Core Insights - ASUS is aggressively pursuing the AI PC market, unveiling its new generation of AI technologies during the CES 2026 event with a focus on Workspace AI, Creator AI, and Everyday AI to meet consumer, creator, and commercial demands [1] Group 1: AI Strategy and Product Focus - ASUS's AI strategy encompasses seven areas, including AI Infrastructure, Sustainability AI, Workspace AI, Industrial AI, Everyday AI, Creator AI, and Healthcare AI, with a specific focus on Workspace AI, Creator AI, and Everyday AI at CES [2] - The new commercial and creator devices from ASUS are primarily equipped with Intel's latest processors, while also increasing the use of AMD and Qualcomm chips, aiming to create a comprehensive AI ecosystem with proprietary AI software [2] Group 2: Product Launches - ASUS introduced the ASUS V400 AiO, the world's first all-in-one computer featuring the Snapdragon X processor, supporting multitasking, light creative work, and casual gaming, along with complete Copilot AI functionality [3]

Core Insights - The competition among major chip manufacturers is intensifying around the foundational computing power for AI, with native AI hardware accelerating its large-scale implementation, transitioning from laboratory settings to consumer and industrial applications [1][2] - Chinese manufacturers are playing an increasingly significant role at global tech events, showcasing their advancements in AI hardware and capabilities, which are supported by their supply chain and R&D strengths [2][11] Group 1: Computing Power and AI Development - The rapid evolution of underlying computing infrastructure is crucial for the accelerated development of AI large models, with chip leaders emphasizing the exponential growth of computing power and the new application opportunities it creates [3][4] - NVIDIA's CEO highlighted the arrival of the "ChatGPT moment" for physical AI, indicating that machines are beginning to understand and act in the real world, with autonomous taxis being one of the first applications to benefit [3] - AMD's CEO noted that the floating-point computing power for training AI models is growing fourfold annually, with inference token consumption increasing by 100 times over the past two years, necessitating new product offerings to meet Yotta-scale infrastructure demands [4] Group 2: Emerging AI Applications - The potential of edge AI is significant, with advancements in smart wearable devices being highlighted as a new category of mobile terminals that will coexist with smartphones [5][6] - Qualcomm's CEO projected that the market for personal AI devices could reach 100 million units in the coming years, emphasizing the importance of edge data for providing highly relevant user services [6] Group 3: Robotics and Physical AI - The maturity of physical AI was showcased at CES, with Chinese manufacturers presenting advanced robots that demonstrate improved capabilities compared to previous years [7][8] - The introduction of humanoid robots and their increasing commercial viability was noted, with companies achieving substantial progress in motion control and operational precision [9][10] - The integration of hardware, sensors, and environmental perception into scalable systems is seen as essential for advancing physical AI applications across various industries [10] Group 4: Chinese Manufacturers' Competitive Edge - Chinese companies are leveraging their supply chain efficiencies and R&D capabilities to drive rapid iterations and cost optimization in the robotics sector, significantly outpacing European competitors in product development cycles [11][12] - The shift from simple manufacturing to innovative solutions reflects a broader transformation in the perception of "Made in China" to "Created in China," highlighting the technological advancements and better solutions being offered [12]

Real Estate Sector - Former President Trump's proposal to ban large institutional investors from purchasing single-family homes has led to significant declines in stock prices for major real estate companies, with American Homes 4 Rent (AMH) down 4.7% and Blackstone (BX) falling as much as 9.3% before settling at a 5.4% decrease [2][3]. Artificial Intelligence Sector - AI startup Anthropic is in the process of raising $10 billion, which would increase its valuation to approximately $350 billion, following substantial investments from Microsoft and Nvidia [4]. Automotive Technology - Hyundai Mobis and Qualcomm Technologies, Inc. (QCOM) have entered into a broad agreement to collaborate on software-defined vehicle (SDV) architecture for Advanced Driver-Assistance Systems (ADAS), aiming to enhance vehicle capabilities through integrated technology [5]. Energy Sector - The U.S. Department of Energy has announced a selective rollback of sanctions on Venezuela, allowing the transport and sale of Venezuelan crude and oil products to global markets, with proceeds to be managed in U.S.-controlled accounts [6]. Financial Markets - UBS Group AG (UBS) successfully completed a €3 billion debt offering, structured in two tranches, attracting over $21 billion in investor bids [8].

Core Insights - Hyundai Mobis and Qualcomm Technologies Inc. have signed a comprehensive agreement to co-develop next-generation solutions for Software-Defined Vehicles (SDV) and Advanced Driver Assistance Systems (ADAS) at CES 2026 [1][6] Group 1: Collaboration Details - The MOU signing was attended by key executives from both companies, indicating a high-level commitment to the partnership [2] - The collaboration aims to develop integrated solutions tailored for emerging markets, leveraging Hyundai Mobis's expertise in system integration and sensor fusion alongside Qualcomm's leadership in system-on-chip (SoC) technology [3] Group 2: Focus Areas - The initial focus will be on co-developing advanced driving and parking solutions based on Qualcomm's Snapdragon Ride Flex SoC, targeting fast-growing markets like India where ADAS adoption is increasing [4] - Future SDV applications will involve creating integrated solutions that combine Hyundai Mobis's standardized software platform with Qualcomm's Snapdragon automotive technologies to enhance performance, efficiency, and stability [4] Group 3: Strategic Initiatives - Hyundai Mobis hosted a private exhibition booth at CES 2026 to showcase its strategy of expanding into new business areas, including robotics, SDV solutions, and semiconductors, with over 200 representatives from major customers visiting for discussions [5]

Core Viewpoint - Qualcomm is likely to utilize Samsung's 2nm chip manufacturing process for its next-generation mobile application processors, marking a return to Samsung after years of reliance on TSMC for advanced chip manufacturing [2] Group 1: Qualcomm and Samsung - Qualcomm is in discussions with multiple foundries, including Samsung, for the adoption of cutting-edge 2nm chip manufacturing processes [2] - The majority of Qualcomm's new core chip designs for PCs, smartphones, and AI data centers have been completed, aiming for large-scale manufacturing and commercialization soon [2] - This potential deal signifies Qualcomm's shift from nearly exclusive reliance on TSMC to Samsung's advanced manufacturing capabilities [2] Group 2: TSMC's Market Position - TSMC's stock surged by 6.9%, reaching a historical high, following Goldman Sachs' significant price target increase of 35% to NT$2330, reflecting strong market confidence in AI-related infrastructure demand [3] - TSMC is the largest contract chip manufacturer globally, benefiting from the booming demand for AI GPUs and ASICs, with major clients like NVIDIA and AMD driving increased orders [4] - TSMC's advanced 2nm process is set to begin mass production in Q4 2025, with performance improvements of 10-15% at the same power consumption or a 25-30% reduction in power consumption for the same performance [5] Group 3: Intel's Challenges - Intel is focusing on 1.8nm technology, skipping the 2nm node, and has announced the upcoming release of its Panther Lake platform based on this process [6] - Qualcomm's decision to return to Samsung for mobile processors poses a significant challenge for Intel, which is trying to attract high-profile clients for its advanced manufacturing capabilities [8] - The success of Intel's 18A and 16A technologies is crucial for its recovery, as it seeks to establish itself in the competitive landscape dominated by TSMC and Samsung [8]

#四大芯片巨头CEO齐聚#【英伟 达、英特尔、AMD、高通，四巨头CEO历史同框：一同现身联想发布会】1月7日，全球消费电子展 2026开幕。AI浪潮下不可或缺的几名巨头在此齐聚一堂。在全球创新科技大会上，联想集团董事长兼 CEO杨元庆与英伟达创始人兼CEO黄仁勋、超威半导体（AMD）董事会主席兼CEO苏姿丰、英特尔 CEO陈立武，以及高通CEO克里斯蒂亚诺·安蒙一齐亮相。联想释出了多项重磅合作计划。 0:00 ...

Core Insights - The fourth annual SDV (Software-Defined Vehicle) Innovator Awards were announced by MotorTrend, celebrating individuals redefining the automotive industry through software innovation [1][2] - The awards recognize pioneers, leaders, and experts in the automotive sector, highlighting their contributions to the evolution of software-defined vehicles [2][3] Group 1: Award Categories - The SDV Innovator Awards feature three categories: Pioneer, Leader, and Expert, with 20 winners selected by MotorTrend editors [2] - Pioneer Award winners have made significant advancements in SDV through research and development of new automotive software [3] - Leader Award winners are senior management individuals who drive the adoption of software solutions in the automotive industry [4] - Expert Award winners are recognized for their specialized knowledge in specific SDV disciplines, such as advanced driver assistance systems and over-the-air updates [5] Group 2: Notable Winners - Notable winners include Ashok Elluswamy from Tesla, Shaoqing Ren from NIO, and Laura Major from Motional, among others, showcasing a diverse range of expertise in the automotive software field [6]

该媒体援引阿蒙在采访中透露的消息表示，这家智能手机与PC端芯片领军者正在与包括三星电子在内 的多家晶圆代工厂就采用最前沿的大规模2nm芯片制造工艺进行合同代工制造展开磋商；阿蒙表示，高 通面向PC、智能手机甚至AI数据中心的绝大多数新一代核心芯片设计工作已经完成，以便在不久的将 来实现大规模代工以及全面商业化。 相较N3E制程(等同于3nm先进制程)，N2约可实现同功耗下性能+10%到15%，或同性能下功耗缩减 25%~30%，以及晶体管密度+15%~20%(具体取决于芯片架构设计)。 另一芯片制造巨头英特尔，则跳过2nm整数制程，聚焦于1.8nm级别制程(即18A)。英特尔表示，18A已 经从"制程节点承诺"走到"终端产品发布与量产爬坡"，而14A仍在研发与路线图/客户导入阶段。英特尔 在CES2026重磅发布/展示了基于18A制程打造的Panther Lake(Core Ultra Series3)，并将其作为18A的"首 批产品平台"对外确认。18A的关键工艺特征，即GAA/RibbonFET+背面供电PowerVia，也作为该代产品 与制程卖点被媒体与英特尔官方材料同步强调，但是具体的生产良率指标仍未 ...

Core Insights - The article highlights the acceleration of native AI hardware development, emphasizing the growing demand for computing power and the expansion of AI applications from cloud to edge [1][2][12] - Chinese manufacturers are increasingly becoming significant players at CES 2026, showcasing a variety of AI hardware, including AI glasses and robots, which have garnered substantial attention [1][12] Group 1: AI Hardware and Computing Power - The rapid evolution of underlying computing infrastructure is supporting the accelerated development of AI large models, with a noted annual increase in floating-point operations for training by four times and a 100-fold increase in inference token consumption over the past two years [2][3] - NVIDIA's CEO highlighted the arrival of the "ChatGPT moment" for physical AI, with autonomous taxis being one of the first applications to benefit from this technology [2] - AMD's CEO discussed the transition to Yotta Scale compute, indicating that AI potential will be fully unleashed across data centers, personal computing devices, and edge AI [2][3] Group 2: Robotics and Physical AI - The maturity of physical AI was emphasized at CES, with a notable improvement in the capabilities of showcased robots compared to previous years, indicating a shift from simple demonstrations to more complex functionalities [7][8] - Companies like UTree Technology and Zongqiong Robotics are showcasing advanced robots capable of performing intricate movements, signaling a move towards mass production and real-world applications [8][9] - The integration of edge AI and real-time situational awareness in wearable devices is expected to create significant market opportunities, with projections of reaching 100 million units in the coming years [5][6] Group 3: Chinese Manufacturers and Global Role - Chinese firms are transitioning from being merely the "world's factory" to becoming key players in global technological innovation, supported by strong supply chain and R&D capabilities [1][12] - The efficiency of China's supply chain allows for rapid product iteration, with a production cycle of about one year compared to three to five years for European companies [12][13] - The article underscores that the advancements in AI technology are not just about manufacturing but also about creating better solutions and technologies, marking a shift from "Chinese manufacturing" to "Chinese innovation" [13]

Core Viewpoint - Qualcomm is showcasing its advancements in personal AI and physical AI at CES 2026, emphasizing the shift from cloud dependency to terminal autonomy through powerful edge computing capabilities [2][6][7]. Group 1: Personal AI Developments - Qualcomm's Snapdragon X series processors are enabling a new generation of AI PCs, demonstrating capabilities such as real-time multimodal AI content creation without latency [2][6]. - The demand for AI PCs has surged, with companies like Lenovo and ASUS reporting a 2.5 times increase in AI PC product offerings within a year [9]. - 62% of users consider "local intelligent agent invocation" a core reason for purchasing AI PCs, highlighting the importance of local processing in enhancing user experience [13]. Group 2: Physical AI Innovations - Qualcomm's advancements in physical AI are evident in the automotive sector, with over 400 million vehicles utilizing Snapdragon digital chassis solutions [19]. - The company is leading in the in-car infotainment and cockpit SoC solutions, with over 75 million vehicles adopting the Snapdragon cockpit platform [19]. - The Snapdragon 8797 platform supports multi-modal large models for cockpit and driving assistance, enhancing the in-vehicle experience [21]. Group 3: Strategic Vision and Market Trends - Qualcomm's strategy focuses on building a comprehensive ecosystem that integrates personal AI and physical AI, aiming for a seamless user experience across various devices [8][26]. - The global AI PC market penetration is expected to exceed 80% in the next three years, indicating a significant shift towards edge computing [27]. - The company is positioned to capitalize on the exponential growth in demand for edge computing capabilities, as AI evolves towards intelligent agents and embodied forms [10][11]. Group 4: Technological Advancements - The Snapdragon X2 Plus platform features an 80 TOPS NPU, setting a new speed record for its class, and offers a 35% performance improvement while reducing power consumption by 43% compared to previous generations [15][29]. - Qualcomm's new processors, such as the Q-8750 and Q-7790, are designed for diverse IoT applications, enhancing the company's ability to support a wide range of smart devices [26][39]. - The Snapdragon Ride platform has been validated in over 60 countries, accumulating extensive data that enhances Qualcomm's capabilities in physical AI applications [46].