碳化硅外延片制造商天域半导体(2658.HK)今日首日上市，盘初一度较IPO价58港元大跌超34%至38港 元，首日上市即破发。以每手50股计算，天域半导体一手帐面暂暂时亏损1000港元。天域半导体为一家 主要专注于自制碳化硅外延片的碳化硅外延片制造商。2022年-2024年，公司收入分别为4.369亿元、 11.712亿元、5.196亿元。由于整体市场状况的变化及海外市场销量下降，公司2024年收入出现明显下 降。 ...

财务方面，2022年、2023年和2024年营收分别为4.37亿、11.71亿和5.2亿元，净利润从281.4万元增至 9588.2万元后，2024年转为亏损5亿元；2025年前五月营收2.57亿元，同比降13.6%，实现净利润951.5万 元，扭转2024年净亏损局面。 天域半导体(02658)首挂上市，公告显示，每股定价58港元，共发行3007.05万股股份，每手50股，所得 款项净额约16.73亿港元。截至发稿，跌34.48%，报38港元，成交额5733.6万港元。 公开资料显示，天域半导体是国内最大的碳化硅外延片制造商，按2024年于中国市场产生的收入及销量 计算，天域半导体的市场份额分别为30.6%、32.5%。此外，截至今年5月底，天域半导体6英寸及8英寸 外延片的年产能约为42万片，其同样也是国内该领域拥有最多产能的公司之一。 ...

公开资料显示，天域半导体是国内最大的碳化硅外延片制造商，按2024年于中国市场产生的收入及销量 计算，天域半导体的市场份额分别为30.6%、32.5%。此外，截至今年5月底，天域半导体6英寸及8英寸 外延片的年产能约为42万片，其同样也是国内该领域拥有最多产能的公司之一。 智通财经APP获悉，天域半导体(02658)首挂上市，公告显示，每股定价58港元，共发行3007.05万股股 份，每手50股，所得款项净额约16.73亿港元。截至发稿，跌34.48%，报38港元，成交额5733.6万港 元。 财务方面，2022年、2023年和2024年营收分别为4.37亿、11.71亿和5.2亿元，净利润从281.4万元增至 9588.2万元后，2024年转为亏损5亿元；2025年前五月营收2.57亿元，同比降13.6%，实现净利润951.5万 元，扭转2024年净亏损局面。 ...

Group 1: Economic Indicators - The number of initial jobless claims in the U.S. dropped to 191,000, significantly lower than economists' expectations of 220,000, marking the lowest level in over three years [2][11] - The U.S. non-farm payrolls are expected to decrease by 9,000 in November, with the previous month's data revised from a decrease of 9,100 to a decrease of 15,500 [11] - The European Central Bank is expected to announce a GDP year-on-year revision for Q3, with a market expectation of 1.4% [15] Group 2: Market Performance - The U.S. stock market showed mixed results, with the Dow Jones down 0.07%, the S&P 500 up 0.1%, and the Nasdaq up 0.2% [3] - The Hong Kong Hang Seng Index closed up 0.68% at 25,935.90 points, with the Hang Seng Tech Index rising 1.45% [4] - The A-share market saw the Shanghai Composite Index down 0.06%, while the Shenzhen Component Index rose 0.40% and the ChiNext Index increased by 1.01% [5] Group 3: Commodity Prices - Spot gold closed at $4,208.48 per ounce, up 0.15%, while spot silver fell 2.33% to $57.11 per ounce [6] - WTI crude oil rose by 1.08% to $59.74 per barrel, and Brent crude oil increased by 0.91% to $63.32 per barrel [6] Group 4: Corporate Developments - Oracle's stock rose by 3%, while Intel's shares fell by 7.4%, and Nvidia's shares increased by 2% [3] - In Hong Kong, Aoda Holdings surged by 370.87% after resuming trading, while other notable gainers included Gilead Sciences and Semiconductor Manufacturing International Corporation [4]

港股又将迎来两只新股上市。 12月4日晚间，天域半导体和遇见小面这两家港股新股迎来暗盘阶段。不过，从本次的暗盘表现来看， 这两家公司上市首日（12月5日）的表现可能并不太乐观。 富途牛牛显示，在当晚的暗盘中，两只新股双双"破发"，且跌幅均超过14%。 值得注意的是，这两家公司也是各有特点，遇见小面作为一家成立于广东却主打重庆小面的中式面馆， 将正式成为"中式面馆第一股"；而天域半导体是中国首家技术领先的专业碳化硅外延片供应商，其背后 的股东阵容极为豪华，不仅有华为、比亚迪等头部企业，还有上海、广东国资以及中国—比利时基金 等。 不过，相比近期一些新股数千倍的超额认购，本次散户对这两只新股的认购热情都不太高。遇见小面最 新发布的公告显示，其本次公开发售超额认购倍数为425.97倍。 | 有效申請數目 | 61.057 | | --- | --- | | 受理申請數目 | 9.590 | | 認購額 | 425.97倍 | | 重新分配 | | | 香港公開發售項下初步可供認購的發售股份數目 | 9.736.500 | | 從國際發售重新分配的發售股份數目 | 0 | | 香港公開發售項下發售股份的最終數目(重新 ...

每经AI快讯，12月4日，格科微(688728.SH)公告称，截至公告发布日，公司3,200万及5,000万像素图像 传感器产品已累计实现出货超1亿颗。公司近日收到国际知名品牌原始设备制造商（ODM）订单，供应 0.7微米规格5,000万像素图像传感器产品，已实现部分出货。该产品基于GalaxyCell®2.0工艺平台，在 像素性能、动态范围及功耗优化方面实现显著提升。公司高像素单芯片集成技术及相关产品得到市场验 证与认可，对公司未来发展产生积极影响。 ...

12月4日，香港恒生指数收涨0.68%，恒生科技指数涨1.45%。 | 代码 | 名称 | 现价 涨跌 | | 涨跌幅 | | --- | --- | --- | --- | --- | | મંદા | 恒生指数 | 25935.90c 175.17 | 0.68% | | | HSTECH 恒生科技 | | 5615.43c 80.51 1.45% | | | | HSBIO 恒生生物科技 | | 15575.91c 398.39 | 2.62% | | | HSCEI | 恒生中国企业指数 | 9106.48c 77.93 | 0.86% | | | HSCI | 恒生综合指数 | 3972.31 c 25.17 = | 0.64% | | 医药生物板块大涨，歌礼制药涨超11%，药明合联、药明生物涨超7%，药明康德等多股涨超5%。 | 代码 | 名称 | 现价 | 涨跌幅 ▼ | | --- | --- | --- | --- | | 1672 | 歌礼制药-B | 13.210c | 11.10% | | 2197 | 三叶草生物-B | 2.740 c | 10.04% | | 2268 | 药明合 ...

Core Viewpoint - Tianyue Advanced (02631) has established business partnerships with over half of the top ten global power semiconductor manufacturers, focusing on high-quality silicon carbide substrates for power and RF devices used in electric vehicles, AI data centers, and photovoltaic systems [1] Group 1: Company Performance - Tianyue Advanced's stock rose over 6% in the afternoon session, currently up 5.09% at HKD 61.9, with a trading volume of HKD 215 million [1] Group 2: Industry Insights - Addressing the thermal management issues of CoWoS packaging is crucial for the development of AI computing chips [1] - If CoWoS replaces the interposer with SiC and follows a projected 35% compound annual growth rate over 28 years, it would require over 2.3 million 12-inch SiC substrates by 30 years, equivalent to approximately 9.2 million 6-inch substrates, significantly exceeding current production capacity [1]

Core Viewpoint - Tianyue Advanced (02631) has established business partnerships with over half of the top ten global power semiconductor manufacturers, focusing on high-quality silicon carbide substrates for power and RF devices used in electric vehicles, AI data centers, and photovoltaic systems [1] Group 1: Company Performance - Tianyue Advanced's stock rose over 6% in the afternoon session, currently trading at 61.9 HKD with a transaction volume of 215 million HKD [1] Group 2: Industry Insights - According to Huaxi Securities, addressing the thermal management issues of CoWoS packaging is crucial for the development of AI computing chips [1] - If CoWoS replaces the interposer with SiC and follows a projected 35% compound annual growth rate over 28 years, it will require over 2.3 million 12-inch SiC substrates by 2030, equivalent to approximately 9.2 million 6-inch substrates, significantly exceeding current production capacity [1]

Core Viewpoint - Tianyue Advanced (02631) has established business partnerships with over half of the top ten global power semiconductor manufacturers, focusing on high-quality silicon carbide substrates for power and RF devices used in electric vehicles, AI data centers, and photovoltaic systems [1] Group 1: Company Performance - Tianyue Advanced's stock rose over 6% in the afternoon, currently up 5.09% at HKD 61.9, with a trading volume of HKD 215 million [1] Group 2: Industry Insights - According to Huaxi Securities (002926), addressing the thermal management issues of CoWoS packaging is crucial for the development of AI computing chips [1] - If CoWoS replaces Interposer with SiC, and assuming a 35% compound annual growth rate (CAGR) over 28 years with a 70% replacement of SiC, it is projected that over 2.3 million 12-inch SiC substrates will be needed by 2030, equivalent to approximately 9.2 million 6-inch substrates, significantly exceeding current production capacity [1]