Market Overview - The battery sector experienced a decline of 0.53% on the previous trading day, with Defu Technology leading the drop [1] - The Shanghai Composite Index closed at 3889.5, down 0.19%, while the Shenzhen Component Index closed at 13231.47, down 0.93% [1] Top Gainers in the Battery Sector - Haike Xinao (301292) saw a closing price of 26.44, with a significant increase of 12.46% and a trading volume of 317,800 shares, amounting to 788 million yuan [1] - Jinyinhai (300619) closed at 37.67, up 12.35%, with a trading volume of 224,800 shares and a turnover of 810 million yuan [1] - Qiaocheng Ultrasonic (688392) closed at 103.40, rising by 11.97% with a trading volume of 72,800 shares, totaling 728 million yuan [1] Top Losers in the Battery Sector - Defu Technology (301511) closed at 32.27, down 5.95%, with a trading volume of 288,100 shares and a turnover of 928 million yuan [2] - Keda Li (002850) closed at 174.01, decreasing by 5.05%, with a trading volume of 87,900 shares and a turnover of 1.526 billion yuan [2] - Anfu Technology (603031) closed at 39.85, down 4.18%, with a trading volume of 71,500 shares and a turnover of 285 million yuan [2] Capital Flow in the Battery Sector - The battery sector experienced a net outflow of 3.121 billion yuan from institutional investors, while retail investors saw a net inflow of 3.336 billion yuan [2][3] - Notable net inflows from retail investors included Tianqi Materials (002709) with 2.12 billion yuan and Greenmei (002340) with 2.11 billion yuan [3] - Major net outflows from institutional investors included Shida Shenghua (603026) with 94.291 million yuan and Jinyinhai (300619) with 71.922 million yuan [3]

Core Viewpoint - The company reported successful customer onboarding for its HVLP1-3 generation copper foil products and positive progress in customer validation for HVLP4/5 generation copper foil products [1] Group 1 - The company is actively engaging with customers for its HVLP1-3 generation copper foil products, indicating a smooth onboarding process [1] - The validation process for HVLP4/5 generation copper foil products is progressing well with customers [1]

（文章来源：证券日报） 证券日报网讯德福科技10月13日在互动平台回答投资者提问时表示，截至2025年9月30日，公司股东人 数为43525户。 ...

Core Viewpoint - Defu Technology (301511) reported successful customer onboarding for its HVLP1-3 generation copper foil products and positive progress in customer validation for HVLP4/5 generation copper foil products [1] Group 1 - The company is currently experiencing smooth customer onboarding for its HVLP1-3 generation copper foil products [1] - The validation process for HVLP4/5 generation copper foil products is progressing well with customers [1]

Core Viewpoint - 德福科技 (301511.SZ) confirms a close cooperative relationship with 超颖电子 in the automotive electronics and storage PCB sectors, with multiple products being shipped in bulk [2] Company Summary - 德福科技 is actively engaged in a partnership with 超颖电子, focusing on automotive electronics and storage PCB [2] - The collaboration involves the bulk shipment of various products, indicating a strong operational relationship between the two companies [2]

Core Viewpoint - Defu Technology (301511.SZ) maintains a close cooperative relationship with Chaoying Electronics in the fields of automotive electronics and storage PCBs, with multiple products being shipped in bulk [1] Group 1 - Defu Technology has confirmed its collaboration with Chaoying Electronics, which is also based in Jiujiang [1] - The cooperation involves multiple products that are being delivered in large quantities [1]

Core Viewpoint - Defu Technology (301511.SZ) reports successful customer onboarding for its HVLP1-3 generation copper foil products and positive progress in customer validation for HVLP4/5 generation copper foil products [1] Group 1 - The company is currently experiencing smooth customer onboarding for its HVLP1-3 generation copper foil products [1] - The validation process for HVLP4/5 generation copper foil products is progressing well with customers [1]

德福科技(301511.SZ)回复：尊敬的投资者您好，公司与超颖电子在以上领域里保持紧密合作关系，多 款产品批量出货，感谢您的关注。 格隆汇10月13日丨有投资者通过互动平台向德福科技(301511.SZ)提问：请问董秘，作为同是九江的公 司，即将登陆主板的超颖电子和公司在汽车电子和储存PCB上面有供应合作关系吗？ ...

格隆汇10月13日丨德福科技(301511.SZ)在投资者互动平台表示，公司HVLP1-3代铜箔产品目前客户导入 顺利，HVLP4/5代铜箔产品在客户验证进展顺利。 ...

Core Viewpoint - The report highlights that the evolution of AI computing hardware is driving structural growth opportunities in the PCB (Printed Circuit Board) industry, with significant demand for high-layer and HDI boards due to the increasing requirements of AI applications and high-performance computing [1][27]. Industry Overview - The global PCB market size is projected to grow from $62 billion in 2020 to $75 billion in 2024, with a compound annual growth rate (CAGR) of 4.9%. By 2029, the market is expected to reach $93.7 billion, with a CAGR of 4.6% from 2024 to 2029 [1][27]. - The AI and high-performance computing sectors are anticipated to see substantial growth, with the market size expected to reach $15 billion by 2029, reflecting a CAGR of 20.1% from 2024 to 2029 [1][27]. Demand Drivers - The demand for high-layer PCBs and HDI boards is rapidly increasing, driven by the need for high-frequency, low-signal loss, and high-heat dissipation performance in AI servers. The value of a single AI server PCB is significantly higher than that of traditional servers [1][27]. - The market for high-layer PCBs is projected to reach $171 billion by 2029, while the share of high-end HDI boards in the global HDI market is expected to rise from 47% in 2024 to 57% in 2029, with a market size of $9.6 billion [1][27]. Technological Advancements - AI server requirements are pushing PCB technology upgrades, necessitating the use of high-layer (14-30 layers) and low-loss materials. This includes the adoption of low roughness reverse (RTF) copper foil and very low loss materials to minimize signal distortion [1][27]. - The report emphasizes the importance of material upgrades, such as the transition from traditional fiberglass cloth to low dielectric constant Q cloth, to meet the evolving demands of high-frequency applications [1][27]. Company Strategies - Companies in the PCB sector are actively expanding their capabilities. For instance, companies like Huadian Co. are advancing high-end PCB production, while Shenghong Technology has the capacity for mass production of high-layer boards and HDI boards [1][27]. - Equipment manufacturers like Chip Microelectronics and Dazhu CNC are introducing laser equipment tailored for high-end PCB processing, while material suppliers like Honghe Technology and Feilihua are developing low-dielectric electronic fabrics and high-end copper foils [1][27].