Core Viewpoint - The establishment of a "Technology Board" in the bond market aims to support the development of technology enterprises through a series of comprehensive policies and measures [1][4][10]. Group 1: Policy Overview - The People's Bank of China, along with the CSRC and other departments, has introduced a package of policies to support the issuance of technology innovation bonds [1][4]. - The unified naming of technology-related bonds as "technology innovation bonds" marks a significant step towards a clearer policy roadmap for supporting technology enterprises [5][6]. - The issuance entities have expanded to include financial institutions, technology enterprises, private equity investment institutions, and venture capital institutions [6][10]. Group 2: Market Response - Following the announcement of the policies, nearly 100 market institutions plan to issue over 300 billion yuan in technology innovation bonds, with 55 institutions already issuing more than 80 billion yuan [2][11][12]. - Banks are the primary issuers, accounting for over 450 billion yuan, while leading securities firms have issued over 160 billion yuan [12][13]. Group 3: Financial Support Mechanisms - The policies include risk-sharing mechanisms, such as credit protection tools and government financing guarantees, to support the issuance and investment of technology innovation bonds [6][7]. - A series of fees related to the issuance and trading of technology innovation bonds will be waived from 2025 to 2027, providing significant cost savings for institutions [8][10]. Group 4: Investment Trends - The technology innovation bonds are primarily directed towards sectors such as construction, industrial investment, and energy, with a growing focus on high-tech industries like medical devices and renewable energy [14][17]. - The bond market for technology innovation has seen rapid growth, with a year-on-year increase of 186.47% in issuance scale in 2023, and a projected continued high growth rate in 2024 [13][14]. Group 5: Areas for Improvement - There are concerns regarding the actual use of raised funds, as initial issuances have deviated from supporting early-stage technology enterprises [17]. - The standardization of evaluation criteria for "technology innovation attributes" across different bond types needs to be strengthened [17][18]. - The tendency towards short-term bonds may limit support for long-term research and development projects, highlighting the need for a more balanced maturity structure [17][18].

债券研究 证 券 研 究 报 告 【债券分析】 "科创债"新政了解一下 ❖ 2025 年 5 月 6 日，央行、证监会发布《关于支持发行科技创新债券有关事宜 的公告》（简称"公告"），从丰富科技创新债券产品体系和完善科技创新债券 配套支持机制等方面，对支持科技创新债券发行提出若干举措；5 月 7 日，国 新办新闻发布会上，央行推出十项措施以加大宏观调控强度，其中一项为"创 设科技创新债券风险分担工具"，同日，交易所发布《关于进一步支持发行科 技创新债券服务新质生产力的通知》，交易商协会发布《关于推出科技创新债 券 构建债市"科技板"的通知》，完善科技创新债券配套规则。 ❖ 新政要点解读：拓宽科创债发行主体范围，完善发行、信披与增信制度。 一是，拓宽科创债发行主体范围及募集资金投向范围，新增金融机构和股权投 资机构。交易所新增支持商业银行、证券公司、金融资产投资公司等金融机构 以及私募股权投资机构、创业投资机构等股权投资机构作为发行主体；交易商 协会拓宽科技型企业的认定标准，并新增支持私募股权投资、创业投资、产业 股权投资等机构及其母公司作为发行主体。 二是，优化完善科创债发行条款，便于匹配资金使用需求。交易所 ...

Core Viewpoint - The People's Bank of China plans to launch a "Technology Board" in the bond market to support financial institutions, technology companies, and private equity investment institutions, aiming to enhance the product system of technology innovation bonds (referred to as "Sci-Tech Bonds") [2] Group 1: Current Status of Sci-Tech Bonds - Sci-Tech Bonds are credit bonds issued by technology innovation enterprises or used to raise funds for technology innovation, serving as an important tool for financing and supporting the real economy [3] - The market for Sci-Tech Bonds has shown strong growth since its inception in June 2016, evolving into mainstream Sci-Tech corporate bonds and notes, with issuance volumes increasing significantly from 16.6 billion yuan in 2021 to 1.23 trillion yuan in 2024 [3][4] - As of March 11, 2025, the total balance of mainstream Sci-Tech Bonds reached 1.78 trillion yuan, accounting for 6.48% of the market's credit bonds [4] Group 2: Advantages of Sci-Tech Bonds - Issuing Sci-Tech Bonds helps reduce overall financing costs for technology enterprises, with high-credit Sci-Tech Bonds showing a premium of 5-10 basis points over ordinary credit bonds of the same rating and maturity [4] - The funds raised through Sci-Tech Bonds effectively support research and innovation activities, leading to improved profitability and cash flow for the issuers [5] Group 3: Challenges Facing the Sci-Tech Bond Market - The market faces three main bottlenecks: a mismatch of risk and return in debt assets, limited use of raised funds for equity investments, and a mismatch between bond issuance terms and the innovation cycle of technology enterprises [6][7][8] - In 2024, the issuance of Sci-Tech Bonds was dominated by central and local state-owned enterprises, with private enterprises accounting for only 7.82% of issuers [6] - The average issuance term of Sci-Tech Bonds has increased, but private enterprises still face shorter terms, which do not align well with the longer return cycles of innovation projects [8] Group 4: Policy Recommendations - To address the challenges, it is recommended to introduce credit enhancement mechanisms to encourage more small and medium-sized technology enterprises to issue Sci-Tech Bonds [9] - Expanding the range of issuing institutions to include financial institutions and private equity investment institutions, while extending the bond issuance terms to better match the investment cycles of technology projects [10] - Developing bond index products to encourage long-term funds to invest in technology innovation corporate bonds [10] Group 5: Future Outlook - With coordinated policy efforts and improvements in credit enhancement, the expansion of issuing institutions, and the attraction of long-term capital, the Sci-Tech Bond market is expected to play a more significant role in supporting technological innovation and promoting high-quality economic development [11]

Core Viewpoint - The Chinese government is introducing a comprehensive financial policy package aimed at stabilizing the market and expectations, including a new relending tool for service consumption and elderly care [1][3]. Group 1: Service Consumption and Elderly Care Relending - The People's Bank of China has established a relending tool for service consumption and elderly care with a total quota of 500 billion yuan, aimed at encouraging commercial banks to increase credit support for these sectors [1][3]. - This new policy tool expands and upgrades the previous inclusive elderly care relending policy, which had a quota of 40 billion yuan and was initially piloted before being rolled out nationwide [3]. Group 2: Impact of New Policy Tool - Experts believe this initiative will invigorate the service consumption and elderly care markets, enhancing domestic service consumption potential and supporting the development of the elderly care industry [3]. - The policy is expected to stimulate both the supply and demand sides of service consumption, ultimately releasing residents' consumption potential over a longer term [3]. Group 3: Insurance Company Investment Regulation - The Financial Regulatory Administration has announced a 10% reduction in the risk factor for insurance companies' solvency regulations regarding stock investments, encouraging them to increase their market participation [4][6]. - The previous adjustment in September 2023 saw the risk factor for investments in the CSI 300 index drop from 0.35 to 0.3, and for stocks listed on the Sci-Tech Innovation Board from 0.45 to 0.4 [6]. Group 4: Bond Market "Technology Board" - The bond market "Technology Board" will focus on financing support for key technology industries such as artificial intelligence, big data, integrated circuits, and biotechnology, aligning with national technology strategies [9]. - The design of the "Technology Board" includes targeted arrangements for the issuance process to meet the needs of issuers, aiming to enhance market investment enthusiasm [11]. - Financial institutions and asset management companies are encouraged to actively participate in investments related to technology innovation bonds, with plans to create indices linked to these bonds to broaden the investor base [11].

Core Insights - The bond market's "Technology Board" is progressing with policy details emerging, indicating strong market interest and readiness for issuing technology innovation bonds [2][3][4] - Nearly 100 market institutions plan to issue over 300 billion yuan in technology innovation bonds, with expectations for more participants [2][5] - The initiative aims to enhance financial support for technology enterprises, particularly encouraging private technology firms to access financing through bond issuance [2][4][8] Policy Developments - The People's Bank of China (PBOC) and the China Securities Regulatory Commission (CSRC) have released announcements detailing measures to support the issuance of technology innovation bonds [5][6] - The new policies include improved systems for issuance, trading, information disclosure, and credit rating tailored to the characteristics of technology enterprises [4][5] Risk Management and Credit Enhancement - The initiative addresses the diverse risk profiles of technology enterprises, particularly smaller firms, by encouraging financial institutions to develop credit protection tools [6][8] - The PBOC plans to create risk-sharing tools and provide low-cost refinancing to support the issuance of technology innovation bonds, thereby reducing default risk [6][8] Market Dynamics - The "Technology Board" is expected to attract more institutional investors to focus on "hard technology," fostering a positive funding cycle [8][9] - The initiative will prioritize financing for key technology sectors such as artificial intelligence, big data, integrated circuits, and biotechnology [8] Credit Rating Innovations - The bond market's "Technology Board" will introduce a new credit rating system tailored to the characteristics of technology firms and private equity institutions [9] - Rating agencies are encouraged to develop specialized rating methodologies that reflect the unique aspects of technology enterprises, moving away from traditional asset-based metrics [9]

7日，国务院新闻办公室举行新闻发布会，介绍"一揽子金融政策支持稳市场稳预期"有关情况。中 国人民银行行长潘功胜表示，将增加3000亿元科技创新和技术改造再贷款额度，由目前的5000亿元增加 至8000亿元，持续支持"两新"政策实施。 资料显示，2024年4月，中国人民银行会同发改委、科技部等部门设立"科技创新和技术改造再贷 款"，初始额度为5000亿元，其中1000亿元额度专门用于支持初创期、成长期科技型中小企业首次贷 款，激励金融机构更大力度投早、投小、投硬科技。 "这次我们将再贷款额度增加3000亿元，增加到8000亿元，支持'两新'政策加力扩围。"潘功胜说。 "目前看，市场各方响应非常积极，各类型金融机构、科技型企业、股权投资机构积极与人民银 行、证监会沟通，对接发行科技创新债券的意愿。"潘功胜介绍，初步统计，目前有近100家市场机构计 划发行超过3000亿元的科技创新债券，预计后续还会有更多机构参与。 为了支持股权投资机构在"科技板"发行长期限的债券融资，中国人民银行会同证监会借鉴2018年设 立民营企业债券融资支持工具的经验，将创设科技创新债券风险分担工具。 潘功胜透露，创设科技创新债券风险分担工具 ...

Core Viewpoint - The Chinese government is implementing new monetary policy tools to support technology innovation, including the establishment of a risk-sharing mechanism for technology innovation bonds, which is expected to significantly impact the development of the technology innovation sector in China [1][4]. Group 1: Policy Initiatives - The People's Bank of China (PBOC) and other government departments have introduced multiple policies since 2024 to enhance financing support for technology innovation enterprises, creating a more diversified financing mechanism [2]. - A notable initiative includes the creation of a "technology board" in the bond market, aimed at improving the issuance and trading of technology innovation bonds, thereby lowering issuance costs and facilitating capital flow into the technology sector [4][6]. Group 2: Financial Instruments and Market Trends - As of the end of 2024, the outstanding scale of technology innovation bonds reached 1.6416 trillion yuan, accounting for 3.32% of China's credit bond market. In 2025, 405 technology innovation bonds were issued, totaling 372.756 billion yuan, representing a year-on-year growth of approximately 60% [6]. - The issuance of technology company bonds constituted 49.63% of the total in 2024, while technology notes and short-term financing bonds accounted for 21.11% and 25.35%, respectively, indicating a predominance of company bonds and notes in the current market [6]. Group 3: Expert Insights - Industry experts suggest that the new risk-sharing tools for technology innovation bonds will encourage the issuance of longer-term bonds, aligning with the long development cycles typical of technology research and development, thus avoiding the mismatch of short-term debt financing for long-term investments [5][7]. - The establishment of a comprehensive service system combining bond financing, credit support, and equity investment is expected to promote continuous innovation among enterprises [7].

Wind数据显示，以发行起始日为统计口径，截至4月30日，今年以来新发各类科创债433只，合计发行 规模为3995.64亿元。与2024年同期对比，今年以来科创债发行数量增加了58只，发行规模增加了306.3 亿元。 近年来，在政策支持下，国内科创债券发行扩容势头强劲。2023年全年新发各类科创债786只，发行规 模7700亿元；2024年，我国科创债发行数量首次破千，发行规模站上万亿元门槛，分别达到1228只和 1.22万亿元。 期限结构方面，科创债发行以短期为主，集中在3年期以内，然而随着2024年长久期信用债热度上升， 科创债也呈现出趋长化特征。 浙商证券认为， 科创债的推出旨在引导资金流向科技创新领域，改变当前以大型国有企业和上游行业 企业为主的发行格局，有助于民营企业和中小型科技创新企业通过债券市场融资。未来科创债的存量市 场结构将类似于科技类转债的市场结构，即发行人类型向体量较小的科技类企业倾斜，发行人企业性质 以民企为主。 5月7日，国务院新闻办公室举行新闻发布会，介绍"一揽子金融政策支持稳市场稳预期"有关情况。 中国人民银行行长潘功胜表示，前期中国人民银行会同有关部门，积极准备推出债券市场"科 ...

5月7日，国务院新闻办公室举行新闻发布会，介绍"一揽子金融政策支持稳市场稳预期"有关情况。 中国人民银行行长潘功胜表示，前期中国人民银行会同有关部门，积极准备推出债券市场"科技板"，支持 金融机构、科技型企业、股权投资机构这三类市场主体发行科技创新债券。 同时，针对科技型企业、股 权投资机构的特点，对科技创新债券的发行交易、信息披露、信用评级等制度安排进行了完善，健全了与 科技创新融资特点相适应的配套规则体系。相关政策和准备工作已经基本就绪。目前看，市场各方响应非 常积极，各类型金融机构、科技型企业、股权投资机构积极与中国人民银行、证监会沟通，对接发行科技 创新债券的意愿。初步统计，目前有近100家市场机构计划发行超过3000亿元的科技创新债券，预计后续 还会有更多机构参与。 分析人士指出，债券"科技板"的提出体现了我国对科技创新的金融支持力度，也为市场注入新活力，有助 于引导债市资金以更加高效、便捷、低成本的方式投向科技创新领域，推动科技与金融深度融合，助力实 体经济高质量发展。 科创债发行持续火热 2025年，以DeepSeek为代表的AI技术突破引发市场对科技创新的高度关注，而债券市场对科技企业的支 持 ...

这些举措包括，一是支持金融机构、科技型企业、私募股权投资机构和创业投资机构（下称"股权投资 机构"）发行科技创新债券。科技创新债券含公司债券、企业债券、非金融企业债务融资工具等；二是 发行人可灵活设置债券条款，鼓励发行长期限债券，更好匹配科技创新领域资金使用特点和需求；三是 为科技创新债券融资提供便利，优化债券发行管理，简化信息披露，创新信用评级体系，完善风险分散 分担机制等；四是将科技创新债券纳入金融机构科技金融服务质效评估；五是鼓励有条件的地方提供贴 息、担保等支持措施。 党的二十届三中全会明确提出，要加快多层次债券市场建设，构建同科技创新相适应的科技金融体制。 央行行长潘功胜在当日新闻发布会上透露，前期，人民银行会同证监会、金融监管总局、科技部等部 门，积极准备推出债券市场"科技板"，支持金融机构、科技型企业、股权投资机构等三类市场主体发行 科技创新债券，完善科技创新债券发行交易、信息披露、信用评级等制度安排，健全与科技创新融资特 点相适应的配套规则体系。相关政策及准备工作已基本就绪。目前看，市场各方响应非常积极，各类型 金融机构、科技型企业、股权投资机构积极与人民银行、证监会沟通，对接发行科技创新债券 ...