Core Viewpoint - The article highlights the significance of the "兆元宴" hosted by NVIDIA CEO Jensen Huang, which gathered key decision-makers from Taiwan's AI supply chain, indicating a strong focus on collaboration and potential market impacts in the AI sector [1]. Group 1: Event Overview - The "兆元宴" took place in Taipei, featuring prominent figures from Taiwan's AI industry, including leaders from TSMC, MediaTek, ASUS, Quanta, and Foxconn, showcasing the importance of these partnerships in the AI supply chain [1][3]. - The event is seen as a potential catalyst for stock performance among participating companies, with historical data indicating significant stock price increases for companies involved in the previous year's event [1]. Group 2: Stock Performance Insights - According to Yahoo Finance, among the 20 listed companies that participated in last year's "兆元宴," Delta Electronics saw the highest stock price increase of 270%, followed by Xinxing at 166% and Yidong at 147%, while TSMC's stock rose by 111%, with an average increase of approximately 34% across the 20 companies [1].

Group 1 - The core viewpoint of the article highlights that Biyimi has announced a price increase for its products due to rising upstream raw material costs and ongoing capacity shortages, aiming to ensure long-term supply chain stability and product delivery [1] - Biyimi specializes in the research, design, and sales of analog and mixed-signal chips, providing high-performance, low-power, and stable quality chip solutions across various sectors including consumer electronics, industrial control, smart IoT, data centers, and automotive electronics [3] - Recently, other companies in the industry, such as Guokemi and Zhongwei Semiconductor, have also issued price increase notices, with some products seeing price hikes of up to 50% [4]

以下文章来源于芯智讯 ，作者芯智讯浪客剑 芯智讯 . "芯智讯"——有料的科技新媒体！专注于半导体产业链、智能手机产业链、人工智能、AR/VR、智能硬 件及汽车电子等相关领域。 1月30日消息，根据业内最新传闻显示，在全球存储芯片供应持续紧缺的背景下，中国最大的NAND Flash制造商── 长江存储（YMTC）位于武汉的三期项目（第三座晶圆厂）投资项目正 以惊人的速度加 快建设，原定于2027年才能达成的量产目标，有望提前至2026年下半年正式启动。 长江存储三期项目于2025年9月正式动工。该项目的公司主体—— 长存三期（武汉）集成电路有限 责任公司（以下简称"长存三期"）成立于9月5日，注册资本207.2亿元。 股东信息显示，长存三期由长江存储持股50.19%、湖北长晟三期投资发展有限责任公司持股 49.81%。其中，湖北长晟三期投资发展有限责任公司为湖北国资旗下企业，这一背景为新公 司提供了坚实的资本与政策支持。 按照常规半导体建厂周期，需要等到2027年才能具备正式量产能力。但是，据业内人士透露，长江存储 近期已开始密集进行NAND Flash 生产设备的采购订单发送与工厂启动设置作业，显示其进度已 ...

据《日经亚洲》援引日本研究机构Global Net数据显示，2025年全球半导体设备市场规模向1680亿美元 冲刺，行业竞争格局迎来显著调整。 整体来看，美日荷企业仍主导全球市场，凭借核心技术壁垒把控先进制程关键环节；中国企业实现跨越 式发展，在刻蚀、光刻等领域从跟跑到并跑，成为国产替代核心力量，推动全球竞争版图多元化。 TOP20榜单清晰呈现两大梯队格局，头部企业垄断高端市场，中坚企业深耕细分赛道，中国三强的突围 成为最大亮点。 | 头部梯队 榜单前10名基本被美日荷企业包揽，仅北方华创作为中国企业跻身其中，这类企业覆盖从成熟制程到 3nm、2nm先进制程，是全球半导体制造的核心支撑。 荷兰阿斯麦（ASML） 仍是光刻领域绝对龙头，凭借EUV极紫外光刻技术垄断7nm以下先进制程市场， 高NA EUV设备更是3nm、2nm制程的核心装备，DUV领域亦保持技术领先。 美国应用材料（AMAT） 作为平台型巨头，产品覆盖沉积、刻蚀、检测等多环节，其Selectra5000选择性沉积设备领跑先进制程 市场； 泛林（LAM） 主导刻蚀赛道，同时在清洗、沉积领域稳居前列，是先进制程核心供应商； 科 磊（KLA） 掌控检测 ...

日前，上海高性能非易失性存储（NVM）芯片设计龙头聚辰股份正式向港交所递交上市申请，启动"A+H"双重上市布局。作为国产存储芯片领域的标杆 企业，聚辰股份凭借全品类产品矩阵与领先的市场地位，已在多个细分赛道实现国产替代突破，成为全球产业链中不可或缺的重要力量。 在汽车电子领域，聚辰股份突破海外技术垄断，成为国产车规级芯片的核心推动者，截至2025年底，是国内唯一可提供全系列车规级EEPROM芯片的供 应商，同时位列全球第三大汽车电子EEPROM供应商、中国第一大汽车电子EEPROM供应商。其车规级产品通过AEC-Q100 Grade 1认证，适 配-40℃~125℃严苛车载环境，可应用于ADAS、BMS等车载场景，随着智能汽车单车芯片用量提升，相关业务成为公司核心增长引擎。此外，在开环摄 像头马达驱动芯片市场，2024年前三大企业合计占据46.9%份额，聚辰股份以17.8%的份额位列行业第一，凭借聚焦时间短、体积小、误差率低的技术优 势，巩固了市场领先地位。 成立于2009年11月的聚辰股份，深耕芯片设计领域十余年，聚焦AI时代高速迭代的存储与混合信号芯片需求，构建了多元化产品矩阵，涵盖SPD芯片、 EEPR ...

Core Viewpoint - The company, Sda Semiconductor Co., Ltd., has received approval from the Shanghai Stock Exchange for its application to issue convertible bonds, aiming to raise funds for strategic projects in the power semiconductor sector [1][5]. Company Overview - Sda Semiconductor is a leading player in the domestic power semiconductor industry, headquartered in Jiaxing, Zhejiang, with subsidiaries in Shanghai, Zhejiang, Chongqing, and Europe. The company focuses on the design, research, production, and sales of power semiconductor chips and modules, particularly IGBT and SiC technologies [4]. - The company ranks fifth globally in the IGBT module market according to Omdia's 2023 report, showcasing its competitive strength [4]. Financial Performance - For the first half of 2025, the company reported operating revenue of 1.935 billion, a decrease from 3.391 billion in 2024 and 3.663 billion in 2023. The net profit for the same period was 279 million, down from 513 million in 2023 [5]. - The company has a stable shareholding structure, with Hong Kong Sda holding 41.66% of the shares, making it the controlling shareholder [5][6]. Fundraising and Project Focus - The company plans to raise 1.5 billion for four core projects, aligning with industry trends and its strategic layout. The projects include: - Manufacturing of automotive-grade SiC MOSFET modules, with an investment of 600 million [7]. - Manufacturing of IPM modules, with an investment of 270 million [7]. - Industrialization of automotive-grade GaN modules, with an investment of 200 million [7]. - Supplementing working capital, with an investment of 430 million [7]. - The demand for power semiconductors is growing, particularly for third-generation semiconductor devices like SiC and GaN in sectors such as new energy vehicles and energy storage [7]. Market Position and Opportunities - The company is a major supplier of high-power automotive-grade IGBT/SiC modules for electric vehicle motor controllers, with plans to supply over 3 million sets in 2024 [4]. - The successful fundraising from the convertible bonds will enhance the company's production capacity and technological competitiveness, allowing it to seize opportunities in the rapidly evolving power semiconductor industry [7].

1月30日，闻泰科技发布2025年业绩预告，公司全年业绩出现大幅亏损，核心系子公司安世半导体相关 控制权受限引发连锁反应，具体业绩数据如下： 业绩数据方面，2025年公司归属于母公司所有者的净利润预计为-135亿元至-90亿元，扣除非经常性损 益后的净利润预计为-3亿元至-2亿元。对比上年同期数据，公司此前利润总额为-19.11亿元，归属于母 公司所有者的净利润为-28.33亿元，扣非后归母净利润为-32.42亿元，每股收益为-2.28元/股，可见本期 亏损规模显著扩大，核心差异源于非经常性损益相关的投资及资产减值损失。 | | | 业绩变动的核心诱因是子公司安世的控制权受限问题，该事项不仅直接影响公司对核心资产的管 控，更对整体经营及业绩核算造成根本性冲击。 2025年第四季度，闻泰科技核心子公司安世半导体有限公司与安世半导体控股有限公司（合称"安 世"），先后收到荷兰经济事务与气候政策部下达的部长令（Order）及阿姆斯特丹上诉法院企业法 庭的裁决。截至本报告期末，虽经公司推动，上述荷兰经济事务与气候政策部的部长令已被宣布暂 停执行，但阿姆斯特丹上诉法院企业法庭的裁决仍处于生效状态，这一法律层面的生效裁决 ...

Core Viewpoint - The leading domestic AI chip company, Cambricon, has reported a significant turnaround in its financial performance for the year 2025, achieving substantial revenue growth and profitability for the first time in its history [1][4]. Financial Performance - Cambricon is expected to achieve an operating revenue of between 6 billion to 7 billion yuan in 2025, representing an increase of 4.826 billion to 5.826 billion yuan compared to 1.174 billion yuan in 2024, with a year-on-year growth rate of 410.87% to 496.02% [4]. - The net profit attributable to the parent company is projected to be between 1.85 billion to 2.15 billion yuan, a significant recovery from a net loss of 0.452 billion yuan in 2024 [4]. - The net profit after deducting non-recurring gains and losses is expected to reach between 1.6 billion to 1.9 billion yuan, indicating strong core business competitiveness [4]. - In Q1 2025, the company reported a revenue increase of 4230.22% year-on-year, with both net profit and net profit excluding non-recurring items turning positive, setting a solid foundation for the annual performance [4]. - By the end of Q3 2025, cumulative revenue reached 4.607 billion yuan, a year-on-year increase of 2386.38%, with net profit of 1.605 billion yuan, nearing the lower limit of the annual forecast [4]. Growth Drivers - The substantial growth and turnaround in profitability are primarily attributed to the continuous rise in demand for computing power in the AI industry, alongside the company's focus on research and development in AI chip products and technological innovation [5][6]. - Cambricon has established a comprehensive product system covering cloud, edge, and end devices, meeting various AI computing needs across different scales [6]. - The company’s core products, such as the Siyuan 590 and Siyuan 370, have become mainstream market choices, while the edge product Siyuan 220 has also seen significant growth [6]. Industry Context - The remarkable performance of Cambricon reflects broader opportunities within the domestic AI chip industry, driven by the explosive demand for AI computing power and the acceleration of domestic substitution processes [7]. - The Chinese AI chip market is experiencing rapid growth, with increasing space for domestic alternatives, positioning Cambricon favorably to capitalize on these industry trends [7].

日前，清华大学电子工程系官网信息显示，沈渊教授为该系新任系主任。汪玉教授不再担任系主任一职。 沈渊，清华大学电子工程系系主任、长聘教授、博导。本科毕业于清华大学电子工程系，博士毕业于美国麻省理工学院电子工程与计算机科学系，曾任该 校信息与决策实验室博士后研究员。 长期深耕定位导航、通信感知、生物信息等领域，在统计推断与学习、通信与信息论、优化与控制论方面积淀深厚。入选国家青年高层次人才计划，获国 家自然科学基金青年科学基金（A 类）支持，主持国家自然科学基金、国家重点研发计划等 20 余项项目。 科研成果丰硕，曾获中国电子学会自然科学一等奖、科技进步一等奖，中国航空运输协会民航科学技术一等奖等多项奖励；出版著作及章节 4 部，获国内 外发明专利授权 30 项（中国 26 项、美国 4 项）；在领域顶刊及国际会议发表论文百余篇，斩获 IEEE 通信协会 Ellersick 最佳论文奖等多项论文奖项。个 人荣誉方面，摘得马可尼协会青年学者奖、求是科学基金会杰出青年学者奖、IEEE 通信协会亚太地区杰出青年学者奖等殊荣。 学术任职经历丰富，2019-2020 年任 IEEE 通信协会无线电通讯技术委员会主席，担任 ...

Core Viewpoint - The Chinese semiconductor industry has experienced a financing boom in the past six months (August 2025 - January 2026), with capital focusing on key segments such as inference GPUs, AI chips, server chips, advanced packaging, and wide bandgap semiconductors [1]. Financing Events Overview Over 2 Billion RMB Financing Events - **Sunrise**: Completed approximately 3 billion RMB in strategic financing, focusing on inference GPUs, with plans for next-generation GPU development and ecosystem building [1]. 1-2 Billion RMB Financing Events - **Aixin Yuanzhi**: Secured over 1 billion RMB in C-round financing, with a post-investment valuation of 10.6 billion RMB, aiming to become the "first stock of China's edge AI chips" [3]. - **Borui Jingxin**: Received over 1 billion RMB in financing, focusing on ARM server chips and digital solutions for various industries [4]. 500 Million to 1 Billion RMB Financing Events - **Heizhima Intelligent**: Obtained 500 million RMB in strategic investment, focusing on edge AI and embodied intelligence [5][6]. - **Jindishi Technology**: Completed over 600 million RMB in B-round financing, focusing on RISC-V AI chips [7]. - **Zhizhan Technology**: Secured nearly 300 million RMB in C-round financing, focusing on silicon carbide power semiconductor devices [8]. - **Mingjia Semiconductor**: Completed 110 million RMB in A++ round financing, focusing on gallium oxide semiconductors [9]. - **Xiqian Semiconductor**: Achieved over 1 billion RMB in strategic financing, focusing on silicon-based capacitors and related technologies [11]. - **Xulun Technology**: Completed over 1 billion RMB in A3 and A4 round financing, focusing on advanced packaging materials [12]. - **Lanxin Computing Power**: Secured over 1 billion RMB in A-round financing, focusing on RISC-V architecture intelligent computing chips [13]. - **Liangxuan Technology**: Completed several hundred million RMB in C-round financing, focusing on quantum computing [14]. - **Ruishi Technology**: Achieved several hundred million RMB in C-round financing, focusing on semiconductor optical chips [15]. Financing Characteristics - Capital is concentrated in high-end chips and advanced materials, addressing critical areas such as inference GPUs and ARM server chips, while also covering wide bandgap semiconductors and advanced packaging materials [16]. - The financing scale is clear, with leading companies like Sunrise and Aixin Yuanzhi securing over 1 billion RMB, while over 70% of smaller "specialized and innovative" companies received financing in the 100 million RMB range [16]. - Local state-owned platforms and industrial funds are key investors, focusing on both financial returns and the improvement of the industrial chain [16]. - The financing companies align with the distribution of semiconductor industry clusters, with major cities like Beijing, Shanghai, and Shenzhen leading, while emerging cities like Chengdu are also gaining traction [16].