Investment Rating - The report indicates a positive investment outlook for the AI PCB and complete machine sectors, highlighting strong performance in the semiconductor industry driven by AI demand [1][6]. Core Insights - The semiconductor sector, particularly TSMC, reported a record revenue of NT$3,357.7 billion in August 2025, marking a 34% year-on-year increase, driven by AI-related demand [6][8]. - The report emphasizes the growth in various segments, including testing, storage, and EMS, with companies like 京元电子 and 南亚科 showing significant revenue increases [9][16]. - The overall sentiment in the industry remains optimistic, with expectations of continued growth in AI applications and advanced manufacturing processes [14][16]. Summary by Relevant Sections AI Sector - TSMC's revenue reached NT$3,357.7 billion in August 2025, a 34% increase year-on-year, driven by AI demand [6]. - 京元电子's revenue grew by 32% year-on-year, supported by increased capital expenditure and expansion into high-end testing capacity [9]. Semiconductor Manufacturing - The report notes that 联电, 世界先进, and 力积电 experienced slight revenue changes, with 联电's revenue down 7% year-on-year [16]. - The high-performance computing sector continues to show growth potential despite some market fluctuations [16]. Storage Market - 南亚科's revenue surged by 141% year-on-year, attributed to increased demand for DDR4 memory as major manufacturers shift focus to high-bandwidth memory [16]. EMS Sector - Companies like 鸿海 and 纬创 reported significant revenue growth, with 纬创's revenue increasing by 198% year-on-year, driven by strong AI server demand [14][16]. - The report highlights that the overall EMS sector is benefiting from the AI trend, with expectations of continued growth in the coming quarters [14]. PCB and CCL Markets - The PCB sector saw companies like 欣兴 and 金像电 reporting revenue growth of 5% and 65% year-on-year, respectively, indicating a recovery in market demand [12][14]. - 台光电's revenue increased by 53% year-on-year, reflecting strong growth across various product lines [12].

Core Viewpoint - Glass substrates are emerging as a superior alternative to organic substrates in advanced packaging due to their flatness, lower thermal expansion coefficient, and reduced warpage issues, making them ideal for high-frequency applications and 6G communications [2][3][5]. Group 1: Advantages of Glass Substrates - Glass substrates provide significant improvements in warpage reduction (50%) and positioning accuracy (35%) compared to organic substrates, facilitating the implementation of redistribution layers (RDL) with line widths and spacings below 2 micrometers [2]. - The dielectric constant of glass (2.8) is much lower than that of silicon (12), resulting in significantly lower transmission losses and enhanced signal integrity for high-frequency applications [3]. - Glass substrates are versatile and can be used as carriers, core substrates for embedded components, 3D stacking materials, or sealed cavities for sensors and MEMS [2]. Group 2: Manufacturing Challenges - Glass cutting is prone to micro-cracking, and the challenge of repeatedly manufacturing thousands of fine-pitch through-glass vias (TGV) hinders the full potential of glass substrates [3][22]. - The laser-induced deep etching (LIDE) technology is being improved to facilitate mass production of TGVs, allowing for the etching of vias as small as 3 micrometers with a spacing of 5 micrometers [10][11]. Group 3: Applications in 6G Technology - Glass substrates are ideal for 6G wireless communication networks, which require data rates exceeding 100 GHz, due to their high-frequency transmission capabilities and low loss characteristics [5]. - Heterogeneous integration in stacked glass can combine high-frequency front-end chips with low-loss interconnects, enhancing the performance of large-scale antenna arrays [5]. Group 4: Innovations in Glass Processing - The use of ABF (Ajinomoto Build-up Film) as a low-k dielectric and adhesive for glass bonding has shown promising results, achieving electrical performance up to 220 GHz with minimal loss [5][8]. - New methods for cutting glass substrates, such as embedding cut substrates in organic resin for edge protection, are being explored to minimize damage during handling [24]. Group 5: Yield Improvement Techniques - Predictive modeling and machine learning are being utilized to enhance yield rates in glass substrate manufacturing, particularly in identifying and mitigating defects early in the production process [18][19]. - The development of automated systems for wet etching and drying processes is aimed at improving the efficiency and yield of TGV manufacturing [10][11]. Group 6: Future Directions - The glass ecosystem is preparing for the continued growth in chip and substrate sizes in multi-chip advanced packaging, with significant progress being made in laser modification and high-frequency etching techniques [28]. - Ongoing research aims to further reduce micro-cracking during cutting processes and improve the compatibility of new processing techniques with stringent design rules [29].

Industry Overview - The storage chip market, particularly NOR Flash, is experiencing rapid growth driven by advancements in technologies such as artificial intelligence and the Internet of Things, despite a lackluster performance last year due to supply and demand factors [2] - In the first half of this year, the market showed signs of recovery with significant inventory reduction and gradual demand restoration, particularly in industrial markets and supported by long-term demand from AI and high-performance computing [2] - Starting from the third quarter, overall storage demand is rebounding, with prices showing an upward trend, indicating a positive outlook for the second half of the year [2] Company Performance - In the first half of the year, the revenue rankings among storage chip manufacturers are as follows: Zhaoyi Innovation (4150.31 million), Beijing Junzheng (2249.11 million), Fudan Microelectronics (1838.85 million), Puran Co. (906.70 million), Jucheng Co. (574.86 million), Dongxin Co. (342.99 million), and Hengshuo Co. (174.28 million) [3] - Zhaoyi Innovation leads in net profit with 575.48 million, followed by Jucheng Co. (205.15 million) and Beijing Junzheng (203.12 million), while Dongxin Co. and Hengshuo Co. reported losses of 110.97 million and 70.78 million respectively [4] - In terms of gross margin, Jucheng Co. has the highest at 60.25%, followed by Fudan Microelectronics at 56.80%, and Zhaoyi Innovation at 37.21% [5] Inventory Management - Fudan Microelectronics holds the highest inventory at 3088.98 million, followed by Beijing Junzheng (2773.43 million) and Zhaoyi Innovation (2400.65 million) [6] - Inventory turnover days are highest for Fudan Microelectronics at 705 days, with Dongxin Co. at 596 days and Hengshuo Co. at 355.66 days, while Zhaoyi Innovation has the lowest at 163.95 days [7] - In terms of inventory impairment provisions, Fudan Microelectronics has the highest at 548.26 million, followed by Zhaoyi Innovation (287.39 million) and Beijing Junzheng (263.53 million) [7]

Core Viewpoint - The company, JieJie Microelectronics, emphasizes its modular design for PC power supplies, which is compatible with Intel® 800 series chipsets and the latest processor architectures [1] Company Summary - JieJie Microelectronics is committed to leveraging innovative technology to enhance PC power supply design, focusing on more efficient and intelligent power solutions [1] - The company aims to assist clients in developing the next generation of high-performance computing platforms [1] Industry Summary - The demand for AI computing power and high-performance computing is driving the evolution of PC power supply design towards modularity and high efficiency [1] - JieJie Microelectronics' solutions are expected to further enhance its competitiveness in the PC and computer power supply market [1]

Core Viewpoint - Glass is gaining attention as the next-generation packaging substrate material due to its numerous advantages over organic substrates, including lower thermal expansion, improved flatness, and reduced transmission loss for high-frequency applications [1][2][3]. Group 1: Advantages of Glass Substrates - Glass substrates are significantly flatter and have a lower thermal expansion coefficient compared to organic substrates, simplifying lithography processes [2]. - The warpage issues associated with multi-chip packaging have been notably improved with glass substrates, allowing for better chip bonding and alignment [2]. - Glass substrates provide extremely low transmission loss for high-frequency devices, making them suitable for applications like 6G communications [3][4]. Group 2: Manufacturing Challenges - The cutting of glass substrates can lead to micro-cracks, which pose a significant manufacturing challenge [3][17]. - The process of creating through-glass vias (TGV) is complex, with challenges in achieving high yield rates due to the need for precise laser etching and filling techniques [6][12]. - Despite the challenges, companies like Intel continue to invest heavily in glass substrate technology, indicating a strong belief in its potential for high-performance computing and AI applications [3][12]. Group 3: Innovations in Glass Processing - Recent advancements in laser-induced deep etching (LIDE) technology have improved the manufacturing process for TGVs, allowing for smaller and more precise vias [6][10]. - The use of automated systems for wet etching processes has been developed to enhance the efficiency and yield of glass substrate production [7][10]. - New methods, such as embedding cut glass substrates in organic resin for edge protection, are being explored to mitigate issues related to cracking during processing [19][20]. Group 4: Future Outlook - The glass ecosystem is preparing for the ongoing growth in chip and substrate sizes for advanced multi-chip packaging, with significant progress being made in the industry [22]. - The potential for direct laser etching using excimer lasers is being considered as a more environmentally friendly alternative to traditional methods, provided it can meet the requirements for subsequent copper filling [22]. - Continued research into polymer retraction techniques before cutting may help prevent micro-cracking, indicating a focus on improving manufacturing processes for glass substrates [22].

公众号记得加星标⭐️，第一时间看推送不会错过。 预计到 2034 年，全球微处理器芯片制造市场规模将从 2024 年的1146 亿美元增至约2615 亿美元， 在 2025 年至 2034 年的预测期内以8.6%的复合年增长率增长。2024年，亚太地区 占据主导地位， 占有超过61.4% 的份额，收入为703 亿美元。 微处理器芯片制造市场是指从事设计、制造和供应微处理器单元（MPU）的行业，微处理器单元是 计算设备的中央处理单元。微处理器是在电子系统中执行算术、逻辑、控制和输入/输出操作的集成 电路。 市场驱动力来自对高性能计算日益增长的需求、互联设备的日益普及以及云基础设施的扩展。人工智 能、机器学习和高级数据分析的发展需要强大的处理器，从而推动了微处理器设计的创新。随着电动 汽车和自动驾驶的兴起，汽车行业对专用芯片的需求也显著增加。 来源 ： 内容 编译自 market 。 消费电子产品的需求最为强劲，尤其是智能手机、笔记本电脑、平板电脑和游戏机，这些领域构成了 微处理器的最大市场。数据中心和云服务提供商也是主要的消费市场，需要强大的芯片来处理海量工 作负载。随着汽车集成先进的驾驶辅助系统、信息娱乐和互 ...

Industry Overview - Bitcoin miners are increasingly integrating with High-Performance Computing (HPC), indicating a shift in operational focus that is expected to strengthen over time [1] - The Bitcoin mining network has achieved a significant milestone, reaching one zettahash of computing power, which equates to one sextillion computations per second [6] Market Performance - Cipher Mining's stock rose by 39% to $10.32, while Bitfarms saw a 62% increase, nearing $2 per share after CEO Ben Gagnon announced stock purchases [1] - IREN also performed well, surpassing $30 per share [1] Bitcoin Difficulty Adjustments - Recent Bitcoin difficulty adjustments show a significant upward trend, with a 7.96% increase in July followed by a 4.89% adjustment, and expectations of an additional 8% increase [2][4] - The current hash price is estimated to be between $53 to $56 per petahash per day [3] Legal and Regulatory Developments - Tether is involved in a legal dispute with Swan Bitcoin, claiming exclusive ownership over intellectual property developed in their joint venture [8][9] - A GOP lawmaker has urged a Treasury investigation into Bitmain's operations, citing potential risks to U.S. energy grid security [13][14] Company-Specific Developments - Canaan has reported strong performance, mining 1,400 Bitcoin in Q2 and shifting its operations to the U.S. [16] - Ocean Pool is facing controversy over executive compensation, with unconfirmed reports suggesting a salary of $750,000 for its CEO, which is considered high for the industry [17][18]

Core Viewpoint - Glass is transitioning from a background consumable to a core component in semiconductor packaging, providing essential substrates and dielectric materials for advanced applications [2][4]. Group 1: Glass in Semiconductor Manufacturing - Glass substrates are increasingly used in modern wafer fabs, supporting silicon wafers and forming sealed MEMS caps [2]. - The demand for higher bandwidth and power density in AI and high-performance computing (HPC) is driving the need for advanced packaging solutions, where glass can offer better performance than traditional organic laminates and silicon interposers [3][4]. Group 2: Market Potential and Applications - The low dielectric loss and optical transparency of glass make it a significant growth driver beyond computing packaging, particularly in photonic applications [6]. - Co-packaged optical devices (CPO) are being developed to simplify fiber connections, leveraging glass's capabilities to support electrical redistribution layers and low-loss waveguides [6]. Group 3: Supply Chain Insights - The transition from pilot lines to mass production for glass substrates hinges on advancements in laser drilling, copper filling, and panel processing technologies [8]. - Understanding the competitive landscape with silicon and improved organic materials is crucial, as foundries push for mixed wafer-level redistribution, which may diminish glass's advantages [8].

Company Overview - Tongfu Microelectronics is an integrated circuit packaging and testing service provider, offering one-stop services from design simulation to packaging testing for global clients [2][3] - The company covers various fields including AI, high-performance computing, big data storage, 5G, IoT, automotive electronics, and industrial control [2][3] - Major shareholder is Nantong Huada Microelectronics Group, with stable equity structure [2] Financial Performance - Revenue for 2022, 2023, 2024, and the first half of 2025: CNY 21.429 billion, CNY 22.269 billion, CNY 23.882 billion, and CNY 13.038 billion respectively [3] - Net profit for the same periods: CNY 0.502 billion, CNY 0.169 billion, CNY 0.678 billion, and CNY 0.412 billion [3] - 2024 revenue growth of 7.24% and net profit growth of 299.90% [6] - 2025 H1 revenue growth of 17.67% and net profit growth of 27.72% [6] Industry Situation - Global semiconductor market reached USD 346 billion in H1 2025, a year-on-year growth of 18.9% [4] - Forecast for 2025 global semiconductor market size is USD 728 billion, up 15.4% from 2024 [4] - Expected market size for 2026 is USD 800 billion, with a further growth of 9.9% [4] Key Trends in Semiconductor Market - AI-driven growth continues; Asia-Pacific IC design market expected to grow by 15% in 2025 [5] - TSMC maintains dominance in wafer foundry; strong demand for advanced processes [5] - 2025 is a critical year for 2nm wafer manufacturing technology [5] Business Performance in Specific Fields - In H1 2025, the company increased market share in mobile, home appliance, and automotive sectors [9] - Focus on AI and high-performance products, with successful integration of Suzhou and Penang factories [9] Technology Development - Significant progress in large-size FCBGA development, with mass production initiated [11] - Breakthroughs in optical-electrical hybrid packaging technology [11] - Over 1,700 patent applications, with nearly 70% being invention patents [8] Future Outlook - Continued growth expected in AI and new energy vehicle sectors in H2 2025 [10] - Chinese IC packaging and testing industry is anticipated to transition from "catching up" to "keeping pace" and potentially "leading" [10]

Core Insights - MediaTek has successfully completed the design tape-out of its first flagship SoC using TSMC's 2nm process, expected to enter mass production by the end of next year [1] - The 2nm process represents a significant advancement in semiconductor technology, promising enhanced performance and energy efficiency for applications such as mobile processors, generative AI, and high-performance computing [1] - TSMC's 2nm technology utilizes nanosheet transistor architecture, achieving a 1.2x increase in logic density, up to 18% performance improvement at the same power level, and a 36% reduction in power consumption at the same speed compared to the N3E process [1] Industry Context - TSMC is a leading foundry, producing chips for major tech companies, including Apple and NVIDIA, and is crucial for the production of processors used in devices like iPhones and iPads [2] - Qualcomm and MediaTek are currently competing with their next-generation flagship SoCs primarily based on TSMC's 3nm process, with competition expected to extend to the more advanced 2nm process as it matures [2] - According to Counterpoint Research, MediaTek holds the largest market share in smartphone application processors at 36%, benefiting from increased demand for entry-level and mainstream products, while Qualcomm follows with 28% and Apple at 17% [2]