Core Viewpoint - The article discusses the growth and investment opportunities in the AI computing center market in China, particularly focusing on the Huawei Ascend ecosystem and its associated companies across four key areas: complete machines, power supply, cooling, and connectivity [2]. Group 1: Complete Machines - The newly added computing power in 2024 is expected to reach approximately 20,000 PFlops, with the investment scale of China's intelligent computing center market projected to reach 288.6 billion yuan by 2028. In 2023, the market size was 87.9 billion yuan, showing a year-on-year growth of over 90% [3]. - As of August 2024, there are over 300 intelligent computing center projects in China, with a total announced computing power exceeding 500,000 PFlops. About one-third of these projects are planned to have a computing power greater than 500 PFlops, mainly funded by government or telecom operators [3]. Group 2: Power Supply - AI servers utilize three power supply methods: external cabinets, racks, and trays. The power supply unit (PSU) converts high-voltage AC from the grid to 48V DC, which is then further converted to 12V for CPUs and 0.8V for GPUs [15]. - The GB200 NVL72 cabinet is equipped with 48 5.5kW PSUs, providing a total power of 132kW. The increasing power demand in AI servers is expected to expand the AI power supply market [16][21]. Group 3: Cooling - The power consumption of single cabinets has increased from 4-6 kW in traditional computing centers to 20-40 kW or higher in intelligent computing centers. Liquid cooling technology is becoming the preferred choice due to its efficiency and low energy consumption [27]. - The market size for liquid cooling data centers in China was 8.63 billion yuan in 2023, with a growth rate of 26.2%, expected to reach 18.01 billion yuan by 2026 [29]. Group 4: Connectivity - Backplane connectors are crucial for high-performance servers and communication devices, supporting high-speed data transmission and ensuring signal integrity [38]. - The Chinese communication connector market is projected to grow at a compound annual growth rate of 30%-35%, with expectations to exceed 60 billion yuan by 2025, where AI-related connectors will account for over 70% of the market [40].

2025 年 05 月 17 日 金融工程研究团队 魏建榕（首席分析师） 证书编号：S0790519120001 张 翔（分析师） 证书编号：S0790520110001 傅开波（分析师） 证书编号：S0790520090003 高 鹏（分析师） 证书编号：S0790520090002 苏俊豪（分析师） 证书编号：S0790522020001 胡亮勇（分析师） 证书编号：S0790522030001 王志豪（分析师） 证书编号：S0790522070003 盛少成（分析师） 证书编号：S0790121070009 苏 良（分析师） 证书编号：S0790121070008 何申昊（分析师） 证书编号：S0790524070009 陈 威（研究员） 证书编号：S0790123070027 蒋 韬（研究员） 证书编号：S0790123070037 相关研究报告 《 AIGC 板 块 的 资 金 行 为 监 测 》 -2024.11.24 《 芯 片 板 块 的 资 金 行 为 监 测 》 -2024.12.28 《 机 器 人 板 块 的 资 金 行 为 监 测 》 -2025.01.24 《 农 业 板 块 的 ...

Core Viewpoint - The global high-speed backplane connector market is projected to reach USD 2.76 billion by 2030, with a compound annual growth rate (CAGR) of 9.6% in the coming years [1]. Market Overview - The top four manufacturers in the global high-speed backplane connector market are expected to hold approximately 87.0% market share in 2024 [5]. - The primary product type is data transmission speed of 25, which accounts for about 66.6% of the market share [7]. - The telecommunications and data communication sector is the largest downstream market, representing approximately 95.8% of the demand [10]. Market Drivers - The growth in data transmission demand due to the development of data centers, cloud computing, and big data applications is driving the need for higher frequency and transmission speed [15]. - Technological innovations and standard upgrades, such as PCIe 5.0/6.0, USB4, and HDMI 2.1, are increasing the demand for high-speed connection solutions [16]. - The miniaturization and high-performance requirements of electronic devices are pushing backplane connector designs towards compact and high-density solutions [17]. - The rise of 5G and edge computing is creating a demand for high-speed and reliable connections, expanding the backplane connector market [18]. - The growth of automation and industrial applications is increasing reliance on high-speed data communication, accelerating the adoption of backplane connectors [19]. Market Challenges - Signal integrity challenges, such as signal distortion, crosstalk, and reflection, can affect performance during high-speed transmission [20]. - Heat management issues arise from increased heat generation during high-speed transmission, raising costs and design complexity [21]. - The complexity and cost of manufacturing increase due to the need for advanced manufacturing processes for high-precision and high-density designs [22]. - Rapid changes in industry standards can lead to quick product obsolescence, affecting compatibility and return on investment [23]. - Reliability and durability issues arise as high-frequency connectors require higher durability and long-term reliability, complicating design and testing [24]. - Market competition and technological barriers exist, as significant investment in new technology development is required, making it difficult for some companies to keep pace with market demands [25]. Industry Opportunities - The industry is evolving towards higher speeds to support standards like PCIe 6.0, USB4, and Thunderbolt 4, meeting the growing data transmission speed requirements [26]. - High-density and compact designs are being promoted to enhance connection density for space-constrained applications [27]. - Innovations in materials and processes, such as low-loss materials and advanced manufacturing techniques, are improving signal quality and performance [28]. - Enhancing electromagnetic compatibility (EMC) through structural optimization and shielding technology is addressing challenges posed by high-speed signals [29]. - The integration of smart connectivity and plug-and-play technology is increasing system intelligence and maintenance convenience [30]. - There is a continuous growth in demand across various sectors, including data centers, cloud computing, artificial intelligence, 5G base stations, industrial automation, and high-performance computing [31]. - The focus on green and sustainable development is driving efforts to reduce energy consumption and use environmentally friendly materials [32].

5月15日，宝盈国家安全沪港深股票C（013613）下跌2.43%，最新净值1.27元，连续3个交易日下跌，区 间累计跌幅4.36%。 据了解，宝盈国家安全沪港深股票C成立于2021年9月，基金规模0.06亿元，成立来累计收益 率-26.54%。从持有人结构来看，截至2024年末，宝盈国家安全沪港深股票C的基金机构持有0.01亿份， 占总份额的20.24%，个人投资者持有0.04亿份，占总份额的79.76%。 公开信息显示，现任基金经理容志能先生:中国国籍,浙江大学电子科学与技术专业硕士。曾在广东省电 力设计研究院担任网络工程项目经理,在广发证券股份有限公司担任家电行业研究员,在中国中投证券有 限公司担任通信行业研究员,在天风证券股份有限公司担任通信行业联合首席,2020年12月加入宝盈基金 管理有限公司,担任行业研究员,现任宝盈转型动力灵活配置混合型证券投资基金基金经理。2023年3月17 日担任宝盈国家安全战略沪港深股票型证券投资基金、宝盈转型动力灵活配置混合型证券投资基金基金 经理。2023年4月15日担任宝盈创新驱动股票型证券投资基金基金经理。2024年12月24日担任宝盈科技 30灵活配置混合型证券 ...

Group 1 - The Shanghai Stock Exchange Science and Technology Innovation Board Composite Index (000680) decreased by 1.44% as of May 15, with constituent stocks showing mixed performance [1] - Notable gainers included Junjie Xing, up 7.76%, and Xingtou Xinke, up 6.84%, while Changguang Huaxin led the decline at 8.10% [1] - The Huaxia Science and Technology Innovation Index ETF (589000) fell by 1.37%, with a latest price of 0.93 yuan, but had a cumulative increase of 0.64% over the past two weeks as of May 14 [1] Group 2 - As of May 7, 2024, a total of 5,412 listed companies in China reported a combined operating income of 71.98 trillion yuan, with nearly 60% achieving positive revenue growth [2] - The growth rate of revenue for companies on the ChiNext and Science and Technology Innovation Board outpaced that of the main boards, while net profit indicators for the Shanghai and Shenzhen main boards remained resilient [2] - Many listed companies are focusing on global expansion, digital transformation, and diversification to enhance core competitiveness, with "artificial intelligence" frequently mentioned as a key opportunity for future development [2]

Group 1 - The Shanghai Stock Exchange Sci-Tech Innovation Board Composite Index (000680) decreased by 1.41% as of May 15, 2025, with mixed performance among constituent stocks [3] - Leading gainers included Junzhixing (688655) up 7.70%, Huaxi Biological (688363) up 6.56%, and Wanrun New Energy (688275) up 6.22%, while leading decliners were Changguang Huaxin (688048) down 8.10%, Huafeng Technology (688629) down 7.95%, and Aerospace Nanhu (688552) down 7.21% [3] - The Huaxia Sci-Tech Innovation Index ETF (589000) fell by 1.48%, with the latest price at 0.93 yuan, but showed a cumulative increase of 0.64% over the past two weeks as of May 14, 2025 [3] Group 2 - The Huaxia Sci-Tech Innovation Index ETF (589000) recorded a turnover rate of 3.73% during the trading session, with a transaction volume of 104 million yuan [3] - Over the past week, the average daily transaction volume of the Huaxia Sci-Tech Innovation Index ETF was 192 million yuan, ranking first among comparable funds [3] - In terms of scale and shares, the Huaxia Sci-Tech Innovation Index ETF saw an increase of 1.902 billion yuan in scale and 1.988 billion shares in volume over the past month, leading among comparable funds [3] Group 3 - The pharmaceutical sector is showing continuous signs of performance improvement for 2024 and Q1 2025, with overall profitability on the rise [4] - The sector is experiencing a gradual clearing of inventory and the impact of anti-corruption measures, with notable performance in sub-sectors such as chemical pharmaceuticals and medical consumables [4] - The overall R&D expense ratio for the pharmaceutical sector is expected to rebound year-on-year in 2024, laying a foundation for long-term stable development [4]

海外重稀土暴涨 250%，后续走势如何看？20240514 摘要 • 中国工信部拟将稀土进口矿纳入配额管理，虽细则未定，但政策导向已显。 中美贸易战背景下，中国对中重稀土实施出口管制，直接冲击海外供应链， 可能加速海外"去中国化"进程，倒逼技术升级和替代方案。 • 韩国氧化镝进口量激增，引发中国政府警惕，或加强出口管制并严控第三 国转移，维护国家安全。与此同时，中国严打战略矿产走私，进一步收紧 稀土出口。 • 受出口管制影响，欧洲稀土价格飙升，与中国国内价格差距扩大，但实际 成交量有限。若中美贸易关系缓和，海外虚高价格或将缓解，但政策调整 仍是关键变量。 • 中国稀土储量全球第一，产量占比近七成，分离冶炼和磁材制造环节市场 占有率高达 90%。中国政策变化对国际市场供需和价格具有重要影响。 • 中国轻稀土矿配额增加以满足下游需求，离子型稀土配额保持平稳，重稀 土开采配额增速放缓。缅甸、老挝等国政局及政策调整影响离子型稀土供 应，美国对华基础金属出口量下降。 Q&A 全球稀土市场的供需状况及未来展望如何？ 2024 年 7 月 1 日，中国国务院公布了稀土管理条例，旨在规范稀土行业管理， 保障稀土资源合理开发利 ...

Investment Rating - The report maintains an "Add" investment rating for the electronic industry, indicating a positive outlook for the sector over the next six months [1]. Core Insights - Huawei's UB Mesh architecture addresses the cost and performance challenges associated with large model training, achieving a 2.04 times cost efficiency improvement compared to the Clos architecture [3]. - The UB Mesh architecture utilizes a 4D/5D topology, allowing for high bandwidth, low-cost, and high-reliability AI training clusters, significantly reducing the reliance on expensive network infrastructure [6][7]. - The report highlights the potential for Huawei's Ascend 920 series chips to capture a significant market share in domestic computing power demand, driven by their innovative capabilities and the ongoing trend of domestic computing power substitution [7]. Summary by Sections Industry Trends - The UB Mesh architecture is designed to meet the demands for large-scale AI training clusters, providing a flexible multi-dimensional aggregation that reduces transmission overhead [6]. - The architecture's reliance on short-distance direct interconnections minimizes costs and enhances system reliability, with 86.7% of the system's cabling being passive [6]. Performance Comparison - Under the same training benchmarks, the UB Mesh architecture demonstrated similar performance to the Clos architecture while significantly lowering hardware costs, with a reduction in network infrastructure costs from 67% to 20% [3]. - The operational cost savings from reduced use of high-performance switches and optical modules amounted to a 35% decrease [3]. Market Opportunities - The report identifies several companies in the supply chain that may benefit from the advancements in Huawei's technology, including SMIC, Huafeng Technology, and others [7].

证券代码：688629 证券简称：华丰科技 四川华丰科技股份有限公司 2024年年度股东大会会议资料 2025年5月 | 2024年年度股东大会会议须知 | 2 | | --- | --- | | 2024年年度股东大会会议议程 | 4 | | 2024年年度股东大会会议议案 | 6 | | 议案一：关于公司2024年年度报告及其摘要的议案 | 6 | | 议案二：关于公司2024年度董事会工作报告的议案 | 7 | | 议案三：关于2024年度监事会工作报告的议案 | 8 | | 议案四：关于2024年度财务决算报告的议案 | 9 | | 议案五：关于2025年度财务预算报告的议案 | 10 | | 议案六：关于2025年度董事薪酬方案的议案 | 11 | | 议案七：关于2025年度监事薪酬方案的议案 | 12 | | 议案八：关于2024年度利润分配预案的议案 | 13 | | 议案九：关于预计2025年度日常关联交易的议案 | 15 | | 议案十：关于预计2025年度为控股子公司提供担保额度的议案 | 22 | | 议案十一：关于购买董监高责任险的议案 | 25 | | 附件一： 2024年度董事会 ...

Investment Rating - The report maintains a "Buy" rating for several key companies in the semiconductor and AI sectors, including 中芯国际 (SMIC), 海光信息 (Haiguang), and others, indicating strong growth potential in the domestic AI and computing landscape [5][6]. Core Insights - The domestic AI landscape is witnessing significant advancements with the emergence of models like 豆包 (Doubao) and DeepSeek, which are leading the charge in multi-modal and lightweight AI model development, respectively [1][2]. - The report highlights a shift towards domestic computing power solutions, with chip manufacturers rapidly adapting to the evolving AI ecosystem, particularly through advancements in semiconductor processes and AI training capabilities [2][3]. - There is a notable increase in capital expenditure among cloud computing firms, driven by the rising demand for AI computing infrastructure, which is expected to lead to a "volume and price rise" scenario in the cloud computing market [3][4]. Summary by Sections Section 1: Breakthroughs in Domestic AI Models - 豆包 has emerged as a leading multi-modal model, enhancing capabilities in speech, image, and code processing, with a significant release of its visual understanding model in December 2024 [1][11]. - DeepSeek focuses on lightweight model upgrades, achieving a remarkable cost-performance ratio with its DeepSeek-V3 model, which has 671 billion total parameters and costs only 557.6 million USD, positioning it among the world's top models [1][12]. - The rapid iteration of domestic models, including updates from 通义千问 and others, reflects a competitive landscape that is accelerating the development of AI applications [1][34]. Section 2: Advancements in Domestic Computing Power - 中芯国际 is advancing its semiconductor processes, with N+1 and N+2 technologies being developed to support the growing demand for AI chips, achieving significant performance improvements [2][56]. - The report notes that the domestic chip industry is evolving, with companies like 昇腾 (Ascend) and others making strides in AI training and inference capabilities, thereby reducing reliance on international competitors [2][59]. - The cloud computing sector is experiencing a capital expenditure boom, with companies like 华勤 and 浪潮 rapidly deploying servers that are compatible with domestic computing power solutions [3][4]. Section 3: Infrastructure and Supply Chain Developments - The report emphasizes the need for enhanced computing infrastructure to meet the surging demand for AI applications, with significant investments being made in server and power supply innovations [3][4]. - Innovations in power supply and cooling systems, particularly the shift from traditional air cooling to liquid cooling, are becoming essential to support the increasing power density in data centers [4]. - The report identifies key players in the supply chain, including companies in power supply, cooling, and server manufacturing, that are poised to benefit from the growth of the AI and computing sectors [5].