Core Viewpoint - The recent surge in the A-share cultivated diamond sector is driven by policy changes and technological advancements, leading to a revaluation of its market potential from decorative to functional applications [2][4]. Group 1: Market Dynamics - The cultivated diamond sector is experiencing a significant influx of capital, with stocks like Huanghe Xuanfeng and Power Diamond seeing substantial price increases, indicating a collective vote of confidence in the industry's future [2]. - The cultivated diamond's transition from jewelry to high-tech applications, such as in semiconductor cooling solutions, highlights its evolving role in the manufacturing sector [4][5]. Group 2: Technological Advancements - Cultivated diamonds are recognized for their superior thermal conductivity compared to copper and silicon, making them ideal for addressing heat dissipation challenges in advanced electronics [4]. - Power Diamond has set a global record with a 156.47-carat cultivated diamond, showcasing advancements in single crystal cultivation technology that enhance the practical applications of diamonds in electronics [5]. Group 3: Strategic Policy Impacts - The Chinese government has implemented export controls on synthetic diamond products, recognizing their strategic importance in high-end manufacturing, particularly in the semiconductor industry [6][10]. - These export controls are expected to shift the industry focus from scale to technology, promoting higher-end production and innovation within the cultivated diamond sector [10][12]. Group 4: Industry Structure and Challenges - Despite China's dominance in cultivated diamond production, the industry faces structural imbalances, with significant reliance on India for processing and branding, leading to a distorted value distribution [8]. - The Indian cultivated diamond market is under pressure, with a 37.01% year-on-year decline in rough diamond imports, contrasting with the resilience of the natural diamond market, which saw a 14.07% increase in imports [7][8]. Group 5: Future Opportunities - The policy changes are expected to create new opportunities across the industry chain, particularly for upstream manufacturers and midstream processing firms, as well as for downstream brands in the domestic market [11][12]. - The cultivated diamond market in China has a low penetration rate of 5%, indicating significant growth potential as consumer awareness and demand increase [11].

本报讯（记者 李凤虎 河南日报社全媒体记者 陈萌萌）10月15日，走进位于柘城高新技术开发区的河南 省力量钻石股份有限公司（以下简称"力量钻石"）生产车间，一排排大型六面顶压机在恒温恒压环境下 静默运行。正是这套智能化生产系统，既能稳定产出10至50克拉的常规培育钻石原石，又能突破技术瓶 颈，培育出156.47克拉的"巨无霸"单晶。 在9月举行的第十五届中国河南国际投资贸易洽谈会的展台上，一颗重达156.47克拉的人工培育钻石原 石，以璀璨光芒吸引了众人目光。这是力量钻石的最新力作，经国际宝石学院（IGI）鉴定，它超越了 2022年MeylorGlobal公司150.42克拉的纪录，成为全球最大的人工培育钻石单晶。 这一纪录，不仅是人工培育钻石的重量突破，更是柘城县超硬材料产业从"装饰应用"转向"功能突破"的 标志性见证。 "这颗钻石的成功培育，标志着我们的大颗粒单晶技术正式跻身全球领先行列，未来有望拓展出更多的 应用场景。"力量钻石项目部主任陈亚男说。 在力量钻石的生产版图中，另一项"钻石黑科技"同样破解着产业难题。 在金刚石散热片生产车间，透明的金刚石晶片在自动化设备中缓缓沉积，这些看似轻薄的晶片，正成为 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容来自 连线 。 随着科技公司竞相建设更多数据中心，用于容纳运行最新人工智能模型的服务器，这些设施的耗电量 也随之飙升。但这些电力大部分根本没用于计算。它们以最粗暴的方式被浪费：以热量的形式，从现 代芯片中数千亿个晶体管中散发出来。 "芯片中隐藏的秘密是，超过一半的能量在晶体管层面上以漏电流的形式被浪费掉了，"南旧金山一家 专门生产用于电子产品的钻石的 Diamond Foundry 公司电气工程师兼企业家 R. Martin Roscheisen 说道。 这些热量会极大地浪费能源，显著缩短芯片寿命，降低芯片运行效率，并产生更多浪费的热量。因 此，数据中心的关键任务之一是降低服务器温度，以确保其平稳运行。 麻省理工学院机械工程师伊芙琳·王 (Evelyn Wang) 表示："这种方法可以显著降低热阻。"但她指出， 该技术尚未得到商业验证。 罗斯柴森先生是众多工程师之一，他们正在开发将微小的人造金刚石嵌入芯片以保持芯片冷却的方 法。金刚石不仅是已知最坚硬的材料，而且还非常善于将热量从一个地方传导到另一个地方。 英国布里斯托大学物理化学家保罗·梅表示：" ...

Core Viewpoint - The company has confirmed that it is the sole supplier of high-performance thermal copper powder used in the Ascend series 910 chips [1] Company Summary - The company, Youyan Powder Materials (stock code: 688456), has engaged with investors regarding its product supply [1] - The specific product in question is high-performance thermal copper powder, which is critical for the performance of the Ascend series 910 chips [1]

Summary of Liquid Cooling Industry Conference Call Industry Overview - The liquid cooling industry is evolving with significant attention on NVIDIA's GB300 and the upcoming LOBIN structure, transitioning from traditional air cooling to advanced cooling solutions like microchannel cooling plates (MLCP) and bidirectional energy boards [1][2][6] Key Trends and Technologies - **Bidirectional Energy Boards**: Expected to become mainstream by 2026, currently facing design complexity and material selection challenges. R134 and 1,233ZD are the main candidates for refrigerants, each with pros and cons [1][4][3] - **Microchannel Cooling Plates (MLCP)**: Aiming to enhance cooling efficiency by integrating the cooling plate directly with chip packaging, though costs are significantly higher (3 to 7 times traditional plates) [7][6] - **Refrigerant Selection**: The industry is cautious about the transition to new refrigerants, with R134A likely to coexist with newer options due to its maturity and cost-effectiveness [2][13] Future Directions - **Integration of Technologies**: Companies are exploring the combination of bidirectional energy boards with silent cooling methods to address GPU cooling challenges [5][6] - **Material Innovations**: New materials such as quick connectors, CDU, and stainless steel hoses are expected to enhance overall system performance [8][6] - **Economic and Environmental Considerations**: The choice of immersion cooling fluids will focus on cost, performance, and environmental impact, with options like silicone oil and perfluoropolyether (PFPE) being prominent [9][10] Challenges and Considerations - **Design and Implementation**: The complexity of bidirectional energy board design and the need for better sealing and pressure tolerance in the phase change process are significant challenges [4][6] - **Market Dynamics**: The partnership between Dow and Intel has seen slow progress due to pricing mechanisms and responsibility allocation issues, impacting the adoption of silicone oil in data centers [11][9] Emerging Materials - **Liquid Metal**: Offers excellent thermal conductivity but is still in early experimental stages due to high costs and oxidation issues [14][15] - **New Tri-block Materials**: Recent advancements in tri-block materials have improved stability and reduced volatility, making them viable for semiconductor temperature control [17][16] Market Outlook - **Cost Trends**: The cost of K-type PFPE is expected to decrease below 300 RMB per kilogram in the long term, while Y-type PFPE remains high due to supply chain constraints [18][19] - **GWP Concerns**: The high Global Warming Potential (GWP) of PFPE remains a challenge, with no effective methods currently available to significantly reduce it [19][10] This summary encapsulates the key points discussed in the conference call regarding the liquid cooling industry, highlighting trends, challenges, and future directions.

Summary of Conference Call Notes Industry Overview - The conference call discusses advancements in liquid cooling solutions, particularly in response to the increasing thermal demands of next-generation chips, such as NVIDIA's Ruby series [1][2][3]. Key Points and Arguments 1. **Emergence of Hybrid Liquid Cooling Solutions** - The industry is exploring hybrid liquid cooling solutions that combine cold plates with silent liquid cooling to manage higher power outputs effectively [1][2]. - Hybrid solutions can handle approximately 70% of the heat through cold plates, reducing the reliance on silent systems and improving stability [1][4]. 2. **Cost and Performance Optimization** - Hybrid liquid cooling significantly reduces the amount of fluorinated liquids required, with each cabinet needing about 500-600 kg (approximately half a ton), leading to a cost of around 150,000 to 200,000 RMB per cabinet [1][6][7]. - This cost is deemed acceptable compared to the overall cabinet cost of over 6 million RMB, indicating a balance between performance and cost [7]. 3. **Market Demand Projections** - The market demand for high-end electronic fluorinated liquids could reach 20 billion RMB if hybrid solutions are successfully implemented [3][11]. - Current production capacity for liquid cooling solutions is around 2,500 to 3,000 tons, with plans for expansion to 5,000 tons specifically for liquid cooling applications [3][14]. 4. **Technological Requirements for Next-Gen Chips** - NVIDIA's Ruby Ultra series requires advanced cooling solutions that exceed the capabilities of traditional single-phase cooling systems, necessitating the adoption of hybrid solutions [3][11]. 5. **Comparison of Cooling Fluids** - R134A is highlighted for its high cooling efficiency and lower cost (around 50,000 RMB), but it faces quota reduction risks [9]. - Hydrofluoroethers are considered a viable alternative due to their adjustable boiling points and high stability, although they may cause corrosion over time [9]. 6. **Challenges with Pure Silent Liquid Cooling** - Pure silent liquid cooling faces issues of high costs and system stability, as it requires a significant amount of liquid (over 1.5 tons) and can lead to instability in high-density interconnect products [5][10]. 7. **New Opportunities for New Materials** - High-end electronic fluorinated liquids, such as perfluoropolyether and perfluoramine, are becoming preferred choices for hybrid solutions due to their superior performance [3][11]. Additional Important Content - **Newzobang's Market Position** - Newzobang is positioned as a leader in liquid cooling cabinet production, with plans to expand its capacity significantly, potentially reaching 10,000 tons [14]. - The company is expected to achieve a service profit of approximately 7.775 billion RMB in 2025, with a total valuation of around 30 billion RMB for its main business [15][16]. - **Strategic Partnerships and Validation** - Newzobang has established partnerships with major companies like Alibaba and ByteDance, which have provided data support for its liquid cooling products [13]. This summary encapsulates the critical insights from the conference call, focusing on the advancements in liquid cooling technologies and the strategic positioning of key players in the industry.

Group 1: Company Overview - The main business of the company is chip design, and it does not involve military applications [2] - The company aims to become a leading industry player with sustainable and healthy development [3] Group 2: Market Performance and Challenges - The company's stock price is influenced by macroeconomic factors and market trends, and it is actively working to enhance its market value [2][3] - The company is aware of the competitive landscape, particularly with other chip stocks reaching new highs [2] Group 3: Technology and Product Development - The company has developed high-performance products, including the A733 chip, and is focused on continuous iteration based on customer needs [4] - The company has achieved mass production of 12nm chips and is advancing its process technology [5][6] Group 4: Collaborations and Industry Trends - The company is monitoring industry developments, including potential collaborations with major players like Huawei and Nvidia [3][4] - The company has developed multiple chip products based on the RISC-V architecture and has achieved large-scale production [6] Group 5: Future Directions - The company is exploring opportunities in the humanoid robot sector and has applications in products like robotic vacuum cleaners and quadruped robots [5] - The company plans to choose downstream target markets and product development based on operational needs [6]

Core Viewpoint - Tianyue Advanced (02631) shares rose over 8% following Huawei's announcement of two patents related to silicon carbide (SiC) heat dissipation, indicating a positive market response to advancements in SiC technology [1] Group 1: Company Developments - Tianyue Advanced's stock increased by 8.05%, reaching HKD 65.8, with a trading volume of HKD 115 million [1] - The company continues to innovate in forward-looking technologies, expanding its offerings beyond SiC substrates for power and RF devices to include SiC products and technologies in emerging fields such as optical waveguides and TF-SAW filters [1] Group 2: Industry Trends - Huawei's patents focus on heat-conducting compositions and their applications, utilizing SiC as a filler to enhance the thermal conductivity of electronic devices [1] - NVIDIA is reportedly shifting the substrate material for its next-generation Rubin processor design from silicon to silicon carbide to improve heat dissipation, with large-scale adoption expected by 2027 [1] - According to Dongfang Securities, the excellent thermal performance of SiC is anticipated to benefit related manufacturers in applications such as intermediary layers and heat dissipation substrates, with Tianyue Advanced identified as a leading player in the SiC substrate industry [1]

Core Viewpoint - Silicon carbide (SiC) is emerging as a new solution for chip heat dissipation, with Huawei recently announcing two patents related to SiC thermal management [2][6]. Group 1: Huawei's Patents - Huawei has filed two patents involving SiC for thermal management, aimed at enhancing the thermal conductivity of electronic devices [2]. - The first patent focuses on a thermal composition and its applications in electronic component cooling and chip packaging [2]. - The second patent pertains to a thermal absorbing composition for electronic components and circuit boards [2]. Group 2: Industry Trends - NVIDIA is reportedly switching the intermediate substrate material in its next-generation Rubin processors from silicon to SiC to improve heat dissipation, with large-scale adoption expected by 2027 [6]. - SiC has superior thermal conductivity, with a thermal conductivity of 500 W/mK, compared to silicon's 150 W/mK and ceramic substrates' 200-230 W/mK [7]. - The increasing power of AI chips, such as NVIDIA's GPUs, necessitates improved heat dissipation solutions, as the power of the H200 chip has risen from 700W to 1400W [7]. Group 3: Market Potential - The use of SiC intermediate layers can reduce GPU chip junction temperatures by 20-30°C and lower cooling costs by 30%, preventing performance throttling due to overheating [8]. - The market for SiC applications is expanding from power electronics to packaging and cooling solutions, creating new growth opportunities [9]. - A projection indicates that if NVIDIA's H100 chips were to switch to SiC intermediate layers, it would require approximately 76,190 substrates based on current production metrics [9]. Group 4: Stock Market Response - Following NVIDIA's entry into the SiC cooling sector, related stocks in the A-share market have seen significant increases, with companies like Lushou Technology and Tianyue Advanced rising over 30% since September [11]. - Companies such as Tianyue Advanced and Sanan Optoelectronics are actively pursuing innovations in SiC products for various applications, including power devices and thermal management [11][12]. - Financing data shows that several SiC-related stocks have received substantial investments, with Tongfu Microelectronics leading with an increase of 7.01 billion yuan in financing [14].

Core Viewpoint - The company has announced that its LCP materials are being utilized in the fields of chip and server cooling [1] Group 1 - The company is actively engaging with investors through its interactive platform [1] - The application of LCP materials indicates a focus on advanced technology sectors [1]