国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 7月7日消息，据证监会最新披露，长鑫科技集团股份有限公司已披露上市辅导备案，正式启动IPO进 程！ 长鑫存储由长鑫科技集团股份有限公司100%持股。官方网站介绍，长鑫存储是一家一体化存储器制造 公司，专注于动态随机存取存储芯片（DRAM）的设计、研发、生产和销售，创立于2016年。 长鑫科技集团股份有限公司位于安徽合肥，公司注册资本达601.9亿元，无控股股东，第一大股东为国 企控股的合肥清辉集电企业管理合伙企业（有限合伙），直接持有该公司21.67%股份。 2024年3月底，长鑫科技集团股份有限公司刚以接近1400亿元的投前估值，拿下了年内国内市场最大一 笔股权融资——108亿元人民币。此次投资方既有老股东兆易创新，也有合肥国资背景的合肥产投壹 号、建信金融资产等机构持续押注。参考胡润全球独角兽榜单，1400亿的估值足以让长鑫跻身中国前十 大独角兽。 据备案信息披露，长鑫科技成立于2016年，注册资本达601.9亿元，公司无控股股东，第一大股东合肥 清辉集电企业管理合伙企业（有限合伙），直接持有公 ...

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7月7日，中国证监会官网显示，长鑫科技集团股份有限公司（简称"长鑫存储"）启动上市辅导，中金公司、中信建投担任辅导机构。 据公司官网，长鑫存储是一家一体化存储器制造公司，专注于动态随机存取存储芯片（DRAM）的设计、研发、生产和销售。创立于2016年，长鑫存储总部 位于安徽合肥，在国内外拥有多个研发中心和分支机构。长鑫存储的技术团队拥有丰富的技术研发经验和创新能力，已推出多款DRAM商用产品，广泛应用于 移动终端、电脑、服务器、虚拟现实和物联网等领域。 长鑫存储首席执行官为曹堪宇博士。 据介绍，曹堪宇于2017年加入长鑫存储，在担任产品研发执行副总裁以及技术研发执行副总裁期间，制定公司研发战略 及设计路线，完成了多款产品的开发和量产应用，实现了DRAM从无到有的转变，并兼任过技术研究与开发、市场及战略等多个领域的管理工作。2023年4月 起，他开始担任长鑫存储首席执行官。 加入长鑫存储前，曹堪宇曾担任兆易创新战略市场副总裁。他曾在北京凡达讯科技有限公司任首席执行官，并于2005 年联合创立了昆天科微电子技术有限公司，担任中国区总经理。曹堪宇在半导体行业从业20余年，深度参与和推动了中国DRAM产业发展，拥有2 ...

21世纪经济报道记者 张赛男上海报道 存储芯片龙头长鑫存储上市迈出关键一步。 7月7日，证监会官网最新披露，长鑫科技集团股份有限公司（简称：长鑫科技/长鑫存储）已披露上市 辅导备案，正式启动IPO进程。 其辅导机构为中国国际金融股份有限公司、中信建投证券股份有限公司，律师事务所为上海市锦天城律 师事务所，会计师事务所为德勤华永会计师事务所（特殊普通合伙）。 据备案信息披露，长鑫科技成立于2016年，注册资本达601.9亿元，公司无控股股东，第一大股东合肥 清辉集电企业管理合伙企业（有限合伙），直接持有公司21.67%股份。主营业务为动态随机存取存储 器（DRAM）产品的研发、设计、生产及销售，广泛应用于移动终端、电脑、服务器、虚拟现实和物联 网等领域。 值得关注的是，在此次上市前，该公司已获得包括国家大基金在内的多轮重磅投资。其中，国家大基金 二期持股比例为9.8%，安徽省投资集团控股有限公司持股8.8761%。此外，还有阿里巴巴、兆易创新、 国寿投资、人保资本、美的投资、建银国际、招商证券、阳光人寿、中邮人寿、湖北小米长江产业基金 等股东。2024年3月，公司最新一轮融资估值已达1508亿元。 长鑫科技的I ...

Core Viewpoint - The semiconductor industry in China is experiencing a recovery in various segments despite tightening export controls from overseas, with a focus on self-sufficiency and innovation in advanced processes, equipment, and materials [1][18]. Group 1: Industry Overview - Since Q2 2025, export controls on advanced semiconductor processes and computing chips from overseas have intensified, yet domestic production capacity and yield continue to improve [1]. - The semiconductor index in June 2025 increased by 5.96%, lagging behind the Philadelphia semiconductor index and Taiwan semiconductor index, which rose by 16.54% and 8.15% respectively [27]. Group 2: Demand Side - The demand for consumer electronics is recovering, with global smartphone shipments in Q1 2025 increasing by 1.5% year-on-year, and China's shipments rising by 3.3% [3]. - AI applications are driving innovation in various sectors, including automotive and wearable devices, with global AI glasses shipments soaring by 216% year-on-year in Q1 2025 [3]. - The automotive market in China remains strong, with significant orders for new models like Xiaomi's YU7 [3]. Group 3: Inventory Trends - The smartphone supply chain remains stable, while the PC supply chain shows slight improvement in inventory levels [4]. - Global inventory levels for major smartphone chip manufacturers decreased slightly in Q1 2025, while PC chip manufacturers saw a minor increase [4]. Group 4: Supply Side - TSMC is increasing its capital expenditure for advanced process lines in the U.S., with a projected investment of $100 billion [5]. - Major memory manufacturers are focusing their capital expenditures on high-end memory products, with Micron's revenue in FY25Q3 exceeding guidance [6][10]. Group 5: Price Trends - Prices for memory products, particularly DDR4, have seen a significant increase, with an approximate 50% rise since late May 2025 [6]. - The prices of high-capacity NAND products are also on the rise, indicating a recovery in consumer product prices [6]. Group 6: Sales Performance - Global semiconductor sales reached $57 billion in April 2025, marking a 22.7% year-on-year increase and the first month of sequential growth in 2025 [7]. Group 7: Industry Chain Tracking - The semiconductor industry chain is showing signs of marginal improvement, with a focus on companies benefiting from self-sufficiency and recovery in demand [8]. - Domestic companies in the semiconductor design and manufacturing sectors are expanding their product offerings and customer bases, with notable IPOs from companies like Muxi and Moer Thread [9]. Group 8: Investment Recommendations - The focus on self-sufficiency in the semiconductor supply chain is expected to accelerate, with positive trends in orders and revenue for domestic equipment and material manufacturers [16][18].

2025 年 07 月 07 日 证券研究报告 | 公募基金周报 "反内卷"政策加码，科技主题轮动加速 公募基金权益指数跟踪周报（2025.06.30-2025.07.04） 分析师：王骅 分析师登记编码：S0890522090001 电话：021-20321067 邮箱：wanghua@cnhbstock.com 分析师：宋逸菲 分析师登记编码：S0890524080003 电话：021-20321087 邮箱：songyifei@cnhbstock.com 021-20515355 相关研究报告 06-30 3、《指数冲高下的板块轮动，银行调 整和科技复苏—公募基金权益指数跟 踪周报（2025.06.23-2025.06.27）》 2025-06-30 4 、《 ETF 策 略 指 数 跟 踪 周 报 — 2025/6/30》2025-06-30 权益或具短期动力—公募基金量化遴 选 类 策 略 指 数 跟 踪 周 报 （2025.06.22）》2025-06-24 投资要点 权益市场回顾：上周（2025.06.30-2025.07.04）A 股震荡上涨，全周累计看，沪深 300 上涨 1.54%，中证 ...

Group 1 - TCL Technology has made substantial progress in acquiring a 21.5311% stake in Shenzhen Huaxing Semiconductor, with a total transaction value of 11.562 billion yuan, combining cash and shares for payment [1][2] - The cash component of the transaction amounts to 7.203 billion yuan, with approximately 4.359 billion yuan raised through a targeted issuance to no more than 35 specific investors [1][2] - Post-transaction, TCL Technology's ownership in Shenzhen Huaxing Semiconductor will increase from 62.68% to 84.21%, enhancing control over core semiconductor display assets [1][2] Group 2 - Shenzhen Huaxing Semiconductor will become a major shareholder of TCL Technology, holding a 4.99% stake, while TCL Technology's chairman and his associates will see their stake diluted from 6.74% to 6.40% [2] - The acquisition is expected to strengthen TCL Technology's main business and enhance profitability, solidifying its competitive position in the semiconductor display industry [2] - TCL Technology focuses on three main sectors: semiconductor displays, new energy photovoltaics, and semiconductor materials, following a significant restructuring in 2018 [2] Group 3 - The semiconductor display business of TCL Technology is projected to achieve a revenue growth of 24.6% year-on-year in 2024, reaching 104.3 billion yuan, with a net profit turnaround from a slight loss to a profit of 6.23 billion yuan [3] - TCL Huaxing is the second-largest panel manufacturer in mainland China, with large-size LCD TV panels as its core strength, contributing approximately 50% of its revenue [3] - Shenzhen Huaxing Semiconductor operates the T6 and T7 factories, which are critical for producing ultra-large size displays, with significant investments in these production lines [3][4] Group 4 - Shenzhen Huaxing Semiconductor was established in June 2016 and initially fully owned by TCL Huaxing, later introducing external shareholders like the Shenzhen Major Industry Development Fund and Samsung Display [4] - Following the recent transaction, the Major Industry Fund's stake will decrease to 10.77%, while TCL Technology's total stake will rise to 84.21%, with Samsung Display retaining 5.0239% of the shares [4]

Core Viewpoint - Changxin Storage is set to launch its A-share listing, marking a significant milestone in its development and the advancement of China's semiconductor industry, particularly in the DRAM sector [1][3]. Group 1: Company Overview - Changxin Storage, established in 2016, specializes in the research, production, and sales of DRAM memory chips, with a registered capital of approximately 60.193 billion yuan [1]. - The company is the only domestic entity capable of large-scale production of DRAM chips, having developed a complete industrial chain from chip design to wafer manufacturing and packaging testing [1]. - Changxin Storage has achieved significant technological milestones, including mass production of 19nm DDR5 chips and advancements in high bandwidth memory (HBM) products [1][2]. Group 2: Market Position and Growth - The company's average monthly production increased from 100,000 wafers in Q1 2024 to 200,000 in Q1 2025, with an expected total production of 2.73 million wafers for the year, representing a year-on-year growth of 68% [2]. - Market analysis predicts that Changxin Storage's global DRAM market share will rise from 6% in Q1 2025 to 8% by the end of the year, with DDR5 and LPDDR5 products expected to account for 7% and 9% of sales, respectively [2]. Group 3: Strategic Developments - The timing of Changxin Storage's listing coincides with supportive domestic semiconductor policies, including the "1+6" policy measures from the CSRC aimed at facilitating the listing of hard-tech companies [2]. - The company has completed multiple rounds of large-scale financing, with a post-money valuation reaching 150.8 billion yuan after a recent 10.8 billion yuan funding round [3]. - Changxin Storage's competitive pricing strategy, with some products priced at 50% of international brands, is expected to disrupt the mid-to-low-end market dominated by major players like Samsung and SK Hynix [3]. Group 4: Industry Impact - The IDM model adopted by Changxin Storage has created a strong industrial driving effect, collaborating with upstream companies to promote the localization of equipment and materials [4]. - The company's products are integrated into the supply chains of major smartphone manufacturers and contribute to the domestic AI computing ecosystem [4]. - With the mass production of high-end products like HBM, Changxin Storage aims to establish a comprehensive technical standard system across the entire industry chain [4].

如果您希望可以时常见面，欢迎标星收藏哦~ 台积电董事长魏哲家上个月表示，台积电位于熊本的第一家晶圆厂已于去年年底开始量产，而原定 于今年年初开始建设的第二家晶圆厂则因当地交通问题而"略有推迟"，但他并未提供修改后的时间 表。 《华尔街日报》报道称，消息人士称，尽管尚未确定具体的时间表，但建设可能会进一步推迟。 台积电位于亚利桑那州的第一家晶圆厂已于去年投入商业生产。第二家工厂即将竣工，设备安装正 在进行中。第三家工厂已于今年4月破土动工。该公司新承诺的1000亿美元投资将用于建造另外三 家晶圆厂、两家集成电路组装厂和一个研发中心。 来 源： 内容来自 taipeitimes 。 台积电近日表示，其在美国的投资不会影响其在其他地方的现有项目，否认了《华尔街日报》的报 道。《华尔街日报》报道称，在美国总统唐纳德·特朗普的关税威胁下，该公司将推迟在日本建设 第二家制造厂，以专注于美国扩张。 这家全球最大的合约芯片制造商在一份声明中表示，其全球扩张战略基于多种因素，包括客户需 求、商业机会、运营效率、政府支持和总体成本。 台积电表示，因此该公司在美国的投资不会影响其在其他地区的计划。 《华尔街日报》称，台积电正在认真 ...

同 时 ， 为 了 保 持 摩 尔 定 律 的 进 展 ， 创 新 的 重 点 已 从 尺 寸 缩 放 转 向 功 能 性 缩 放 。 在 从 FinFET 到 Nanosheet，乃至未来CFET等晶体管架构的艰难跋涉中，业界深刻意识到： 仅依赖硅基材料的三 维堆叠技术，已难以支撑可持续的微缩与能效提升。寻求根本性的材料革新，成为突破瓶颈、开辟 新增长曲线的关键所在。 在这一背景下，从传统硅基三维材料向二维半导体材料的战略过渡，迅速跃升为全球半导体研发与 产业布局的核心焦点，吸引了全球科研人员与产业界的目光。 二维半导体，来势汹汹 IMEC 预测至 2039 年的路线图 如果您希望可以时常见面，欢迎标星收藏哦~ 近日，在 《芯片，最新路线图》 一文中，笔者分享了IMEC对未来14年半导体路线图的预测。 能看到，随着先进制程节点的演进和晶体管架构的革新，二维半导体材料或将成为未来业界关注的 焦点。 实际上，当前摩尔定律日益放缓，随着制程节点向物理极限不断逼近，硅基三维晶体管的制造结构 日趋复杂，所需投入的成本呈现指数级攀升，而技术演进带来的边际效益却显著递减。 众所周知，随着半导体制程向亚-纳米级逼近，硅基器 ...