证券代码：300684 证券简称：中石科技 公告编号：2025-047 北京中石伟业科技股份有限公司（以下简称"公司"或"中石科技"）于 2025 年 4 月 14 日召开了第五届董事会第二次会议以及第五届监事会第二次会议，审 议并通过了《关于回购公司股份方案的议案》，同意公司使用自有资金以集中竞 价交易的方式回购公司部分股份，用于实施股权激励或员工持股计划。本次回购 股份的资金总额不低于人民币1,500万元（含），且不超过人民币3,000万元（含）， 回购股份的价格不超过 30.00 元/股；回购期限自公司董事会审议通过本次回购股 份方案之日起 12 个月内。具体内容详见公司分别于 2025 年 4 月 14 日、2025 年 4 月 15 日在巨潮资讯网（www.cninfo.com.cn）披露的《关于回购公司股份方案 的公告》（公告编号：2025-009）和《回购报告书》（编号：2025-010）。 因实施 2024 年年度权益分派，公司本次回购股份价格上限由不超过人民币 30.00 元/股（含）调整为不超过人民币 29.35 元/股（含）。具体内容详见公司于 2025 年 5 月 21 日在巨潮资讯网 ...

Core Viewpoint - The article emphasizes the critical role of thermal management in the performance and reliability of electronic devices, driven by increasing power density due to advancements in technologies like 5G, AI, and IoT. Effective heat dissipation solutions are essential to prevent device failures and ensure optimal operation [7][10][15]. Group 1: Thermal Density and Management - The rise in power density of electronic components necessitates advanced thermal management solutions, as temperature increases can significantly reduce system reliability [7][10]. - The failure rate of electronic components increases exponentially with temperature, with a 50% reduction in reliability for every 10°C increase [7][8]. - The thermal flow density has surged from under 10W/cm² to nearly 100W/cm², driven by both increased power and reduced chip sizes [11][15]. Group 2: Passive Cooling Solutions - Passive cooling methods, which do not use active components, include materials like metal heat sinks, graphite films, and heat pipes, relying on thermal interface materials (TIMs) to transfer heat away from components [23][26]. - Metal heat sinks are effective for low-power devices but face limitations in high-power applications due to their thermal transfer rates [28][31]. - Graphite films have been widely adopted in consumer electronics for their high thermal conductivity in the X-Y plane, although their Z-axis conductivity is limited [32][33]. Group 3: Active Cooling Solutions - Active cooling methods, such as forced air cooling and liquid cooling, are becoming necessary as device power levels increase beyond the capabilities of passive systems [68][69]. - Liquid cooling systems can achieve heat dissipation rates of 10-1000W/cm², significantly outperforming air cooling methods [73][74]. - Data centers are increasingly adopting liquid cooling solutions to manage the rising power density of servers, with some configurations exceeding 30kW per cabinet [80][81]. Group 4: Market Opportunities and Beneficiaries - Companies involved in the development of advanced thermal management solutions, such as VC (vapor chamber) technology and liquid cooling systems, are positioned to benefit from the growing demand for efficient heat dissipation in high-performance electronics [49][54]. - Key players in the market include companies like Feirongda, Suzhou Tianmai, and others that are innovating in thermal management technologies [5][6].

Market Performance - The electronic chemicals sector declined by 1.53% on July 31, with Rongda Photoelectric leading the drop [1] - The Shanghai Composite Index closed at 3573.21, down 1.18%, while the Shenzhen Component Index closed at 11009.77, down 1.73% [1] Stock Performance - Siquan New Materials (301489) saw a significant increase of 20.00%, closing at 103.66 with a trading volume of 66,300 shares and a transaction value of 667 million [1] - Tiancheng Technology (688603) increased by 1.97%, closing at 65.26 with a trading volume of 98,000 shares and a transaction value of 659 million [1] - Other notable performances include Tongyu New Materials (301630) up by 0.91%, Guanghua Technology (002741) up by 0.61%, and Zhongshi Technology (300684) up by 0.50% [1] Capital Flow - The electronic chemicals sector experienced a net outflow of 795 million from institutional investors, while retail investors saw a net inflow of 851 million [3] - Speculative funds had a net outflow of 56.71 million [3]

Core Viewpoint - The company, Zhongshi Technology, confirmed its products are utilized in the consumer electronics sector, including applications in Huawei smartphones, and serves major global clients in the industry [2]. Group 1: Company Products - The main products offered by the company in the consumer electronics industry include high thermal conductivity graphite products, thermal interface materials, heat pipes, heat spreaders, thermal modules, EMI shielding materials, adhesive materials, and sealing materials [2]. - These products are applied in various devices such as smartphones, tablets, laptops, smart wearable devices, and smart home devices [2]. Group 2: Clientele - The company has achieved comprehensive coverage of leading clients in the 3C industry, providing long-term services to major North American clients, including Samsung, Microsoft, Google, Amazon, Honor, DJI, and others [2].

Investment Rating - The report maintains an "Outperform" rating for the heat management industry, driven by the slowdown of Moore's Law and the rise of edge AI applications [1]. Core Insights - The heat management industry is undergoing significant upgrades due to the deceleration of Moore's Law and the explosive growth in cloud computing power demands, leading to increased pressure on thermal management solutions for edge AI applications [1][2]. - Passive cooling methods are nearing their physical limits, prompting a shift towards active cooling technologies in mobile devices [3][4]. Summary by Sections 1. Moore's Law Slowdown and Edge AI Iteration - The growth rate of transistor density has significantly slowed, with the compound annual growth rate (CAGR) dropping to single digits for processes below 5nm, indicating the gradual failure of Moore's Law [19][20]. - As performance demands increase, the power consumption per unit area of chips is rising, necessitating enhanced thermal management solutions [24][25]. - The limitations of passive cooling methods are becoming evident, as the area of vapor chambers (VC) is increasing while material iterations are slowing down [43][44]. 2. Transition to Active Cooling Technologies - The industry is expected to enter an active cooling era, with technologies like micro-pump liquid cooling and micro fans becoming more prevalent [3][4]. - By 2030, it is projected that the penetration rate of active cooling in smartphones will reach 30%, with a market size of approximately 20 billion yuan [3][4][75]. 3. Investment Highlights and Beneficiary Segments - Active cooling technologies are anticipated to unlock the full potential of edge AI applications, with significant benefits for companies involved in the thermal management supply chain [4][4]. - Key players in the thermal management module sector include Feirongda, Suzhou Tianmai, and Zhongshi Technology, while chip-related companies include Aiwei Electronics and Nanchip Technology [4][4].

Core Viewpoint - The company, Zhongshi Technology, provides thermal management solutions that are widely applicable across various industries, including consumer electronics and clean energy [1] Group 1: Product Offerings - The company's thermal management solutions include high thermal conductivity graphite products, thermal interface materials, heat pipes, heat spreaders, and thermal modules [1] - These products are utilized in consumer electronics such as smartphones, tablets, laptops, smart wearable devices, and smart home devices [1] - The solutions are also applicable in digital infrastructure, including communication base stations, servers, and optical communication modules [1] Group 2: Industry Applications - The company's products have universal applicability and can be used in the AI glasses sector [1] - The thermal management solutions are relevant for smart transportation and clean energy industries [1]

Group 1 - The company responded to an investor inquiry regarding the applicability of its thermal management products in AI glasses, indicating that its products are versatile and can be used in this field [2] - The company's thermal management solutions include high thermal conductivity graphite products, thermal interface materials, heat pipes, heat spreaders, and thermal modules [2] - These products are widely used in various industries, including consumer electronics, digital infrastructure, smart transportation, and clean energy [2] Group 2 - The company's main products are applicable to electronic devices in sectors such as smartphones, tablets, laptops, smart wearable devices, and smart home equipment [2] - The company highlighted that its solutions are suitable for digital infrastructure applications like communication base stations, servers, and optical communication modules [2]

Core Viewpoint - The company provides a range of thermal management and EMI shielding materials for the consumer electronics industry, serving major global clients including Huawei, Samsung, Microsoft, Google, Amazon, and others [1] Group 1: Product Offerings - The company offers high thermal conductivity graphite products, thermal interface materials, heat pipes, heat spreaders, thermal modules, EMI shielding materials, adhesives, and sealing materials [1] - These products are utilized in various devices such as smartphones, tablets, laptops, smart wearables, and smart home devices [1] Group 2: Client Base - The company has achieved comprehensive coverage of leading clients in the 3C (computer, communication, consumer electronics) industry [1] - It has long-term service relationships with major North American clients and other international consumer electronics companies [1]

Group 1 - The core viewpoint of the news highlights the significant performance of Zhongshi Technology (300684), with a stock price increase of 11.18% to 30.33 yuan as of July 29, 2025, and a trading volume of 362,100 hands, amounting to 1.059 billion yuan [1] - The company reported a total operating revenue of 349 million yuan for Q1 2025, reflecting a year-on-year growth of 16.41%, and a net profit attributable to shareholders of 61.73 million yuan, which is a remarkable increase of 105.70% [1] - The company's financial ratios indicate a strong liquidity position, with a current ratio of 5.384 and a quick ratio of 4.898, alongside a low debt-to-asset ratio of 13.91% [1] Group 2 - Zhongshi Technology has made investments in 11 companies and participated in 27 bidding projects, showcasing its active engagement in the market [2] - The company holds a total of 10 trademark registrations and 149 patents, indicating a strong focus on intellectual property [2] - Additionally, Zhongshi Technology possesses 7 administrative licenses, further demonstrating its operational capabilities [2]

Investment Rating - The report assigns a "Buy" rating for the company, marking its first coverage [1]. Core Insights - The company is experiencing rapid revenue growth from high-efficiency heat dissipation modules, with a projected revenue of 1.566 billion yuan in 2024, representing a year-on-year increase of 24.51%. The net profit attributable to shareholders is expected to reach 201 million yuan, a significant increase of 173.04% [4]. - For the first half of 2025, the company anticipates a net profit of 116 to 129 million yuan, reflecting a growth of 85.01% to 105.75%, driven by increased demand in the consumer electronics sector and the introduction of new projects and products [4]. - The company is strategically expanding its product applications in AI-enabled hardware and is maintaining a leading position in the artificial graphite materials sector [5]. Company Overview - The latest closing price is 27.13 yuan, with a total market capitalization of 8.1 billion yuan and a circulating market value of 5.5 billion yuan. The company has a total share capital of 300 million shares, with 203 million shares in circulation [3]. - The company has a debt-to-asset ratio of 19.5% and a price-to-earnings ratio of 40.13 [3]. Financial Projections - Revenue projections for 2025, 2026, and 2027 are 1.961 billion yuan, 2.432 billion yuan, and 3.104 billion yuan, respectively. The net profit attributable to shareholders is expected to be 295 million yuan, 375 million yuan, and 490 million yuan for the same years [8]. - The report indicates that the current stock price corresponds to price-to-earnings ratios of 28, 22, and 17 for the years 2025, 2026, and 2027, respectively [8].