如果您希望可以时常见面，欢迎标星收藏哦~ 在AI推动的新一轮技术浪潮中，连接、感知和计算正同时加速演进。5月21日，Qorvo在北京举办 了以「连接无界 智护未来」为主题的2025媒体日，全面展示了其在三大核心技术方向的最新布 局：包括Wi-Fi 8的标准演进、UWB与Matter的融合应用，以及面向AI数据中心的企业级SSD电源 管理方案（PMIC）。 从过去强调"更快"，到如今关注"更稳"，Wi-Fi 8正引领无线通信标准的方向变化；UWB和Matter 的结合，则让空间定位和多协议协同走向真正可用、可扩展；而在AI大模型带动下，电源管理早 已不只是简单"供电"，更关乎数据中心的稳定性和可靠性。 这不仅是一场产品的集中亮相，更是Qorvo围绕"下一代智能连接"给出的一份系统级答卷。 Wi-Fi 8标准轮廓初显，Qorvo敢为人先 在2024年Wi-Fi 7尚未全面普及之际，Wi-Fi 8已悄然走入技术前沿的讨论视野。近日，Qorvo亚太 区无线连接事业部高级行销经理林健富在活动上率先披露Wi-Fi 8的关键演进路径、核心技术特性 及其面临的系统设计挑战，标志着这家全球领先的射频技术企业再次走在了下一代无线 ...

Core Viewpoint - Nvidia is reportedly developing an AI PC in collaboration with Dell's Alienware, aiming to disrupt the gaming market with a new custom APU that could outperform Intel and AMD offerings [1][2]. Group 1: Product Development - Nvidia is working on a new gaming laptop featuring a custom APU, which includes a MediaTek CPU component and a GPU based on Nvidia's Blackwell architecture [1]. - The Alienware Arm laptop is expected to launch in Q4 2025 or early 2026, with the APU's power range estimated between 80W and 120W [1]. Group 2: Performance Expectations - Despite lower power consumption, the new APU is anticipated to deliver performance comparable to the laptop version of the GeForce RTX 4070 [2]. - The new chip is seen as a potential breakthrough in the PC industry, offering a unified computing solution that could change the traditional separation of CPU and GPU components in portable systems [2]. Group 3: Market Context - Historically, Arm processors are considered more energy-efficient than x86 CPUs, but adoption has been limited, with only a small number of customers utilizing systems powered by Qualcomm's Snapdragon X Pro and Elite processors [2]. - Qualcomm continues to invest in the PC market, reportedly developing the Snapdragon X Elite 2 processor for upcoming liquid-cooled gaming desktops [2]. Group 4: Industry Speculation - Rumors about Nvidia entering the PC gaming market have circulated since 2023, with CEO Jensen Huang confirming plans for an Arm-based desktop CPU [2]. - Dell's CEO Michael Dell hinted that more specific details about the project may be revealed in 2025, further fueling speculation [2].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 electronicsweekly 。 Imec 已制造出间距为 16nm 的钌 (Ru) 线，平均电阻低至 656W/µm。 16nm 间距金属线采用半镶嵌集成流程制造，该流程针对成本效益的可制造性进行了优化，使其成 为制造 A7 及更高技术节点的第一个局部互连金属层的一种有吸引力的方法。 钌 (Ru) 半镶嵌工艺最初由比利时微电子研究中心 (IMEC) 提出，作为一种颇具吸引力的模块方 法，旨在解决当金属间距小于 20 纳米时，Cu 双镶嵌工艺带来的电阻-电容 (RC) 延迟问题日益加 剧。半镶嵌工艺是一种双层金属化模块，从直接蚀刻第一层局部互连金属层 (M0) 开始，并有可能 扩展到多层。 2022年，imec首次通过实验展示了18nm金属间距的直接蚀刻低电阻Ru线，并将集成方案扩展至使 用完全自对准通孔（FSAV）的双金属级模块。 参考链接 https://www.electronicsweekly.com/news/business/imec-fabs-ru-lines-at-16nm-pitch-with-low-resistance- ...

Core Viewpoint - Intel is strategically targeting the South Korean market for its foundry services, particularly aiming to compete with Samsung's wafer foundry business by hosting the Direct Connect Asia event in Seoul [1][2]. Group 1: Event and Strategic Intent - Intel's foundry division will hold the Direct Connect Asia event in Seoul on June 24, marking the first time this event is held outside the U.S. [1] - The event aims to engage with local IC design companies in South Korea that require low-cost advanced process foundry services, indicating Intel's intent to capture market share from Samsung [1][2]. Group 2: Technology and Competitive Landscape - Intel has high hopes for its Intel 18A process technology, which utilizes advanced RibbonFET and PowerVia technologies, and plans to begin mass production in the second half of 2025 [1][2]. - Intel 18A is positioned to compete directly with TSMC's 2nm process technology, showcasing its potential in the foundry market [2]. - Samsung's advanced process technology has lagged behind TSMC, with reports indicating only a 50% yield for its 3nm process and a current 40% yield for its 2nm process, which may hinder its ability to attract large clients [2].

Core Viewpoint - The global semiconductor market is projected to reach $700.9 billion in 2025, reflecting a year-on-year growth of 11.2% driven by demand in AI, cloud infrastructure, and advanced consumer electronics [1][3]. Market Segmentation - The growth in the semiconductor market will be primarily led by logic and memory segments, both expected to see double-digit growth due to sustained demand in various sectors [3]. - Sensor and analog markets will contribute positively to the overall market growth, albeit at a more moderate pace, while discrete semiconductors, optoelectronics, and micro ICs are anticipated to experience slight declines due to specific demand constraints [3]. Regional Analysis - The Americas and Asia Pacific (excluding Japan) are expected to achieve significant growth rates of 18.0% and 9.8% respectively in 2025, while Europe and Japan will see comparatively smaller growth [3][4]. - The total semiconductor market is forecasted to grow from $630.5 billion in 2024 to $700.9 billion in 2025, with a further increase to $760.7 billion in 2026, marking an 8.5% growth [4]. Product Categories - Integrated circuits are projected to grow significantly, with logic and memory segments leading the charge, showing year-on-year growth rates of 23.9% and 11.7% respectively in 2025 [4]. - Discrete semiconductors and optoelectronics are expected to decline by 2.6% and 4.4% respectively in 2025, indicating challenges in these specific markets [4].

Core Points - The U.S. Trade Representative (USTR) announced a three-month suspension of the planned 25% tariffs on certain Chinese imports, including chips and semiconductor components like GPUs and motherboards, originally set to take effect on June 1, 2025, now extended to August 31, 2025 [1] - The USTR's decision is based on public feedback regarding the extension of previously restored exemptions and new COVID-related exemptions, indicating a careful consideration of the impact on U.S. businesses [1] - The tariffs were initially imposed under Section 301 of the Trade Act of 1974 during the Trump administration, but the Biden administration has continued to extend these exemptions due to their importance to U.S. enterprises [1] Summary by Sections Tariff Suspension - The USTR has decided to extend the exemption period for 164 previously restored exemptions and 14 new exemptions for an additional three months, reflecting ongoing evaluations of public comments [1] - This extension delays potential price increases for GPUs and motherboards, which have been a concern for manufacturers and consumers alike [1] Historical Context - The implementation of Section 301 tariffs has been ongoing for over six years, with many chip manufacturers relocating from China to countries like Vietnam due to these tariffs [2] - The initial tariffs were part of a broader strategy by the Trump administration to address trade imbalances, which included a 10% base tariff on nearly all imports [2] - Despite legal challenges to the tariffs, they remain in effect, highlighting the complexities of U.S.-China trade relations [2]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 复旦大学， 作者：祁金， 谢谢 。 讲座最后，白鹏介绍了华虹半导体的技术布局，并对半导体行业的未来进行了展望。他表示，世界 运行于硅基之上，半导体行业还将继续蓬勃发展，中国的半导体市场也将持续迎来增长。目前，中 国半导体产业链尚有缺口，他期待同学们加入产业界，共同迎接挑战，携手走通半导体全产业链。 6月3日，华虹半导体执行董事及总裁白鹏到访复旦，在邯郸校区光华楼东辅楼202报告厅为集成电 路与微纳电子创新学院师生带来一场题为"创芯者的战略解码"的讲座。复旦大学集成电路与微纳电 子创新学院院长、中国科学院院士刘明主持讲座。 在讲座中，白鹏从摩尔定律的解读、其在半导体行业的职业发展、华虹集团的技术布局以及半导体 行业的未来等四个方面切入，与在场师生深入分享在集成电路制造领域从业多年的经验与心得。 什么是摩尔定律？"芯片上的晶体管数量每两年会翻一番。" 讲座之初，白鹏引用英特尔公司创始 人之一戈登·摩尔对半导体行业的洞察，向同学们解释摩尔定律的来源与内涵。 （图源：复旦大学） 他表示，晶体管尺寸微缩是摩尔定律的基础，晶体管尺寸微缩的两大核心优势是单个晶体管成 ...

Core Viewpoint - The article discusses the emerging trend of ASIC (Application-Specific Integrated Circuit) chips in the AI chip market, highlighting NVIDIA's introduction of NVLink Fusion and the competitive landscape between NVIDIA and the UALink alliance [1][3][4]. Group 1: NVIDIA's Position and Strategy - NVIDIA has entered the ASIC market with NVLink Fusion, allowing various processors from companies like MediaTek and Qualcomm to connect to NVIDIA's AI data centers [1]. - NVIDIA's CEO Jensen Huang stated that 90% of ASIC projects are likely to fail, emphasizing the competitive edge of NVIDIA's ASICs over others [3]. - NVIDIA's gross margin remains high at 60%, indicating strong profitability and competitive positioning in the ASIC market [4]. Group 2: Market Growth and Future Projections - The market for cloud-based ASIC chips is projected to exceed $40 billion by 2028, as noted by MediaTek's chairman [3]. - Major cloud service providers are developing their own ASIC chips to create a competitive advantage, with companies like Google, Microsoft, Meta, AWS, and Apple actively involved in this trend [6]. Group 3: Competitive Landscape - The UALink alliance, which includes major companies like Alibaba, AWS, AMD, Apple, Cisco, Google, HPE, Meta, Intel, Microsoft, and Synopsys, is positioning itself against NVIDIA by promoting an open standard for AI chip interconnects [4]. - The competition between NVIDIA's NVLink and UALink is creating two distinct ecosystems in the cloud ASIC chip market [4]. Group 4: Supply Chain and Development - The development of ASIC chips heavily relies on the Taiwanese semiconductor supply chain, with companies like TSMC and others involved in the production process [7]. - The number of AI ASIC servers is expected to surpass 50% of the overall market by 2028, indicating a significant shift towards ASIC technology in AI applications [7].

Core Viewpoint - SK Hynix has surpassed Samsung Electronics to become the leading DRAM manufacturer in the first quarter of 2023, marking a significant shift in market leadership [1][2]. Market Share Analysis - In Q1 2023, SK Hynix achieved a DRAM market sales revenue of $9.72 billion, capturing a market share of 36%, while Samsung Electronics held a 33.7% share and Micron had 24.3% [1]. - The market share of SK Hynix slightly decreased from 36.6% in Q4 2022, while Samsung's share dropped significantly from 39.3% [1][2]. - In Q1 2022, Samsung's market share was 43.9% compared to SK Hynix's 31.1%, indicating a rapid narrowing of the gap over the past year [2]. Product Development and Strategy - The shift in market dynamics is attributed to the increased shipment of high-value products like HBM3E by SK Hynix, while Samsung faced challenges in selling HBM products to China, leading to a decline in HBM3E shipments [2]. - SK Hynix is currently the exclusive supplier of NVIDIA's fifth-generation HBM3E and has provided samples of the next-generation HBM4 [2]. - Samsung is implementing a strategy to regain competitiveness in the HBM sector by reducing production of older HBM models and focusing on the latest products, particularly HBM4 [3]. Market Outlook - The global DRAM market sales in Q1 2023 decreased by 5.5% to $27.01 billion due to falling contract prices and reduced HBM shipments [3]. - TrendForce predicts a recovery in the DRAM market in Q2 2023 as PC and smartphone manufacturers adjust inventory and increase production [4].

Group 1 - The core viewpoint of the article highlights the growth in the electronic information manufacturing industry, with a year-on-year increase of 11.3% in value added from January to April 2025, outperforming the overall industrial and high-tech manufacturing sectors by 4.9 and 1.5 percentage points respectively [1] - In April, the electronic information manufacturing industry saw a year-on-year increase of 10.8% in value added [1] - Key product outputs from January to April include 105 million microcomputer devices (up 4.7% year-on-year), 454 million mobile phones (down 6.8% year-on-year), and 150.9 billion integrated circuits (up 5.4% year-on-year) [1] Group 2 - Export statistics for January to April show that 43.84 million notebook computers were exported (down 0.4% year-on-year), 22.4 million mobile phones (down 7.1% year-on-year), and 106.3 billion integrated circuits (up 20% year-on-year) [1]