Core Viewpoint - Shengyi Electronics has shown significant stock price fluctuations in 2023, with a year-to-date increase of 86.84% but a recent decline over the past five trading days by 7.85% [2] Group 1: Stock Performance - As of October 15, Shengyi Electronics' stock price rose by 2.03% to 72.34 CNY per share, with a total market capitalization of 60.174 billion CNY [1] - The stock has experienced a 52.32% increase over the past 60 days, despite a 5.59% decline over the last 20 days [2] - The company has appeared on the "Dragon and Tiger List" three times this year, with the most recent net buy of 15.1121 million CNY on June 18 [2] Group 2: Financial Performance - For the first half of 2025, Shengyi Electronics reported a revenue of 3.769 billion CNY, representing a year-on-year growth of 91.00%, and a net profit of 531 million CNY, up 452.11% [2] - Cumulative cash dividends since the company's A-share listing amount to 999.2 million CNY, with 584 million CNY distributed over the last three years [3] Group 3: Shareholder Information - As of June 30, 2025, the number of shareholders decreased by 3.84% to 17,500, with an average of 47,464 circulating shares per shareholder, an increase of 3.99% [2] - Hong Kong Central Clearing Limited is the third-largest circulating shareholder, holding 11.7295 million shares, an increase of 3.9454 million shares from the previous period [3]

10月13日，生益电子跌7.55%，截至发稿，报70.17元/股，成交2.25亿元，换手率0.37%，总市值583.69 亿元。 资料显示，生益电子股份有限公司位于广东省东莞市东城区(同沙)科技工业园同振路33号，成立日期 1985年8月2日，上市日期2021年2月25日，公司主营业务涉及各类印制电路板的研发、生产与销售业 务。 从基金十大重仓股角度 诺德新生活A（006887）基金经理为周建胜。 截至发稿，周建胜累计任职时间3年93天，现任基金资产总规模5.01亿元，任职期间最佳基金回报 65.94%， 任职期间最差基金回报29.16%。 风险提示：市场有风险，投资需谨慎。本文为AI大模型自动发布，任何在本文出现的信息（包括但不 限于个股、评论、预测、图表、指标、理论、任何形式的表述等）均只作为参考，不构成个人投资建 议。 责任编辑：小浪快报 数据显示，诺德基金旗下1只基金重仓生益电子。诺德新生活A（006887）二季度增持12.01万股，持有 股数88.67万股，占基金净值比例为9.45%，位居第四大重仓股。根据测算，今日浮亏损失约508.09万 元。 诺德新生活A（006887）成立日期2019年3月2 ...

Core Viewpoint - The company has adjusted the maximum repurchase price of its shares following the implementation of its 2025 semi-annual profit distribution plan, reducing it from RMB 42.77 per share to RMB 42.47 per share, effective from September 25, 2025 [1][5]. Summary by Sections 1. Basic Information on Share Repurchase - The company approved a share repurchase plan on April 18, 2025, allowing for the repurchase of shares using its own funds, with a total repurchase amount between RMB 50 million and RMB 100 million, and a maximum price of RMB 43.02 per share [2]. 2. Progress of Share Repurchase - As of September 30, 2025, the company has not yet implemented the share repurchase plan and will proceed based on market conditions [3]. 3. Reason for Adjusting the Maximum Repurchase Price - The adjustment in the maximum repurchase price is due to the company's decision to distribute a cash dividend of RMB 3.00 per 10 shares, effective from the record date of September 24, 2025 [4][3]. 4. Specifics of the Price Adjustment - The new maximum repurchase price is calculated as RMB 42.47 per share, derived from the previous maximum price minus the cash dividend per share, which is approximately RMB 0.2970 [5]. 5. Other Matters - Other aspects of the share repurchase plan remain unchanged, and the company will adhere to relevant regulations while making repurchase decisions based on market conditions [6].

Market Overview - The component sector experienced a decline of 3.87% on October 10, with Fangbang Co., Ltd. leading the drop [1] - The Shanghai Composite Index closed at 3897.03, down 0.94%, while the Shenzhen Component Index closed at 13355.42, down 2.7% [1] Individual Stock Performance - Notable gainers included *ST Dongjing, which rose by 4.96% to a closing price of 11.01, and Sihui Furun, which increased by 2.49% to 41.56 [1] - Fangbang Co., Ltd. saw a significant drop of 9.99%, closing at 60.55, while other major declines included ShenNan Circuit (-9.03%) and Shenghong Technology (-6.77%) [2] Trading Volume and Capital Flow - The component sector saw a net outflow of 4.263 billion yuan from institutional investors, while retail investors contributed a net inflow of 2.897 billion yuan [2] - The trading volume for major stocks included Shengyi Technology with 58.77 million shares and Sihui Furun with 12.17 million shares [1][2] Capital Flow Analysis - Major net inflows were observed in stocks like Shengyi Technology (75.38 million yuan) and Sihui Furun (40.40 million yuan), while Fangbang Co., Ltd. had a net inflow of 7.72 million yuan [3] - Conversely, significant net outflows were recorded for stocks such as *ST Dongjing (-1.37 million yuan) and ShenNan Circuit (-1.43 million yuan) [3]

Core Viewpoint - Shengyi Electronics (688183.SH) has announced that as of September 30, 2025, the company has not yet implemented its share repurchase plan and will consider executing this plan based on market conditions [1] Summary by Category - **Company Actions** - The company has not yet initiated the share repurchase of its shares as of the specified date [1] - Future implementation of the repurchase plan will depend on market conditions [1]

关于股份回购进展暨2025年半年度权益分派实施后调 整回购股份价格上限的公告 证券代码：688183 证券简称：生益电子 公告编号：2025-056 生益电子股份有限公司 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2025/4/19 | | | | | | | --- | --- | --- | --- | --- | --- | --- | | 回购方案实施期限 | 年 月 2025 5 12 4 | 日~2026 | 年 | 月 | 17 | 日 | | 预计回购金额 | 5,000万元~10,000万元 | | | | | | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 □用于转换公司可转债 | | | | | | | | □为维护公司价值及股东权益 | | | | | | | 累计已回购股数 | 0万股 | | | | | | | 累计已回购股数占总股本比例 | 0% | | | | | | | 累计已回购金额 | 0万元 | | | | | | | ...

Core Viewpoint - The company has adjusted its share repurchase plan due to the impact of the 2025 interim dividend distribution, lowering the maximum repurchase price from 42.77 yuan to 42.47 yuan per share [1] Summary by Relevant Sections - **Share Repurchase Plan** The company initially planned to repurchase shares worth between 50 million to 100 million yuan for implementing equity incentives or employee stock ownership plans [1] The maximum repurchase price was set at 42.77 yuan per share, which has now been revised to 42.47 yuan per share [1] - **Dividend Distribution Impact** The adjustment in the repurchase price is based on the cash dividend distribution plan approved at the 2025 first extraordinary general meeting, which involves a cash dividend of 3 yuan (including tax) for every 10 shares [1] - **Implementation Status** As of September 30, 2025, the company has not yet executed the share repurchase and will proceed based on market conditions [1]

Core Insights - The HDI board market is experiencing significant growth driven by global digital transformation and the trend towards electric and intelligent vehicles. China, as a major manufacturing and consumption market, is seeing rapid development in the HDI board industry, with a projected market size of 45.568 billion yuan in 2024, reflecting a year-on-year increase of 16.5% [1][6]. - The market is expected to continue expanding, reaching 50.908 billion yuan by 2025, with an 11.7% year-on-year growth [1][6]. Industry Overview - HDI boards, or High-Density Interconnect boards, utilize micro-blind buried hole technology and lamination processes to enhance circuit density, catering to the miniaturization and high-speed signal transmission needs of electronic products. They are primarily used in mobile phone motherboards, digital devices, and automotive electronics [3][4]. - The HDI board industry can be categorized into three types based on lamination complexity: low-end HDI (single lamination), high-end HDI (two or more laminations), and any-layer HDI (most complex) [3]. Market Size and Growth - The global HDI board market is projected to reach 12.8 billion USD in 2024, with a year-on-year increase of 15.3%, and is expected to grow to approximately 14.3 billion USD by 2025 [5][6]. Competitive Landscape - The HDI board industry is dominated by overseas and Taiwanese manufacturers, while mainland Chinese companies are rapidly catching up. Key players in mainland China include companies like Fangzheng Technology, Bomin Electronics, and Shenghong Technology, which are increasing their R&D investments and expanding high-end production capacities [7][8]. Development Trends - The HDI board market is shifting towards higher-end products, driven by the demand for advanced mobile devices and the adoption of AnyLayer HDI motherboards in Android smartphones. The trend indicates a growing need for high-layer HDI boards as high-end smartphone sales increase [9]. - The application fields for HDI boards are expanding, particularly in the rising electric vehicle sector, which requires stable and reliable circuit connections for various systems [10]. Additionally, the medical device sector is also a growing market for HDI boards due to the demand for miniaturized and intelligent devices [11]. - Environmental considerations are leading to a trend towards green manufacturing practices in the HDI board industry, with a focus on reducing harmful substances and optimizing production processes [12].

Core Viewpoint - The recent financing and expansion plans of major PCB companies are primarily driven by the increasing demand for AI technologies and high-end PCB products, indicating a significant shift in the industry towards advanced manufacturing capabilities [1][3][6]. Group 1: Company Expansion Plans - Huadian Co. disclosed a new project for high-end printed circuit boards (PCBs) with an investment of 4.3 billion yuan, which began construction in June 2023 and is expected to start trial production in the second half of 2026 [1]. - Shenghong Technology completed a fundraising round of 1.9 billion yuan, with allocations of 850 million yuan for an AI HDI project in Vietnam and 500 million yuan for a high-layer PCB project in Thailand [1]. - Eight PCB manufacturers have announced new financing and expansion plans since July 25, focusing on enhancing their capabilities in HDI, HLC, and SLP products [1][2]. Group 2: Market Demand and Trends - The demand for high-density and high-layer PCBs is expected to grow significantly due to advancements in AI, satellite communications, and automotive electronics, with the HDI market projected to reach 17.037 billion USD by 2029, reflecting a compound annual growth rate of 6.4% [6]. - The complexity of PCB production processes is increasing, necessitating higher precision and efficiency in manufacturing equipment, particularly in plating and drilling stages [6][7]. - The shift towards high-end PCB products is driving upgrades in core materials such as copper foil, electronic cloth, and resin, which are essential for meeting the demands of high-speed signal transmission [7]. Group 3: Investment Opportunities - The expansion of PCB production is anticipated to create a favorable cycle for the industry, benefiting upstream material and equipment companies as demand for high-end PCBs rises [7]. - The global market for PCB-specific equipment is expected to reach 10.765 billion USD by 2029, with a compound annual growth rate of 8.7% from 2024 to 2029 [6].

Market Overview - On September 30, the component sector declined by 1.03%, with Shengyi Electronics leading the drop [1] - The Shanghai Composite Index closed at 3882.78, up 0.52%, while the Shenzhen Component Index closed at 13526.51, up 0.35% [1] Stock Performance - Notable gainers in the component sector included: - Zhongfu Circuit (300814) with a closing price of 53.41, up 11.36% and a trading volume of 187,900 shares, totaling 976 million yuan [1] - Fangzheng Technology (600601) closed at 11.36, up 8.92% with a trading volume of 5,150,500 shares, totaling 5.632 billion yuan [1] - Fangbang Co., Ltd. (688020) closed at 68.50, up 6.78% with a trading volume of 51,300 shares, totaling 34.6 million yuan [1] - Major decliners included: - Shengyi Electronics (688183) closed at 78.50, down 3.37% with a trading volume of 196,900 shares, totaling 1.557 billion yuan [2] - Yuandiwei (832491) closed at 34.27, down 2.78% with a trading volume of 74,100 shares, totaling 256 million yuan [2] - Dongshan Precision (002384) closed at 71.50, down 2.58% with a trading volume of 523,100 shares, totaling 376.8 million yuan [2] Capital Flow - The component sector experienced a net outflow of 1.335 billion yuan from institutional investors, while retail investors saw a net inflow of 1.108 billion yuan [2][3] - Notable net inflows from retail investors included: - Fangzheng Technology (600601) with a net inflow of 668.9 million yuan [3] - Zhongfu Circuit (300814) with a net inflow of 181 million yuan [3] - Conversely, significant net outflows from institutional investors were observed in: - Nanya New Materials (688519) with a net outflow of 572 million yuan [3] - Yibotech (301366) with a net outflow of 1.640 million yuan [3]