| 股票代码：603650 | 股票简称：彤程新材 编号：2024-049 | | --- | --- | | 债券代码：113621 | 债券简称：彤程转债 | 彤程新材料集团股份有限公司 关于持股 5%以上股东股份解除质押的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 1.股份被解质情况 | 股东名称 | 舟山市宇彤创业投资合伙企业（有限合伙） | | | | | --- | --- | --- | --- | --- | | 本次解质股份（股） | | 6,460,000 | | | | 占其所持股份比例（%） | 20.58 | | | | | 占公司总股本比例（%） | | | | 1.08 | | 解质时间 | 2024 | 年 6 月 | 12 | 日 | | 持股数量（股） | | 31,394,623 | | | | 持股比例（%） | | | | 5.23 | | 剩余被质押股份数量（股） | | 12,250,000 | | | | 剩余被质押股份数量占其所持股份比例（%） | | | 39.02 ...

重要内容提示 ●调整前回购价格上限：不超过人民币 40 元/股（含） ●调整后回购价格上限：不超过人民币 39.41 元/股（含） | 股票代码：603650 | 股票简称：彤程新材 | 编号：2024-045 | | --- | --- | --- | | 债券代码：113621 | 债券简称：彤程转债 | | 彤程新材料集团股份有限公司 关于 2023 年度权益分派实施后调整回购价格上限的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 （www.sse.com.cn）及指定媒体披露的《彤程新材 2023 年年度权益分派实施公告》（公 告编号：2024-041）。 根据《回购报告书》的规定，如公司在回购期限内实施了资本公积金转增股本、 现金分红、派送股票红利、配股、股票拆细或缩股等除权除息事项，公司将按照中国 证监会及上海证券交易所的相关规定，对回购股份的价格上限进行相应调整。 三、本次回购股份价格上限的调整 根据《回购报告书》，本次以集中竞价交易方式回购股份价格上限由不超过人民 币 40 元/股（含）调整为不超过 3 ...

彤程新材料集团股份有限公司 | 股票代码：603650 | 股票简称：彤程新材 | 编号：2024-044 | | --- | --- | --- | | 债券代码：113621 | 债券简称：彤程转债 | | 关于年度预计融资担保进展的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示 ●担保人名称：彤程新材料集团股份有限公司（以下简称"公司"） ●被担保人名称：彤程化学（中国）有限公司（以下简称"彤程化学"） ●是否为上市公司关联人：否 ●本次担保金额及已实际为其提供的担保余额：公司本次为彤程化学提供的担保 金额为人民币 15,000 万元，公司实际为彤程化学提供的担保余额为 39,234 万元。 ●本次担保是否有反担保：无 ●对外担保逾期的累计数量：截至本公告披露日，公司无逾期对外担保事项。 一、担保情况概述 （一）担保基本情况 为满足子公司日常经营及业务发展需要，2024 年 5 月 17 日，公司与上海浦东发 展银行股份有限公司空港支行签订了《最高额保证合同》，为彤程化学提供连带责任 保证担保，所担保 ...

| 证券代码：603650 | 证券简称：彤程新材 公告编号：2024-043 | | --- | --- | | 债券代码：113621 | 债券简称：彤程转债 | 彤程新材料集团股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2024/2/7 | | | | | | --- | --- | --- | --- | --- | --- | | | | | | | 日 | | 预计回购金额 | 元 80,000,000 元~120,000,000 | | | | | | 回购用途 | □减少注册资本 | | | | | | 累计已回购股数 | 股 2,542,117 | | | | | | 累计已回购股数占总股本比例 | 0.42% | | | | | | 累计已回购金额 | 67,084,076.51 元 | | | | | | 实际回购价格区间 | 元/股~29.53 元/股 24.43 | | | | | | 回购方案 ...

Investment Rating - The report maintains a "Recommended" rating for the company, with a current price of 30.90 CNY and projected PE ratios of 36, 30, and 24 for the years 2024, 2025, and 2026 respectively [1]. Core Insights - The company signed a cooperation agreement for a semiconductor chip advanced polishing pad project with an investment of 300 million CNY, which is expected to generate annual sales of approximately 800 million CNY upon reaching full production [1]. - The company's performance in Q1 2024 exceeded market expectations, with significant revenue contributions from specialty rubber additives and electronic chemicals, totaling 5.97 billion CNY and 1.56 billion CNY respectively [1]. - The company is advancing its semiconductor materials strategy by establishing a production base for semiconductor chip polishing pads, which are crucial materials in semiconductor processing [1]. - The domestic CMP polishing pad market is expected to benefit from the company's technological advancements, as it aims to break the oligopoly currently held by foreign companies [1]. Summary by Sections Financial Performance - In Q1 2024, the company reported revenues of 5.97 billion CNY from specialty rubber additives and 1.56 billion CNY from electronic chemicals, with a total revenue of 290.6 million CNY from biodegradable materials [1]. - The projected revenues for 2024, 2025, and 2026 are 2,944 million CNY, 3,634 million CNY, and 4,195 million CNY respectively, with growth rates of 17.7%, 23.4%, and 15.5% [5][8]. - The net profit attributable to the parent company is expected to be 516 million CNY, 615 million CNY, and 760 million CNY for 2024, 2025, and 2026 respectively, reflecting growth rates of 27.0%, 19.1%, and 23.7% [5][8]. Market Position - The company is positioned as a leader in the domestic semiconductor photoresist market, with several products set to ramp up production in 2024 [1]. - The global semiconductor materials market is projected to grow by nearly 7% in 2024, reaching 74 billion USD, with the domestic market showing a significant demand gap for CMP polishing pads [1]. Investment Outlook - The company is expected to benefit from both the existing CMP polishing pad market and the expansion of domestic wafer manufacturers, providing a dual advantage [1]. - The report forecasts a steady increase in net profit and revenue, indicating a positive outlook for the company's financial performance in the coming years [5][8].

上海市锦天城律师事务所 关于彤程新材料集团股份有限公司 差异化分红事项的 法律意见书 锦 天 城 律师事务 所 ALLBRIGHT LAW OFFICES 地址：上海市浦东新区银城中路 501 号上海中心 11、12 层 电话：021-20511000 传真：021-20511999 邮编：200120 上海市锦天城律师事务所 法律意见书 上海市锦天城律师事务所 关于彤程新材料集团股份有限公司 对本法律意见书,本所及经办律师特作如下声明; 1、本法律意见书中,本所及本所经办律师认定某些事件是否合法有效是以 该等事件所发生时应当适用的法律、法规、规章和规范性文件为依据。 2、本法律意见书的出具已经得到公司如下保证: (1) 公司已经提供了本所为出具本法律意见书所要求公司提供的原始书面 材料、副本材料、复印材料、确认函或证明。 (2)公司提供给本所的文件和材料是真实、准确、完整和有效的,并无隐 上海市锦天城律师事务所 差异化分红事项的法律意见书 致:彤程新材料集团股份有限公司 上海市锦天城律师事务所(以下简称"锦天城"或"本所")作为彤程新材 料集团股份有限公司(以下简称"公司")的常年法律顾问,接受公司的委托, ...

| 证券代码：603650 | 证券简称：彤程新材 公告编号：2024-041 | | --- | --- | | 债券代码：113621 | 债券简称：彤程转债 | 彤程新材料集团股份有限公司 2023 年年度权益分派实施公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗 漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 每股分配比例 A 股每股现金红利 0.59 元（含税） 相关日期 | 股份类别 | 股权登记日 | 最后交易日 | 除权（息）日 | 现金红利发放日 | | --- | --- | --- | --- | --- | | Ａ股 | 2024/6/4 | － | 2024/6/5 | 2024/6/5 | 差异化分红送转： 是 一、 通过分配方案的股东大会届次和日期 本次利润分配方案经彤程新材料集团股份有限公司 2024 年 5 月 15 日的 2023 年年度股东 大会审议通过。 二、 分配方案 1. 发放年度：2023 年年度 2. 分派对象： 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任公司上海分 公司（以下简称 ...

| 证券代码：603650 | 证券简称：彤程新材 公告编号：2024-042 | | --- | --- | | 债券代码：113621 | 债券简称：彤程转债 | 彤程新材料集团股份有限公司 关于因利润分配调整可转债转股价格的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 证券停复牌情况：适用 因实施权益分派,本公司的相关证券停复牌情况如下： | 113621 | 彤程转债 | 可转债转股复 | | | 2024/6/4 | 2024/6/5 | | --- | --- | --- | --- | --- | --- | --- | | 证券代码 | 证券简称 | 停复牌类型 牌 | 停牌起始日 | 停牌 期间 | 停牌终止日 | 复牌日 | 日调整为 32.53 元/股。因实施 2022 年年度权益分派，转股价格于 2023 年 6 月 5 日调整为 32.45 元/股。 一、转股价格调整依据 公司于 2024 年 5 月 15 日召开 2023 年年度股东大会并审议通过了《关于公司 2023 年度 ...

Investment Rating - The report assigns an "Overweight" rating to Tongcheng New Materials (603650) [36] Core Views - Tongcheng New Materials is a global leader in new materials, with its business covering automotive, display panels, and semiconductors [43] - The company is a leading domestic semiconductor photoresist manufacturer, with G-line and I-line photoresist products widely used in domestic integrated circuit production lines [36] - The company has successfully mass-produced ArF photoresist, and its EBR solvent production capacity has reached 20,000 tons per year, meeting the demand for high-purity solvents in advanced chip manufacturing [25] - The company plans to invest in a semiconductor chip polishing pad project, which is expected to generate annual sales of approximately 800 million yuan upon full production [26] - The company is a global leader in tire rubber phenolic resin, with a leading market share in the industry [9] Business Segments Electronic Materials - The company's electronic materials business accounted for 19% of total revenue in 2023, with a year-on-year growth of 174% in 2022 [76] - The company has successfully developed and mass-produced ArF photoresist, with the first batch of products reaching the level of international manufacturers [25] - The company's EBR solvent production capacity has reached 20,000 tons per year, meeting the demand for high-purity solvents in advanced chip manufacturing [25] Automotive/Tire Specialty Materials - The company's automotive/tire specialty materials business accounted for 78% of total revenue in 2023 [76] - The company is a global leader in tire rubber phenolic resin, with a leading market share in the industry [9] - The company has established stable cooperative relationships with 75 global tire companies, covering multiple international and domestic brands [79] Biodegradable Materials - The company has successfully implemented a 100,000-ton/year PBAT project (actual construction of 60,000 tons) in the Shanghai Chemical Industry Park, marking significant progress in the field of high-end biodegradable products [80] - The company is actively promoting the application of biodegradable materials in fields such as agricultural mulch and express packaging [80] Financial Performance - In 2023, the company achieved revenue of 2.944 billion yuan, a year-on-year increase of 17.74%, and net profit attributable to the parent company of 407 million yuan, a year-on-year increase of 36.37% [22] - The company's gross margin remained stable at over 20% from 2021 to 2023, with a gross margin of 24.81% in Q1 2024 [13] - The company's net profit margin in Q1 2024 was 18.88%, showing a rapid increase compared to the previous quarter [13] Industry Analysis Photoresist Industry - Photoresist is a key material in the semiconductor manufacturing process, accounting for about 6% of semiconductor production costs [3] - The global photoresist market is expected to recover in 2024, with EUV and KrF photoresist products growing the fastest [33] - The domestic semiconductor photoresist market is highly competitive, with companies such as Beijing Kehua, Xuzhou Bokang, and Suzhou Ruihong making significant progress in G/I-line and KrF photoresist [24] Rubber Additives Industry - The global rubber additives market has shown steady growth, with China being the main producer and exporter [9] - The company is a global leader in tire rubber phenolic resin, with a leading market share in the industry [9] Biodegradable Materials Industry - Biodegradable plastics such as PLA, PBAT, and PHA are emerging materials in the plastics industry, with the potential to replace traditional plastics [80] - The company has successfully implemented a 100,000-ton/year PBAT project in the Shanghai Chemical Industry Park, marking significant progress in the field of high-end biodegradable products [80]

| 股票代码：603650 | 股票简称：彤程新材 | 编号：2024-040 | | --- | --- | --- | | 债券代码：113621 | 债券简称：彤程转债 | | 彤程新材料集团股份有限公司 关于子公司签订"半导体芯片先进抛光垫项目"合作协 议的公告 彤程新材料集团股份有限公司（以下简称"公司"或"上市公司"）全资子公司 上海彤程电子材料有限公司于 2024 年 5 月 27 日与江苏省金坛华罗庚高新技术产业开 发区管理委员会签署《"半导体芯片先进抛光垫项目"合作协议》（以下简称"《合作 协议》"），协议备案投资 3 亿元（最终投资金额以项目建设实际投入为准），项目顺利 达产后可实现年产半导体芯片先进抛光垫 25 万片、预计满产后年销售约 8 亿元。 相关风险提示： 1、本次投资系公司基于长期战略规划及对行业市场前景的判断而做出的谨慎决 定，但受市场变化的不确定性及相关政策的影响，仍存在一定的市场风险和经营风险。 公司将进一步完善内部管控制度和监督机制，根据市场变化及时调整经营策略，防范 可能出现的风险。 2、本次项目投入建设后，受宏观经济、行业政策、市场环境变化等因素的影响， 可能存在如 ...