Group 1 - Chip Origin Co., Ltd. (芯原股份) successfully completed a private placement of A-shares, raising a total of 1.807 billion yuan by issuing 24.86 million shares at a price of 72.68 yuan per share [1] - The initial plan was to issue up to 50.09 million shares, indicating that the actual issuance was less than half of the maximum proposed [1] - The private placement involved 11 institutional investors, including major fund management companies and securities firms, with E Fund Management being the largest subscriber, contributing approximately 755 million yuan, accounting for 42% of the total raised [1][2] Group 2 - Chip Origin Co., Ltd. has previously raised a total of approximately 3.67 billion yuan through two rounds of equity financing, with the first round occurring during its IPO in August 2020 [2] - The funds raised from the latest private placement will be primarily allocated to research and development projects in the AIGC and smart mobility sectors, focusing on Chiplet solutions and new generation IP development [2] - The company specializes in providing platform-based, comprehensive, and one-stop chip customization services and semiconductor IP licensing, with a portfolio of various processor IPs and over 1,600 mixed-signal and RF IPs [3] Group 3 - Despite its technological capabilities, the company faces financial challenges, with projected revenues of 2.338 billion yuan and 2.322 billion yuan for 2023 and 2024, respectively, alongside significant R&D expenditures [3] - The company reported a net loss of 296 million yuan in 2023 and is expected to incur a larger loss of 601 million yuan in 2024 [3] - In the first quarter of this year, the company achieved a revenue of 390 million yuan, reflecting a year-on-year growth of 22.49%, but still reported a net loss of 220 million yuan [3]

Core Viewpoint - The company, VeriSilicon Microelectronics (Shanghai) Co., Ltd., is focused on providing comprehensive chip customization services and semiconductor IP licensing, leveraging its proprietary semiconductor IP to cater to various applications, including AI, consumer electronics, and automotive sectors [1][2][4]. Group 1: Company Overview - The company was established on August 21, 2001, and became a joint-stock company on March 26, 2019, with its shares listed on the Shanghai Stock Exchange under the stock code 688521.SH since August 18, 2020 [1][3]. - The total share capital of the company is 525,713,273 shares, and it operates primarily in the semiconductor industry, providing services such as chip design, modeling, and technical consulting [1][4]. Group 2: Main Business and Services - The company specializes in semiconductor IP, offering a wide range of processor IPs, including graphics, neural network, video, digital signal, image signal, and display processors, along with over 1,600 mixed-signal and RF IPs [1][5][9]. - The main business includes a one-stop chip customization service that encompasses the entire process from design to manufacturing, packaging, and testing, aimed at reducing design risks and shortening development cycles for clients [5][6]. Group 3: Market Position and Financial Performance - In 2023, the company ranked first in the semiconductor IP licensing market in mainland China and eighth globally, with its licensing revenue ranking sixth worldwide [5]. - The company reported a total revenue of 2.68 billion yuan in 2023, with a significant increase in net profit, turning from a loss of 29.65 million yuan in 2022 to a profit of 7.38 million yuan in 2023 [11][14]. Group 4: Research and Development - The company has consistently invested in R&D, with a focus on chip customization technology, software technology, and semiconductor IP technology, accumulating a substantial number of patents and intellectual property rights [10][12]. - As of December 31, 2024, the company had obtained 205 invention patents, 3 utility model patents, and 12 software copyrights, reflecting its commitment to innovation and technology advancement [10][12]. Group 5: Future Plans and Fundraising - The company plans to raise approximately 1.81 billion yuan through a private placement of shares, with the funds allocated to projects in the AIGC and smart mobility sectors, as well as new IP development [22][26]. - The issuance is set to take place on June 12, 2025, with a share price of 72.68 yuan, and the funds will be used to enhance the company's operational capabilities and long-term profitability [22][24].

Core Viewpoint - The semiconductor industry is at a critical juncture of transformation, with both challenges and opportunities for innovation and growth [8][9]. Group 1: Leadership Changes - He Tingbo, former president of Huawei HiSilicon, has been appointed as the head of Huawei's Senior Talent Compensation Department, effective July 1 [1]. - He Tingbo has a strong educational background in semiconductor physics and communication engineering, having joined Huawei in 1996 and held various key positions [3]. Group 2: Achievements in Semiconductor Business - Under He Tingbo's leadership since the establishment of HiSilicon in 2004, Huawei's semiconductor business has supported over 20 years of product development and innovation [4]. - Huawei has transitioned from a follower to a leader in the industry, expanding into advanced fields such as smartphone chipsets, optical chips, and AI processors, achieving significant milestones like the Kirin application processor and the Ascend AI processor [5]. Group 3: Industry Insights and Future Outlook - He Tingbo emphasizes that the semiconductor industry is facing a major crisis and transformation, where previously leading suppliers may lose their technological advantages, while lagging demanders could emerge as new leaders [8]. - The core elements of semiconductor development are advanced processing equipment and complex manufacturing processes, rather than rare natural resources [9]. - There is a strong belief in the potential for innovation driven by market demand and a solid technological foundation, suggesting a hopeful future for the semiconductor industry [9].

Core Viewpoint - Chiplet Solutions Platform Development: The company has completed a private placement of shares, raising a total of 1.807 billion yuan, which will be primarily used for the development of Chiplet solutions in the AIGC and smart mobility sectors, as well as for the R&D and industrialization of next-generation IP targeting AIGC and graphics processing applications [1] Summary by Relevant Categories - Fundraising Details - The company announced the completion of a private placement of shares, raising a total of 1.807 billion yuan [1] - Strategic Focus Areas - The raised funds will be allocated to multiple strategic directions, including the development of Chiplet solutions for AIGC and smart mobility [1] - The funds will also support the R&D and industrialization of next-generation IP for AIGC and graphics processing scenarios [1]

Core Viewpoint - The recent IPO applications of domestic GPU companies, Moore Threads and Muxi Integrated Circuit, have reignited discussions about the challenges and potential of the domestic GPU industry, particularly regarding the high costs and the need for substantial investment to achieve profitability [1][3][4][5]. Group 1: IPO Developments - Both Moore Threads and Muxi Integrated Circuit have had their IPO applications accepted by the Shanghai Stock Exchange, marking a significant step for the domestic GPU sector [1][3]. - Muxi plans to raise 3.9 billion yuan, while Moore Threads aims to raise 8 billion yuan through their IPOs [4][5]. Group 2: Financial Performance - Muxi's projected net losses from 2022 to 2024 are 777 million yuan, 871 million yuan, and 1.4 billion yuan, with R&D expenditures of 647.8 million yuan, 699 million yuan, and 900 million yuan respectively [4]. - Moore Threads anticipates net losses of 1.84 billion yuan, 1.673 billion yuan, and 1.492 billion yuan over the same period, with R&D costs of 1.116 billion yuan, 1.334 billion yuan, and 1.359 billion yuan [5]. - Despite the losses, both companies are seeing revenue growth, with Muxi's revenue projected to reach 743 million yuan by 2024, and Moore Threads expecting 438 million yuan in the same year [7][9]. Group 3: Market Dynamics - The domestic GPU market is characterized by high competition, with various players adopting different strategies, including those aligned with NVIDIA and AMD technologies [12][14]. - The GPU industry is heavily reliant on R&D investments, with companies needing to continue funding their development efforts to remain competitive [21][22]. Group 4: Future Prospects - The AI sector is identified as a significant growth area for GPUs, with the market for AI chips in China projected to grow substantially, indicating a promising future for domestic GPU manufacturers [25][26]. - The competitive landscape is expected to undergo consolidation, as many players vie for market share, suggesting that mergers and acquisitions may become more common [26][27].

Core Viewpoint - Unisoc, as the largest independent mobile chip design company in China, has completed the IPO counseling filing for the Sci-Tech Innovation Board, with a valuation of 71.5 billion yuan, positioning itself to become the "first stock of domestic smartphone chips" [1] Market Performance - In 2024, Unisoc's revenue is expected to reach 14.5 billion yuan, marking a historical high, with global chip delivery volume reaching 1.6 billion units and over 5,000 employees, 85% of whom are R&D personnel [1] - In Q1 2025, Unisoc's global market share for smartphone chips is projected to be 10%, ranking fourth behind MediaTek (36%), Qualcomm (28%), and Apple (17%) [1] Technical Strength and Product Layout - Unisoc is one of the few companies globally that master full-scene communication technology from 2G to 5G, with products covering mobile phones, IoT, and automotive electronics [2] - Key technical highlights include: - 5G technology: One of three companies in the global open market for 5G mobile chips, launching the 6nm EUV process T8300 chip, entering the mid-range 5G smartphone market [2] - R16 features: The V620 platform fully supports 5G R16 standards, including TSN and high-precision positioning [2] - AI capability: The T820 chip's NPU computing power reaches 8 TOPS, a 67% increase from the previous generation [2] - International layout: Products cover over 140 countries, certified by more than 270 operators [2] Core Shortcomings - Dependence on the low-end market: Unisoc's products are almost exclusively used in budget phones within the Xiaomi supply chain, while MediaTek covers models under $400 and Qualcomm occupies 20% of the high-end market [2] - Performance gap: The T8100 processor's performance is only comparable to Snapdragon 765G, indicating a generational gap with flagship chips [3] - Weak profitability: Unisoc has not yet achieved profitability, with expectations to break even by 2025; the high proportion of R&D personnel (85%) indicates a need for improved technology conversion efficiency [4] - Customer concentration risk: The company heavily relies on a few smartphone manufacturers for low-end model orders, resulting in weak risk resistance [5] Peer Comparison Analysis - Comparison of Unisoc with competitors like MediaTek, Qualcomm, Huawei HiSilicon, and Xiaomi's玄戒 shows differences in core products, process levels, market positioning, and technical advantages [6] - Unisoc's core product is the T8300 5G SoC, with a 6nm EUV process, targeting budget phones under $99, while competitors focus on mid to high-end markets [7] Development Prospects and Recommendations - The IPO will provide critical capital support for Unisoc, but it must address several issues: - Product upgrades: Utilize advanced packaging technologies like chiplets to bridge process gaps and penetrate the mid to high-end market [8] - Diversified layout: Increase investment in emerging fields such as IoT and automotive electronics [8] - Technical collaboration: Leverage resources from the new Unisoc Group to strengthen cooperation across the industry chain [8] - As the IPO process advances, Unisoc is expected to accelerate technological breakthroughs, but its ability to escape the "high volume, low price" dilemma and achieve a transition to high-value markets will determine its long-term investment value [8]

Investment Rating - The report initiates coverage of K&S (KLIC US) with a Buy rating, and BE Semiconductor (BESI NA) with a Neutral rating, while maintaining a Buy rating on ASMPT (522 HK) [3][6][11]. Core Insights - Advanced packaging (AP) is expected to evolve significantly from 2025 onwards, with a shift from CoWoS-S to CoWoS-L/R, increased adoption of SoIC driven by HBM5, and potential upgrades in InFO technology led by Apple [3][6]. - The semiconductor cycle's recovery is a key catalyst for K&S and ASMPT, given their substantial sales exposure to conventional packaging [3][6]. CoWoS Technology - CoWoS technology is transitioning from CoWoS-S to CoWoS-L, with TSMC expected to increase its CoWoS-L capacity from approximately 20% in 2024 to nearly 60% in 2025 [7][21]. - CoWoS-S is anticipated to face oversupply due to non-TSMC supply chain expansions, while CoWoS-L is expected to be in demand for high-end GPUs [7][28]. SoIC Technology - SoIC is projected to gain importance with the adoption of high-NA EUV technology, although headwinds are expected in 2025 due to limited new adopters and potential capex constraints from Intel [8][14]. - AMD is currently the major adopter of SoIC, with potential future demand driven by Apple and HBM technologies [8][14]. InFO Technology - Apple is likely to adopt upgraded InFO technology from 2026 onwards, necessitating capacity upgrades to accommodate new application processor designs [9][20]. - The transition from InFO-PoP to InFO-M is expected as the I/O count between DRAM and application processors becomes insufficient [9][20]. Company-Specific Insights - K&S is positioned to be the primary TCB supplier for TSMC's on-wafer process starting in 2025, benefiting from the shift towards CoWoS-L technology [3][6]. - ASMPT is expected to gain market share in the HBM market from a low base, with its TCB potentially adopted by TSMC and Apple in the future [3][6]. - BE Semiconductor faces challenges due to rich valuations and potentially disappointing hybrid bonding orders in 2025 [3][6].

Fundraising Overview - The company, Chiplet Microelectronics (Shanghai) Co., Ltd., has received approval from the China Securities Regulatory Commission to issue shares to specific investors, raising a total of RMB 1,806,856,851.88 [1][2] Special Account and Supervision Agreement - The company has established a special account for the raised funds, which will only be used for the designated projects and not for any other purposes [2][3] - A tripartite supervision agreement has been signed between the company, the sponsoring institution (Guotai Junan Securities Co., Ltd.), and the banks holding the funds to ensure proper management and usage of the raised capital [2][3] Specific Projects and Fund Allocation - The funds will be allocated to research and development projects in the fields of AIGC (Artificial Intelligence Generated Content) and smart mobility, specifically for the Chiplet solution platform [3][4] - The agreement stipulates that the funds must be used solely for the specified projects, ensuring investor protection and compliance with relevant regulations [4][5] Monitoring and Reporting - The sponsoring institution is responsible for ongoing supervision of the fund usage, conducting at least biannual on-site inspections to verify compliance with the agreement [6][7] - The company is required to notify the sponsoring institution of any significant expenditures from the special account and provide detailed expenditure reports [8][9]

Core Insights - The article discusses Meta's ambitious plans to challenge NVIDIA's dominance in the AI server market with its MTIA series of products, aiming for significant production volumes and advanced technology [3][5]. Group 1: Meta's MTIA Series - Meta is developing the MTIA T-V1, T-V1.5, and T-V2 models, with T-V1 and T-V1.5 expected to have a combined shipment target of 1-1.5 million units by the end of 2026, with T-V1.5 making up a larger share [5][4]. - The MTIA T-V1.5 will feature a doubled intermediary layer size and a PCB with up to 40 layers, while T-V2 is expected to utilize larger CoWoS packaging and require liquid cooling systems with power systems exceeding 170KW [4][5]. Group 2: Market Dynamics - In 2026, the shipment volume of AI ASICs is projected to surpass that of GPGPUs, with NVIDIA currently holding over 80% of the AI server market value share, while ASIC AI servers account for approximately 8-11% [6][7]. - By 2025, the combined shipment of Google TPU and AWS Trainium 2 is expected to reach 40-60% of NVIDIA's GPU shipments, indicating a shift in market dynamics [7]. Group 3: Cost and Technical Considerations - The article highlights a divergence in views regarding the necessity and cost of ASICs, with some large cloud service providers (CSPs) advocating for ASICs to bridge technology gaps despite higher BOM costs, while NVIDIA's CEO suggests that most ASIC projects may be canceled due to economic viability concerns [9][10]. - The high costs associated with ASICs stem from the need for larger CoWoS packaging and high-spec PCBs, which are essential for performance compensation and thermal management [11][12]. Group 4: PCB Market Potential - The article notes that the market for ASIC and GPU PCBs is expected to double in value, with a projected growth rate of 65% next year, indicating a significant opportunity for PCB suppliers [16]. - Companies like Huada Empyrean (WUS) are highlighted as potential beneficiaries of this growth, providing advanced PCBs for Meta's MTIA [17][19].

Core Viewpoint - NVIDIA's CEO Jensen Huang asserts that NVIDIA's growth will continue to outpace that of Application-Specific Integrated Circuits (ASICs), citing a high failure rate among ASIC projects and emphasizing NVIDIA's technological advancements and cost optimization [2][3]. Group 1: NVIDIA's Market Position - Huang believes that while many companies are developing ASICs, about 90% will fail, similar to the high failure rate of startups [2]. - NVIDIA is not overly concerned about the competition from ASICs, as they recognize that without NVIDIA, the computing field cannot thrive [3]. - Huang emphasizes that the development of ASICs is not the main challenge; rather, the deployment requires significant investment and expertise, which NVIDIA possesses [4]. Group 2: NVLink Fusion Announcement - NVIDIA introduced NVLink Fusion, a technology aimed at integrating third-party CPUs and accelerators with NVIDIA's ecosystem, allowing for semi-custom designs [5][7]. - NVLink Fusion enables non-NVIDIA CPUs to connect to NVIDIA GPUs via a short-distance chip-to-chip connection, enhancing flexibility for system vendors [9][11]. - The technology is seen as a step towards allowing third-party chip manufacturers to integrate their designs with NVIDIA's high-performance NVLink network [15]. Group 3: Industry Collaboration - Companies like Alchip, AsteraLabs, Marvell, and MediaTek are confirmed to be developing accelerators that will support NVLink Fusion, indicating a growing ecosystem around NVIDIA's technology [15]. - Fujitsu and Qualcomm are also working on new CPUs that will pair with NVIDIA GPUs, aiming to enhance efficiency through NVLink Fusion [15]. - Cadence and Synopsys are participating as technical partners in the NVLink Fusion initiative, providing IP blocks and design services to companies looking to build compatible hardware [16].