Core Viewpoint - The semiconductor packaging industry is experiencing a shift from CoWoS technology to emerging alternatives like CoPoS and FOPLP due to the limitations and challenges faced by CoWoS, particularly in terms of complexity, cost, and capacity constraints [1][36]. Group 1: CoWoS Technology Challenges - CoWoS packaging technology has become a focal point in the industry but is now facing significant challenges such as high production costs, yield control issues, and electrical performance limitations [1][36]. - The increasing size of AI GPU chips and the number of HBM stacks have led to bottlenecks in CoWoS, particularly due to photomask size limitations [4][36]. - TSMC has acknowledged these challenges and is positioning CoPoS as the next-generation successor to CoWoS, aiming to gradually replace CoWoS-L through technological iterations [4][9]. Group 2: CoPoS Technology Development - CoPoS technology represents a significant evolution from CoWoS by replacing the silicon interposer with a panel-sized substrate, allowing for larger packaging sizes and improved area utilization [6][8]. - CoPoS aims to enhance overall computational performance by integrating more semiconductors within a single package, thus improving yield efficiency and reducing edge waste [6][8]. - TSMC plans to establish a pilot line for CoPoS technology by 2026, with mass production targeted for late 2028 to 2029, with NVIDIA as the first customer [9][36]. Group 3: FOPLP Technology Emergence - FOPLP is emerging as a potential major alternative to CoWoS, leveraging the advantages of fan-out wafer-level packaging while utilizing panel-level substrates for enhanced size and utilization [10][13]. - The FOPLP market is projected to grow significantly, with a compound annual growth rate of 32.5%, reaching approximately $221 million by 2028 [14][36]. - Major industry players like ASE, Samsung, and others are actively investing in FOPLP technology, with ASE planning to establish a production line in Kaohsiung and Samsung already having a foothold in the panel-level packaging sector [11][18][19]. Group 4: CoWoP Technology Introduction - NVIDIA has proposed CoWoP technology, which simplifies the traditional packaging structure by integrating the chip directly onto the PCB, potentially reducing costs and improving performance [25][30]. - CoWoP aims to enhance signal integrity and power delivery while reducing thermal issues, but it faces significant technical challenges related to PCB manufacturing capabilities [30][36]. - The transition to CoWoP is seen as a long-term project for NVIDIA, with potential benefits including reduced costs and improved performance, although short-term adoption remains uncertain due to existing dependencies on traditional packaging methods [33][35].

Core Viewpoint - The semiconductor industry is experiencing a shift from CoWoS packaging technology to emerging alternatives like CoPoS and FOPLP due to the limitations and challenges faced by CoWoS, including high production costs and capacity bottlenecks [2][39]. Group 1: CoWoS Technology Challenges - CoWoS packaging technology has become a focal point due to the rise of AI and GPU chips, but it faces significant challenges such as complex processes, high production costs, and issues with yield control and testing [2][39]. - The increasing size of AI GPU chips and the number of HBM stacks have led to limitations in CoWoS, particularly due to photomask size constraints [6][39]. Group 2: CoPoS as an Evolution - CoPoS technology is seen as the next evolution of CoWoS, with TSMC positioning it as a successor that offers greater flexibility and economic benefits [4][6]. - CoPoS replaces the silicon interposer with a panel-sized substrate, allowing for larger packaging sizes and improved area utilization, which enhances production flexibility and scalability [8][11]. Group 3: FOPLP Technology Emergence - FOPLP is gaining traction as a potential major alternative to CoWoS, with its ability to support larger chip sizes and higher I/O density, making it suitable for AI and high-performance computing applications [12][14]. - The FOPLP market is projected to grow significantly, with a compound annual growth rate of 32.5%, reaching approximately $221 million by 2028 [18][21]. Group 4: Industry Players and Developments - Major companies like ASE, Samsung, and TSMC are actively investing in FOPLP technology, with ASE planning to establish a production line in Kaohsiung and Samsung having acquired PLP technology to support its development [22][23]. - TSMC is also advancing its FOPLP technology, with plans for a dedicated production line and initial trials expected to begin in 2026 [24][25]. Group 5: CoWoP Technology Introduction - CoWoP, proposed by NVIDIA, aims to simplify the packaging structure by integrating the chip directly onto the PCB, potentially reducing costs and improving performance [29][31]. - However, CoWoP faces significant challenges, including the need for high-precision PCB manufacturing and the risk of yield issues during the transition from existing technologies [35][37]. Group 6: Future Outlook - The semiconductor industry is currently balancing mature technologies like CoWoS with emerging solutions such as CoPoS, FOPLP, and CoWoP, which are expected to reshape the landscape as they mature [39].

Core Viewpoint - The article discusses the significant rise of TSMC's CoWoS packaging technology, driven by the increasing demand for GPUs in the AI sector, particularly through its partnership with NVIDIA, which has deepened over time [1][3]. Group 1: CoWoS Technology and NVIDIA Partnership - NVIDIA has emphasized its reliance on TSMC for CoWoS technology, stating that it has no alternative partners in this area [1]. - TSMC has reportedly surpassed ASE Group to become the largest player in the global packaging market, benefiting from the growing demand for advanced packaging solutions [1]. - NVIDIA's upcoming Blackwell series will utilize more CoWoS-L packaging, indicating a shift in production focus from CoWoS-S to CoWoS-L to meet the high bandwidth requirements of its GPUs [3]. Group 2: Challenges and Innovations in CoWoS - The increasing size of AI chips poses challenges for CoWoS packaging, as larger chips reduce the number of chips that can fit on a 12-inch wafer [4]. - TSMC is facing difficulties with the use of flux in CoWoS, which is essential for chip bonding but becomes problematic as the size of the interposer increases [4][5]. - TSMC is exploring flux-free bonding technologies to improve yield rates and address the challenges posed by flux residue [5]. Group 3: Future Developments and Alternatives - TSMC plans to introduce CoWoS-L with a mask size of 5.5 times larger by 2026 and aims for a record 9.5 times larger version by 2027 [8]. - The company is also developing CoPoS technology, which replaces traditional wafers with panel substrates, allowing for higher chip density and efficiency [9][10]. - CoPoS is positioned as a potential alternative to CoWoS-L, targeting high-performance applications in AI and HPC systems [12]. Group 4: Technical Comparisons - FOPLP and CoPoS both utilize large panel substrates but differ in architecture; FOPLP does not use an interposer, while CoPoS does, enhancing signal integrity for high-performance chips [11]. - CoPoS is transitioning to glass substrates, which offer better performance characteristics compared to traditional organic substrates [12]. - The shift from round wafers to square panels in CoPoS aims to improve yield and reduce costs, making it more competitive in the AI and 5G markets [12]. Group 5: Challenges Ahead - Transitioning to square panel technology requires significant investment in materials and equipment, along with overcoming technical challenges related to pattern precision [14]. - The demand for finer RDL line widths poses additional challenges for suppliers, necessitating breakthroughs in RDL layout technology [14]. Conclusion - The future of TSMC's packaging technologies appears promising, with ongoing innovations and adaptations to meet the evolving demands of the semiconductor industry [14].