Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, focusing on enhancing domestic capabilities and self-sufficiency in the semiconductor industry [20][22][23]. Conference Overview - The conference will take place on July 9-10, 2025, at the Sheraton Hotel in Hefei, Anhui, with an expected attendance of 300 participants [11][12]. - It will feature over 20 speakers from the lithography industry, covering various topics related to advanced lithography technologies and materials [10][12]. Key Topics - Discussions will include the latest research and application prospects of cutting-edge lithography technologies such as EUV, electron beam lithography, and nanoimprint lithography [9][20]. - The conference will also analyze the current state and technological bottlenecks of lithography materials, including photoresists and wet electronic chemicals, and explore solutions for improving domestic production and quality [9][20][22]. Industry Challenges - The domestic lithography industry faces significant challenges, including low self-sufficiency rates for high-end photoresists and reliance on imports for certain high-purity electronic chemicals and mask materials [20][22]. - The high-precision manufacturing technology for masks is difficult, and the rapid repair and update technologies need improvement [20]. Strategic Importance - The conference aims to foster collaboration among experts, scholars, and industry representatives to enhance the integration of production, learning, and research, thereby accelerating technological innovation and the transformation of results [22]. - It seeks to build a communication bridge for upstream and downstream enterprises in the industry chain, promoting resource integration and competitive advantages [22].

Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, focusing on enhancing domestic capabilities and self-sufficiency in the semiconductor industry [12][21]. Conference Overview - The conference will take place on July 9-10, 2025, in Hefei, Anhui, at the Sheraton Hotel [16][20]. - It will feature over 20 industry experts discussing advanced lithography technologies, including EUV, electron beam lithography, and nanoimprint techniques [13][12]. - The agenda includes sessions on lithography materials, chemical products, and equipment, emphasizing the need for domestic production and innovation [12][21]. Keynote Speakers and Topics - Li Jiarong, General Manager of Hangzhou Zhongtai Hydrogen Energy Technology Co., will present on "Application of Lithography Gases and Development of China's Rare Gas Industry" [6][11]. - Other notable speakers include representatives from BOE Technology Group and Nankai University, discussing various aspects of lithography technology and materials [9][10]. Industry Challenges - The domestic lithography industry faces significant challenges, including low self-sufficiency in high-end photoresists and reliance on imports for critical materials and equipment [20][21]. - The conference aims to foster collaboration between academia and industry to address these challenges and promote technological innovation [21][12]. Registration and Participation - Registration fees are set at RMB 2600 before June 30 and RMB 2800 thereafter, which includes conference materials, meals, and a gala dinner [17][16]. - The conference is expected to attract around 300 participants, providing a platform for networking and resource integration within the lithography supply chain [16][21].

Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, focusing on enhancing domestic capabilities in the semiconductor industry [19][20]. Group 1: Conference Overview - The conference will take place on July 9-10, 2025, at the Sheraton Hotel in Hefei, Anhui, with an expected attendance of 300 participants [14][19]. - The event will feature over 20 speakers from the lithography industry, covering advanced lithography technologies, photoresists, and equipment [12][20]. - The agenda includes discussions on cutting-edge lithography techniques such as EUV, electron beam lithography, and nanoimprint lithography, as well as the current state and challenges of domestic photoresist production [11][19]. Group 2: Key Topics and Challenges - The conference will explore the low self-sufficiency rate of high-end photoresists in China and the technological gaps compared to international standards [19][20]. - It will address the reliance on imports for high-purity electronic chemicals and the challenges in the precision manufacturing of photomasks [19][20]. - The event aims to foster collaboration between academia, research institutions, and industry to enhance innovation and the domestic supply chain in lithography technology [20]. Group 3: Featured Speakers and Sessions - Notable speakers include Zhang Wali, who will present on the application and challenges of hybrid bonding in advanced packaging [7][11]. - Other sessions will cover topics such as the development of new photoresist materials and the application mechanisms of wet electronic chemicals [8][11]. - The conference will also feature a roundtable discussion on the current state and future trends of the mask and lithography equipment industry [9][11]. Group 4: Industry Context - The lithography technology is critical for semiconductor manufacturing, directly impacting chip performance, integration, and production costs [19]. - The conference aims to strengthen the self-sufficiency of the lithography industry in China amid increasing geopolitical tensions affecting the semiconductor supply chain [20]. - The event will serve as a platform for resource integration and collaboration among upstream and downstream enterprises in the lithography supply chain [20].

Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, focusing on enhancing domestic capabilities and self-sufficiency in the semiconductor industry [21][22]. Group 1: Conference Overview - The conference will take place on July 9-10, 2025, at the Sheraton Hotel in Hefei, Anhui, with an expected attendance of 300 participants [15][21]. - The agenda includes discussions on advanced lithography technologies, the current state of lithography materials, and the challenges faced in domestic production [13][22]. - Keynote speakers and industry experts will present on various topics, including the latest research in extreme ultraviolet lithography (EUV) and the domestic production of photoresists and wet electronic chemicals [10][14]. Group 2: Industry Challenges - The domestic high-end photoresist supply rate is low, and the technology lags behind international standards, affecting the performance and quality required for advanced chip manufacturing [21][22]. - The reliance on imports for high-purity and specialized wet electronic chemicals poses a supply risk, while the manufacturing of high-precision masks remains a significant challenge [21][22]. - The lithography equipment market is dominated by foreign companies, with domestic manufacturers facing substantial technological and precision gaps [21][22]. Group 3: Company Profile - Jiangsu Jicui Photo-sensitive Electronic Materials Research Institute, established in June 2021, focuses on the R&D and industrialization of photoresist raw materials and related technologies [7][8]. - The company has achieved recognition as a high-tech enterprise and is a member of the "Integrated Circuit Photoresist Industry Innovation Alliance" [8]. - The company has successfully developed several KrF photoresist resins that have passed customer testing and are in small-scale production [8]. Group 4: Conference Highlights - The conference will feature over 20 speakers from the lithography industry, providing insights and fostering interaction across the supply chain [14]. - Three main sessions will cover advanced lithography technologies, photoresists and wet electronic chemicals, and mask and lithography equipment, offering a comprehensive view of the industry [14]. - The event aims to facilitate collaboration between academia, research institutions, and industry players to enhance innovation and technology transfer [22].

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 7月9日-10日，2025势银（第五届）光刻产业大会（安徽合肥） 点此报名 添加文末微信，加 光刻胶 群 在半导体芯片集成高密化和线路精细化上，光刻与刻蚀承担着重要的工艺角色，尤其是在半导体前 道制程中，光刻机与刻蚀机分辨率很大程度上决定了集成电路精细化发展水平。在这里我们重点阐 述光刻产业话题。 | 制程 | 晶圆尺寸 | 金属材料 | 光刻机类型 | | --- | --- | --- | --- | | 0.5µm | 200mm | Al | g-line:436nm | | 0.35µm | 200mm | Al | i-line:365nm | | 0.25µm | 200mm | Al | KrF:248nm(stepper) | | 0.18/0.15µm | 200mm | Al | KrF:248(stepper&scanner) | | 0.13µm | 200/300mm | Al/Cu | ArF: ...

Core Viewpoint - The article discusses the advancements and challenges in lithography technology, particularly in the semiconductor industry, highlighting the need for innovative solutions to meet the growing demand for high-performance, low-energy, and scalable manufacturing processes [2][6][7]. Group 1: Industry Developments - The ability to manufacture nanoscale components is crucial for producing high-performance devices and driving technological advancements across various industries [2]. - Significant investments are being made in semiconductor research, with the U.S. government committing $280 billion through the CHIPS and Science Act, and the EU proposing $50 billion to double its chip production by 2023 [2]. - Taiwan Semiconductor Manufacturing Company plans to invest $33 billion by 2025 to keep pace with Moore's Law by entering new microchip markets [2]. Group 2: Lithography Technology Overview - Lithography is a manufacturing technique that creates patterned structures on substrates, with common methods including photolithography and electron beam lithography [3]. - Traditional lithography methods face challenges related to resolution, position control, and throughput, necessitating the development of new techniques to meet commercial application demands [3][7]. - Emerging lithography technologies are being developed to overcome the limitations of traditional methods, focusing on flexibility, scalability, and cost-effectiveness [6][7]. Group 3: Emerging Lithography Techniques - Various new lithography techniques are summarized, including: - **Nanoimprint Lithography**: High throughput and low cost, but may face issues with pattern replication [8]. - **Two-Photon Lithography**: Capable of generating smaller structures but has high time costs for large structures [8]. - **Block Copolymer Lithography**: Low cost but limited by the periodicity of microdomains [8]. - Each emerging technique has its advantages and disadvantages, with potential applications in various fields, including electronics and biomedicine [8][9]. Group 4: Upcoming Industry Events - The 2025 TrendBank (Fifth) Lithography Materials Industry Conference will be held from July 8-10 in Hefei, focusing on new applications, trends, and in-depth discussions on the lithography materials supply chain [11].

Core Viewpoint - The article discusses the advancements and challenges in the semiconductor lithography industry, particularly focusing on EUV lithography and emerging technologies like Inversion Semiconductor's particle accelerator-based light source and Atum Works' 3D printing technology for chip manufacturing [1][2][14]. Group 1: EUV Lithography and Inversion Semiconductor - ASML's EUV lithography machines are essential for modern chip production, especially as processes advance to 3nm technology [1]. - The importance of EUV lithography is increasing, with ASML leading the transition to High NA EUV to meet stricter customer demands [1]. - Inversion Semiconductor aims to utilize a "desktop" particle accelerator to produce high-power light, significantly reducing the size of traditional accelerators from kilometers to about one meter [3][4]. - The company plans to achieve a light source output power of 10 kilowatts, which could generate billions in annual revenue for wafer fabs [2][6]. Group 2: Laser Wakefield Acceleration (LWFA) - Inversion Semiconductor's technology leverages Laser Wakefield Acceleration (LWFA) to accelerate electrons to high energies over short distances, enhancing the efficiency of light generation [3][4]. - The collaboration with Lawrence Berkeley National Laboratory aims to develop a high-power, tunable light source named STARLIGHT, targeting soft X-rays in the range of 20nm to 6nm [6][7]. - The anticipated improvements include doubling transistor density and tripling throughput compared to existing machines, potentially allowing a single light source to power multiple lithography machines [7][8]. Group 3: Alternative Lithography Technologies - Lace Lithography AS is exploring atom-based lithography, claiming it can achieve resolutions beyond the limits of current EUV technology, offering a cost-effective and energy-efficient alternative [8][9]. - The company is developing a prototype that utilizes metastable atoms and dispersion force-based masks to achieve 2nm feature sizes, currently in the concept validation stage [9][10]. - Atum Works is promoting its nano-scale 3D printing technology, which could reduce chip manufacturing costs by up to 90%, although it currently lags behind mainstream logic chip technology by about 20 years [14][15]. Group 4: Future Prospects and Industry Impact - The semiconductor industry is facing fundamental bottlenecks in 2D lithography, prompting a shift towards 3D integration to accommodate more transistors and bandwidth on chips [14][15]. - Atum Works' 3D printing technology aims to simplify the manufacturing process by enabling direct material deposition in three-dimensional space, potentially improving yield and efficiency [15][16]. - The advancements in lithography technologies, including both EUV and emerging alternatives, indicate a dynamic landscape in semiconductor manufacturing, with significant implications for future chip design and production [16].

Core Viewpoint - The article discusses the insights of H.-S. Philip Wong, TSMC's Chief Scientist, on the future of semiconductor technology and the challenges posed by U.S. policies towards China’s semiconductor industry [1][2]. Group 1: Background of H.-S. Philip Wong - H.-S. Philip Wong was born in Hong Kong and earned his Ph.D. in Electrical Engineering from Lehigh University after graduating from the University of Hong Kong [2]. - Before joining Stanford University, he led advanced semiconductor research at IBM and is known for creating the world's first carbon nanotube computer in 2013 [2]. Group 2: TSMC's Research and Development Strategy - Wong emphasized the importance of having a forward-looking research team that can identify valuable technologies, even if they are not developed in-house [3]. - He formed a small team with members from universities, other companies, and TSMC, focusing on close interaction with the external research community [3]. Group 3: Challenges in Semiconductor Manufacturing - Wong pointed out that the importance of lithography technology is decreasing, suggesting that future advancements may not rely heavily on extreme resolution [4]. - He noted that the manufacturing process has become overly time-consuming, with the entire process taking up to seven months, and emphasized the need to reduce cycle times [5]. Group 4: U.S. Policies and China's Semiconductor Industry - Wong expressed skepticism about the long-term effectiveness of U.S. strategies to contain China's semiconductor industry, suggesting that these policies may inadvertently create a market for domestic Chinese equipment manufacturers [6][7]. - He observed that while the quality of Chinese research papers has improved significantly in the past 5 to 10 years, Chinese universities still struggle to establish new research directions [7].

Core Viewpoint - The article provides an in-depth analysis of photoresists, focusing on their types, compositions, and the processes involved in their application in semiconductor manufacturing. Group 1: Types of Photoresists - Positive photoresists undergo a decomposition reaction upon exposure to light, resulting in high resolution and good contrast, but they have lower adhesion and higher costs [3][8]. - Negative photoresists form a cross-linked structure upon exposure, which enhances adhesion and etch resistance, but can lead to deformation during development [3][37]. Group 2: Composition of Positive Photoresists - The main component of positive photoresists is phenolic resin, which is soluble in alkaline developers and can be easily cross-linked through thermal reactions [12][35]. - The average molecular weight of the resin typically ranges from 1000 to 3000 g/mole, consisting of 8 to 25 repeating units [17]. Group 3: Development Process - The development process for positive photoresists involves using alkaline developers, which are often based on sodium hydroxide or potassium hydroxide solutions [94]. - The choice of developer is crucial, as it must be compatible with the photoresist to ensure effective development without residue [102][106]. Group 4: Process Conditions - Recommended process conditions for applying photoresists include specific spin speeds and baking temperatures to achieve desired film thickness and uniformity [62][73]. - The article emphasizes the importance of controlling environmental factors such as humidity and temperature during the photoresist application process to avoid defects [78][113]. Group 5: Sensitivity to Environmental Factors - Positive photoresists are particularly sensitive to humidity, which can affect their performance during the development process [25][36]. - The article discusses the impact of temperature on the development rate, highlighting the need for precise control to avoid underdevelopment or overdevelopment [113][116]. Group 6: Conclusion - The article concludes that understanding the properties and processes of photoresists is essential for optimizing semiconductor manufacturing and achieving high-quality results [1][10].

Core Insights - The article discusses the critical challenges faced by photomasks in the development of lithography technology, particularly as the industry transitions to EUV (Extreme Ultraviolet) and beyond, highlighting the high costs associated with photomask manufacturing and maintenance [1][2][3]. Group 1: EUV and Non-EUV Challenges - The primary challenge for EUV is the high cost of manufacturing, maintaining, and replacing masks, which significantly impacts the overall production costs [1][3]. - Non-EUV applications are also facing similar challenges, as companies aim to stay competitive while managing costs associated with advanced photomask technologies [2][3]. - The lifespan of EUV photomasks is notably shorter compared to DUV (Deep Ultraviolet) masks, leading to increased cleaning frequency and the need for backup masks, which further escalates costs [3][4]. Group 2: Multi-Exposure Techniques - Multi-exposure techniques are deemed necessary for the future of EUV lithography, as they will enhance resolution and pattern fidelity [6][7]. - Companies are actively researching multi-exposure methods to extend the lifespan of EUV technology, with Intel planning to use high-NA EUV for its 14A node due to single-exposure limitations [7][8]. - The industry is exploring various techniques to optimize multi-exposure applications, although challenges remain in terms of cost and complexity [8][9]. Group 3: Photomask Materials and Process Control - The evolution of photomask materials is crucial for supporting finer nodes, with advancements in binary reflective masks and low-refractive-index reflective masks improving image contrast [10][11]. - The introduction of metal oxide resists is highlighted as a significant advancement, offering higher contrast and better etch resistance compared to traditional resists [11][12]. - Customization of mask blank properties presents opportunities for enhancing wafer process margins, although the market for new resist materials remains niche and underdeveloped [11][12]. Group 4: EUV Membrane Challenges - EUV membranes face challenges related to transmission rates and durability, with current membranes requiring frequent replacements that increase costs and downtime [14][15]. - The complexity of EUV membranes compared to 193i membranes complicates the cleaning and replacement processes, impacting throughput and efficiency [15][16]. - Ongoing research into alternative membrane materials, such as carbon nanotube-based versions, shows promise but faces reliability and performance challenges [15][16].