使用部分闲置募集资金进行现金管理的核查意见 国泰君安证券股份有限公司、中航证券有限公司（以下简称"保荐机构"） 作为深南电路股份有限公司（以下简称"深南电路"、"公司"） 非公开发行 A 股 的保荐机构，根据《上市公司监管指引第 2 号——上市公司募集资金管理和使用 的监管要求》《深圳证券交易所股票上市规则》及《深圳证券交易所上市公司自 律监管指引第 1 号——主板上市公司规范运作》等相关法律、法规及规范性文件 的规定，对深南电路等有关规定，对深南电路拟使用部分闲置募集资金进行现金 管理的事项进行了核查，具体情况如下： 一、募集资金情况 公司经中国证券监督管理委员会《关于核准深南电路股份有限公司非公开发 行股票的批复》（证监许可〔2021〕4151 号）核准，非公开发行人民币普通股 23,694,480 股，共计募集资金总额 2,549,999,937.60 元，扣除与发行有关的费 用 （ 不 含 税 ） 人 民 币 20,335,154.66 元 ， 实 际 募 集 资 金 净 额 为 人 民 币 2,529,664,782.94 元。上述募集资金的到位情况已经立信会计师事务所（特殊普 通合伙）审验并出具《 ...

证券代码：002916 证券简称：深南电路 公告编号：2024-055 深南电路股份有限公司 关于使用部分闲置募集资金进行现金管理的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 深南电路股份有限公司（以下简称"公司"）于 2024 年 12 月 27 日召开第四 届董事会第四次会议，审议通过了《关于使用部分闲置募集资金进行现金管理的 议案》。为提高暂时闲置募集资金使用效率，合理利用暂时闲置募集资金，在保 证募投项目资金需求和资金安全的前提下，根据《上市公司监管指引第 2 号—— 上市公司募集资金管理和使用的监管要求》《深圳证券交易所股票上市规则》《深 圳证券交易所上市公司自律监管指引第 1 号——主板上市公司规范运作》等有关 法律法规的规定，公司拟使用不超过人民币 5.60 亿元（含本数）的闲置募集资金 进行现金管理，用于购买期限不超过 12 个月（含）的保本型产品。使用期限自 董事会审议通过之日起 12 个月内有效，可以循环滚动使用，到期后归还至募集 资金专用账户。 一、募集资金情况 公司于 2023 年 6 月 13 日召开第三届董事会第二十三次会 ...

证券代码：002916 证券简称：深南电路 公告编号：2024-054 深南电路股份有限公司 | 关联交易 类型 | 关联方 | 关联交易 内容 | 关联交易定价 原则 | 2025年预计 交易金额 | 2024年1-11月 实际发生交易 | | --- | --- | --- | --- | --- | --- | | | | | | | 金额 | | 采购商品 | 中航工业及下 属企业 | 原材料/商 品/劳务 | 参照市场价格 | 9,590.00 | 8,104.05 | | | 华进半导体 | 原材料/商 品/劳务 | 参照市场价格 | 40.00 | 26.55 | | | | 小计 | | 9,630.00 | 8,130.60 | | 销售产品 | 中航工业及下 属企业 | 产品 产品 | 参照市场价格 参照市场价格 | 23,440.00 30,000.00 | 28,188.91 31,215.76 | | | 天马微电子股 | | | | | | | 份有限公司 | | | | | | | 华进半导体 | 产品 | 参照市场价格 | 30.00 | 0.00 | | | | 小计 | | ...

证券代码：002916 证券简称：深南电路 公告编号：2024-053 一、监事会会议召开情况 深南电路股份有限公司（以下简称"公司"）第四届监事会第四次会议于 2024 年 12 月 27 日以通讯方式召开。会议通知于 2024 年 12 月 20 日以通讯方式向全 体监事发出。本次应参与表决监事 3 人，实际表决 3 人，本次会议的召开符合有 关法律、行政法规、部门规章、规范性文件和《公司章程》的规定。 二、监事会会议审议情况 深南电路股份有限公司 第四届监事会第四次会议决议 本公司及监事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 本次会议审议并通过了以下议案： （一）《关于使用部分闲置募集资金进行现金管理的议案》 在确保不影响募集资金投资计划的前提下，为了提高公司募集资金使用效率， 增加现金管理收益，公司拟使用不超过人民币 5.60 亿元（含本数）闲置募集资金 购买期限不超过 12 个月（含）的保本型产品，在上述额度范围内，资金可滚动 使用。 深南电路股份有限公司 监事会 二〇二四年十二月二十七日 与会监事以同意 3 票、反对 0 票、弃权 0 票的结果通过。 ...

证券代码：002916 证券简称：深南电路 | --- | |---------------------------------------------------------------------------------------------------------------------| | | | HDI 作为一项平台型工艺技术，可实现 PCB 板件的高密度布线。公司 PCB 业务具备 | | HDI 工艺能力，主要应用于通信、数据中心、工控医疗、汽车电子等下游领域的部分中高端 | | 产品。 | | Q4 、请介绍公司 PCB 业务今年前三季度在数据中心领域的布局拓展情况。 | | 数据中心是公司 PCB 业务重点布局领域之一，聚焦服务器、存储及周边产品。 2024 年 | | 前三季度，全球主要云服务厂商资本开支规模明显回升，并重点用于算力投资，带动 AI 服 | | 务器相关需求增长，叠加通用服务器 Eagle Stream 平台迭代升级，服务器总体需求回温。在 | | 此期间，公司数据中心领域订单同比显著增长，主要得益于 AI 加速卡、 Eagle Stream 平台产 | | 品持续放量 ...

Group 1: Company Overview - The company primarily engages in the design, research, and manufacturing of high-end PCB products, focusing on applications in communication devices, data centers, automotive electronics, industrial control, and medical fields [2][4]. Group 2: Impact of AI on Business - The acceleration of AI technology is driving demand for high-performance PCB products, particularly in high-speed communication networks, data center switches, AI accelerator cards, and memory sectors [2][4]. Group 3: HDI Technology Capabilities - The company possesses HDI (High-Density Interconnect) technology, which is crucial for high-density wiring in PCBs, applicable in communication, data centers, industrial control, medical, and automotive electronics [4]. Group 4: Data Center Business Expansion - In the first three quarters of 2024, the company saw a significant increase in orders in the data center sector, driven by the rising demand for AI accelerator cards and the upgrade of the Eagle Stream platform [4]. Group 5: Packaging Substrate Product Layout - The company offers a wide range of packaging substrate products, including module packaging substrates and storage packaging substrates, and has achieved mass production capabilities for various packaging forms [4]. Group 6: Capacity Utilization - The overall capacity utilization rate has remained stable compared to the third quarter of 2024, indicating consistent operational efficiency [4]. Group 7: Compliance with Disclosure Regulations - The company adhered strictly to information disclosure regulations during the investor relations activity, ensuring no significant undisclosed information was leaked [4].

证券代码：002916 证券简称：深南电路 编号：2024-75 深南电路股份有限公司投资者关系活动记录表 | --- | --- | --- | --- | |--------------------------------|---------------------------------------------------------------------|-------|----------------------------------------------------------------------------------| | 投资者关系 活动类别 | □特定对象调研 □分析师会议 \n□媒体采访 □业绩说明会 \n□路演活动 √其他 | （ | □现场参观 \n □新闻发布会 \n上市公司网上集体接待日 ） | | 活动参与人 员（排名不 分先后） | 投资者网上提问 | | | | 上市公司 接待人员 | | | 副总经理、董事会秘书：张丽君；总会计师：楼志勇；独立董事：于洪宇 | | 时间 | 2024 年 12 月 12 日 | | | | 地点 | 全景网"投资者关系互动平台" ...

证券代码：002916 证券简称：深南电路 公告编号：2024-050 特此公告。 深南电路股份有限公司 深南电路股份有限公司 关于参加 2024 年度深圳辖区上市公司 董事会 集体接待日活动的公告 二〇二四年十二月六日 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 为进一步加强与投资者的互动交流，深南电路股份有限公司（以下简称"公 司"）将参加由深圳证监局和深圳证券交易所指导、深圳上市公司协会与深圳市 全景网络有限公司联合举办的"2024 年度深圳辖区上市公司集体接待日" 活动， 现将相关事项公告如下： 本次活动将采用网络远程的方式举行，投资者可登录"全景路演"网站 （https://rs.p5w.net），或关注微信公众号：全景财经，或下载全景路演 APP，参 与本次互动交流，交流时间为 2024 年 12 月 12 日（周四）15:40-17:00。届时公 司独立董事及高管将在线与投资者进行沟通与交流，欢迎广大投资者踊跃参与！ ...

Group 1: Company Overview - The company focuses on the electronic interconnection field, with three main businesses: printed circuit boards (PCBs), electronic assembly, and packaging substrates, forming a unique "3-In-One" business layout [2][4] - As of the first half of 2024, PCB business accounted for approximately 58% of total revenue, packaging substrates for about 19%, and electronic assembly for around 15% [2][4] Group 2: Packaging Substrate Development - Since 2008, the company has been incubating its packaging substrate business, starting from niche products and has become a pioneer in the field in China [4][6] - The company has established a wide range of packaging substrate products, including module packaging substrates and storage packaging substrates, primarily used in mobile smart terminals and servers [4][6] Group 3: Production Capacity and Projects - The Wuxi substrate phase II factory started production in late September 2022 and has achieved monthly breakeven [6] - The Guangzhou packaging substrate project phase I began production in Q4 2023, with rapid capacity enhancement ongoing [6] Group 4: Impact of AI on PCB Business - The acceleration of AI technology and its applications have increased demand for high-performance PCB products, particularly in high-speed communication networks and data centers [6][4] Group 5: Financial Performance - In Q3 2024, the company reported revenue of 4.728 billion RMB, an increase of 8.45% quarter-on-quarter, primarily due to increased project settlements in electronic assembly [6] - The overall gross margin slightly decreased due to changes in product structure and rising raw material costs [6]

Group 1: Company Overview and Business Expansion - The company focuses on PCB business with applications in communication devices, data centers, automotive electronics, industrial control, and medical fields [2] - In Q3 2024, the company's revenue in data centers and automotive electronics increased compared to Q2, while revenue from the communication sector declined due to lack of demand [2] - The company has invested 1.274 billion RMB in building a factory in Thailand to expand overseas market presence [4] Group 2: AI and Technology Impact - The advancement of AI technology has increased demand for high-performance PCB products, particularly in high-speed communication networks and data centers [2] - The company is adapting to the growing needs for larger, high-layer, high-frequency, and high-heat dissipation PCBs driven by new information technology [2] Group 3: Automotive Electronics Strategy - The company is focusing on the new energy and ADAS sectors, which require higher integration and more complex designs for PCBs compared to traditional automotive electronics [4] - The trend towards electric and intelligent vehicles is expected to transform cars into mobile data terminals, leveraging the company's communication technology advantages [4] Group 4: Electronic Assembly Business - The electronic assembly business is positioned as a downstream segment of PCB manufacturing, focusing on communication, data centers, medical, and automotive electronics [4] - The company aims to enhance customer loyalty by providing integrated solutions that leverage its PCB technology platform [4] Group 5: Production Capacity and Market Demand - In Q3 2024, PCB factory utilization rates remained stable at high levels, while packaging substrate factory utilization slightly decreased due to fluctuations in downstream demand [6] - The company is progressing with the Guangzhou packaging substrate project, focusing on platform capability and customer product certification [6] Group 6: FC-BGA Packaging Substrate Development - The company has achieved mass production capabilities for FC-BGA substrates with up to 16 layers, and is progressing with sample production for 20-layer products [6] - Future plans include accelerating technological breakthroughs in high-end products and enhancing the R&D team to strengthen core competitiveness [6]