九江德福科技股份有限公司 2025 年半年度报告全文 证券代码：301511 证券简称：德福科技 公告编号：2025-066 九江德福科技股份有限公司 2025 年半年度报告 2025 年 8 月 1 九江德福科技股份有限公司 2025 年半年度报告全文 第一节 重要提示、目录和释义 公司董事会、董事、高级管理人员保证半年度报告内容的真实、准确、完 整，不存在虚假记载、误导性陈述或者重大遗漏，并承担个别和连带的法律责 任。 公司负责人马科、主管会计工作负责人范帆及会计机构负责人(会计主管 人员)范帆声明：保证本半年度报告中财务报告的真实、准确、完整。 所有董事均已出席了审议本次半年报的董事会会议。 本半年度报告涉及未来计划等前瞻性陈述，不构成公司对投资者的实质承 诺，投资者及相关人士均应对此保持足够的风险认识，并且应当理解计划、预 测与承诺之间的差异。公司在经营管理中可能面临的风险与应对措施已在本报 告中第三节"管理层讨论与分析"之"十、公司面临的风险和应对措施"部分 予以描述。敬请广大投资者关注，并注意投资风险。 公司计划不派发现金红利，不送红股，不以公积金转增股本。 2 | 第一节 重要提示、目录和释义 ...

Core Viewpoint - The report from Minsheng Securities highlights "speed" and "power" as the two core contradictions in current AI development, with PCB (Printed Circuit Board) being a crucial component in the AI industry chain, benefiting significantly from the ongoing advancements in PCB technology and processes [1] Group 1: PCB Industry Trends - The PCB industry is experiencing rapid development in advanced packaging and high-density interconnect technologies, transitioning from traditional HDI and substrate technologies to mSAP processes capable of sub-10μm line widths to meet the demands of high-speed signal transmission and large-scale integration [1] - New technologies such as CoWoP (Chip-on-Wafer-on-Panel) are changing the form of packaging substrates by using large-size PCBs to carry multiple chips, thereby reducing costs and enhancing interconnect density [1] Group 2: Upstream Material Demand - Driven by AI demand, leading PCB manufacturers like Shenghong Technology, Huitian Technology, and Pengding Holdings are actively expanding production, creating a resonance between material upgrades and capacity expansion [2] - Key upstream materials for PCBs include copper foil, electronic cloth, and resin, with upgrades in these materials to meet the requirements of high-speed signal transmission and lightweight designs [2] Group 3: Equipment Supply and Domestic Substitution - The core processes of PCB manufacturing, including drilling, electroplating, and etching, are critical for determining interconnect density, signal integrity, and production yield, with increasing demands for precision and reliability in these processes [3] - Domestic equipment manufacturers such as Dazhu CNC, Dingtai High-Tech, and Dongwei Technology are accelerating their layouts in advanced process equipment for high-layer boards, HDI, and mSAP, reflecting the industry's shift towards domestic substitution [3] Group 4: Investment Recommendations - Recommended PCB leading manufacturers include Shenghong Technology (300476.SZ), Pengding Holdings (002938.SZ), Huitian Technology (002463.SZ), Shenzhen South Circuit (002916.SZ), Guanghe Technology (001389.SZ), and Jingwang Electronics (603228.SH) [4] - In the materials sector, companies with core technologies and customer resources such as Honghe Technology (603256.SH), Zhongcai Technology (002080.SZ), Feilihua (300395.SZ), Defu Technology (301511.SZ), Longyang Electronics (301389.SZ), and Meilian New Materials (300586.SZ) are recommended [4] - For equipment, focus on domestic substitution in core segments with companies like Dazhu CNC (301200.SZ), Xinqi Microelectronics (688630.SH), Dingtai High-Tech (301377.SZ), and Dongwei Technology (688700.SH) [4]

Core Viewpoint - CCL (Copper Clad Laminate) is experiencing a price surge, with major manufacturers like 建滔积层板 issuing price increase notices, followed by second-tier companies such as 宏瑞兴 and 威利邦 [1] Group 1: Price Increases and Market Dynamics - 建滔积层板 announced a price increase of 10 yuan per sheet for products like CEM-1/22F/V0/HB/FR-4 starting August 15 [1] - 威利邦 and 宏瑞兴 also followed suit, with 威利邦 raising prices by 5 yuan per sheet due to rising copper prices, and 宏瑞兴 increasing prices by 10 yuan for various copper-clad laminates [1] Group 2: CCL and PCB Cost Structure - CCL is a core material for PCBs, accounting for 30% of the total PCB cost, with overall raw material costs making up 60% of PCB expenses [2] - The cost structure of CCL includes significant contributions from copper foil (42.1%), resin (26.1%), and fiberglass (19.1%) [3] Group 3: Demand Drivers and Supply Constraints - The rapid development of AI technology is driving strong demand for AI servers, which in turn boosts PCB demand [4] - The PCB industry is experiencing simultaneous increases in volume and price, leading to supply shortages in high-end materials such as LowDk electronic cloth and HVLP copper foil [5] Group 4: Key Material Suppliers - Recommended companies for AIPCB upstream materials include: - Electronic Cloth: 宏和科技 and 中材科技 [8] - Copper Foil: 铜冠铜箔, 德福科技, 隆扬电子, 嘉元科技, and 方邦股份 [8] - Electronic Resins: 东材科技, 圣泉集团, 宏昌电子, and 同宇新材 [8] - Functional Fillers: 联瑞新材 [8] - PCB-specific Electronic Chemicals: 天承科技 [9] - Copper Balls/Oxidized Copper Powder: 江南新材 [9]

Group 1 - The core point of the article is that Defu Technology (301511) announced a plan for a significant share reduction by its shareholder, Jiujiang Fuhe Construction Investment Group Co., Ltd., and its concerted party, Jiujiang Kuntai Equity Investment Fund Management Co., Ltd. [1] - The shareholders plan to reduce their holdings by up to 9.4548 million shares, which represents 1.5% of the company's total share capital [1]

Group 1 - The core point of the article is that Defu Technology (301511.SZ) announced a plan for major shareholders to reduce their holdings by up to 9,454,830 shares, which is 1.5% of the total share capital, due to personal funding needs [1] - The reduction will take place within three months after 15 trading days from the announcement date, using centralized bidding or block trading methods [1] - The shares to be reduced are sourced from the company's holdings prior to its initial public offering [1]

证券代码：301511 证券简称：德福科技 公告编号：2025-065 九江德福科技股份有限公司 关于合并持股 5%以上股东及其一致行动人股份减持计划 的预披露公告 一、股东基本情况 截至本公告披露日，本次减持计划的股东的基本情况如下： | 序号 | 股东名称 | 持股数量 | 占公司总股本 | | --- | --- | --- | --- | | | | （股） | 比例 | | 1 | 九江富和建设投资集团有 | 24,180,737 | 3.84% | | | 限公司 | | | 1 | | 九江昆泰股权投资基金管 | | | | --- | --- | --- | --- | | 2 | 理有限公司－九江德福股 | 16,687,224 | 2.65% | | | 权投资中心（有限合伙） | | | | | 合计 | 40,867,961 | 6.48% | 注：表格中合计数与明细数直接相加之和在尾数上如有差异，是由于四舍五 入所造成。 合并持股 5%以上股东九江富和建设投资集团有限公司及其一致行动人 九江昆泰股权投资基金管理有限公司－九江德福股权投资中心（有限合伙） 保证向本公司提供的信息内容真实 ...

Investment Rating - The industry investment rating is "Overweight (Maintain)" [2] Core Viewpoints - CCL is experiencing a price increase trend, with major manufacturers like Jiantao and Hongruixing announcing price hikes for various products [5] - CCL is a core raw material for PCBs, accounting for 30% of PCB total costs, with raw material costs making up 60% of the total PCB cost [5][10] - The demand for PCBs is driven by the rapid growth of AI technology, leading to a strong demand for AI servers and an upward trend in PCB market conditions [5] - The supply of upstream materials for AIPCB is facing shortages, particularly in high-performance materials such as Low Dk electronic cloth and HVLP copper foil [5] - The report suggests focusing on companies like Honghe Technology, Tongguan Copper Foil, and Defu Technology, which are key players in the upstream materials for AIPCB [6] Summary by Sections Price Trends - Major manufacturers have announced price increases for CCL products, with Jiantao raising prices by 10 yuan per sheet and other manufacturers following suit due to rising copper prices [5] Cost Structure - CCL's cost structure shows that upstream raw materials account for approximately 90% of its costs, with copper foil, resin, and fiberglass being the primary components [5][12] Market Demand - The rapid development of AI technology is significantly boosting the demand for PCBs, particularly for high-performance materials required for AI server upgrades [5] Supply Constraints - The report highlights a tightening supply of high-end materials in the PCB industry, including Low Dk electronic cloth and HVLP copper foil, which are critical for meeting the growing demand [5] Investment Recommendations - The report recommends monitoring companies such as Honghe Technology, Tongguan Copper Foil, and Defu Technology for potential investment opportunities in the AIPCB upstream materials sector [6]

Group 1 - The A-share market has seen a significant increase, with the Shanghai Composite Index surpassing 3,800 points, reaching a nearly ten-year high [1] - There has been a notable wave of share reductions, particularly in July and August, with 428 A-share listed companies' shareholders reducing their stakes, totaling approximately 600 billion yuan [1][2] - The number of reduction events in the first half of 2025 has doubled compared to the same period in 2024, indicating a strong trend in shareholder exits [1][2] Group 2 - Venture capital funds are key participants in the reduction wave, marking a significant operational phase for these funds as they seek to exit investments [2][3] - The improvement in market conditions has allowed venture capital funds to realize returns, reflecting a recovery in the capital market's exit function [2][3] Group 3 - Venture capital funds typically have a lifespan of 8-10 years, necessitating timely exits to distribute returns to limited partners (LPs) [3][4] - The recent market recovery has provided a rare opportunity for these funds to exit investments, which had been delayed due to previous market volatility [3][4] Group 4 - Specific examples include DeFu Technology and Shangwei New Materials, where venture capital funds have begun to reduce their stakes following significant stock price increases [5][6] - The reduction actions are not short-term but rather part of a long-term investment strategy, demonstrating a complete cycle of fundraising, investment, management, and exit [5][6] Group 5 - The reduction process must consider market capacity and the needs of the companies involved, emphasizing compliance and gradual exit strategies to avoid market disruption [7][8] - Effective communication and expectation management are crucial to mitigate market concerns regarding sudden or opaque reductions [7][8] Group 6 - The short-term impact of reductions on stock prices can be managed through compliance and transparency, with long-term value being determined by the company's fundamentals [8][9] - Some venture capital funds choose to maintain a stake in companies post-IPO to benefit from continued growth, particularly in sectors like hard technology and new energy [8][9] Group 7 - The relationship between venture capital funds and companies can extend beyond equity, fostering collaboration and resource synergy through continued investment [9][10] - The ability to maintain long-term relationships post-IPO is often limited by the fund's lifecycle and the need for cash flow to LPs [10]

Investment Rating - The report maintains a "Recommended" rating for leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd. [4][5] Core Viewpoints - The PCB industry is experiencing rapid advancements in packaging and high-density interconnect technologies, with traditional HDI and substrate technologies evolving into mSAP processes to meet the demands of high-speed signal transmission and large-scale integration [1][2] - The demand for PCB is driven by AI applications, leading to significant expansions in production capacity among leading companies, with total investments exceeding 30 billion RMB [2][20] - The core materials for PCB, including copper foil, electronic cloth, and resin, are undergoing upgrades to meet the high-frequency and high-speed requirements of AI applications [2][20][26] Summary by Sections 1. CoWoP and mSAP as Core Technologies - CoWoP (Chip-on-Wafer-on-PCB) is emerging as a future packaging route, enhancing interconnect density and reducing costs by directly using large-size PCBs [1][11] - mSAP (Modified Semi-Additive Process) is becoming the core process for achieving sub-10 µm line capabilities, essential for high-performance applications [1][14] 2. PCB Capacity Expansion and Material Upgrades - Leading PCB manufacturers are actively expanding production capacity, with significant investments announced by companies like Huadian Co., Ltd. and Shenghong Technology [2][20] - The upgrade of core materials includes the transition of copper foil from HVLP1 to HVLP5, electronic cloth to third-generation low-dielectric cloth, and resin to hydrocarbon and PTFE types [2][20][28] 3. Tight Supply of Core Equipment and Acceleration of Domestic Substitution - The supply of core PCB equipment, including drilling, plating, and etching imaging, is tight, with domestic manufacturers accelerating their layouts in advanced process equipment [2][49] - Companies like Dazhu CNC and Ding Tai High-Tech are focusing on high-layer boards and HDI equipment to meet the increasing demands of the industry [2][49] 4. Investment Recommendations - The report suggests focusing on leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd., as well as material companies with core technologies like Honghe Technology and Zhongcai Technology [3][4] - Equipment manufacturers involved in domestic substitution, such as Dazhu CNC and Xinqi Microelectronics, are also highlighted as potential investment opportunities [3][4]

金融界消息 截至2025年8月22日收盘，德福科技（301511）报收于39.55元，上涨8.71%，换手率 18.37%，成交量68.81万手，成交金额26.75亿元。 资金流向方面，今日主力资金净流入1.82亿元，占比成交额6.79%。其中，超大单净流入1244.86万元、 占成交额0.47%，大单净流入1.69亿元、占成交额6.32%，中单净流出流出18022.52万元、占成交额 6.74%，小单净流出127.80万元、占成交额0.05%。 德福科技最新一期业绩显示，截至2025一季报，公司营业总收入25.01亿元、同比增长110.04%，归属净 利润1820.09万元，同比增长119.21%，扣非净利润588.70万元，同比增长105.66%，流动比率1.019、速 动比率0.868、资产负债率73.54%。 天眼查商业履历信息显示，九江德福科技股份有限公司，成立于1985年，位于九江市，是一家以从事有 色金属冶炼和压延加工业为主的企业。企业注册资本63032.2万人民币，实缴资本25420.593万人民币。 公司法定代表人为马科。 通过天眼查大数据分析，九江德福科技股份有限公司共对外投资了9家企业， ...