如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 technews 。 面对半导体产业的全球竞争，日本不再执着于「最先进制程」的技术光环，而是选择与台积电携手 合作，聚焦市场需求最强烈的成熟制程。从过去封闭的技术优越感，到今日以开放、务实的姿态迎 向国际伙伴，日本在熊本设厂的决策，不只是产业策略的转向，更标志着国家意识的一次重大革 新。 虽然日本在半导体的生产现况说不上亮眼，但前景令人期待。这是因为成功招揽全球最大的半导体 制造企业台积电在日本设厂，索尼集团与电装合资，在熊本成立日本先进半导体制造公司（Japan Advanced Semiconductor Manufacturing，JASM），生产22／28纳米与12／16纳米的半导体。 虽然主要由台积电出资，但据闻日本政府也成立六千亿日圆规模的基金，多数用于新工厂的补助。 我个人更看好JASM的前景胜过Rapidus。 其中一个原因是，日本终于成功招揽强大的亚洲企业来投资。回顾过去，2015年夏普被台湾鸿海 集团收购，同时东芝的家电部门和电视部门也被中国企业收购，媒体大肆宣扬技术外流的担忧。 在 此 之 前 ， 2000 年 代 中 期 ， 有 ...

Core Viewpoint - Kioxia Holdings (Kioxia HD) is focusing on advancing its flagship product BiCS FLASH technology to meet the growing demands of artificial intelligence (AI) by enhancing bit density, reliability, performance, and energy efficiency [1][6]. Summary by Sections Memory Technology Evolution - Kioxia HD's memory capacity has increased from 4M bits in 1991 to 2T bits in the eighth generation of BiCS FLASH, representing a 500,000-fold increase [1]. - The company emphasizes that the cost competitiveness of NAND flash memory depends on the number of bits that can be loaded onto a chip, with various methods to increase bit density including layer stacking and architectural innovations [1][3]. Bit Density Maximization - Kioxia HD combines layer stacking with planar area reduction to maximize bit density, utilizing new architectures like CBA (CMOS Direct Bonding Array) and early adoption of QLC technology [3][4]. - The OPS (On Pitch SGD) technology has been developed in collaboration with partners to reduce area overhead in the word line layer, enhancing the efficiency of memory designs [3]. New Architectures and Technologies - The introduction of CBA technology in the eighth generation reduces wiring overhead between CMOS and memory cells, allowing for better performance under optimal conditions [4]. - Kioxia HD has been producing QLC products since the fourth generation of BiCS FLASH, balancing performance and reliability to lower costs [6]. Future Technology Strategy - The company plans to develop high-capacity and high-performance products by combining layer stacking and planar reduction, targeting enterprise and data center SSD markets [7]. - Kioxia HD aims to leverage CBA technology to create competitive products that meet advanced application demands while maintaining investment efficiency [9]. Market Expansion Efforts - Kioxia HD is exploring new markets beyond TLC and QLC NAND, including the development of OCTRAM for low-power AI applications and X-FLASH to bridge the latency gap between TLC NAND and DRAM [11]. - The CXL-XL memory, which allows memory sharing between CPUs, is set to address the growing need for large-capacity, low-latency memory solutions [13].

Core Viewpoint - The global AI chip market is becoming increasingly competitive, with Huawei's Ascend 910C GPU facing significant challenges in gaining traction against NVIDIA's entrenched ecosystem and products [1][2]. Group 1: Challenges Faced by Huawei - The entrenched CUDA ecosystem of NVIDIA poses a major barrier, as many Chinese tech companies have invested heavily in it, making it difficult for them to switch to Huawei's alternatives [1][2]. - Intense competition among Chinese tech companies leads to reluctance in adopting a competitor's product, further complicating Huawei's market penetration efforts [2]. - The Ascend 910C chip suffers from overheating issues, which negatively impacts its reliability perception in high-performance computing and AI training scenarios [2][3]. - Many Chinese tech companies have substantial NVIDIA GPU inventories, reducing their incentive to switch to Huawei's offerings in the short term [3]. - U.S. export controls create additional hurdles, as companies must carefully consider compliance risks when adopting Huawei chips, especially those with significant overseas operations [3]. Group 2: Technical Specifications and Market Position - The Ascend 910C chip reportedly offers 800 TFLOP/s of computing power with FP16 precision and up to 3.2 TB/s memory bandwidth, comparable to NVIDIA's H100 GPU [3]. - Huawei has introduced the "CloudMatrix 384," which bundles up to 384 Ascend chips to provide substantial computing power, although it lacks direct support for FP8 memory optimization, which is crucial for large-scale AI training [4][5]. - In contrast, NVIDIA continues to perform strongly in the AI infrastructure market, with significant visibility in business pipelines and projected revenues of approximately $400 billion to $500 billion per year from AI infrastructure projects [5]. - NVIDIA holds a dominant position in the AIB GPU market, with a remarkable 92% market share, further solidifying its leadership in the AI chip sector [5].

Core Viewpoint - The memory chip market is shifting towards a more customized product approach, focusing on a few core customers and integrating them into an ecosystem [1][2]. Group 1: Market Trends - AI memory chips are becoming more specialized and reliant on a limited number of "locked-in" core customers [1]. - SK Hynix has benefited from the AI boom and is now a major supplier of NVIDIA's high-bandwidth memory (HBM) chips, with the latest HBM4e expected to be used in NVIDIA products starting in 2026 [1]. Group 2: Business Strategy - The new business model emphasizes deep collaboration with specific customers from the initial product development stage, allowing for higher customization flexibility in HBM4e compared to traditional HBM chips [2]. - There is a potential risk in this strategy as it increases dependency on AI clients like NVIDIA; if these clients experience slow growth, SK Hynix may also face a slowdown [2]. - Ensuring that selected customers become leaders in their respective fields is crucial for the success of this new model [2].

来源：内容 编译自 NYT 。 乔治·E·史密斯因发明革命性的成像设备而获得诺贝尔物理学奖，该设备不仅使科学家能够更清楚 地看到宇宙，还使数亿人能够为子孙后代记录每个生日和假期，他于周三在新泽西州巴尼加特镇的 家中去世，享年 95 岁。 他的女儿劳伦·兰宁 (Lauren Lanning) 证实了他的死讯。 1969 年，史密斯博士在贝尔实验室工作期间，与同事威拉德·S·博伊尔 (Willard S. Boyle ) 萌生了 电荷耦合器件 (CCD) 的想法，该技术是当今几乎所有望远镜、医学扫描仪、复印机和数码相机的 重要组成部分。 诺贝尔学院秘书长贡纳尔·奥奎斯特在宣布史密斯博士和博伊尔博士将共同获得2009年诺贝尔物理 学奖时表示，他们的工作帮助构建了"我们现代信息社会的基础"。（他们与高锟分享了该奖项，高 锟因其在光纤电缆研发方面的贡献而获奖。） 当 CCD 的想法萌生时，史密斯博士和博伊尔博士一直在努力为计算机创造更好的存储方式。他们 认为光电效应——爱因斯坦曾对此作出解释，并因此获得了 1921 年的诺贝尔奖——或许能提供解 决方案。 如果您希望可以时常见面，欢迎标星收藏哦~ 光电现象发生在电磁辐射 ...

Core Viewpoint - The company, Nanjing Shangluo Electronics Co., Ltd., has signed an investment intention agreement to acquire a stake in Guangzhou Ligong Technology Co., Ltd., aiming to gain control of the target company, which aligns with its strategic focus on distribution and enhances its competitive edge in the electronic components sector [1][6][14]. Agreement Signing Situation - The company has entered into an investment intention agreement with major shareholders of Ligong Technology, intending to purchase a portion of its equity through cash [1][6][7]. Basic Information of the Target Company - Guangzhou Ligong Technology Co., Ltd. was established on February 5, 1999, with a registered capital of 320 million RMB. It operates in the wholesale of electronic components and related technology services [8][9]. Main Content of the Intention Agreement - The agreement outlines that the company plans to acquire equity from existing shareholders to achieve control over Ligong Technology. The final transaction price will be determined based on due diligence and mutual agreement [12][13]. Impact of the Agreement on the Company - The acquisition is expected to enhance the company's distribution capabilities and sales scale, as Ligong Technology's business complements the company's existing operations in the electronic components market [14].

Core Viewpoint - STMicroelectronics is expected to see 5,000 employees leave over the next three years, including 2,800 layoffs announced earlier this year, due to ongoing market challenges and cost-cutting measures [1][2]. Group 1: Employee Reductions - The CEO of STMicroelectronics, Jean-Marc Chery, indicated that approximately 2,000 employees will leave through natural attrition, bringing the total voluntary departures to 5,000 [1]. - Earlier in April, STMicroelectronics announced plans to cut 1,000 jobs in France due to voluntary departures, while negotiations with Italy were still ongoing [2]. - Italian unions expressed that the announcement of 1,200 layoffs at the Agrate factory in Lombardy was "unacceptable" and called for urgent discussions with the Italian government [2]. Group 2: Market Conditions and Financial Outlook - Chery noted signs of market recovery this year, which contributed to an 11.1% increase in the company's stock price, closing at €24.94, marking the largest single-day gain since March 2020 [2]. - The company has outlined a cost-cutting plan aimed at saving hundreds of millions of dollars by 2027, which includes layoffs and early retirements [1]. Group 3: Government Relations and Speculations - The Italian government, which, along with France, holds a 27.5% stake in STMicroelectronics, has expressed dissatisfaction with the company's management and accused it of insider trading, which the company denies [1]. - Italian Industry Minister Adolfo Urso denied rumors regarding the potential splitting of STMicroelectronics, labeling such reports as "groundless" [2].

Group 1 - The core viewpoint of the article highlights the establishment of a fourth-generation diamond semiconductor project in Urumqi, with a total investment of 265 million yuan, aimed at producing diamond heat sink plates and cultivated diamonds, which have significant applications in high-end GPU cooling [1] - The project is set to commence construction in September 2025 and aims for completion and production by May 2026, filling a gap in the domestic market for high-performance semiconductor materials [1] - Diamond is recognized as a fourth-generation semiconductor material due to its ultra-wide bandgap and high thermal conductivity, being referred to as the "ultimate semiconductor material" [1]

Core Viewpoint - Texas Instruments (TI) plans to increase prices on over 3,300 product lines, with the price hike set to take effect on June 15, indicating a strategic shift from aggressive pricing to optimizing product line profitability [1][2]. Price Increase Details - The price increase shows a clear gradient distribution: 9% of items will see a price increase of 100% or more, 5% will increase by 50%-100%, 1% by 30%-50%, 55% by 15%-30%, and 30% will increase by less than 15% [2]. - The average price increase is over 10%, with some items experiencing increases of 40%-70%, particularly in low-margin, older products that did not meet committed quantities [2]. - Notably, signal chain components like ADCs and operational amplifiers are seeing price hikes exceeding 100%, which is significantly higher than market expectations [2]. Strategic Shift and Market Impact - TI's pricing strategy has shifted from gaining market share through low prices to focusing on product line profitability, as evidenced by a drop in gross margin from 70.2% in Q1 2022 to 57.2% in Q1 2024 [3]. - This price increase presents opportunities for domestic companies like Shengbang and Sirepu, whose main products overlap with TI's mid-to-low-end offerings, potentially allowing them to follow suit with price increases or expand their market share [3]. - End-user manufacturers may accelerate the adoption of domestic alternatives to avoid TI's high-priced models, especially in long-cycle sectors like industrial and automotive [3]. Industry Recovery Signals - TI reported Q1 revenue of $4.069 billion, an 11% year-over-year increase and a 2% quarter-over-quarter increase, with Q2 revenue expected to be between $4.17 billion and $4.53 billion, surpassing market expectations [3]. - The overall analog chip industry is showing signs of recovery, with decreasing channel inventory and expectations of revenue growth in the upcoming quarter [3].

Group 1 - Changan Automobile is one of the four major automotive groups in China, with a history of 163 years and over 40 years of vehicle manufacturing experience, operating 12 manufacturing bases and 22 factories globally [2] - In 2024, Changan Automobile achieved a total sales volume of 2.683 million vehicles, a year-on-year increase of 5.1%, with 730,000 units of new energy vehicles sold and over 530,000 units sold overseas [2] - The company aims to reach total sales of 3 million vehicles, including 1 million new energy vehicles and 1 million overseas sales in 2025, as part of its "third entrepreneurial plan" focusing on smart electric transformation and globalization [2] Group 2 - The Changan Automobile Global R&D Center covers over 1,000 acres with a total investment of 4.3 billion yuan, featuring 180 laboratories across various fields such as hybrid power, air conditioning systems, and non-metal materials [4] - The center serves as a hub for product development and experimental verification, providing new engines for Changan's transformation and upgrading [5] Group 3 - The automotive industry is undergoing a transformation driven by smart electric vehicles, with intensified competition and new challenges arising from changes in manufacturing methods and business models [8] - Changan Automobile is accelerating the implementation of its three major plans: "Shangri-La" for new energy, "Beidou Tianshu" for intelligence, and "Haina Baichuan" for globalization, establishing a new development pattern to meet diverse market demands [8] Group 4 - The annual "Changan Automobile Forward Technology and Ecological Chain Cooperation Exhibition" series aims to create a platform for innovative technology exchange and cooperation, enhancing communication and collaboration within the industry [9] - In 2025, the event will focus on hot topics and further innovate and upgrade its format based on Changan's R&D and procurement needs [9] Group 5 - The event will feature an opening ceremony, product displays, a forward technology forum, supply-demand matching, and interactive visits, with targeted invitations to well-known enterprises in the supply chain [24] - A closed-door forum will be held to discuss key technologies and industry bottlenecks, focusing on areas such as intelligent driving, vehicle networking, and automotive chips [32] Group 6 - Key procurement directions include advanced perception systems, operating systems, automotive chips, and various technologies related to intelligent cockpit systems [46][49][51][53][56] - The event aims to optimize the supply chain by enhancing collaboration between existing suppliers and potential new partners, fostering a new type of "partner" supply chain ecosystem [15]