Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on advanced packaging technologies in the semiconductor industry, particularly heterogeneous integration and multi-material integration [14][18]. Conference Overview - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo, with an expected attendance of 300-500 participants [18]. - The event aims to gather industry and academic experts to discuss cutting-edge technologies in heterogeneous integration and advanced packaging [16]. Key Topics and Presentations - COMSOL's China Technical Manager, Zhong Zhenhong, will present on "The Application of COMSOL Multiphysics® in Advanced Packaging of Semiconductors" [2]. - The conference will cover various topics including 2.5D/3D heterogeneous integration, optical-electrical co-packaging, and wafer-level bonding technologies [16][14]. Industry Context - Heterogeneous integration is becoming a crucial direction in the semiconductor field, especially as traditional Moore's Law approaches physical limits [14]. - The conference aims to address the challenges and opportunities presented by new semiconductor technologies driven by applications in artificial intelligence, smart driving, and high-performance computing [14]. Supporting Organizations - The conference is supported by the Ningbo Electronic Industry Association and other local organizations, highlighting the collaborative effort to enhance the semiconductor industry in the Ningbo and Yangtze River Delta regions [14][18]. Registration and Fees - Registration fees are set at RMB 2500 per person, with early bird discounts available [19].

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Conference, focusing on the theme of "Focusing on the Frontier of Heterogeneous Integration Technology, Advancing the Journey of Advanced Packaging" to promote the development of the advanced electronic information industry in Ningbo and the Yangtze River Delta region [5][15]. Summary by Sections Conference Overview - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo, with an expected attendance of 300-500 participants [18]. - The event is co-hosted by TrendBank and the Yongjiang Laboratory, with support from the Ningbo Electronic Industry Association [18]. Keynote Speakers and Topics - Ma Weidong, Deputy General Manager of Wuhan Guangxun Technology Co., will present on "Development Trends and Challenges of Optical Chips for CPO" [1]. - Various topics will be covered, including heterogeneous integration processes, advanced packaging trends, and challenges in micro-nano devices [10][11]. Industry Context - The conference aims to address the challenges posed by artificial intelligence, smart driving, and high-performance computing applications, which demand new semiconductor technologies [14]. - Heterogeneous integration is highlighted as a significant and promising direction in the semiconductor field, particularly in 2.5D/3D integration and optical-electrical co-packaging [14]. Event Activities - The event will include a closed-door meeting for industry stakeholders, a ribbon-cutting ceremony for the Yongjiang Laboratory's micro-nano platform verification line, and various forums discussing advanced packaging technologies [9][10][16]. Registration and Fees - The registration fee is set at RMB 2500 per person, with early bird discounts available [17]. Students can obtain a discounted rate of RMB 1500 [17].

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference, focusing on the theme of "Focusing on the Frontier of Heterogeneous Integration Technology, Advancing the Journey of Advanced Packaging" to promote the development of the advanced electronic information industry in Ningbo and the Yangtze River Delta region [18][20]. Group 1: Conference Details - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo [22]. - The event is organized by the Yongjiang Laboratory and TrendBank, with support from the Ningbo Electronic Industry Association [22]. - The expected attendance is between 300 to 500 participants [22]. Group 2: Key Themes and Topics - The conference will cover core technologies related to multi-material heterogeneous integration and optoelectronic fusion, focusing on advanced packaging technologies such as 2.5D/3D heterogeneous integration, optical-electrical co-packaging, and wafer-level bonding [20]. - Notable topics include the challenges and trends in heterogeneous integration processes, materials equipment, and the development of advanced packaging solutions [14][20]. Group 3: Featured Speakers and Presentations - Dr. Dustin Ho, Technical Project Director at Applied Materials, will present on "The Application of New Optical Waveguide Technology in Silicon Photonics/CPO" [2]. - Various industry experts will discuss topics such as AI-driven opportunities in chip integration, micro-nano device applications, and the latest advancements in optical technology [14][15][16]. Group 4: Background and Industry Context - The conference aims to address the stringent requirements for chip design and manufacturing driven by applications in artificial intelligence, smart driving, and high-performance computing [18]. - As traditional Moore's Law approaches its physical limits, heterogeneous integration is identified as a crucial and promising direction in the semiconductor field [19].

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on the strategic opportunities in the new generation of chip development and the importance of heterogeneous integration technology in the semiconductor industry [7][8]. Event Details - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo [8]. - The event aims to gather industry and research experts to discuss advanced packaging technologies and promote collaboration between the semiconductor industry and research institutions [9]. Conference Agenda - The agenda includes various sessions on topics such as CIS heterogeneous integration processes, 2.5D/3D chip integration, and the impact of artificial intelligence on chip interconnects [3][4]. - Keynote speeches will be delivered by government leaders and representatives from the organizing bodies [3]. Focus Areas - The conference will emphasize multi-material heterogeneous integration, optoelectronic integration, and advanced packaging technologies, including TGV (Through Glass Via) and FOPLP (Fan-Out Panel Level Packaging) [9]. - Discussions will also cover challenges and innovations in semiconductor materials and equipment [9]. Registration and Fees - The registration fee is RMB 2500 per person, with early bird discounts available for those who register before October 31 [10]. - Special pricing is offered for students at RMB 1500 [10].

Core Viewpoint - The article highlights the significance of the 2025 Bay Area Semiconductor Industry Ecological Expo, showcasing advancements in semiconductor technology and the importance of collaboration in the industry [2][10]. Group 1: Event Overview - The 2025 Bay Area Semiconductor Industry Ecological Expo (Bay Chip Expo) commenced on October 17, 2023, at the Shenzhen Convention Center, attracting over 60 leading companies and institutions from more than 20 countries, with more than 48,300 professional visitors on the first day [2][10]. - The expo features a comprehensive display platform covering the entire industry chain, including technology research and development, process implementation, and industrial application [4][10]. Group 2: Focus Areas and Innovations - The expo emphasizes advanced packaging technologies, showcasing the transition from "continuing Moore's Law" to "beyond Moore's Law," with a complete industry chain map from materials and equipment to packaging applications [10]. - Key topics include heterogeneous integration, optoelectronic fusion, 3D heterogeneous integration, and advanced packaging technologies such as TGV (Through Glass Via) and FOPLP (Fan-Out Panel Level Packaging) [30]. Group 3: Industry Collaboration and Future Directions - The Ningbo Membrane Intelligence Information Technology Co., Ltd. is the sole registered entity for TrendBank, indicating a structured approach to industry collaboration [1]. - A significant conference on heterogeneous integration technology will be held from November 17-19, 2025, in Ningbo, aiming to foster collaboration and innovation in the semiconductor industry [30].

Core Insights - The article discusses the advancements and commercialization efforts of micro-transfer printing (μTP) technology, which is crucial for the integration of III-V materials on silicon substrates, enhancing photonic integrated circuits [2][5][6]. Group 1: μTP Technology Overview - μTP technology was developed by researchers at the University of Illinois in 2004 and has seen significant advancements, including the ability to transfer individual devices onto target photonic chips [2]. - The process involves using a PDMS stamp to pick and transfer devices, ensuring high alignment accuracy and allowing for large-scale parallel integration [3]. - μTP enables the integration of different materials on a common substrate without modifying the backend processes of silicon photonics [3]. Group 2: Commercialization Efforts - The INSPIRE project, running from 2021 to March 2025, focuses on commercializing wafer-level μTP technology, aiming to combine InP and SiN photonics on a single platform [5]. - Key partners in the INSPIRE project include Eindhoven University of Technology, imec, Smart Photonics, and Cambridge University, among others [5]. Group 3: Integration Challenges - The integration of III-V materials on silicon faces challenges due to lattice mismatch, which can lead to defects affecting the reliability of semiconductor lasers [6]. - Successful applications of single-chip methods in quantum dot devices have been reported, indicating potential for improved laser reliability [6]. Group 4: Upcoming Conference - TrendBank plans to host a conference from November 17-19, 2025, focusing on heterogeneous integration technologies, aiming to foster collaboration between industry and academia [9]. - The conference will cover advanced packaging technologies, including multi-material integration and photonic-electronic co-packaging [9].

Core Viewpoint - The article emphasizes the strategic opportunity in the new generation of chip development, highlighting the upcoming Heterogeneous Integration Annual Conference organized by TrendBank to foster advanced electronic information industry growth in Ningbo and the Yangtze River Delta region [5]. Group 1: Research Directions - The company is focusing on various research areas, including photolithography technology, advanced packaging, and polyimide materials, with specific reports scheduled for 2026 [2][3]. - A series of databases related to photolithography, polyimide projects, advanced IC substrates, advanced packaging, perovskite photovoltaics, and polarizers will be updated quarterly [3]. Group 2: Upcoming Conference - The Heterogeneous Integration Annual Conference will take place from November 17-19, 2025, with the theme "Focusing on the Frontier of Heterogeneous Integration Technology, Advancing the Journey of Advanced Packaging" [5]. - The conference will cover core technologies such as multi-material heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and advanced packaging techniques like TGV and FOPLP [5].

Core Insights - TrendBank is organizing various industry conferences to promote collaboration and innovation in the semiconductor and display technology sectors [3][4][10] - The company aims to enhance resource aggregation and industry cluster development in the Ningbo and Yangtze River Delta regions [10][11] Event Summaries - The 2025 TrendBank Display Technology and Supply Chain Industry Annual Conference will be held from November 19-21 in Chengdu, Sichuan [3] - The 2025 TrendBank Polarizer Industry Conference successfully gathered numerous enterprises to explore future development opportunities [4] - The 2025 TrendBank Lithography Industry Conference focused on the localization of lithography technology [4] - The 2025 TrendBank PI Conference and the HIPC 2025 event on heterogeneous integration were also successfully concluded [4] - In 2026, TrendBank plans to host a series of conferences focusing on advanced materials and technologies in the semiconductor industry [6][7][8] Future Plans - TrendBank will collaborate with the Yongjiang Laboratory to host the Heterogeneous Integration Annual Conference from November 17-19, 2025, focusing on advanced packaging technologies [10][11] - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic co-packaging, and advanced packaging techniques like TGV and FOPLP [11]

Core Viewpoint - The article discusses the advancements and integration techniques in silicon photonics, emphasizing the importance of heterogeneous integration for the development of next-generation optical devices and systems [17]. Group 1: Heterogeneous Integration Techniques - Silicon itself does not emit light but is transparent at 1300nm and 1550nm, making it suitable for single-mode fiber transmission. The combination of silicon (Si) and silicon dioxide (SiO2) allows for the creation of various optical components [2]. - Grating couplers are highlighted as essential components that can rotate laser beams and couple them into silicon photonic (SiP) circuits, although they incur higher optical power loss [3]. - The addition of germanium (Ge) to silicon enables the detection of light at 1300nm and 1550nm, with SiGe technology being compatible with high-speed electronic devices [6]. - The unique properties of silicon-based modulators are crucial for the success of various SiP products, with modern CMOS technology driving this development [6]. Group 2: Integration Methods - Heterogeneous integration involves combining different material technologies into a single photonic integrated circuit (PIC), which can be achieved through processes like flip-chip bonding and micro-transfer printing [10][11]. - Flip-chip bonding requires precise alignment and can achieve high coupling efficiency, although it faces limitations in manufacturing throughput and cost reduction [11]. - Wafer bonding methods, including metal or oxide intermediate bonding and direct wafer bonding, are discussed, with direct bonding being more suitable for CMOS processes due to its lower temperature requirements [12]. Group 3: Upcoming Events and Industry Focus - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [17]. - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic integration, and advanced packaging techniques, aiming to promote technological innovation and industry application [17].

Core Viewpoint - The article discusses the upcoming 2025 TrendBank Heterogeneous Integration Annual Conference, emphasizing the importance of heterogeneous integration technology in the semiconductor industry and its role in advancing the electronic information industry in Ningbo and the Yangtze River Delta region [2][4]. Event Details - The 2025 TrendBank Heterogeneous Integration Annual Conference will be held from November 17-19, 2025, in Ningbo, Zhejiang, focusing on the theme "Focusing on the Frontier of Heterogeneous Integration Technology" [2]. - Concurrently, the 8-inch verification line of the Ningbo Jiang Laboratory's information materials and micro-nano device preparation platform will be inaugurated and open for visits [2]. Conference Agenda - The conference will feature various sessions, including: - Closed-door meetings on heterogeneous integration [4]. - Keynote speeches from government leaders and organizers [4]. - Discussions on topics such as micro-nano devices, 2.5D/3D chip heterogeneous integration, and AI-driven integration opportunities [4][5][6]. Micro-Nano Platform Overview - The micro-nano platform at Ningbo Jiang Laboratory is a significant public research support service platform focused on "chip heterogeneous integration" and "micro-nano optics," aiming to provide comprehensive technological development and solutions for future industries like high-speed communication and autonomous driving [9]. - The platform has gathered 48 high-level research and management personnel and is equipped with advanced facilities, including a 6-inch R&D line and an 8-inch verification line, along with 165 high-end precision devices [11].