Core Insights - The Guangzhou Municipal Government has issued a plan to accelerate the construction of a strong advanced manufacturing city from 2024 to 2035, focusing on enhancing the manufacturing capabilities of specialized process manufacturing [1] Group 1: Semiconductor Industry - The plan emphasizes strengthening the specialty process manufacturing, particularly through the development of silicon-based wafer foundries, targeting the production of automotive-grade chips and industrial control chips [1] - It aims to improve the manufacturing capacity of smart sensors and initiate research and development for 12-inch advanced SOI (Silicon-On-Insulator) technology [1] - The initiative includes the establishment of production lines for FD-SOI (Fully Depleted SOI) technology, enhancing the overall semiconductor manufacturing ecosystem [1] Group 2: Optical Chip Industry - The government plans to enhance the planning and design of the optical chip industry, promoting the development and application of optical chip products [1] - Support will be provided for enterprises to innovate in the fields of optical sensing and optical communication products [1] - There is a commitment to invest in future technologies related to silicon photonic chips, including the establishment of production lines for these chips [1]

Core Viewpoint - The Guangzhou Municipal Government has issued a plan to accelerate the construction of a strong advanced manufacturing city from 2024 to 2035, focusing on enhancing the automotive chip design, manufacturing, and testing capabilities to improve the security of the supply chain [1] Group 1: Automotive Chip Development - Continuous promotion of various automotive chip categories including computing, control, storage, analog drivers and power, communication and interfaces, sensors, and power chips [1] - Targeted initiatives to encourage collaboration between chip manufacturing and design companies with automotive manufacturers for high-reliability microcontroller units (MCUs), AI chips, power control management chips, advanced driver-assistance systems (ADAS) chips, and automotive audio/video/information terminal chips [1] - Accelerating the improvement of related supporting service capabilities to promote the large-scale application of autonomous and controllable automotive chips [1]

Core Viewpoint - Tesla plans to build a TeraFab factory capable of producing 2nm chips, challenging traditional cleanroom standards in chip manufacturing [3][4] Group 1: TeraFab Factory Plans - Elon Musk announced that Tesla intends to establish a TeraFab factory for 2nm chip production, which would allow activities like smoking and eating inside the facility [1][3] - Musk's approach to chip manufacturing involves a concept called "wafer isolation," which focuses on keeping the wafers themselves isolated from external contamination rather than maintaining a cleanroom environment [3] Group 2: Industry Context and Collaboration - Tesla has previously proposed creating its own chip manufacturing network to meet its custom chip needs and has engaged in extensive collaboration with Samsung on AI5 and AI6 chips [4] - Given Tesla's lack of experience in chip manufacturing, the TeraFab project is likely to be a collaborative effort with other partners rather than a standalone initiative [4]

Core Viewpoint - Tesla CEO Elon Musk announced plans to build a 2nm chip factory, challenging existing cleanroom standards in the semiconductor industry [1][3]. Group 1: Tesla's Plans - Tesla intends to establish a TeraFab super factory capable of producing 2nm process chips [3]. - Musk controversially claimed that the factory would allow him to eat hamburgers and smoke cigars while working, indicating a radical approach to chip manufacturing [3]. Group 2: Cleanroom Standards - Musk's proposal challenges the traditional cleanroom standards, suggesting that the focus should shift from the entire room to the wafers themselves, using a concept called "wafer isolation" [3]. - This approach aims to reduce the need for expensive ISO-level cleanrooms by ensuring wafers are physically isolated from the external environment during processing [3]. Group 3: Industry Skepticism - Industry experts express skepticism regarding Musk's ideas, emphasizing that advanced chip manufacturing requires ISO 1 or 2 level environments, where only a few particles are allowed per cubic meter of air [3][4]. - Concerns remain about contamination from human activities and the sensitivity of critical equipment like extreme ultraviolet (EUV) lithography machines to environmental factors [4].

Key Points - The People's Bank of China will conduct a buyout reverse repurchase operation of 1.1 trillion yuan on January 8, 2026, with a term of 90 days [6] - China has increased its gold reserves for 14 consecutive months, with a total of 74.15 million ounces as of December 2025, reflecting an increase of 30,000 ounces [7] - The Ministry of Industry and Information Technology and seven other departments have issued the "Implementation Opinions on the Special Action of 'Artificial Intelligence + Manufacturing'," aiming for significant advancements in AI technology and applications in manufacturing by 2027 [7][8] - The Ministry of Commerce announced an anti-dumping investigation on dichlorodihydrosilane from Japan, effective January 7, 2026, with the investigation period set from July 1, 2024, to June 30, 2025 [6] - The Shanghai Futures Exchange will adjust the margin ratio and price fluctuation limits for silver futures contracts starting January 9, 2026 [8] Company News - Fenglong Co., Ltd. has experienced an eight consecutive trading limit increase and may apply for a trading suspension if the stock price continues to rise abnormally [11] - Goldwind Technology has reported no significant changes in its operating conditions after two consecutive trading limits [12] - Zhongke Lanyun expects a net profit increase of 366.51% to 376.51% for 2025, driven by significant growth in the fair value of investments [12] - Chuanjinno anticipates a net profit increase of 144.24% to 172.64% for 2025 [13] - Kouzi Jiao expects a net profit decrease of 50% to 60% for 2025 [16] - Kechuan Technology's subsidiary has completed the first chip trial for silicon photonics but has not yet generated revenue [17]

Group 1 - Eli Lilly announced the acquisition of biopharmaceutical company Ventyx Biosciences for over $1 billion to enhance its innovative drug pipeline and R&D capabilities in relevant therapeutic areas [2] - Qualcomm is in talks with Samsung Electronics regarding the outsourcing of 2nm chip manufacturing, planning to shift the Snapdragon 8 Elite processor from TSMC's 3nm to Samsung's 2nm process, with chip design completed and expected to enter mass production soon [2] - Nvidia is collaborating with Lenovo to launch the "Lenovo AI Cloud Super Factory" to accelerate AI deployment and expansion, and is also partnering with Caterpillar to transform heavy industry using physical AI and robotics technology [2] Group 2 - Ping An Life announced that its asset management arm will invest in Agricultural Bank of China H-shares, reaching a 20% stake by December 30, 2025, triggering a stake increase [5] - Baidu Kunlun Chip plans to raise up to $2 billion through a Hong Kong IPO to expand its AI chip business, aiding in technology development and market expansion [5] - Zhipu AI listed on the Hong Kong Stock Exchange under the code "2513," becoming the "first global large model stock" with a valuation expected to reach HKD 51.1 billion [5] Group 3 - Morgan Stanley has reached an agreement to take over Apple’s credit card business from Goldman Sachs, which plans to divest approximately $20 billion in outstanding credit card debt at a discount of over $1 billion [8] - Amazon's Ring will launch a commercial mobile surveillance vehicle priced at $5,000, equipped with 360-degree cameras and wireless connectivity, expected to enter the commercial security market this spring [8] - Alphabet's market capitalization reached $3.88 trillion, surpassing Apple for the first time since 2019, driven by growth in its search engine and AI business [8] Group 4 - Samsung Electronics reported an operating profit of 16.9 trillion KRW (approximately $12.7 billion) for Q4 2025, a 160% year-on-year increase, and announced a stock buyback of 250 trillion KRW (approximately $19 billion) for employee compensation [11] - Toyota's annual sales in the U.S. exceeded 2 million units, with strong performance in SUVs, while GAC Toyota is the only growth driver for GAC Group in 2025 [11] - Hyundai Motor selected Italy's Danieli to supply $650 million worth of metallurgical equipment for its U.S. green factory, accelerating its electrification transition [11]

Core Viewpoint - The Ministry of Commerce announced an anti-dumping investigation into imports of dichlorodihydrosilane from Japan, set to begin on January 7, 2026, following a domestic industry's application citing rising import volumes and a 31% price decline from 2022 to 2024 [1]. Group 1: Investigation Details - The investigation is initiated based on preliminary evidence submitted by domestic applicants, indicating that imports from Japan have shown an overall increasing trend [1]. - The investigation is expected to conclude by January 7, 2027, although it may be extended by six months under special circumstances [1]. Group 2: Impact on Domestic Industry - The imported product is primarily used in the production of logic chips, memory chips, analog chips, and other types of chips, as well as in the synthesis of silicon-based precursors and polysilazane [1]. - The domestic industry claims that the dumping of these products has caused damage to their production and operations [1].

Core Viewpoint - Qualcomm is likely to utilize Samsung's 2nm chip manufacturing process for its next-generation mobile application processors, marking a return to Samsung after years of reliance on TSMC for advanced chip manufacturing [2] Group 1: Qualcomm and Samsung - Qualcomm is in discussions with multiple foundries, including Samsung, for the adoption of cutting-edge 2nm chip manufacturing processes [2] - The majority of Qualcomm's new core chip designs for PCs, smartphones, and AI data centers have been completed, aiming for large-scale manufacturing and commercialization soon [2] - This potential deal signifies Qualcomm's shift from nearly exclusive reliance on TSMC to Samsung's advanced manufacturing capabilities [2] Group 2: TSMC's Market Position - TSMC's stock surged by 6.9%, reaching a historical high, following Goldman Sachs' significant price target increase of 35% to NT$2330, reflecting strong market confidence in AI-related infrastructure demand [3] - TSMC is the largest contract chip manufacturer globally, benefiting from the booming demand for AI GPUs and ASICs, with major clients like NVIDIA and AMD driving increased orders [4] - TSMC's advanced 2nm process is set to begin mass production in Q4 2025, with performance improvements of 10-15% at the same power consumption or a 25-30% reduction in power consumption for the same performance [5] Group 3: Intel's Challenges - Intel is focusing on 1.8nm technology, skipping the 2nm node, and has announced the upcoming release of its Panther Lake platform based on this process [6] - Qualcomm's decision to return to Samsung for mobile processors poses a significant challenge for Intel, which is trying to attract high-profile clients for its advanced manufacturing capabilities [8] - The success of Intel's 18A and 16A technologies is crucial for its recovery, as it seeks to establish itself in the competitive landscape dominated by TSMC and Samsung [8]

该媒体援引阿蒙在采访中透露的消息表示，这家智能手机与PC端芯片领军者正在与包括三星电子在内 的多家晶圆代工厂就采用最前沿的大规模2nm芯片制造工艺进行合同代工制造展开磋商；阿蒙表示，高 通面向PC、智能手机甚至AI数据中心的绝大多数新一代核心芯片设计工作已经完成，以便在不久的将 来实现大规模代工以及全面商业化。 相较N3E制程(等同于3nm先进制程)，N2约可实现同功耗下性能+10%到15%，或同性能下功耗缩减 25%~30%，以及晶体管密度+15%~20%(具体取决于芯片架构设计)。 另一芯片制造巨头英特尔，则跳过2nm整数制程，聚焦于1.8nm级别制程(即18A)。英特尔表示，18A已 经从"制程节点承诺"走到"终端产品发布与量产爬坡"，而14A仍在研发与路线图/客户导入阶段。英特尔 在CES2026重磅发布/展示了基于18A制程打造的Panther Lake(Core Ultra Series3)，并将其作为18A的"首 批产品平台"对外确认。18A的关键工艺特征，即GAA/RibbonFET+背面供电PowerVia，也作为该代产品 与制程卖点被媒体与英特尔官方材料同步强调，但是具体的生产良率指标仍未 ...

智通财经APP获悉，有媒体援引美国高通公司首席执行官克里斯蒂亚诺·阿蒙(Cristiano Amon)的话报道 称，高通(QCOM.US)很可能将使用三星电子的2nm级别芯片代工工艺来制造其下一代移动应用处理器。 高通过去几年在领先制程上"几乎完全依赖台积电"，而此次若把下一代移动AP的一部分先进节点订单 转向三星2nm，意味着高通在"最核心、最量大的手机SoC"上启动双供应链策略或者分散化，会在份额 与议价权层面对台积电形成轻微压力，但是对于台积电基本面增长前景无任何重大扰动。 台积电与英特尔的先进芯片制程布局 该媒体援引阿蒙在采访中透露的消息表示，这家智能手机与PC端芯片领军者正在与包括三星电子在内 的多家晶圆代工厂就采用最前沿的2nm芯片制造品工艺进行合同代工制造展开磋商;阿蒙表示，高通面 向OC、智能手机甚至数据中心的绝大多数新一代核心芯片设计工作已经完成，以便在不久的将来实现 大规模代工以及全面商业化。 有着"全球芯片代工之王"称号的台积电方面同样全面聚焦于2nm及以下这一最先进芯片制程产能，该公 司在其官网制程介绍中明确写到：2nm(N2)"已于2025年第四季度(4Q25)按计划开始量产"，并强 ...