轴承领域着力提升航天轴承的产能和智能化转型，满足配套商业 航天重点主机需求，全面开展技术迭代、提升系统工程助力。 二、交流环节 国机精工集团股份有限公司投资者关系活动记录表 编号：2026—007 | | 特定对象调研 ☑ | □分析师会议 | | --- | --- | --- | | 投资者关系 | □媒体采访 | □业绩说明会 | | 活动类别 | □新闻发布会 | □路演活动 | | | □现场参观 | □电话会议 | | | □其他 | | | | 天风证券：王奕红、曾庆亮、文灿曦 深圳博普资产：雍国铁 | | | | 玺营资产：廖江彤、张婧姝 | | | 参与单位名称 | 国盛证券：彭元立 | | | | 开源证券：蒋雨凯 | | | 及人员姓名 | 华福证券：邓娴仪 | | | | 天治基金：陈付佳 | | | | 中金公司：张琮翎 | | | | 广发基金：白家乐 | | | 时间 | 2026 年 3 月 5 日 | | | 地点 | 国机精工下属企业郑州磨料磨具磨削研究所 | | | 上市公司接待 | 董事会秘书：赵祥功 | | | 人员姓名 | 投资者关系助理：汪智婷 一、公司情况介绍 ...

恐慌情绪有所缓解，市场风格切换至科技成长。 周四恐慌情绪有所缓解，对中东局势的担忧通过两个交易日的调整后已经得到一定程度释放，A股迎 来超跌反弹。其中近期领跌的科创板指数领涨市场，而石油石化板块则连续第二个交易日出现回调。目前霍尔木兹海峡的油运通道依然存在较大不确定 性，由此导致原油、美元等避险品种价格依然维持上涨趋势，市场风险偏好能否出现持续回升仍然取决于中东局势是否能出现实质性缓和。 后市展望： 中东局势存在较大不确定性，原油价格走势或将影响短期市场节奏。中东局势目前存在较大不确定性，其对全球原油市场的供给将形成 多大冲击，以及冲击将延续多长时间目前均较难判断。若原油价格在此期间出现大幅上涨，则容易诱发市场对该事件的担忧，同时对A股板块轮动也将形 成明显影响。石油化工板块的持续强势将对科技成长板块的偏好形成压制，导致指数依然维持缓慢上行的节奏，但个股表现却明显弱于大盘。但从中长期 而言，A股震荡上行的趋势依然没有发生变化，居民储蓄入市以及A股上市公司业绩出现回升仍然是中期行情的两大支撑因素。 热点板块： 3月进入年报季，关注业绩高景气板块。3月即将进入年报季，业绩高景气方向将成为市场关注焦点。从年报预告披 ...

中东局势紧张压制市场风险偏好。 周二A股迎来较大幅度下跌，其中科创板指数下跌超5%领跌市场。市场出现调整的主要原因是中东局势紧张，霍 尔木兹海峡的油运通道可能面临关闭，由此导致原油、美元等避险品种价格大幅上涨，进而压制市场风险偏好。而A股板块轮动的规律显示，石油化工板 块与科技等成长板块存在明显的"负相关性"，石油板块的大幅上涨导致科技成长品种出现普跌。 后市展望： 中东局势存在较大不确定性，原油价格走势或将影响短期市场节奏。中东局势目前存在较大不确定性，其对全球原油市场的供给将形成 多大冲击，以及冲击将延续多长时间目前均较难判断。若原油价格在此期间出现大幅上涨，则容易诱发市场对该事件的担忧，同时对A股板块轮动也将形 成明显影响。石油化工板块的持续强势将对科技成长板块的偏好形成压制，导致指数依然维持缓慢上行的节奏，但个股表现却明显弱于大盘。但从中长期 而言，A股震荡上行的趋势依然没有发生变化，居民储蓄入市以及A股上市公司业绩出现回升仍然是中期行情的两大支撑因素。 热点板块： 3月进入年报季，关注业绩高景气板块。3月即将进入年报季，业绩高景气方向将成为市场关注焦点。从年报预告披露情况来看，科技硬 件、先进制造业 ...

指数窄幅震荡，科技板块领涨。 马年A股实现平稳开局，经历连续两个交易日上涨后，周四指数小幅震荡回调，科技板块开始表现活跃，取代了前两 个交易日的涨价主题。相较节前的成交清淡，周四成交额已经温和回升到2.56万亿，显示节前落袋为安的部分投资者有资金回流股市的迹象。 后市展望： 春节长假期间三大事件驱动，节后行情有望平稳运行。春节长假期间影响市场的重大事件主要是三个：1）美国对等关税被裁定违法； 2）中东局势紧张；3）科技产业催化密集。美国对等关税被裁定违法后，尽管特朗普宣布重新加征 15%的临时关税，但由于有时间限制，加之形成判例 后，未来对他国商品随意加征高额关税的政策将受到限制，贸易格局预计将出现明显好转，有利于市场信心提升。中东局势紧张，避险情绪短期内推高了 贵金属和原油价格，但从2025年的经验来看，受地缘因素推高的涨价行情持续时间并不长，该事件对市场的压制作用有可能被高估。科技产业催化剂密 集，包括机器人、中国大模型、存储芯片涨价等预计将对节后科技板块走势起到提振作用。综合判断，节后行情有望平稳运行，呈现稳中有升的格局，结 构性机会依然活跃。 热点板块： 2月主线仍是科技，但更聚焦基本面景气向上的科技 ...

Company Developments - Samsung released a new smartphone equipped with artificial intelligence technology on February 25 [3] - Tongwei Co., Ltd. announced a suspension of trading starting February 25 as it plans to acquire 100% equity of Qinghai Lihua Qingneng Co., Ltd. through a combination of share issuance and cash payment [3] - Gude Electric Materials issued shares on February 25 with a price of 58 yuan per share and a price-to-earnings ratio of 27.96, focusing on components for battery thermal runaway protection [3] - Kaipu Cloud decided to terminate a major asset restructuring plan involving the acquisition of a 70% stake in Shenzhen Jintaike [10] - Meta and AMD reached an agreement for AI device procurement, with AMD set to sell AI chips worth up to $60 billion to Meta [10] Industry Insights - The State Council's meeting on February 24 emphasized the potential of the silver economy and the need for supportive measures to enhance the development of the elderly care industry, projecting the market size to reach approximately 12 trillion yuan in 2023 and exceed 20 trillion yuan by 2027 [6] - A breakthrough in chip technology was reported by a team from Peking University, creating the smallest and lowest power-consuming ferroelectric transistor, which could significantly enhance AI chip performance and energy efficiency [9] - The semiconductor market is expected to continue improving, driven by high demand from AI servers and new energy vehicles, with a recommendation to focus on leading companies in the sector [9] - The Shanghai Gold Exchange announced adjustments to margin levels and price limits for certain contracts, effective February 24 [5]

马年春节开市以来，港股市场震荡调整，科技新势力表现活跃，半导体板块上涨趋势明显。 ● 本报记者 刘英杰 指数成分股中，伟志控股大涨13.79%，兆易创新（603986）涨11.91%，普达特科技涨10.91%，天岳先 进、澜起科技、华虹半导体等跟涨。 对于近期半导体板块走强的原因，中信建投（601066）证券机械首席分析师许光坦认为，主要受多重利 好共振推动：一方面，AI算力需求持续升温，全球半导体景气周期开启，带动设备及零部件需求增 长；另一方面，国内设备及零部件企业持续取得突破，市场对半导体国产化率提升的产能释放预期逐渐 升温。此外，部分龙头企业在高端零部件领域的量产进展也进一步提振了市场信心。 展望2026年，随着国内产业政策持续发力，叠加"反内卷"相关举措有望推动制造业盈利水平修复，行业 景气度或逐步回升，进而带动上游零部件设备整体需求稳步改善。在半导体设备、上游零部件国产化率 持续提升并加速推进的驱动下，半导体设备零部件板块有望迎来业绩与估值双升的"戴维斯双击"。 分析人士认为，随着AI大模型加速落地、人形机器人产业不断催化，叠加上市公司业绩披露期渐近， 中国资产有望持续获得投资者关注。尽管短期市场 ...

Core Insights - The development journey of Tongfu Microelectronics reflects the rise of China's semiconductor industry, transitioning from near bankruptcy to becoming the fourth-largest semiconductor packaging and testing leader globally [2] - The company emphasizes continuous innovation and collaboration to achieve significant growth in revenue and profit by the end of the 14th Five-Year Plan [2][9] Group 1: Historical Development - In 1990, the company faced severe financial difficulties but turned profitable in 1994 after launching an integrated circuit packaging production line [3] - Key milestones include a joint venture with Fujitsu in 1997, undertaking national R&D projects in 2009, and acquiring 85% of AMD's packaging plants in 2016, which propelled the company into the semiconductor packaging sector [3] - The company has transformed from a supporting role in the semiconductor supply chain to a key player, significantly enhancing the performance of products like the Loongson CPU [3] Group 2: Investment in Innovation - Since 2009, the company has invested over 10 billion yuan in technological innovation, leading to recognition with a national science and technology progress award in 2021 [4] - The focus on innovation is crucial as the domestic semiconductor industry accelerates its development, with the company aiming to strengthen local production capacity and supply chain resilience [4] Group 3: Embracing AI Trends - The company recognizes the ongoing AI wave as a significant opportunity and plans to increase investments in emerging applications such as storage chips and automotive technologies [6] - A recent announcement indicated plans to raise up to 4.4 billion yuan to enhance packaging capacity and support operational needs, reflecting a commitment to strengthening competitiveness in the semiconductor packaging industry [6] Group 4: Strategic Partnerships - The strategic partnership with AMD, established through the acquisition of packaging plants, has been pivotal, with over 80% of AMD's products being packaged by Tongfu Microelectronics [7] - The company is also diversifying its customer base, with half of the orders from its Suzhou plant now coming from clients outside AMD, aiming for a balanced growth engine [7] Group 5: Future Development Goals - The company outlines three main objectives for future growth: maintaining its core business in integrated circuit packaging, innovating in advanced packaging solutions for the AI era, and fostering international cooperation [9] - The 2025 performance forecast anticipates a net profit of 1.1 billion to 1.35 billion yuan, representing a year-on-year growth of 62.34% to 99.24% [9]

Core Insights - The article highlights the transformation of Tongfu Microelectronics from a struggling transistor factory to a leading semiconductor packaging and testing company, reflecting the rise of China's semiconductor industry [3][4] - The company aims to continue its growth trajectory by focusing on innovation, collaboration, and maintaining its core business, with a target for significant revenue and profit growth by the end of the 14th Five-Year Plan [3][9] Group 1: Company Development - Tongfu Microelectronics was established from the South Jiangsu Transistor Factory, which faced severe financial difficulties, but through technological innovation, it turned profitable in 1994 [4] - Key milestones include a joint venture with Fujitsu in 1997, undertaking national R&D projects in 2009, and acquiring 85% stakes in AMD's packaging plants in 2016, which positioned the company as a significant player in the semiconductor packaging sector [4][5] - The company has invested over 10 billion yuan in technological innovation since 2009, leading to significant advancements in packaging technology [5] Group 2: Future Outlook - The company is committed to embracing the AI wave, planning to increase investments in emerging applications such as storage chips and automotive technologies, with a fundraising target of up to 4.4 billion yuan [6][7] - The strategic partnership with AMD has strengthened, with over 80% of AMD's products being packaged by Tongfu Microelectronics, enhancing both companies' competitive positions in the market [7] - The company anticipates a net profit of 1.1 billion to 1.35 billion yuan for 2025, representing a year-on-year growth of 62.34% to 99.24%, indicating a strong growth trajectory [9]

Group 1: Industry Insights - A research team led by Qiu Chengguang from Peking University has developed the smallest and lowest power-consuming ferroelectric transistor to date, which is expected to support AI chip performance and energy efficiency improvements [1] - This new technology breaks the physical limitations of traditional ferroelectric transistors, achieving energy consumption levels that are an order of magnitude lower than the best international standards [1] - The ultra-low working voltage and energy-efficient characteristics of the nano-gate ferroelectric transistor provide a core component solution for building high-efficiency data centers and lay a critical technological foundation for the next generation of high-performance AI chips [1] - Donghai Securities notes that global semiconductor demand continues to improve, with rapid growth in AI servers and new energy vehicles, and demand is expected to recover further by January 2026 [1] - Despite high and rising inventory levels among companies, the demand surge in certain segments driven by AI is leading upstream wafer foundries to increase prices, while memory price hikes may affect costs in consumer electronics like mobile phones and PCs, potentially slowing shipments [1] - Overall, the semiconductor supply-demand landscape is expected to remain favorable in February, with domestic semiconductor production likely to accelerate, suggesting investors should pay attention to leading companies in specific segments [1] Group 2: Company Developments - Huahai Qingke's main products include CMP equipment, thinning equipment, cutting equipment, wet processing equipment, wafer regeneration, key consumables, and maintenance services, having initially achieved a platform strategy layout of "equipment + services" [2] - Shengmei Shanghai is engaged in the development, manufacturing, and sales of semiconductor cleaning equipment and semiconductor plating equipment, providing customized, high-performance, and low-consumption process solutions for semiconductor manufacturers [2]

Stock Performance - As of February 11, 2026, the stock price of Feiwo Tai closed at 20.88 CNY per share, with a market capitalization of approximately 7.035 billion CNY [2] - The stock has seen a cumulative decline of 6.51% over the last five trading days, but has increased by 2.69% over the past 20 days [2] - On the same day, there was a net inflow of 176,000 CNY in main funds, marking the second consecutive day of net inflow [2] Business Development - Feiwo Tai's nano-film products have entered the supply chains of AI glasses and smartwatches, becoming suppliers for major companies like Huawei, Xiaomi, and Apple [3] - The company's nano-protection technology is applied in medical devices such as endoscopes and ultrasonic knives, having passed ISO13485 quality management certification [3] - The company is actively cooperating with other clients for sample verification, with future demand expected to rise alongside growth in the medical device market [3] - Feiwo Tai has expanded its international presence with subsidiaries in Hong Kong, the USA, and Vietnam, and is continuing to explore markets in India, Malaysia, and Pakistan [3] Financial Performance - For the first three quarters of 2025, Feiwo Tai reported a revenue of 367 million CNY, representing a year-on-year growth of 6.00% [4] - The net profit attributable to shareholders was 28.9777 million CNY, reflecting a year-on-year increase of 6.45% [4] - The basic earnings per share stood at 0.09 CNY, with the number of shareholders decreasing by 8.60%, indicating an increase in share concentration [4] Future Outlook - The annual report for 2025 is expected to be released in the first half of 2026, and investors should monitor the performance realization [5] - Future business catalysts include verification results from medical device clients, progress on new orders, and policies in the electronic chemicals industry, such as semiconductor localization [5]