has applied for over 1,300 patents, ranking among the top globally in the number of patents related to 2.5D/3D packaging and TSV technologies [16].

中国证监会网站近日发布瀚天天成电子科技(厦门)股份有限公司境外发行上市及境内未上市股份"全流通"备案通知书，标志着该公司赴港上市迈出关键一 步。 根据备案信息，瀚天天成计划发行不超过37,678,900股境外上市普通股，拟于香港交易所挂牌；同时，公司39名股东拟将所持合计97,431,581股境内未上市 股份转为境外上市股份，在港交所流通。 | | | | 繁體 English | [] 移动端 合 微博 ● 微信 人 无障碍 | | --- | --- | --- | --- | --- | | | 中国证券监督管理委员会 CHINA SECURITIES REGULATORY COMMISSION | | 请输入关键字 | | | △ 首页 | 宣 新闻发布 ■ 政务信息 | 价 机构概况 | 烈 办事服务 同 互动交流 | 000 统计信息 目 专题专栏 | | | ♥ 当前位置：首页 > 政务信息 > 政府信息公开 > 主动公开 > 按主题查看 > 国际合作 > 境外证券发行 > 结果公示 | | | | | 索 | | bm56000001/2026-00001526 | ਜੋ क्रेंड 结果公 ...

Core Viewpoint - The article discusses the ongoing trend of asset restructuring in the global sensor industry, highlighted by significant transactions such as Infineon Technologies AG's acquisition of ams OSRAM's non-optical analog/mixed-signal sensor business for €570 million (approximately 4.68 billion RMB) [1][4]. Group 1: Transaction Details - Infineon announced the acquisition of ams OSRAM's sensor business, which includes products for automotive, industrial, and medical applications, such as X-ray solutions and high-precision temperature sensors [3][4]. - The transaction is structured as a debt-free, cash-free asset deal, and it includes R&D capabilities, intellectual property, and testing equipment, but not production facilities [3]. - A multi-year supply agreement has been signed to ensure smooth business transition and continuity during the integration process [3]. Group 2: Strategic Implications - The acquisition is expected to enhance Infineon's position in the automotive and industrial sensor markets while expanding its product range in medical applications [4]. - The acquired business is projected to generate approximately €230 million in revenue in 2026, and the deal is anticipated to immediately boost Infineon's earnings per share [4]. - Infineon aims to leverage the acquisition to strengthen its capabilities in analog and sensor technologies, creating growth opportunities in existing and emerging markets [4]. Group 3: ams OSRAM's Strategic Focus - For ams OSRAM, the divestiture is a critical step in its plan to deleverage its balance sheet, having raised approximately €670 million from asset disposals, which will be used primarily to reduce debt [4]. - The company plans to focus on high-pixel LED lighting, AR smart glasses, AI data center optical interconnects, and advanced sensor technologies for robotics, while retaining traditional automotive lighting for stable cash flow [4]. - ams OSRAM has set a financial target for 2030, aiming for a compound annual growth rate in its semiconductor division of mid to high single digits and an adjusted EBITDA margin of 25% or more [4]. Group 4: Industry Trends - The acquisition reflects a broader trend of asset restructuring in the global sensor industry, with European semiconductor firms focusing on core businesses to enhance competitiveness [6]. - The collaboration between Infineon and ams OSRAM is expected to drive technological innovation and industry upgrades in the global semiconductor sensor and digital photonics sectors [6].

Core Viewpoint - Omron has announced a price increase for several core automation products, with adjustments ranging from 5% to 50%, effective February 7, 2026, in response to ongoing challenges in the global supply chain and rising raw material costs [2][4][9]. Group 1: Price Adjustment Details - The price adjustments will affect various product categories, including: - Small PLCs: 5%-20% - Motion Controllers: 5%-20% - General HMIs: 5%-25% - Parallel Robots: 25%-50% - Scara Robots: 20%-35% - General Relays: 12%-20% - Small Power Relays: 10%-20% - General Bases: 15%-35% - Proximity Sensors: 24%-35% - Miniature Photoelectric Sensors: 15%-25% - Rotary Encoders: 7%-30% - Fiber Optics: 25%-30% - Limit Switches: 6%-25% - Micro Switches: 14%-20% - Temperature Sensors: 5%-10% [5]. Group 2: Reasons for Price Increase - The price increase is attributed to the ongoing volatility in the global supply chain and the sustained high prices of core raw materials, which have significantly impacted manufacturing costs [4][9]. - Other companies in the industry, such as ADI and Infineon, have also initiated price hikes since late 2025, primarily due to rising costs of upstream metals and materials [9].

2月7日，上海硅产业集团股份有限公司（证券代码：688126，证券简称：沪硅产业）发布股东减持股份 计划公告，国家集成电路产业投资基金股份有限公司（下称"产业投资基金"）计划减持公司不超过3% 的股份。 公告显示，截至本次公告披露日，产业投资基金持有沪硅产业512056457股股份，占公司总股本的 15.49%，该部分股份均来自公司首次公开发行前取得，已全部解除限售并上市流通。此前12个月内， 产业投资基金曾于2026年1月7日至1月19日期间减持公司54943543股股份，减持比例达1.66%，减持价 格区间为22.55-23.54元/股。 | 股东名称 | 减持数量 | 減持比例 | 减持期间 | 减持价格区间 | 前期减持计划 | | --- | --- | --- | --- | --- | --- | | | (股) | | | (元/股) | 披露日期 | | 国家集成电路 | 54,943,543 | | 1.66% 2026/1/7~ | 22.55-23.54 | 2025/10/24 | | 产业投资基金 | | | 2026/1/19 | | | | 股份有限公司 | | | | | | ...

Core Viewpoint - The article highlights the performance of A-share listed companies in the chip design sector, particularly focusing on the profitability and growth of certain companies in 2025, with a notable emphasis on Weijie Chuangxin as the only profitable company in the RF front-end chip segment [4][23]. Summary by Sections 2025 Earnings Forecast - In January, A-share listed companies began releasing their 2025 earnings forecasts, with 45 chip design companies predicting revenue growth, and 39 of them expecting positive growth [4]. - Among 75 companies forecasting net profit attributable to shareholders, 49 anticipate positive growth, with 28 companies reporting a turnaround from losses to profits [4]. Notable Companies - Sixteen companies are expected to see net profit growth exceeding 100%, with Weijie Chuangxin leading the RF front-end segment [4][5]. - Weijie Chuangxin's net profit is forecasted to grow by 289.67%, making it the only profitable company in the RF front-end sector for 2025 [9][19]. Industry Challenges - The RF front-end sector faces challenges with stagnant demand and intense competition, making profitability difficult for many companies [6][8]. - Other companies in the RF front-end space, such as Zhuoshengwei and Angruiwei, are struggling with profitability despite some revenue growth [8]. Weijie Chuangxin's Success Factors - Weijie Chuangxin's profitability is attributed to advancements in three key markets: high-integration L-PAMiD modules, automotive-grade products, and WiFi7 products [11][13]. - The company has established strong partnerships with major platform chip manufacturers like MediaTek, which has significantly contributed to its market position and innovation capabilities [18][19]. Future Prospects - The article suggests that Weijie Chuangxin's focus on technology innovation and its unique position in the RF front-end market could lead to further growth opportunities in emerging areas such as satellite communication, 6G, and AI applications [26][24].